Equipment front-end module and semiconductor process equipment

Abstract

The utility model discloses an equipment front-end module and semiconductor process equipment, and relates to the field of semiconductors. An equipment front-end module comprises a front-end module body, a heating device and a regulation and control device. The heating device is arranged on the front-end module body; the regulation and control device comprises an over-temperature protection assembly, a pressure difference detection element and a control assembly. The over-temperature protection assembly is arranged in the heating device and used for detecting the temperature in the environment where the heating device is located. The pressure difference detection element is arranged in at least one of the heating device and the front-end module body and is used for detecting the wind speed in the environment; the control assembly is electrically connected with the over-temperature protection assembly, the pressure difference detection element and the heating device and used for controlling the heating device to stop heating under at least one of the conditions that the temperature in the environment where the over-temperature protection assembly is located exceeds the preset temperature and the air speed in the environment where the pressure difference detection element is located is lower than the preset air speed. The problem that the fire risk is increased due to the fact that the front-end module of the current equipment is prone to overheating can be solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a device front-end module and semiconductor process equipment. Background Technology

[0002] For etching processes, wafers often retain a lot of halogen gases after the process is completed, such as Cl2, HBr, and HCl. When the wafer enters the front-end module of the equipment, the gas inside the front-end module is generally air, which is rich in moisture. When the moisture in the air combines with the residual gas, it can damage the wafer pattern, leading to a decrease in product yield. Currently, most front-end modules of equipment are equipped with heating systems. Due to the high air velocity at the air inlet of the front-end module, the heating system has a high power, which may pose a fire risk.

[0003] In some front-end modules of related technologies, even though protective elements are installed at the air outlet below the heater, there is still a risk of failure, which can cause overheating and thus increase the risk of fire. Utility Model Content

[0004] The purpose of this application is to provide a front-end module and semiconductor process equipment that can solve the problem that the current front-end module is prone to overheating, which increases the risk of fire.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides a device front-end module, including: a front-end module body, a heating device, and a control device;

[0007] The heating device is located on the front-end module body and is used to provide heating gas to the interior of the front-end module body;

[0008] The control device includes an over-temperature protection component, a differential pressure detection element, and a control component;

[0009] The over-temperature protection component is located inside the heating device and is used to detect the temperature in the surrounding environment.

[0010] The differential pressure detection element is disposed in at least one of the heating device and the front-end module body, and is used to detect the wind speed in the environment.

[0011] The control component is electrically connected to the over-temperature protection component, the differential pressure detection element, and the heating device, respectively, and is used to control the heating device to stop heating when at least one of the following conditions occurs: the temperature in the environment where the over-temperature protection component is located exceeds a preset temperature, or the wind speed in the environment where the differential pressure detection element is located is lower than a preset wind speed.

[0012] This application also provides a semiconductor process apparatus, including the aforementioned apparatus front-end module.

[0013] In this embodiment, by incorporating an over-temperature protection component and a differential pressure detection element, the heating device can be stopped by a control component in at least one of the following situations: the temperature of the environment where the over-temperature protection component is located is too high, exceeding a preset temperature; or the wind speed of the environment where the differential pressure detection element is located is too low, falling below a preset wind speed. This prevents overheating. Compared to related technologies, this embodiment, by employing the combined use of the over-temperature protection component and the differential pressure detection element, effectively mitigates the risk of single component failure, improves the safety performance of semiconductor process equipment, and reduces the risk of fire. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the front-end module of a device in related technologies;

[0015] Figure 2 This is a schematic diagram of the device front-end module disclosed in an embodiment of this application;

[0016] Figure 3 This is a schematic diagram illustrating the control principle of the device front-end module disclosed in an embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the heating device disclosed in the embodiments of this application;

[0018] Figure 5 This is an assembly diagram of the heating device disclosed in the embodiments of this application;

[0019] Figure 6 This is a schematic diagram of the heating device disclosed in the embodiments of this application before assembly;

[0020] Figure 7 This is a schematic diagram of the semiconductor process equipment disclosed in the embodiments of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 01-Heater; 02-Temperature sensor; 03-Protective components; 04-Fan; 05-Equipment front-end module;

[0023] 10 - Equipment front-end module;

[0024] 100 - Front-end module body;

[0025] 200 - Heating device; 210 - Housing; 220 - Heating element; 230 - Fan; 240 - Filter; 250 - Enclosure; 251 - Receiving cavity;

[0026] 300 - Control device; 310 - Temperature detection element; 320 - Over-temperature protection component; 321 - Over-temperature trip sensor; 322 - Fuse; 330 - Control component; 331 - Controller; 332 - First relay; 333 - Second relay; 334 - Contactor; 341 - Differential pressure detection element; 351 - Humidity detection element; 360 - Control box;

[0027] 400 - Control Section;

[0028] 20-Load chamber;

[0029] 30 - Transmission chamber;

[0030] 40 - Process chamber. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0034] Related technologies provide a device front-end module, such as Figure 1 As shown, fan 04 is located on top of front-end module 05 of the device, and heater 01 is located on top of fan 04. Heater 01 detects the outlet temperature through temperature sensor 02 at the outlet position below, so as to adjust the power of heater 01. In addition, a single protection element 03 is provided to prevent heater 01 from overheating.

[0035] However, when the protective element 03 fails due to prolonged use, it can cause the heater to overheat, thereby increasing the risk of fire.

[0036] Based on the above, refer to Figures 2 to 7 This application discloses a semiconductor process equipment, which includes a front-end module body 100, a heating device 200, and a control device 300.

[0037] The heating device 200 is located on the front-end module body 100, for example, above the front-end module body 100, and is used to provide heating gas to the interior of the front-end module body 100, thereby ensuring that a temperature environment that meets the actual requirements is formed inside the front-end module body 100.

[0038] The control device 300 may include an over-temperature protection component 320, a control component 330, and a differential pressure detection element 341. The over-temperature protection component 320 is located within the heating device 200 and is used to detect the temperature of the surrounding environment. Specifically, during the operation of the heating device 200, heating gas can be continuously supplied to the front-end module body 100. Simultaneously, the over-temperature protection component 320 monitors the temperature inside the heating device 200 in real time to prevent the internal temperature of the heating device 200 from becoming too high, which could then affect the process.

[0039] A differential pressure detection element 341 is disposed in at least one of the heating device 200 and the front-end module body 100, and is used to detect the wind speed in the surrounding environment. For example, the differential pressure detection element 341 can be disposed alone in the heating device 200 to detect the wind speed in the heating device 200 in real time; the differential pressure detection element 341 can also be disposed alone in the front-end module body 100 to detect the wind speed in the front-end module body 100 in real time; of course, the differential pressure detection element 341 can also be disposed simultaneously in the heating device 200 and the front-end module body 100 to detect the wind speed in both in real time.

[0040] It should be noted that, since the heating gas in the heating device 200 is introduced into the front-end module body 100, the wind speed in the heating device 200 and the front-end module body 100 is basically the same, or has a relatively small error. Therefore, the wind speed in both devices can be characterized by detecting the wind speed in at least one of the heating device 200 and the front-end module body 100 using the differential pressure detection element 341.

[0041] Of course, differential pressure detection elements 341 can also be installed in both the heating device 200 and the front-end module body 100 to ensure the accuracy of wind speed detection.

[0042] The control component 330 is electrically connected to the over-temperature protection component 320, the differential pressure detection element 341, and the heating device 200, respectively, and is used to control the heating device 200 to stop heating when at least one of the following conditions occurs: the temperature in the environment where the over-temperature protection component 320 is located exceeds the preset temperature, and the wind speed in the environment where the differential pressure detection element 341 is located is lower than the preset wind speed.

[0043] It should be noted that the control component 330 can be set to a preset temperature. If the detected temperature is lower than the preset temperature, it is determined that there is no risk of overheating and no temperature control is required. If the detected temperature exceeds the preset temperature, it is determined that there is a risk of overheating and temperature control is required.

[0044] In addition, the control component 330 can also set a preset wind speed. If the detected wind speed is higher than the preset wind speed, it is determined that there is no risk of overheating and no temperature control is required. If the detected wind speed is lower than the preset wind speed, it is determined that there is a risk of overheating and temperature control is required.

[0045] Based on the above settings, this embodiment of the application, by setting an over-temperature protection component 320 and a differential pressure detection element 341, can control the heating device 200 to stop heating in at least one of the following situations: the temperature of the environment where the over-temperature protection component 320 is located is too high and exceeds a preset temperature; or the wind speed of the environment where the differential pressure detection element 341 is located is too low and falls below a preset wind speed. This prevents overheating. For example, in at least one of the following situations, when the temperature of the environment where the over-temperature protection component 320 is located exceeds a preset temperature, and the wind speed of the environment where the differential pressure detection element 341 is located is lower than a preset wind speed, the heating device 200 can be stopped by disconnecting a relay or a contact to prevent overheating.

[0046] Compared to related technologies, the embodiments of this application, by using the over-temperature protection component 320 and the differential pressure detection element 341 in combination, can effectively mitigate the risk of single component failure, improve the safety performance of semiconductor process equipment, and reduce the risk of fire.

[0047] refer to Figure 2 and Figure 3 In some embodiments, the control device 300 may include at least two over-temperature protection components 320, wherein the bottom of the heating device 200 may be provided with an air outlet, which is connected to the inner cavity of the front module body 100, and the at least two over-temperature protection components 320 are distributed at the bottom and top of the heating device 200.

[0048] Based on the above settings, multi-point temperature measurement can be achieved inside the heating device 200, which can improve the accuracy of temperature detection to a certain extent and prevent the temperature detection accuracy from being affected by excessively high or low local temperatures.

[0049] It should be noted that the heating gas formed in the heating device 200 enters the inner cavity of the front module body 100 through the gas outlet. Therefore, setting at least one over-temperature protection component 320 near the gas outlet can make the detection accuracy more precise. Of course, setting an over-temperature protection component 320 in the area far from the gas outlet can also facilitate multi-point temperature measurement, which is beneficial to improving the detection accuracy.

[0050] Continue to refer to Figure 2 and Figure 3 In some embodiments, each of the multiple over-temperature protection components 320 includes an over-temperature disconnect sensor 321 and a fuse 322, and the over-temperature disconnect sensors 321 of the multiple over-temperature protection components 320 together form a first protection circuit, and the fuses 322 of the multiple over-temperature protection components 320 together form a second protection circuit.

[0051] Based on the above settings, by using the over-temperature disconnect sensor (OT) 321 and the fuse (Fuse) 322 together, the failure of the over-temperature protection component 320 due to the failure of a single type of component can be avoided. Furthermore, different types of components have different temperature detection methods, which can increase the number of temperature detection methods to a certain extent and help improve the temperature detection accuracy.

[0052] In addition, the combined use of multiple over-temperature disconnect sensors 321 allows for temperature detection at multiple different locations. Thus, even if one of the over-temperature disconnect sensors 321 fails, the temperature at other locations can still be obtained, thereby reducing the impact on the accuracy of temperature detection.

[0053] Similarly, the combined use of multiple fuses 322 allows for temperature detection at multiple different locations. Thus, even if one fuse 322 fails, the temperature at other locations can still be obtained, thereby reducing the impact on the accuracy of temperature detection.

[0054] refer to Figure 3 In some embodiments, the control device 300 may include at least two differential pressure detection elements 341, which are respectively disposed in the heating device 200 and the front-end module body 100. Based on this arrangement, the wind speed in the heating device 200 and the front-end module body 100 can be detected by the differential pressure detection elements 341, and compared with the preset wind speed set by the control component 330 to determine whether the wind speed is within a reasonable range.

[0055] For example, the heating device 200 is provided with a differential pressure detection element 341, and the front-end module body 100 is provided with another differential pressure detection element 341. The two differential pressure detection elements 341 detect the wind speed in the heating device 200 and the front-end module body 100 in real time, respectively. When at least one differential pressure detection element 341 detects that the wind speed in its environment is lower than a preset wind speed, it determines that there is an overheating risk, and the control component 330 controls the heating device 200 to stop heating to reduce the overheating risk and ensure the safety of the equipment.

[0056] For example, the differential pressure detection element 341 can be a differential pressure gauge, which can be equipped with a differential pressure contact. When the wind speed is less than a preset wind speed, the differential pressure contact is disconnected. Of course, the differential pressure detection element 341 can also be other components, which are not specifically limited here.

[0057] refer to Figure 4 In some embodiments, the heating device 200 may include a housing 210 and a heating element 220, both of which are disposed within the housing 210. Based on this, the heating element 220 can rapidly heat the gas within the housing 210 to improve heating efficiency. The heated gas then enters the front-end module body 100 through an outlet provided in the housing 210, thereby creating the required temperature environment within the front-end module body 100.

[0058] In some embodiments, the heating element 220 can be a PTC heating element. Compared to a finned heating rod, the resistance of a PTC heating element approaches infinity as the temperature rises, resulting in power approaching zero, thereby improving the safety of the heating device 200 under low wind speed conditions. It should be noted that the PTC heating element can be a thermistor, whose characteristic is that its resistance increases with temperature, approaching infinity at 245°C.

[0059] Additionally, refer to Figure 5 and Figure 6 The heating device 200 may further include a fan 230 and a filter 240. The fan 230 is positioned above the front-end module body 100, and the filter 240 is positioned on the side of the fan 230 away from the front-end module body 100. Thus, the fan 230, the housing 210, and the filter 240 are stacked sequentially above the front-end module body 100. Based on this arrangement, the fan 230 can blow the gas heated by the heating element 220 inside the housing 210 into the front-end module body 100 through the air outlet, thereby creating a high-temperature environment inside the front-end module body 100 to meet temperature requirements. Furthermore, the filter 240 can filter out impurities in the gas, effectively mitigating the contamination caused by impurities entering the front-end module body 100.

[0060] Furthermore, the air inlet end of the fan 230 may be provided with a receiving cavity 251, and at least a portion of the outer casing 210 is disposed within the receiving cavity 251. Optionally, the air inlet end of the fan 230 may be provided with a surrounding plate 250, and the receiving cavity 251 located at the air inlet end of the fan 230 is bent out from the surrounding plate 250 to facilitate the assembly of the outer casing 210.

[0061] Based on the above configuration, the assembly of the outer shell 210 and the receiving cavity 251 can improve the stability and sealing of the assembly between the components of the heating device 200.

[0062] Considering that a heating element 220 is provided inside the outer casing 210, the temperature of the outer casing 210 is relatively high when the heating element 220 is working. To alleviate the impact of high temperature on the operation of the fan 230 or reduce the service life of the fan 230, a heat insulation component (not shown in the figure) can be provided between the outer wall of the outer casing 210 and the inner wall of the receiving cavity 251. The heat insulation component blocks the transfer of heat from the outer casing 210 to the fan 230, thereby effectively alleviating the problem of the fan 230 being in a high-temperature environment, affecting normal operation or reducing its service life. For example, the heat insulation component can be a silicone heat insulation sponge, but other types of components are also possible, and no specific limitation is made here.

[0063] To improve airtightness, a seal (not shown in the figure) may be provided at the connection between the filter 240 and the housing 210. This seal can seal the connection to prevent unfiltered gas from entering the housing 210 and contaminating the front-end module body 100. For example, the seal can be aluminum foil tape, but other types of components are also possible, and no specific limitation is made here.

[0064] refer to Figure 3 In some embodiments, the control component 330 may include a controller 331, a first relay 332, a second relay 333, and a contactor 334. The over-temperature protection component 320 and the differential pressure detection element 341 are both electrically connected to the second relay 333. The second relay 333, contactor 334, and first relay 332 are connected in series. The second relay 333 can be a safety relay, and a power supply can be connected to it. The first relay 332 can be a solid-state relay. When an over-temperature risk occurs, the power supply can be promptly cut off via the second relay 333, and the heating device 200 can be stopped to stop heating via the contactor 334 and the first relay 332 in sequence, thus avoiding the risk of fire due to over-temperature.

[0065] In addition, the control device 300 may also include a temperature detection element 310 disposed in the heating device 200. The temperature detection element 310 is electrically connected to the controller 331. The controller 331 is electrically connected to the heating device 200 through the first relay 332. The controller 331 is used to control the heating power of the heating device 200 through the first relay 332 when both the second relay 333 and the contactor 334 are turned on.

[0066] When the temperature is low, the controller 331 controls the heating device 200 to increase its heating power via the first relay 332 to raise the heating temperature; when the temperature is high but has not reached the preset temperature, the controller 331 controls the heating device 200 to decrease its heating power via the first relay 332 to lower the heating temperature. Based on this, the heating power of the heating device 200 can be adjusted in real time to keep the heating temperature within the preset range.

[0067] For example, the temperature sensing element 310 can be disposed within the heating device 200 and close to the air outlet area to detect the temperature near the air outlet and feed back the temperature near the air outlet to the controller 331 in real time.

[0068] Optionally, the temperature sensing element 310 can be a temperature sensor, or other components, without specific limitations here.

[0069] In addition, the controller 331 can also be electrically connected to the control part 400 of the front-end module 10 of the device, for example, by using the 485 communication method to realize signal transmission. Of course, a conductive connection can also be used.

[0070] Optionally, the control device 300 may also include a control box 360, in which components such as the controller 331, the first relay 332, the second relay 333, and the contactor 334 may be housed to protect each control element.

[0071] refer to Figure 2 and Figure 3 In some embodiments, the control device 300 may further include a humidity detection element 351, which is disposed in the front-end module body 100 and electrically connected to the control component 330 to ensure that a humidity environment that meets actual needs is formed in the front-end module body 100.

[0072] Based on the aforementioned device front-end module 10, this application embodiment also discloses a semiconductor process equipment, referencing... Figures 2 to 7 The disclosed semiconductor process equipment includes the aforementioned equipment front-end module 10.

[0073] In addition, the semiconductor process equipment may also include a load chamber 20, a transfer chamber 30, and at least one process chamber 40. The equipment front-end module 10 is connected to the load chamber 20, the transfer chamber 30 is connected to the load chamber 20, and at least one process chamber 40 is connected to the transfer chamber 30. Based on this, the wafer can sequentially pass through the equipment front-end module 10, the load chamber 20, and the transfer chamber 30, and finally enter the process chamber 40 for processing.

[0074] In this embodiment, the temperature control principle of the device front-end module is as follows:

[0075] When the front-end module is operating normally, heating gas is supplied to the front-end module body 100 through the heating device 200. The over-temperature protection component 320 and the temperature detection element 310 detect the temperature inside the heating device 200, and the differential pressure detection element 341 detects the wind speed within at least one of the heating device 200 and the front-end module body 100. In this case, neither the over-temperature protection component 320 nor the differential pressure detection element 341 is triggered. At this time, the first relay 332, the second relay 333, and the contactor 334 are all in the ON state. The controller 331 receives the temperature information inside the heating device 200 detected by the temperature detection element 310 and compares the detected temperature information with the target temperature set by the controller 331 to obtain the output power percentage, thereby achieving automatic adjustment of the heating power.

[0076] When at least one of the over-temperature protection component 320 and the differential pressure detection element 341 is triggered, the second relay 333 is disconnected, the contactor 334 is disconnected, and the heating device 200 stops heating.

[0077] In summary, the embodiments of this application establish a safe heating system for the front-end module 10 of the equipment, which can form a heating protection circuit and a wind speed detection circuit, thereby improving the safety of the heating system of the front-end module 10 when the wind speed is low, and effectively reducing the safety risks of the front-end module 10 and even the entire semiconductor process equipment.

[0078] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A device front-end module, characterized in that, include: The front-end module body (100), heating device (200), and control device (300); The heating device (200) is located on the front-end module body (100) and is used to provide heating gas to the interior of the front-end module body (100); The control device (300) includes an over-temperature protection component (320), a control component (330), and a differential pressure detection element (341). The over-temperature protection component (320) is located inside the heating device (200) and is used to detect the temperature in the environment. The differential pressure detection element (341) is disposed in at least one of the heating device (200) and the front-end module body (100) and is used to detect the wind speed in the environment. The control component (330) is electrically connected to the over-temperature protection component (320), the differential pressure detection element (341), and the heating device (200), respectively, and is used to control the heating device (200) to stop heating in at least one of the following situations: the temperature in the environment where the over-temperature protection component (320) is located exceeds a preset temperature, and the wind speed in the environment where the differential pressure detection element (341) is located is lower than a preset wind speed.

2. The device front-end module according to claim 1, characterized in that, The control device (300) includes at least two of the over-temperature protection components (320); The heating device (200) has an air outlet at its bottom, and the air outlet is connected to the inner cavity of the front module body (100). At least two of the over-temperature protection components (320) are located at the bottom and top of the heating device (200).

3. The device front-end module according to claim 2, characterized in that, Each of the aforementioned over-temperature protection components (320) includes an over-temperature disconnect sensor (321) and a fuse (322). The over-temperature disconnection sensors (321) of the multiple over-temperature protection components (320) together form a first protection circuit; The fuses (322) of the multiple over-temperature protection components (320) together form a second protection circuit.

4. The device front-end module according to claim 1, characterized in that, The control device (300) includes at least two of the differential pressure detection elements (341). At least two of the differential pressure detection elements (341) are respectively disposed in the heating device (200) and the front-end module body (100).

5. The device front-end module according to claim 1, characterized in that, The heating device (200) also includes a fan (230) and a filter (240); The fan (230) is positioned above the front-end module body (100); The filter (240) is located on the side of the fan (230) opposite to the front-end module body (100) (230).

6. The device front-end module according to claim 5, characterized in that, The heating device (200) further includes a housing (210) and a heating element (220) disposed within the housing (210). The fan (230), the housing (210), and the filter (240) are stacked sequentially on top of the front-end module body (100); The fan (230) has an air inlet end with a receiving cavity (251), and at least a portion of the outer shell (210) is located inside the receiving cavity (251).

7. The device front-end module according to claim 6, characterized in that, A heat insulation element is provided between the outer wall of the outer shell (210) and the inner wall of the receiving cavity (251); And / or, a seal is provided at the connection between the filter (240) and the housing (210).

8. The device front-end module according to claim 1, characterized in that, The control component (330) includes a controller (331), a first relay (332), a second relay (333), and a contactor (334). The over-temperature protection component (320) and the differential pressure detection element (341) are both electrically connected to the second relay (333), and the second relay (333), the contactor (334), and the first relay (332) are connected in series. The control device (300) further includes a temperature detection element (310) disposed in the heating device (200). The temperature detection element (310) is electrically connected to the controller (331). The controller (331) is electrically connected to the heating device (200) through the first relay (332). The controller (331) is used to control the heating power of the heating device (200) through the first relay (332) when both the second relay (333) and the contactor (334) are turned on. The controller (331) is also electrically connected to the control section (400) of the device front-end module (10).

9. The device front-end module according to claim 1, characterized in that, The control device (300) also includes a humidity detection element (351), which is located inside the front-end module body (100) and electrically connected to the control component (330).

10. A semiconductor process apparatus, characterized in that, Includes the device front-end module (10) as described in any one of claims 1 to 9.

Images