Split type heat dissipation water channel for testing power semiconductor module

Abstract

The utility model discloses a split type heat dissipation water channel for testing a power semiconductor module. The split type heat dissipation water channel comprises a substrate and an assembly plate which is detachably arranged above the substrate, the base plate comprises a water inlet hole, a water outlet hole, a water inlet channel, a water outlet channel, a first water supplementing hole, a second water supplementing hole and a first threaded hole. The first water supplementing hole and the second water supplementing hole are located in the end face, facing the assembling plate, of the base plate, the first water supplementing hole is communicated with the water inlet channel, and the second water supplementing hole is communicated with the water outlet channel. The assembly plate comprises a heat dissipation surface and a bearing surface. And the heat dissipation surface is provided with a heat dissipation groove and a second threaded hole for fixing the substrate. And the bearing surface is provided with a water inlet groove and a water outlet groove. The water inlet groove is provided with a first water control groove connected with the heat dissipation groove, and the water outlet groove is provided with a second water control groove connected with the heat dissipation groove. According to the split type heat dissipation water channel for testing the power semiconductor module, the substrate and the assembly plate are arranged in a modularized mode, and rapid replacement of the heat dissipation water channel is achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductors, and in particular to a split-type heat dissipation channel for testing power semiconductor modules. Background Technology

[0002] In the current development of high-power semiconductor modules, reactive power testing is required to obtain junction temperature data of the modules during actual operation. Different packages and different heat dissipation designs require specific cooling channels for reactive power testing.

[0003] The existing heat dissipation base plates are all manufactured using CNC machining. Each heat dissipation base plate is independently designed to be used with different packages, and features a simple structure and high structural strength.

[0004] However, in practice, due to the independent design of each water channel, its versatility is poor and its processing is inconvenient. When changing test packages, different independent heat dissipation water channels need to be replaced. Furthermore, the water channel connection needs to be disconnected when changing the heat dissipation base plate to different packages, making the operation complicated. Utility Model Content

[0005] In view of this, the present invention provides a split-type heat dissipation channel for power semiconductor module testing to solve the above problems. A split-type heat dissipation channel for power semiconductor module testing includes a substrate and an assembly plate detachably mounted on top of the substrate. The substrate includes a water inlet, a water outlet symmetrically arranged with respect to the water inlet, a water inlet channel communicating with the water inlet, a water outlet channel communicating with the water outlet, a first water replenishment hole communicating with the water inlet channel, a second water replenishment hole communicating with the water outlet channel, and a plurality of first threaded holes disposed along the edge of the substrate. The first and second water replenishment holes are located on the end face of the substrate facing the assembly plate. The first water replenishment hole communicates with the water inlet channel, and the second water replenishment hole communicates with the water outlet channel. The assembly plate includes a heat dissipation surface located at the end of the assembly plate away from the substrate for mounting the test semiconductor, and a receiving surface located at the end of the assembly plate facing the substrate. A heat dissipation groove and a plurality of second threaded holes for fixing the substrate are provided on the heat dissipation surface. The receiving surface is provided with a water inlet groove and a water outlet groove symmetrically arranged with the water inlet groove. The water inlet groove is arranged corresponding to the first water supply hole, and the water outlet groove is arranged corresponding to the second water supply hole. The water inlet groove is provided with a first water control groove connected to the heat dissipation groove, and the water outlet groove is provided with a second water control groove connected to the heat dissipation groove.

[0006] Furthermore, the water inlet and the water outlet are provided with threads.

[0007] Furthermore, the inlet channel and the outlet channel are arranged symmetrically and in parallel.

[0008] Furthermore, the cross-sectional areas of the first and second water replenishment holes are smaller than the cross-sectional areas of the water inlet and water outlet, respectively.

[0009] Furthermore, the first and second water inlet holes are elongated structures, and the extension directions of the first and second water inlet holes are the same as the extension directions of the water inlet and water outlet.

[0010] Furthermore, the cross-sectional profiles of the water inlet and outlet channels are larger than those of the first and second water replenishment holes.

[0011] Furthermore, the water inlet tank and the water outlet tank have the same depth and are higher than the bottom height of the heat dissipation tank.

[0012] Furthermore, the first and second water control tanks are located below the heat dissipation tank.

[0013] Furthermore, the heat sink is also provided with multiple connection holes for mounting semiconductor modules.

[0014] Furthermore, the assembly plate also includes a plurality of sealing grooves disposed on the heat dissipation surface and the receiving surface. The plurality of sealing grooves are respectively disposed along the outer periphery of the water inlet groove and the water outlet groove, and the sealing grooves are spaced apart from the water inlet groove and the water outlet groove. A sealing ring of a corresponding shape is provided in the sealing groove.

[0015] Compared with existing technologies, this utility model provides a modular, split-type heat dissipation channel for power semiconductor module testing, comprising a substrate and an assembly plate. This allows for compatibility with various packages and facilitates operation. The substrate features an inlet channel and an outlet channel to form a modular basic water channel. The assembly plate, through the inclusion of an inlet groove, an outlet groove, a heat dissipation groove, and a control groove, forms a modular and easily replaceable heat dissipation channel. The inlet groove and the outlet groove have the same depth and are higher than the bottom of the heat dissipation groove. The first and second control grooves control the position of cooling water entering the heat dissipation groove. In use, to meet the water channel testing requirements of different semiconductor modules, only the assembly plate with a suitable shape needs to be installed from the substrate, rather than replacing the entire water channel, making operation simpler. Attached Figure Description

[0016] Figure 1 An exploded view of the split-type heat dissipation channel for testing power semiconductor modules provided by this utility model.

[0017] Figure 2 for Figure 1 A schematic diagram of the assembly board for a split-type heat dissipation channel used in power semiconductor module testing.

[0018] Figure 3 for Figure 1A cross-sectional view of a split-type heat dissipation channel used for testing high-performance semiconductor modules. Detailed Implementation

[0019] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0020] The terminology used herein is intended to explain the embodiments and is not intended to limit and / or restrict the present invention. It should be understood that the terms "front," "rear," "left," "right," "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] Please see Figures 1 to 3 This is a schematic diagram of the structure of the split-type heat dissipation channel for power semiconductor module testing provided by this utility model. The split-type heat dissipation channel for power semiconductor module testing includes a substrate 10 and an assembly plate 20 that is detachably mounted on top of the substrate 10. It is conceivable that the split-type heat dissipation channel for power semiconductor module testing also includes other functional modules, such as fixing bushings, which are technologies known to those skilled in the art and will not be described in detail here.

[0022] The substrate 10 is used to set up basic water channels. The substrate 10 includes a water inlet hole 11, a water outlet hole 12 symmetrically arranged with respect to the water inlet hole 11, a water inlet channel 13 communicating with the water inlet hole 11, a water outlet channel 14 communicating with the water outlet hole 12, a first water replenishment hole 15, a second water replenishment hole 16, and a plurality of first threaded holes 17 arranged along the edge of the substrate 10.

[0023] The inlet hole 11 and the outlet hole 12 are threaded, and the water pipe is installed with the inlet hole 11 and the outlet hole 12 by means of PTFE tape.

[0024] The inlet channel 13 and the outlet channel 14 are symmetrically and parallelly arranged, ensuring that the water pipes connecting the inlet channel 13 and the outlet channel 14 do not cross, thus making installation more convenient. The inlet channel 13 and the outlet channel 14 connect to the circulating water circuit, serving as fixed water supply and drainage pipes.

[0025] The first water inlet hole 15 and the second water inlet hole 16 are located on the end face of the substrate 10 facing the assembly plate 20. The first water inlet hole 15 communicates with the water inlet channel 13, and the second water inlet hole 16 communicates with the water outlet channel 14. The cross-sectional areas of the first and second water inlet holes 15 and 16 are smaller than the cross-sectional areas of the water inlet channel 13 and the water outlet channel 14, respectively. By reducing the width of the water flow opening, the first and second water inlet holes 15 and 16 increase the water flow pressure passing through them, thereby improving the efficiency of water supply and drainage. The first and second water inlet holes 15 and 16 have an elongated structure, and their extension directions are the same as those of the water inlet channel 13 and the water outlet channel 14, making their shapes similar to those of the water inlet channel 13 and the water outlet channel 14, facilitating water flow and increasing the flow rate. The water inlet hole is used to cooperate with the water inlet channel 13 and the water outlet channel 14 so that the base plate 10 and the water channel on the assembly plate 20 form a complete cooling water channel.

[0026] The first threaded hole 17 is used to assist in the fixed installation of the substrate 10 and the assembly plate 20.

[0027] The assembly plate 20 includes a heat dissipation surface 21 located at the end of the assembly plate 20 away from the substrate 10 for mounting the test semiconductor, a receiving surface 22 located at the end of the assembly plate 20 facing the substrate 10, and a plurality of sealing grooves 23 disposed on the heat dissipation surface 21 and the receiving surface 22. The assembly plate 20 is used to set the heat dissipation channels of the semiconductor for heat dissipation testing. By replacing different assembly plates 20 disposed on the substrate 10 to accommodate different test semiconductors, the installation of the channels of the test semiconductor is simplified, making testing more convenient.

[0028] The heat dissipation surface 21 is provided with a heat dissipation groove 211, multiple connection holes 212 for mounting semiconductor modules, and multiple second threaded holes 213 for fixing the substrate 10. The heat dissipation groove 211 is used to assemble and test the semiconductor module, and heat dissipation is achieved by absorbing the heat of the semiconductor module through water flowing in the heat dissipation groove 211. The shape of the heat dissipation groove 211 is set to meet the testing requirements of the semiconductor module. The connection holes 212 are located on the outer periphery of the groove opening of the heat dissipation groove 211, and the second threaded holes 213 are provided corresponding to the first threaded holes 17.

[0029] The receiving surface 22 is provided with a water inlet groove 221 and a water outlet groove 222 symmetrically arranged with respect to the water inlet groove 221. The water inlet groove 221 and the water outlet groove 222 are symmetrically arranged. The water inlet groove 221 is provided corresponding to the first water supply hole 15, and the water outlet groove 222 is provided corresponding to the second water supply hole 16. The cross-sectional contours of the water inlet groove 221 and the water outlet groove 222 are larger than the cross-sectional contours of the first and second water supply holes 15 and 16, so that the openings of the water inlet groove 221 and the water outlet groove 222 cover the openings of the first and second water supply holes 15 and 16 to achieve a sealing effect. The water inlet groove 221 and the water outlet groove 222 are used to store cooling water entering and exiting the assembly plate 20. The inlet tank 221 and the outlet tank 222 have the same depth and are higher than the bottom of the heat dissipation tank 211, allowing the inlet tank 221, outlet tank 222, and heat dissipation tank 211 to communicate and form a heat dissipation water channel. The inlet tank 221 has a first water control tank 2211 connected to the heat dissipation tank 211, and the outlet tank 222 has a second water control tank 2221 connected to the heat dissipation tank 211. The first and second water control tanks 2211 and 2221 are located below the heat dissipation tank 211. The water control tanks are used to control the position of water flow into the heat dissipation tank 211, thereby accelerating the efficiency of cooling water entering the heat dissipation tank 211 and facilitating heat dissipation from the heat dissipation tank 211.

[0030] Multiple sealing grooves 23 are respectively arranged along the outer periphery of the water inlet groove 221 and the water outlet groove 222. The sealing grooves 23 are spaced apart from the water inlet groove 221 and the water outlet groove 222 to enhance the sealing effect. The sealing grooves 23 are provided with sealing rings of corresponding shapes. During installation, the receiving surface 22 of the mounting plate 20 is aligned with the first and second threaded holes 17 and 213 on the mounting surface 12 of the substrate 10 and fixed with connectors. When the shape of the mounting plate 20 does not match the semiconductor test module, the mounting plate 20 installed on the substrate 10 is removed and the mounting plate 20 that matches the semiconductor test module is installed.

[0031] Cooling water flows into the inlet channel 13 from the water pipe, and then into the inlet tank 221 through the first water inlet hole 15. When the liquid level is equal to the bottom of the heat dissipation tank 221, the cooling water enters the heat dissipation tank 211 from the first water control tank 2211. It then flows from the second water control tank 2221 through the second water inlet hole 16 and is discharged from the outlet hole 12 of the outlet tank 222.

[0032] Compared with existing technologies, this utility model provides a modular, split-type heat dissipation channel for power semiconductor module testing, comprising a substrate 10 and an assembly plate 20, enabling it to be used with various packages and offering convenient operation. The substrate 10 is equipped with an inlet channel 13 and an outlet channel 14 to achieve a modular basic water channel. The assembly plate 20, through the configuration of an inlet groove 221, an outlet groove 222, a heat dissipation groove 211, and a control groove, achieves a modular and easily replaceable heat dissipation channel. The inlet groove 221 and the outlet groove 222 have the same depth and are higher than the bottom of the heat dissipation groove 211. The first and second control grooves 2211 and 2221 are used to control the position of cooling water entering the heat dissipation groove 211. In use, to meet the water channel testing requirements of different semiconductor modules, only the assembly plate 20 with a suitable shape needs to be installed from the substrate 10, rather than replacing the entire water channel, making operation simpler.

[0033] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. A split-type heat dissipation channel for testing power semiconductor modules, characterized in that: The split-type heat dissipation channel for power semiconductor module testing includes a substrate and a mounting plate detachably mounted on top of the substrate. The substrate includes a water inlet, a water outlet symmetrically arranged around the water inlet, a water inlet channel communicating with the water inlet, a water outlet channel communicating with the water outlet, a first water inlet, a second water inlet, and a plurality of first threaded holes arranged along the edge of the substrate. The first and second water inlets are located on the end face of the substrate facing the mounting plate. The first water inlet communicates with the water inlet channel, and the second water inlet communicates with the water outlet channel. The assembly board includes a heat dissipation surface located at one end of the assembly board away from the substrate and used for mounting and testing semiconductors, and a receiving surface located at one end of the assembly board facing the substrate. The heat dissipation surface is provided with a heat dissipation groove and a plurality of second threaded holes for fixing the substrate. The receiving surface is provided with a water inlet groove and a water outlet groove symmetrically arranged with the water inlet groove. The water inlet groove is provided corresponding to the first water replenishment hole, and the water outlet groove is provided corresponding to the second water replenishment hole. The water inlet groove is provided with a first water control groove connected to the heat dissipation groove, and the water outlet groove is provided with a second water control groove connected to the heat dissipation groove.

2. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The water inlet and the water outlet are threaded.

3. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The inlet channel and the outlet channel are arranged symmetrically and in parallel.

4. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The cross-sectional areas of the first and second water supply holes are smaller than the cross-sectional areas of the water inlet and water outlet, respectively.

5. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The first and second water inlet holes are elongated structures, and the extension directions of the first and second water inlet holes are the same as the extension directions of the water inlet and water outlet.

6. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The cross-sectional profiles of the inlet and outlet water channels are larger than those of the first and second water supply holes.

7. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The inlet tank and the outlet tank have the same depth and are higher than the bottom of the heat dissipation tank.

8. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The first and second water control tanks are located below the heat dissipation tank.

9. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The heat sink is also provided with multiple connection holes for mounting semiconductor modules.

10. The split-type heat dissipation channel for power semiconductor module testing as described in claim 1, characterized in that: The assembly plate also includes multiple sealing grooves disposed on the heat dissipation surface and the receiving surface. The multiple sealing grooves are respectively disposed along the outer periphery of the water inlet groove and the water outlet groove, and the sealing grooves are spaced apart from the water inlet groove and the water outlet groove. The sealing grooves are provided with sealing rings of corresponding shapes.

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