Optical module circuit board device with good anti-interference and heat-conducting properties

Abstract

The utility model discloses an optical module circuit board device with good anti-interference and heat-conducting properties, which comprises a circuit board body, an anti-interference cover is adhered to the top of the circuit board body, a heat-conducting wear-resistant cover is movably arranged at the position, close to the edge, of the top of the anti-interference cover, and supporting frames are movably and symmetrically arranged at the two ends of the bottom of the circuit board body. The anti-interference cover comprises an outer copper-clad plate layer, a nickel-zinc ferrite layer, a conductive rubber layer, a metal micro-powder wave-absorbing material layer and an inner copper-clad plate layer which are sequentially arranged from outside to inside, and the heat-conducting wear-resistant cover comprises a metal substrate, a ceramic substrate, a heat-conducting silica gel layer and a polymer insulating substrate which are sequentially arranged from outside to inside. According to the utility model, the anti-interference cover adhered to the top adopts a multi-layer structure, and the outer copper-clad plate layer, the nickel-zinc ferrite layer, the conductive rubber layer, the metal micro-powder wave-absorbing material layer and the inner copper-clad plate layer are sequentially arranged from outside to inside, so that external electromagnetic interference can be shielded and absorbed in all directions through the design.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of optical module circuit board device of good anti-interference heat conduction performance. BACKGROUND

[0002] The name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper plate, impedance board, PCB, super-thin circuit board, super-thin circuit board, printing (copper etching technology) circuit board etc.Circuit board makes circuit miniaturization, intuition, and plays an important role to the batch production and optimization of fixed circuit and electric appliance layout.

[0003] The existing circuit board only uses single metal layer or simple shielding measure to resist electromagnetic interference, which often cannot comprehensively and effectively shield and absorb external high-frequency noise and electromagnetic interference, resulting in the stability and accuracy of signal transmission being affected, and using relatively simple support structure, even without special support frame, resulting in the circuit board being prone to shaking or deformation during installation and use, affecting the stability and reliability of the circuit board. UTILITARIAN CONTENT

[0004] The utility model aims at providing a kind of optical module circuit board device of good anti-interference heat conduction performance to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of optical module circuit board device of good anti-interference heat conduction performance, including circuit board body, the top of the circuit board body is bonded with anti-interference cover, and the edge position of the top of anti-interference cover is movably provided with heat conduction wear-resistant cover, the both ends of the bottom of the circuit board body are movably and symmetrically provided with support frame, the anti-interference cover includes that outer copper clad plate layer, nickel-zinc ferrite layer, conductive rubber layer, metal micro-powder wave-absorbing material layer and inner copper clad plate layer are sequentially arranged from outside to inside, and the heat conduction wear-resistant cover includes that metal substrate, ceramic substrate, heat-conducting silica gel layer and polymer insulating substrate are sequentially arranged from outside to inside.

[0006] One end of the support frame is fixedly provided with mounting bolt, and the other end of the support frame is fixedly connected with the heat conduction wear-resistant cover by connecting bolt.

[0007] The top of the heat conduction wear-resistant cover is fixedly provided with cooling fan.

[0008] The bottom of the circuit board body is fixedly provided with a plurality of heat dissipation fins connected with electrical components.

[0009] Compared with the prior art, the utility model has the beneficial effects that:

[0010] The anti-interference cover adopts a multilayer structure, and from outside to inside, the multilayer structure is successively an outer copper-coated plate layer, a nickel-zinc ferrite layer, a conductive rubber layer, a metal micro-powder wave-absorbing material layer and an inner copper-coated plate layer, the design can shield and absorb external electromagnetic interference in all directions, protect signals on the circuit board from interference, and ensure stability and accuracy of signal transmission.

[0011] The heat-conducting wear-resistant cover at the top of the anti-interference cover adopts a four-layer structure of a metal substrate, a ceramic substrate, a heat-conducting silica gel layer and a polymer insulating substrate, the design not only improves wear resistance and strength of the cover body, but also realizes efficient heat conduction by the heat-conducting silica gel layer, and rapidly conducts heat generated by the circuit board to the outside.

[0012] The support frame movably and symmetrically arranged at two ends of the bottom not only provides stable support for the circuit board, but also is fixed by mounting bolts and connecting bolts, so that the circuit board device is easy to install and disassemble, and is convenient to maintain and replace. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a front view of the utility model;

[0014] Figure 2 is a bottom view of the utility model;

[0015] Figure 3 is a sectional view of the anti-interference cover of the utility model;

[0016] Figure 4 is a sectional view of the heat-conducting wear-resistant cover of the utility model.

[0017] In the drawing: 1, circuit board body; 2, anti-interference cover; 21, outer copper-coated plate layer; 22, nickel-zinc ferrite layer; 23, conductive rubber layer; 24, metal micro-powder wave-absorbing material layer; 25, inner copper-coated plate layer; 3, heat-conducting wear-resistant cover; 31, metal substrate; 32, ceramic substrate; 33, heat-conducting silica gel layer; 34, polymer insulating substrate; 4, heat dissipation fan; 5, heat dissipation fin; 6, connecting bolt; 7, support frame; 8, mounting bolt. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0019] Please refer to Figures 1-4The utility model provides a technical scheme: a kind of optical module circuit board device of good anti-interference heat conduction performance, including circuit board body 1, the top of circuit board body 1 is adhered with anti-interference cover 2, and anti-interference cover 2 top edge position movably provided with heat conduction wear-resistant cover 3, the both ends of the bottom of circuit board body 1 movably symmetrically provided with support frame 7, anti-interference cover 2 includes that outer copper clad plate layer 21, nickel-zinc ferrite layer 22, conductive rubber layer 23, metal micro powder wave-absorbing material layer 24 and inner copper clad plate layer 25 are sequentially provided from outside to inside, and heat conduction wear-resistant cover 3 includes that metal substrate 31, ceramic substrate 32, heat-conducting silicone layer 33 and polymer insulating substrate 34 are sequentially provided from outside to inside.

[0020] One end of support frame 7 is fixedly provided with mounting bolt 8, and the other end of support frame 7 is fixedly connected with heat conduction wear-resistant cover 3 through connecting bolt 6.

[0021] The top of heat conduction wear-resistant cover 3 is fixedly provided with cooling fan 4.

[0022] The bottom of circuit board body 1 is fixedly provided with a plurality of heat dissipation fins 5 connected with electrical components.

[0023] Outer copper clad plate layer 21: as the outermost layer, provide preliminary electromagnetic shielding, reduce the influence of external electromagnetic interference on circuit board.

[0024] Nickel-zinc ferrite layer 22: has excellent high-frequency absorption characteristics, can absorb high-frequency electromagnetic interference, further enhances anti-interference ability.

[0025] Conductive rubber layer 23: can maintain good conductivity when subjected to pressure, helps the continuity of electromagnetic shielding, while providing certain buffering and shock-absorbing effect.

[0026] Metal micro powder wave-absorbing material layer 24: can absorb wider frequency band electromagnetic interference, improve the overall wave-absorbing performance of anti-interference cover.

[0027] Inner copper clad plate layer 25: as the inner layer of anti-interference cover, closely contacts with circuit board body, provides a clean electromagnetic environment for circuit board.

[0028] Metal substrate 31: provides good heat conduction performance and mechanical strength, protects internal structure from external physical damage.

[0029] Ceramic substrate 32: has excellent heat resistance and insulation, can isolate electrical components from external environment, while helping heat dissipation.

[0030] Heat-conducting silicone layer 33: as a heat-conducting medium, efficiently conducts the heat generated by the circuit board to the external heat dissipation structure, improving heat dissipation efficiency.

[0031] Polymer insulation substrate 34: provides electrical insulation and mechanical support, ensuring stable operation of the circuit board.

[0032] Support frame 7: supports the entire circuit board device, ensuring stable installation and positioning of the circuit board body 1 and the heat-conducting wear-resistant cover 3. By fixing the connection between the circuit board body and the heat-conducting wear-resistant cover through mounting bolts 8 and connecting bolts 6, it is convenient for installation and disassembly.

[0033] Heat dissipation fan 4: active heat dissipation element, generates airflow to accelerate air flow, carries away heat on the heat-conducting wear-resistant cover 3 and the circuit board body 1, and reduces the working temperature of the circuit board.

[0034] Heat dissipation fins 5: increase the heat dissipation area, improve the heat dissipation efficiency, and help the circuit board to dissipate heat to the surrounding environment more quickly. It is closely connected with electrical elements, directly absorbs and conducts the heat generated by the elements.

[0035] It should be noted that in this paper, such as the first and second relationship terms are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "includes", "contains" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0036] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board device for an optical module with good anti-interference and thermal conductivity, comprising a circuit board body (1), characterized in that: The top of the circuit board body (1) is bonded with an anti-interference cover (2), and the edge position of the top of the anti-interference cover (2) is movably provided with a heat-conducting wear-resistant cover (3), the two ends of the bottom of the circuit board body (1) are movably and symmetrically provided with support frames (7), the anti-interference cover (2) comprises, from outside to inside, an outer copper-clad plate layer (21), a nickel-zinc ferrite layer (22), a conductive rubber layer (23), a metal micro-powder wave-absorbing material layer (24) and an inner copper-clad plate layer (25), and the heat-conducting wear-resistant cover (3) comprises, from outside to inside, a metal substrate (31), a ceramic substrate (32), a heat-conducting silica gel layer (33) and a polymer insulating substrate (34).

2. The light module circuit board device of claim 1, wherein: One end of the support frame (7) is fixedly provided with a mounting bolt (8), and the other end of the support frame (7) is fixedly connected with the heat-conducting wear-resistant cover (3) through a connecting bolt (6).

3. The anti-interference and good heat-conducting optical module circuit board device according to claim 1, characterized in that: The top of the heat-conducting wear-resistant cover (3) is fixedly provided with a heat-dissipating fan (4).

4. The anti-interference and high heat dissipation circuit board device of the optical module according to claim 1, characterized in that: The bottom of the circuit board body (1) is fixedly provided with a plurality of heat-dissipating fins (5) connected with electrical elements.

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