Double-camera chip defect detection equipment

Abstract

The utility model relates to the field of chip defect detection, in particular to double-camera chip defect detection equipment which comprises a first detection assembly and a second detection assembly, the first detection assembly and the second detection assembly are both arranged on an external conveying device, and the first detection assembly and the second detection assembly are arranged on the external conveying device. The first detection assembly and the second detection assembly are arranged at intervals, a preset distance is further arranged between the first detection assembly and the second detection assembly, meanwhile, it needs to be explained that the first detection assembly comprises a first camera, the second detection assembly comprises a second camera, and the erection heights of the first camera and the second camera are different, so that different shooting requirements are met. The chip defect detection device has the advantages of being comprehensive in chip defect detection, simple in structure, reasonable in layout and high in applicability by effectively utilizing the structural configuration of the chip defect detection device.

Description

Technical Field

[0001] This application relates to the field of chip defect detection, and more specifically to a dual-camera chip defect detection device. Background Technology

[0002] In intelligent manufacturing, machine vision-based defect detection is a crucial technology. In chip manufacturing, the various processes are interconnected and technically complex. Even slight variations in materials, environment, and process parameters can lead to chip defects, impacting product yield. Chip quality inspection, as a key link in the chip production line, actively provides feedback on product quality, allowing for timely monitoring of the health status of each production stage. This has led to the increasingly prominent role of quality inspection technology in the production line. Early automated inspection technologies primarily revolved around machine vision. Machine vision technology, with its advantages of high efficiency, high precision, high reliability, non-contact operation, and strong objectivity, has been widely researched and applied. Therefore, detecting chip defects through camera imaging is a common practice. However, current methods typically use a single camera for defect detection at a specific stage. With technological advancements, single-camera imaging is no longer sufficient to meet inspection needs; it often misses some defects. Therefore, there is a need for a dual-camera chip defect detection device that offers comprehensive chip defect detection, a simple structure, a reasonable layout, and high applicability. Summary of the Invention

[0003] The main objective of this application is to provide a dual-camera chip defect detection device, wherein the dual-camera chip defect detection device can effectively utilize its own structural configuration to achieve the advantages of comprehensive chip defect detection, simple structure, reasonable layout and high applicability.

[0004] Another objective of this application is to provide a dual-camera chip defect detection device, wherein the dual-camera chip defect detection device includes a first detection component and a second detection component, both of which are disposed on an external conveying device and are spaced apart by a predetermined distance. It should be noted that the first detection component includes a first camera, and the second detection component includes a second camera. The first camera and the second camera are mounted at different heights to meet different shooting requirements. A first illumination lamp is provided at the first camera, and a second illumination lamp is provided at the second camera. The angles of the first illumination lamp and the second illumination lamp are such that different defects are detected by light sources at different angles.

[0005] Another objective of this application is to provide a dual-camera chip defect detection device, wherein the dual-camera chip defect detection device has a simple structure, is easy to operate, does not involve complex manufacturing processes and expensive materials, has high economic efficiency, and is easy to promote and use.

[0006] To achieve at least one of the above-mentioned objectives, this application provides a dual-camera chip defect detection device, wherein the dual-camera chip defect detection device includes:

[0007] A first detection component and a second detection component are provided. Both the first detection component and the second detection component are located on an external conveying device and are spaced apart by a predetermined distance. It should be noted that the first detection component includes a first camera and the second detection component includes a second camera. The first camera and the second camera are mounted at different heights to meet different shooting requirements.

[0008] In one or more embodiments of this application, the first detection component includes a first connecting plate, the first connecting plate is vertically arranged, and the bottom of the first connecting plate is fixed on an external conveying device. In addition, the first connecting plate also has a plurality of evenly distributed first positioning holes, all of which penetrate the first connecting plate.

[0009] In one or more embodiments of this application, the first detection component further includes a first lamp holder, one end of which has a protrusion. The protrusion has a waist-shaped groove that extends through the protrusion. The protrusion contacts the wall surface of the first connecting plate where the first positioning hole is provided. The waist-shaped groove is also aligned with at least one of the first positioning holes. In this case, the user can pass an external bolt through the waist-shaped groove and thread it into the corresponding first positioning hole.

[0010] In one or more embodiments of this application, each end of the first lamp holder has a first connecting portion, one of which is directly opposite the protrusion, and the first detection component further includes a first lighting lamp, the two ends of the first lighting lamp are fixedly connected, and the light source of the first lighting lamp faces the chip board located on the external conveying device.

[0011] In one or more embodiments of this application, the first detection component further includes a second connecting plate, the second connecting plate being an L-shaped plate, one end of the second connecting plate being fixedly connected to the first connecting plate and close to the top of the first connecting plate, the other end extending away from the first connecting plate, and the first camera being fixed to the end of the second connecting plate away from the first connecting plate.

[0012] In one or more embodiments of this application, the second detection component further includes a support frame assembly. The support frame assembly includes a first support block, a first connecting rod, a second support block, a second connecting rod, a third support block, a third connecting rod, and a fourth support block. The first support block is fixed to the frame of the external conveying device, and the first connecting rod is vertically arranged. The bottom of the first connecting rod is fixed to the first support block, and the top of the first connecting rod is fixedly connected to the second support block. The second connecting rod is horizontally arranged, with one end fixedly connected to the second support block and the other end fixedly connected to the third support block. The third connecting rod is horizontally arranged and perpendicular to the second connecting rod, with one end fixed to the third support block and the other end also fixedly connected to the fourth support block.

[0013] In one or more embodiments of this application, the second camera is also fixed on the fourth support block, and the second camera is also facing the chip board placed on the external conveying device.

[0014] In one or more embodiments of this application, the second detection component further includes a second lamp holder, which is fixed on the third connecting rod and located between the third support block and the fourth support block. The second lamp holder also has a second connecting portion and a third connecting portion, which are offset from each other. The second detection component further includes a second lighting lamp, the end of which is selectively fixed to the second connecting portion or the third connecting portion. Attached Figure Description

[0015] These and / or other aspects and advantages of this application will become clearer and more readily understood from the following detailed description of embodiments of this application taken in conjunction with the accompanying drawings, wherein:

[0016] Figure 1 The illustration shows an application diagram of a dual-camera chip defect detection device.

[0017] Figure 2 The diagram illustrates the structure of the first detection component.

[0018] Figure 3 The diagram illustrates the structure of the second detection component.

[0019] Figure 4 The diagram shows the structure of the second lamp holder. Detailed Implementation

[0020] The terms and words used in the following specification and claims are not limited to their literal meaning, but are used solely by the inventors to enable a clear and consistent understanding of this application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this application is provided for illustrative purposes only and not for the purpose of limiting the application as defined in the appended claims and their equivalents.

[0021] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0022] While ordinal numbers such as "first," "second," etc., will be used to describe various components, there is no limitation on which components are used herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will also be understood that the terms “comprising” and / or “having” as used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0024] refer to Figures 1 to 4 According to a preferred embodiment of the dual-camera chip defect detection device of the present invention, it should be noted that the structure of the dual-camera chip defect detection device is as follows: Figure 1 As shown, specifically, it is installed in, for example... Figure 1 The chip delivery device 100 shown features a dual-camera, dual-light source system. In addition, the aforementioned cameras are Dahua industrial cameras to meet the shooting requirements.

[0025] Specifically, the dual-camera chip defect detection device includes a first detection component 10 and a second detection component 20. Both the first detection component 10 and the second detection component 20 are mounted on an external conveying device 100, and the first detection component 10 and the second detection component 20 are spaced apart by a predetermined distance. It should also be noted that the first detection component 10 includes a first camera 11, and the second detection component 20 includes a second camera 21. The first camera 11 and the second camera 21 are mounted at different heights to meet different shooting requirements.

[0026] Furthermore, the first detection component 10 includes a first connecting plate 12, which is vertically arranged, and the bottom of the first connecting plate 12 is fixed to the external conveying device 100, as shown in the installation position. Figure 2 As shown, the first connecting plate 12 also has a plurality of evenly distributed first positioning holes, all of which penetrate the first connecting plate 12.

[0027] Furthermore, the first detection component 10 also includes a first lamp holder 13, one end of which has a protrusion 131. The protrusion 131 has a waist-shaped groove that extends through the protrusion 131. The protrusion 131 contacts the wall surface of the first connecting plate 12 where the first positioning hole is located. The waist-shaped groove is also aligned with at least one of the first positioning holes. In this regard, the user can pass an external bolt through the waist-shaped groove and thread it into the corresponding first positioning hole to define the position of the protrusion 131, thereby supporting the first lamp holder 13. It should also be noted that each end of the first lamp holder 13 has a first connecting portion 132, one of which faces the protrusion 131. Furthermore, the first detection component 10 includes a first lighting lamp 14, with its two ends fixedly connected. The light source of the first lighting lamp 14 faces the chip board located on the external conveying device 100. It should also be noted that the chip board placed on the conveying device 100 is an uncut chip board. The connection method between the first lighting lamp 14 and the first connecting portion 132 is as follows: Figure 2 As shown, the connecting end has an arc-shaped groove, and the first lighting lamp 14 has a second positioning hole. That is, the user can adjust the angle of the first lighting lamp 14 by adjusting the position of the second positioning hole in the arc-shaped groove.

[0028] Furthermore, the first detection component 10 also includes a second connecting plate 15, which is an L-shaped plate. One end of the second connecting plate 15 is fixedly connected to the first connecting plate 12 and close to the top of the first connecting plate 12, while the other end extends away from the first connecting plate 12. The first camera 11 is fixed to the end of the second connecting plate 15 away from the first connecting plate 12, and the first camera 11 is also facing the chip board placed on the external conveying device 100 to facilitate the imaging of defects on the chip board.

[0029] Specifically, the second detection component 20 further includes a support frame assembly 22, which includes a first support block 221, a first connecting rod 222, a second support block 223, a second connecting rod 224, a third support block 225, a third connecting rod 226, and a fourth support block 227. The first support block 221 is fixed to the frame of the external conveying device 100, and the first connecting rod 222 is vertically arranged, with its bottom fixed to the first support block 221. The top of the first connecting rod 222 is fixedly connected to the second support block 223, and the second connecting rod 224 is horizontally arranged. One end of the second connecting rod 224 is fixedly connected to the second support block 223, and the other end is fixedly connected to the third support block 225. The third connecting rod 226 is horizontally arranged and perpendicular to the second connecting rod 224, with one end fixed to the third support block 225 and the other end fixedly connected to the fourth support block 227. Specifically, the layout of the aforementioned support frame assembly 22 is as follows: Figure 3 As shown.

[0030] Specifically, a second camera 21 is also fixed on the fourth support block 227. The second camera 21 faces the chip board placed on the external conveying device 100. In addition, the placement height of the first camera 11 is lower than the height of the second camera 21.

[0031] Specifically, the second detection component 20 further includes a second lamp holder 23, which is fixed to the third connecting rod 226 and located between the third support block 225 and the fourth support block 227. The second lamp holder 23 also has a second connecting portion 231 and a third connecting portion 232, which are offset from each other. The second detection component 20 also includes a second lighting lamp 24, the end of which is selectively fixed to either the second connecting portion 231 or the third connecting portion 232. The connection method between the second lighting lamp 24 and the second connecting portion 231 or the third connecting portion 232 is consistent with the connection method between the first lighting lamp 14 and the first connecting portion 132, and therefore will not be described in detail. Furthermore, the height of the second lighting lamp 24 is greater than the height of the first lighting lamp 14, and the angles of the first lighting lamp 14 and the second lighting lamp 24 are inconsistent. This means that different defects are presented through light sources at different angles, thereby improving the applicability of this invention.

[0032] In summary, the dual-camera chip defect detection device based on the embodiments of this application is explained, which provides advantages such as comprehensive chip defect detection, simple structure, reasonable layout, and high applicability.

[0033] It is worth mentioning that, in this embodiment, the dual-camera chip defect detection device has a simple structure, does not involve complex manufacturing processes or expensive materials, and is highly economical. Furthermore, for manufacturers, the dual-camera chip defect detection device provided in this application is easy to produce and inexpensive, which is more conducive to controlling production costs and further facilitates product promotion and use.

[0034] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and any modifications or variations may be made to the implementation of the present invention without departing from these principles.

Claims

1. A dual-camera chip defect detection device, characterized in that, The dual-camera chip defect detection device includes: A first detection component and a second detection component are provided, both of which are located on an external conveying device and are spaced apart by a predetermined distance. The first detection component includes a first camera, and the second detection component includes a second camera. The first camera and the second camera are mounted at different heights to meet different shooting requirements.

2. The dual-camera chip defect detection device according to claim 1, wherein the first detection component includes a first connecting plate, the first connecting plate is vertically arranged, and the bottom of the first connecting plate is fixed on an external conveying device. In addition, the first connecting plate also has a plurality of evenly distributed first positioning holes, and the plurality of first positioning holes penetrate the first connecting plate.

3. The dual-camera chip defect detection device according to claim 2, wherein the first detection component further includes a first lamp holder, one end of the first lamp holder has a protrusion, the protrusion has an oblong groove, the oblong groove also penetrates the protrusion, and the protrusion contacts the wall surface of the first connecting plate having the first positioning hole, while the oblong groove is also directly opposite at least one of the first positioning holes, wherein, according to the art, the user can pass an external bolt through the oblong groove and thread it to the corresponding first positioning hole.

4. The dual-camera chip defect detection device according to claim 3, wherein each end of the first lamp holder has a first connecting portion, one of the first connecting portions being directly opposite the protrusion, and the first detection component further includes a first lighting lamp, the two ends of the first lighting lamp being fixedly connected, and the light source of the first lighting lamp being directed toward the chip board located on the external conveying device.

5. The dual-camera chip defect detection device according to claim 4, wherein the first detection component further includes a second connecting plate, the second connecting plate is an L-shaped plate, one end of the second connecting plate is fixedly connected to the first connecting plate and close to the top of the first connecting plate, the other end extends away from the first connecting plate, and the first camera is fixed on the end of the second connecting plate away from the first connecting plate.

6. The dual-camera chip defect detection device according to claim 5, wherein the second detection component further includes a support frame assembly, the support frame assembly including a first support block, a first connecting rod, a second support block, a second connecting rod, a third support block, a third connecting rod, and a fourth support block, the first support block being fixed on the frame of the external conveying device, the first connecting rod being vertically arranged, the bottom of the first connecting rod being fixed on the first support block, the top of the first connecting rod being fixedly connected to the second support block, the second connecting rod being horizontally arranged, one end of the second connecting rod being fixedly connected to the second support block, and the other end being fixedly connected to the third support block, the third connecting rod being horizontally arranged and perpendicular to the second connecting rod, and one end of the third connecting rod being fixed to the third support block, and the other end being fixedly connected to the fourth support block.

7. The dual-camera chip defect detection device according to claim 6, wherein the second camera is further fixed on the fourth support block, and the second camera is also facing the chip board placed on the external conveying device.

8. The dual-camera chip defect detection device according to claim 7, wherein the second detection component further includes a second lamp holder, the second lamp holder is fixed on the third connecting rod and located between the third support block and the fourth support block, the second lamp holder also has a second connecting part and a third connecting part, the second connecting part and the third connecting part are offset, and the second detection component further includes a second illumination lamp, the end of the second illumination lamp being selectively fixed to the second connecting part or the third connecting part.

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