Waterproof and breathable structure of sensor, sensor and electronic equipment

Abstract

The utility model discloses a waterproof breathable structure of a sensor, the sensor and electronic equipment. The waterproof and breathable structure of the sensor comprises a shell, the shell is provided with an inner cavity, the inner cavity is suitable for accommodating an electronic element, the shell is uniformly provided with a plurality of micro-nano-scale vent holes at intervals, the vent holes are communicated with the inner cavity, the plurality of micro-nano-scale vent holes are breathable and have a waterproof effect, a waterproof and breathable film does not need to be additionally arranged, and the waterproof and breathable effect is good. And the cost of the sensor is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and more specifically, to a waterproof and breathable sensor structure, a sensor, and electronic equipment. Background Technology

[0002] In related technologies, electronic devices have extremely high cleanliness requirements. High-end products require cleaning after surface-mount components are mounted to ensure the cleanliness of the motherboard circuitry. To achieve better cleaning results, surfactants are typically added to the water to further remove organic compounds. A barometer is mounted on the motherboard, and this barometer has vents. During cleaning, water can enter, and the surfactant foams and bursts due to ultrasonic vibration. This bursting can generate a huge impact on the MEMS film / gold wire, easily causing the MEMS chip film to rupture or the gold wire to break, leading to inaccurate barometer readings or even loss of barometer functionality. Therefore, currently, waterproof and breathable membranes are generally installed in the vents of the barometer. However, these waterproof and breathable membranes increase the cost of the barometer and are also easily damaged by external forces.

[0003] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0004] One objective of this invention is to provide a new technical solution for a waterproof and breathable sensor structure.

[0005] According to a first aspect of the present invention, a waterproof and breathable sensor structure is provided. The waterproof and breathable sensor structure includes:

[0006] The housing has an inner cavity suitable for accommodating electronic components. The housing is provided with a plurality of micro-nano-scale vent holes at uniform intervals, and the vent holes are in communication with the inner cavity.

[0007] Optionally, the outer casing is coated with a nano-coating at the location of the vent.

[0008] Optionally, the inner wall of the vent is coated with a nano-coating.

[0009] Optionally, the nanocoating includes at least one of nanomaterials, nanooxides, nanocarbon materials, and nanopolymers.

[0010] Optionally, the inner diameter of the vent is less than or equal to 10 μm.

[0011] According to a second aspect of the present invention, a sensor is provided. This sensor includes the waterproof and breathable structure described in the above embodiments.

[0012] Optionally, the housing includes a cover and a PCB board, the cover being disposed on the PCB board to form an inner cavity, and the cover having a plurality of micro-nano-scale ventilation holes.

[0013] Optionally, the sensor further includes a MEMS chip and an ASIC chip, which are disposed on the PCB board and located in the cavity.

[0014] Optionally, the ASIC chip is bonded to the PCB board, and the MEMS chip is bonded to the side of the ASIC chip facing away from the PCB board.

[0015] According to a third aspect of the present invention, an electronic device is provided. This electronic device includes the sensor described in the above embodiments.

[0016] One technical advantage of this application is that the waterproof and breathable structure of the sensor includes a shell with an inner cavity suitable for accommodating electronic components. The shell is provided with a plurality of micro-nano-level vent holes at uniform intervals, which are connected to the inner cavity. The plurality of micro-nano-level vent holes can allow air to pass through and have a waterproof effect, eliminating the need for an additional waterproof and breathable membrane, which helps to reduce the cost of the sensor. Furthermore, the shell is relatively strong and not easily damaged by external forces.

[0017] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.

[0019] Figure 1 This is a partial structural diagram of a waterproof and breathable sensor structure according to an embodiment of this application.

[0020] Figure 2 This is a partial structural diagram of a sensor waterproof and breathable structure according to another embodiment of this application.

[0021] Figure label:

[0022] 1. Outer shell; 11. Inner cavity; 12. Cover; 13. PCB board; 14. Vent hole; 2. MEMS chip; 3. ASIC chip; 4. Gold wire. Detailed Implementation

[0023] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0024] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0025] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0026] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0027] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0028] According to one embodiment of this application, a waterproof and breathable structure for a sensor is provided. For example... Figure 1 and Figure 2 As shown, the sensor's waterproof and breathable structure includes a housing 1, which has an inner cavity 11 suitable for accommodating electronic components. The housing 1 is provided with a plurality of micro-nano-scale vent holes 14 at uniform intervals, and the vent holes 14 are connected to the inner cavity 11.

[0029] In this example, the sensor can be a barometric pressure sensor. The housing 1 has an inner cavity 11, which is suitable for accommodating electronic components such as the MEMS chip 2 and the ASIC chip 3. The housing 1 has a plurality of micro / nano-scale vent holes 14 evenly spaced apart, which communicate with the inner cavity 11. These vent holes allow air to pass through, enabling the inner cavity 11 to communicate with the external environment, allowing the MEMS chip 2 to sense external gas pressure. Furthermore, the micro / nano-scale vents provide waterproofing, eliminating the need for an additional waterproof and breathable membrane, thus reducing sensor costs. Additionally, the housing 1 is relatively strong and not easily damaged by external forces.

[0030] It should be noted that the diameter of the vent 14 in the micro-nano pores is much smaller than the diameter of a water droplet, which greatly restricts water molecules or droplets from directly passing through the vent 14. When water comes into contact with the surface of the shell 1 with the micro-nano vent 14, a water film forms at the opening of the vent 14 due to surface tension. The presence of this water film increases the resistance to water molecules passing through the vent 14. At the solid-liquid-gas three-phase interface, surface tension creates a resultant force pointing towards the interior of the pore. This resultant force resists further water penetration into the pore. When the external water pressure is less than the pressure difference formed by this surface tension, water cannot penetrate.

[0031] It should be noted that the vent 14 is waterproof during sensor cleaning to prevent cleaning water from entering the inner cavity 11 and damaging components such as the MEMS film and gold wire 4. The inner cavity 11 is connected to the external environment through the vent 14. The MEMS chip 2 (microelectromechanical system) can sense the pressure of the external gas through its microstructure devices (e.g., piezoresistive or capacitive structures). Utilizing the micromechanical effect of the MEMS chip 2, the mechanical pressure signal is converted into an electrical signal. The MEMS chip 2 and the ASIC chip 3 are electrically connected via the gold wire 4. The MEMS chip 2 transmits the electrical signal to the ASIC chip 3. The ASIC chip 3 (application-specific integrated circuit) can further process and optimize the raw signal output by the MEMS chip 2 to improve the signal-to-noise ratio and measurement accuracy. The ASIC chip 3 is electrically connected to the PCB board 13 via the gold wire 4.

[0032] In this example, the outer shell 1 can be made of metal such as stainless steel or aluminum alloy. The outer shell 1 has high strength, and by setting micro-nano-level vents 14 in the outer shell 1, there is no need to set an additional waterproof and breathable membrane. Of course, the outer shell 1 can also be made of other high-strength materials, such as ceramic materials or ceramic-metal composite materials, etc. Those skilled in the art can decide according to the actual situation, and no specific limitation is made here.

[0033] For example, a vent hole 14 can be drilled on the outer casing 1 using a laser drilling machine, with appropriate laser power, focal length, and drilling path set according to the material and thickness of the outer casing 1. Alternatively, a mechanical drilling method can also be used to drill the vent hole 14 on the outer casing 1. Those skilled in the art can determine the method based on the actual situation, and no specific limitations are made here.

[0034] In one example, the outer casing 1 is coated with a nano-coating at the location of the vent 14.

[0035] In this example, multiple vent holes 14 are evenly spaced, and the surface of the outer shell 1 between two vent holes 14 is coated with a nano-coating. By setting the nano-coating on the outer shell 1, an ultra-thin and dense hydrophobic layer is formed on the surface of the outer shell 1, thereby further improving the waterproof performance.

[0036] It should be noted that nanomaterials possess unique properties such as surface effects, small size effects, and quantum size effects, which can further enhance waterproofing. Furthermore, high surface energy nanomaterials also exhibit hydrophobic and oleophobic properties, which can further improve waterproofing.

[0037] For example, the nanocoating includes at least one of nanomaterials, nanooxides (such as nano-silica, nano-titanium dioxide, etc.), nanocarbon materials (such as carbon nanotubes, graphene, etc.), and nanopolymers. Those skilled in the art can determine the appropriate method based on the specific circumstances, and no specific limitations are made here.

[0038] In this example, a nano-coating can be applied to the surface of the outer shell 1 using methods such as sol-gel method, physical vapor deposition (PVD) and chemical vapor deposition (CVD), spraying or brushing. Those skilled in the art can choose the appropriate method based on the specific circumstances, and no specific limitations are made here.

[0039] In one example, the inner wall of the vent 14 is coated with a nano-coating. The inner wall of the vent 14 is also provided with a nano-coating, thereby further improving the waterproof effect.

[0040] In this example, vent holes 14 can be made on the outer shell 1 first, and then a nano-coating can be applied so that the nano-coating can be applied to the surface of the outer shell 1 and can also enter into the vent holes 14 and form a nano-coating on the inner wall of the vent holes 14.

[0041] It should be noted that when applying the nano-coating, the thickness of the nano-coating needs to be adjusted according to the inner diameter and length of the vent 14, so that the nano-coating can enter the vent 14 and form a nano-coating on the inner wall of the vent 14, while avoiding the nano-coating layer from completely blocking the vent 14 and affecting the air permeability of the vent 14.

[0042] In one example, the inner diameter of the vent 14 is less than or equal to 10 μm. Vents 14 within this size range can have good waterproof performance and breathability. For example, the inner diameter of the vent 14 can be 10 μm, 8 μm, 5 μm, 2 μm, or even several hundred nanometers, etc., which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0043] A second aspect of this application provides a sensor. This sensor includes the waterproof and breathable structure described in the above embodiments. The sensor includes a housing 1 with an inner cavity 11, which is suitable for accommodating electronic components such as a MEMS chip 2 and an ASIC chip 3. The housing 1 is uniformly provided with a plurality of micro / nano-scale vent holes 14, which communicate with the inner cavity 11. These vent holes 14 allow air to pass through, enabling the inner cavity 11 to communicate with the external environment, allowing the MEMS chip 2 to sense external gas pressure. Furthermore, the micro / nano-scale vents provide a waterproof effect, eliminating the need for an additional waterproof and breathable membrane, thus reducing the cost of the sensor. Additionally, the housing 1 has relatively high strength and is not easily damaged by external forces.

[0044] In one example, such as Figure 1 As shown, the outer shell 1 includes a cover 12 and a PCB board 13. The cover 12 covers the PCB board 13 to form an inner cavity 11. The cover 12 is provided with a plurality of micro-nano-scale ventilation holes 14.

[0045] like Figure 1 As shown, in this example, the outer shell 1 includes a cover 12 and a PCB board 13. The PCB board 13 is connected to the cover 12 and covers the open end of the cover 12, so that the cover 12 and the PCB board 13 surround each other to form an inner cavity 11. The cover 12 is provided with a plurality of micro-nano-scale ventilation holes 14, and the inner cavity 11 communicates with the external environment through the ventilation holes 14.

[0046] In this example, the cover 12 can be a metal shell such as stainless steel or aluminum alloy. Multiple micro-nano-sized ventilation holes 14 can be uniformly drilled at intervals on the cover 12 using laser drilling.

[0047] In this example, PCB board 13, or Printed Circuit Board, is a substrate used to assemble electronic components. It is typically made of one or more layers of insulating material with printed copper traces that connect various parts of the circuit. The sensor also includes a MEMS chip 2 and an ASIC chip 3, which are mounted on the PCB board 13 and located within the cavity 11. The PCB board 13 provides an electrical connection between the ASIC chip 3 and the electronic device, enabling the electronic device to measure air pressure. The MEMS chip 2 and ASIC chip 3 are directly mounted on the PCB board 13, saving installation space. The ASIC chip 3 is electrically connected to the PCB board 13 via gold wire 4 or other conductors. The PCB board 13 is soldered or bonded to the housing 12 at one end and can cover the opening of the housing 12.

[0048] Among them, the PCB board 13 can be a rigid board (hard board), which is made of a rigid substrate that is not easy to bend and has a certain strength and toughness, so that it can have a certain supporting function.

[0049] In this example, the PCB board 13 has pads on the side opposite to the cover 12. This facilitates connection with external circuits (e.g., the main control board of an electronic device) to transmit data and receive control commands. Multiple pads can be provided, for example, three, four, five, or seven, depending on the specific circumstances, and no specific limitation is made here.

[0050] In this example, the PCB board 13 can also be bonded or soldered to the cover 12. For example, an adhesive layer is provided between the PCB board 13 and the cover 12, and the adhesive layer is arranged in a ring structure along the circumference of the PCB board 13 to improve the bonding strength. The selected adhesive is evenly applied to the mounting position of the cover 12 or the bonding surface of the PCB board 13, and care is taken to control the amount of adhesive used to ensure sufficient bonding strength while avoiding excessive overflow that would affect the aesthetics. During assembly, the cover 12 is placed in the predetermined position on the PCB board 13, ensuring that there are no gaps or misalignments between the PCB board 13 and the cover 12. If necessary, clamps or positioning tools can be used to assist in the installation to ensure installation accuracy. After the PCB board 13 is positioned, the bonded area is cured, for example, by room temperature natural curing, heat curing, or ultraviolet irradiation curing.

[0051] The adhesive layer can be made of a strong adhesive suitable for electronic devices, such as epoxy resin, double-sided tape, or specialized electronic adhesive, to ensure a strong bond and resistance to temperature and corrosion. Those skilled in the art can determine the appropriate method based on the specific circumstances; no specific limitations are made here.

[0052] Alternatively, the PCB board 13 can be soldered to the cover 12 using solder paste (composed of solder powder, flux, and other additives). For example, it can be soldered by reflow soldering, which uses hot air or infrared radiation to heat the solder paste printed or applied to the PCB board 13 until it melts, forming a metallurgical bond between the PCB board 13, the cover 12, and the pads. Alternatively, it can be soldered using laser soldering, thermoforming, or other methods. Those skilled in the art can choose the appropriate method based on the specific circumstances, and no specific limitations are made here.

[0053] In this example, the interior of the cover 12 can be a rectangular receiving groove, that is, the opening end of the receiving groove is rectangular. The PCB board 13 can be a rectangular board, which can cover the opening end of the receiving groove to form an inner cavity 11. The cover 12 is provided with a vent 14 communicating with the inner cavity 11. The MEMS chip 2 and the ASIC chip 3 can be disposed in the inner cavity 11. The receiving groove can also be a cylindrical groove, a conical groove, or a trapezoidal groove, etc. Furthermore, the depth of the receiving groove can be determined according to the actual situation. Of course, the specific structure of the receiving groove can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0054] In one example, such as Figure 2 As shown, the ASIC chip 3 is bonded to the PCB board 13, and the MEMS chip 2 is bonded to the side of the ASIC chip 3 that is away from the PCB board 13.

[0055] like Figure 2 As shown, in this example, there is an adhesive layer between the ASIC chip 3 and the PCB board 13, and the ASIC chip 3 and the PCB board 13 are bonded together for fixation. There is also an adhesive layer between the MEMS chip 2 and the ASIC chip, and the MEMS chip 2 and the ASIC chip are bonded together for fixation. This bonding method is simple and provides high connection stability.

[0056] Furthermore, the MEMS chip 2 is bonded to the side of the ASIC chip 3 facing away from the PCB board 13. That is, the PCB board 13, the ASIC chip 3 and the MEMS chip 2 are stacked, which helps to reduce the installation area and optimize the signal transmission path, thereby reducing the area of ​​the PCB board 13.

[0057] Alternatively, in this example, ASIC chip 3 and MEMS chip 2 can be arranged side-by-side on PCB board 13. That is, ASIC chip 3 is connected to PCB board 13, MEMS chip 2 is also connected to PCB board 13, and MEMS chip 2 is located to one side of ASIC chip 3. Of course, the specific installation method of ASIC chip 3 and MEMS chip 2 can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0058] The adhesive layer can be epoxy resin, double-sided tape, or specialized electronic adhesive, etc., to ensure a strong bond and resistance to temperature and corrosion. Those skilled in the art can determine the appropriate method based on the specific circumstances; no specific limitations are made here.

[0059] According to a third aspect of this invention, an electronic device is provided. This electronic device includes the sensor described in the above embodiments. The sensor's waterproof and breathable structure has good waterproof and breathable performance, and its structural strength is high, making it resistant to damage from external forces.

[0060] In this example, the electronic device includes at least one of a smartwatch, a smart bracelet, and a mobile phone. The choice of electronic device, such as a smartwatch, smart bracelet, or mobile phone, can be determined by those skilled in the art based on the specific circumstances, and is not specifically limited herein.

[0061] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0062] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A waterproof and breathable structure for a sensor, characterized in that, include: The outer shell (1) has an inner cavity (11) which is suitable for accommodating electronic components. The outer shell (1) is provided with a plurality of micro-nano-scale vent holes (14) at uniform intervals, and the vent holes (14) are connected to the inner cavity (11).

2. The sensor waterproof and breathable structure according to claim 1, characterized in that, The outer shell (1) is coated with a nano-coating at the location of the vent (14).

3. The sensor waterproof and breathable structure according to claim 1, characterized in that, The inner wall of the vent (14) is coated with a nano-coating.

4. The sensor waterproof and breathable structure according to claim 1, characterized in that, The inner diameter of the vent (14) is less than or equal to 10 μm.

5. A sensor, characterized in that, Includes the sensor waterproof and breathable structure as described in any one of claims 1 to 4.

6. The sensor according to claim 5, characterized in that, The outer shell (1) includes a cover (12) and a PCB board (13). The cover (12) covers the PCB board (13) to form an inner cavity (11). The cover (12) is provided with a plurality of micro-nano-scale ventilation holes (14).

7. The sensor according to claim 6, characterized in that, It also includes a MEMS chip (2) and an ASIC chip (3), which are disposed on the PCB board (13) and located in the inner cavity (11).

8. The sensor according to claim 7, characterized in that, The ASIC chip (3) is bonded to the PCB board (13), and the MEMS chip (2) is bonded to the side of the ASIC chip (3) away from the PCB board (13).

9. An electronic device, characterized in that, Includes the sensor as described in any one of claims 5 to 8.

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