Electronic element grinding tool

Abstract

The utility model discloses an electronic component grinding processing tool in the field of electronic component processing, which comprises a horizontally arranged workbench, a top plate is arranged above the workbench, a plurality of supporting columns are vertically arranged between the top plate and the workbench, a plurality of supporting legs are arranged on the lower side of the workbench, a positioning plate is arranged on the workbench, and the positioning plate is arranged on the workbench. A plurality of adsorption positioning holes are formed in the positioning disc, a supporting mechanism is arranged corresponding to the positioning disc, and a grinding mechanism is correspondingly arranged above the positioning disc. According to the silicon wafer grinding device, silicon wafers can be ground conveniently, the positioning disc can be replaced according to the silicon wafers of different sizes, universality is good, and operation is convenient.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component processing, and specifically relates to a grinding tool for electronic components. Background Technology

[0002] Silicon wafers are an indispensable material in semiconductor processing. They are used not only to manufacture electronic components, but also primarily to produce semiconductor devices such as diodes, transistors, and field-effect transistors. These devices are among the most important electronic components and are used in electronic products, computers, and communication equipment. Silicon wafers are also used to manufacture integrated circuits (ICs), serving as the fundamental material for transistors and other electronic components.

[0003] In the manufacturing process of electronic components, silicon wafers often need to be ground to the required thickness. During the grinding process, the silicon wafers need to be positioned using a positioning groove. The silicon wafers are placed in the positioning groove and then ground by a grinding wheel. However, since the size of round silicon wafers varies, different grinding equipment needs to be used for different sizes of silicon wafers, which makes the operation more troublesome and increases the cost of equipment purchase, thus increasing the burden on enterprises. Utility Model Content

[0004] The purpose of this invention is to provide a grinding fixture for electronic components, which can conveniently grind silicon wafers and allows for the replacement of positioning plates according to different sizes of silicon wafers. It has good versatility and is easy to operate.

[0005] The purpose of this utility model is achieved as follows: an electronic component grinding and processing fixture includes a horizontally arranged worktable, a top plate above the worktable, several support columns vertically arranged between the top plate and the worktable, several support legs arranged on the lower side of the worktable, a positioning plate arranged on the worktable, a plurality of suction positioning holes opened on the positioning plate, a support mechanism corresponding to the positioning plate, and a grinding mechanism correspondingly arranged above the positioning plate.

[0006] In operation, this invention places a circular silicon wafer within a positioning disk. Positioning bosses surround the outer circumference of the wafer for positioning. The wafer is vacuum-adhered through suction positioning holes, with the positioning bosses protruding from the upper surface of the wafer. A piston rod of a cylinder supports the edge of the lower surface of the positioning disk. Then, the lifting plate of the grinding mechanism moves up and down, driving the grinding wheel to rotate via a reduction motor, thus grinding the silicon wafer to the desired thickness. If grinding wafers of different sizes is required, a different sized positioning disk is used. The positioning disk is loosened by screwing it in, and then a new one is installed. Compared to existing technologies, the advantages of this invention are: it allows for convenient grinding of silicon wafers, and the positioning disk can be replaced according to different wafer sizes, offering good versatility and ease of operation.

[0007] As a further improvement of this utility model, the workbench and the top plate are both rectangular, and the workbench and the top plate are arranged vertically and vertically. A vertical support column is provided at each of the four corners of the workbench and the top plate. There are four support legs, which are distributed at the four corners of the lower side of the workbench. A support plate is horizontally arranged between each support leg.

[0008] As a further improvement of this utility model, the positioning disk is circular, and an annular positioning boss is provided on the outer edge of the upper surface of the positioning disk. A circular connecting groove is coaxially opened inside the positioning disk, and each adsorption positioning hole is opened above the circular connecting groove. An entry groove is opened on the positioning disk below the circular connecting groove. An installation joint is coaxially provided at the center of the lower side of the positioning disk, and the installation joint is set corresponding to the entry groove. The inner wall of the installation joint is provided with internal threads. An upper joint is vertically arranged on the upper side of the worktable, and the outer circumference of the upper joint is provided with external threads. The installation joint is threadedly connected to the upper joint. By loosening the threaded connection between the installation joint of the positioning disk and the upper joint of the worktable, different positioning disks can be replaced. The opening of different positioning disks corresponds to the outer diameter of the silicon wafer, and new silicon wafers are positioned.

[0009] As a further improvement of this utility model, a lower connector is provided on the lower side of the worktable, and an external thread is provided on the outer periphery of the lower connector. A connecting hole connecting the upper connector and the lower connector is vertically opened on the worktable, and the lower connector is connected to a vacuum generating device via a pipe. The vacuum generating device provides a vacuum to the connecting groove of the positioning plate through the lower connector and the connecting hole, and the silicon wafer is positioned by being attracted by each adsorption positioning hole.

[0010] As a further improvement of this utility model, at least four support holes are vertically provided on the worktable, surrounding the connecting hole. These support holes are evenly distributed circumferentially. The support mechanism includes at least four cylinders evenly distributed circumferentially. Each cylinder is located on the support plate and corresponds to its respective support hole. The piston rod of the cylinder moves upward and passes through the corresponding support hole. A pad is provided at the end of the piston rod, and a rubber shock-absorbing pad is provided on the surface of the pad, contacting the bottom of the positioning disk. After the piston rod of the cylinder moves upward, it supports the edge of the lower surface of the positioning disk. When the grinding wheel grinds the silicon wafer, it provides upward support to the positioning disk carrying the silicon wafer, resulting in more stable grinding.

[0011] As a further improvement of this utility model, the grinding mechanism includes a vertically movable lifting plate, which is connected to a lifting drive assembly. A mounting bracket is provided on the lower side of the lifting plate, and a geared motor is mounted on the mounting bracket. The output end of the geared motor faces downward and a grinding wheel is mounted thereon, which is positioned corresponding to the positioning plate. The geared motor drives the grinding wheel to rotate, thus grinding the silicon wafer.

[0012] As a further improvement of this utility model, two sets of lifting drive components are symmetrically arranged on the left and right sides, distributed on both sides of the lifting plate. Each lifting drive component includes a lead screw rotatably mounted between the top plate and the worktable, with a lead screw nut fitted on the lead screw. The two lead screw nuts are respectively connected to the left and right sides of the lifting plate. Two drive motors are mounted on the top plate, with the upper ends of the lead screws passing through the top plate. The output shafts of the drive motors are connected to the corresponding extended ends of the lead screws. The rotation of the two lead screws drives the lifting plate to move up and down through the lead screw nuts, thereby driving the grinding wheel to rise and fall to grind the silicon wafer.

[0013] As a further improvement of this utility model, the mounting bracket is rectangular and includes two vertically spaced flat plates, with two symmetrical side plates between the two flat plates, and the reduction motor is mounted on the lower flat plate. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0016] Figure 3 This is a structural schematic diagram of the supporting columns on the lower side of the top slab.

[0017] Figure 4 This is a top view of the suction positioning holes on the positioning plate.

[0018] Figure 5 This is a top view of each cylinder.

[0019] The components include: 1. Workbench; 2. Top plate; 3. Support column; 4. Support leg; 5. Positioning plate; 5a. Positioning boss; 6. Adsorption positioning hole; 7. Support plate; 8. Connecting groove; 9. Entry groove; 10. Mounting connector; 11. Upper connector; 12. Lower connector; 13. Connecting hole; 14. Support hole; 15. Cylinder; 16. Pad; 17. Shock-absorbing pad; 18. Lifting plate; 19. Mounting bracket; 19a. Flat plate; 19b. Side plate; 20. Gear motor; 21. Grinding wheel; 22. Lead screw; 22a. Lead screw nut; 23. Drive motor. Detailed Implementation

[0020] like Figure 1-5As shown, this is a grinding fixture for electronic components, including a horizontally arranged worktable 1, a top plate 2 above the worktable 1, several vertically arranged support columns 3 between the top plate 2 and the worktable 1, several support legs 4 on the lower side of the worktable 1, a positioning plate 5 on the worktable 1, multiple suction positioning holes 6 on the positioning plate 5, a support mechanism corresponding to the positioning plate 5, and a grinding mechanism correspondingly arranged above the positioning plate 5. Both the worktable 1 and the top plate 2 are rectangular, arranged vertically opposite each other. A vertical support column 3 is located at each of the four corners of the worktable 1 and the top plate 2. Four support legs 4 are provided, distributed at the four corners of the lower side of the worktable 1, and a support plate 7 is horizontally arranged between each support leg 4.

[0021] The positioning disk 5 is circular. An annular positioning boss 5a is provided on the outer edge of the upper surface of the positioning disk 5. A circular connecting groove 8 is coaxially formed inside the positioning disk 5. Each adsorption positioning hole 6 is formed above the circular connecting groove 8. An entry groove 9 is formed below the circular connecting groove 8 on the positioning disk 5. A mounting connector 10 is coaxially provided at the center of the lower side of the positioning disk 5, corresponding to the entry groove 9. The inner wall of the mounting connector 10 is provided with internal threads. An upper connector 11 is vertically provided on the upper side of the worktable 1, with external threads on its outer circumference. The mounting connector 10 is threadedly connected to the upper connector 11. By loosening the threaded connection between the mounting connector 10 of the positioning disk 5 and the upper connector 11 of the worktable 1, different positioning disks 5 can be replaced. The opening of each different positioning disk 5 corresponds to the outer diameter of the silicon wafer, allowing for the positioning of a new silicon wafer. A lower connector 12 is provided on the lower side of the workbench 1. The lower connector 12 has external threads on its outer periphery. A connecting hole 13 is vertically opened on the workbench 1, connecting the upper connector 11 and the lower connector 12. The lower connector 12 is connected to a vacuum generator via a pipe. The vacuum generator provides a vacuum to the connecting groove 8 of the positioning disk 5 through the lower connector 12 and the connecting hole 13, and the silicon wafer is positioned by being attracted by each adsorption positioning hole 6.

[0022] At least four support holes 14 are vertically arranged around the perimeter of the connecting hole 13 on the worktable 1. The support holes 14 are evenly distributed circumferentially. The support mechanism includes at least four cylinders 15 evenly distributed circumferentially. Each cylinder 15 is located on the support plate 7 and is arranged corresponding to each support hole 14. The piston rod of the cylinder 15 moves upward and passes through the corresponding support hole 14. A pad 16 is provided at the end of the piston rod of the cylinder 15. A rubber shock-absorbing pad 17 is provided on the surface of the pad 16 and contacts the bottom of the positioning disk 5. After the piston rod of the cylinder 15 moves upward, it supports the edge of the lower surface of the positioning disk 5. When the grinding wheel 21 grinds the silicon wafer, it provides an upward support force to the positioning disk 5 that carries the silicon wafer, making the grinding more stable.

[0023] The grinding mechanism includes a vertically movable lifting plate 18, which is connected to a lifting drive assembly. A mounting bracket 19 is provided on the lower side of the lifting plate 18, and a reduction motor 20 is mounted on the mounting bracket 19. The output end of the reduction motor 20 faces downwards and is fitted with a grinding wheel 21, which is positioned corresponding to the positioning disk 5. The reduction motor 20 drives the grinding wheel 21 to rotate, grinding the silicon wafer. Two sets of lifting drive assemblies are symmetrically arranged on the left and right sides of the lifting plate 18. Each lifting drive assembly includes a lead screw rotatably mounted between the top plate 2 and the worktable 1. A lead screw nut 22a is fitted onto the lead screw, and the two lead screw nuts 22a are respectively connected to the left and right sides of the lifting plate 18. Two drive motors 23 are mounted on the top plate 2, with the upper end of the lead screw passing through the top plate 2. The output shaft of the drive motor 23 is connected to the corresponding extended end of the lead screw. The mounting bracket 19 is rectangular and includes two vertically spaced flat plates 19a. Two symmetrical side plates 19b are provided between the two flat plates 19a. The geared motor 20 is mounted on the lower flat plate 19a.

[0024] In operation, a circular silicon wafer is placed within the positioning disk 5. Positioning bosses 5a surround the outer circumference of the wafer for positioning. The wafer is vacuum-adhered through the suction positioning holes 6. The positioning bosses 5a protrude from the upper surface of the wafer. The piston rod of the cylinder 15 supports the edge of the lower surface of the positioning disk 5. Then, the lifting plate 18 of the grinding mechanism moves up and down, and two lead screws rotate. The lead screw nut 22a drives the lifting plate 18 to move up and down, driving the grinding wheel 21 to rise and fall. The reduction motor 20 drives the grinding wheel 21 to rotate, grinding the silicon wafer to a thinner thickness. If grinding wafers of different sizes is required, a different sized positioning disk 5 is used. The positioning disk 5 is loosened by screwing it loose, and a new positioning disk 5 is then installed. Loosening the threaded connection between the mounting connector 10 of the positioning disk 5 and the upper connector 11 of the worktable 1 allows for the replacement of different positioning disks 5. The opening of each positioning disk 5 corresponds to the outer diameter of the silicon wafer, allowing for the positioning of new wafers. The advantages of this invention are: it can easily grind silicon wafers, and the positioning disk 5 can be replaced according to silicon wafers of different sizes, which makes it versatile and easy to operate.

[0025] This utility model is not limited to the above embodiments. Based on the technical solutions disclosed in this utility model, those skilled in the art can make some substitutions and modifications to some of the technical features without creative labor, and these substitutions and modifications are all within the protection scope of this utility model.

Claims

1. A grinding fixture for electronic components, characterized in that, The device includes a horizontally arranged workbench, a top plate above the workbench, several vertically arranged support columns between the top plate and the workbench, several support legs on the underside of the workbench, a positioning plate on the workbench, multiple suction positioning holes on the positioning plate, a support mechanism corresponding to the positioning plate, and a grinding mechanism correspondingly arranged above the positioning plate.

2. The electronic component grinding tooling according to claim 1, characterized in that, The workbench and top plate are both rectangular, and are arranged vertically. A vertical support column is provided at each of the four corners of the workbench and top plate. There are four support legs, which are distributed at the four corners of the lower side of the workbench. A support plate is horizontally arranged between each support leg.

3. The electronic component grinding tooling according to claim 2, characterized in that, The positioning disk is circular, and an annular positioning boss is provided on the outer edge of the upper surface of the positioning disk. A circular connecting groove is coaxially opened inside the positioning disk, and each adsorption positioning hole is opened above the circular connecting groove. An entry groove is opened on the positioning disk below the circular connecting groove. An installation joint is coaxially provided at the center of the lower side of the positioning disk. The installation joint is set corresponding to the entry groove. The inner wall of the installation joint is provided with internal thread. An upper joint is vertically provided on the upper side of the worktable. The outer periphery of the upper joint is provided with external thread. The installation joint is threadedly connected to the upper joint.

4. The electronic component grinding tooling according to claim 3, characterized in that, The workbench is provided with a lower connector on its lower side, and the lower connector is provided with an external thread on its outer periphery. A connecting hole connecting the upper connector and the lower connector is vertically opened on the workbench, and the lower connector is connected to the vacuum generator through a pipe.

5. The electronic component grinding tooling according to claim 4, characterized in that, The workbench is vertically provided with at least four support holes surrounding the connecting hole. The support holes are evenly distributed circumferentially. The support mechanism includes at least four cylinders evenly distributed circumferentially. Each cylinder is located on the support plate and is provided with a corresponding support hole. The piston rod of the cylinder is upward and passes through the corresponding support hole. A pad is provided at the end of the piston rod of the cylinder. A rubber shock-absorbing pad is provided on the surface of the pad. The shock-absorbing pad is in contact with the bottom of the positioning plate.

6. The electronic component grinding tooling according to any one of claims 1-5, characterized in that, The grinding mechanism includes a lifting plate that can move up and down. The lifting plate is connected to the lifting drive assembly. A mounting bracket is provided on the lower side of the lifting plate. A geared motor is mounted on the mounting bracket. The output end of the geared motor faces downward and is equipped with a grinding wheel. The grinding wheel is positioned corresponding to the positioning plate.

7. The electronic component grinding tooling according to claim 6, characterized in that, Two sets of lifting drive components are symmetrically arranged on the left and right sides, and the two sets of lifting drive components are distributed on both sides of the lifting plate. Each lifting drive component includes a lead screw rotatably disposed between the top plate and the worktable. A lead screw nut is sleeved on the lead screw, and the two lead screw nuts are respectively connected to the left and right sides of the lifting plate. Two drive motors are installed on the top plate, and the upper end of the lead screw passes through the top plate. The output shaft of the drive motor is connected to the corresponding extended end of the lead screw.

8. The electronic component grinding tooling according to claim 6, characterized in that, The mounting bracket is rectangular and includes two vertically spaced flat plates. Two symmetrical side plates are provided between the two flat plates, and the reduction motor is mounted on the lower flat plate.

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