Adjusting bracket and semiconductor heat treatment equipment

Abstract

The utility model provides an adjusting bracket and semiconductor heat treatment equipment. The adjusting bracket comprises a fixing assembly, a supporting part, an adjusting assembly connected with the bottom surface of the supporting part, and a spring in a compressed state, the fixing assembly is fixedly connected with the cavity wall of the reaction cavity; an arc-shaped surface attached to a part of the outer surface of the temperature measuring device is formed on the supporting part and is used for supporting the temperature measuring device; two ends of the spring are elastically connected with the bottom surface of the supporting part and the fixing assembly respectively; the adjusting assembly is installed on the fixing assembly and can ascend and descend along with deformation of the spring relative to the fixing assembly. According to the utility model, the contact between the supporting part and the temperature measuring device is surface contact, so that the pressure applied to the temperature measuring device in the embodiment is smaller under the same condition, and the possibility that the contact part of the temperature measuring device and the supporting part is damaged is further reduced. The spring has a buffering effect, the spring deforms adaptively when the supporting part deforms, and the adjusting assembly ascends and descends accordingly, so that the temperature measuring device is prevented from being damaged due to excessive extrusion of the supporting part.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, specifically to an adjustment bracket and semiconductor heat treatment equipment. Background Technology

[0002] With the rapid development of integrated circuit manufacturing technology, the feature size of integrated circuit devices is constantly shrinking, the integration density of chips is increasing, and the requirements for process indicators are becoming more and more stringent. Semiconductor thermal processing equipment, as a crucial process equipment in integrated circuit manufacturing, includes a reaction chamber and a wafer boat. The wafer boat is used to support the wafer and can be moved into and erected within the reaction chamber, allowing the wafer to undergo a thermal treatment reaction to form a film layer on its surface. Temperature is a critical indicator in semiconductor fabrication processes, and temperature uniformity directly affects the uniformity of film thickness.

[0003] Therefore, in order to ensure that the temperature is consistent throughout the crystal boat in the vertical direction, a temperature measuring device is fixedly installed on the side wall of the reaction chamber. Part of the temperature measuring device extends from one end of the crystal boat to the other end of the crystal boat to detect the temperature of each temperature zone inside the reaction chamber in the vertical direction.

[0004] Currently, to improve the installation stability of the temperature measuring device, screws are installed inside the reaction chamber. The top of the screw abuts against the surface of the temperature measuring device, and the bottom of the screw connects to the cavity wall of the reaction chamber to support the temperature measuring device. The angle of the vertical section relative to the vertical direction can be adjusted by turning the screw. However, with this method, the part of the temperature measuring device that abuts against the screw is prone to damage. Utility Model Content

[0005] This invention aims to at least solve the technical problem that the part of the temperature measuring device that abuts against the screw is easily damaged in the prior art, and proposes an adjustment bracket and a semiconductor heat treatment device.

[0006] In a first aspect, this utility model provides an adjustment bracket for a semiconductor heat treatment equipment. The semiconductor heat treatment equipment includes a reaction chamber and a temperature measuring device, with a portion of the temperature measuring device located within the reaction chamber. The adjustment bracket includes a fixing component, a support portion, a spring, and an adjustment component. The fixing component is fixedly connected to the wall of the reaction chamber. An arc-shaped surface is formed on the support portion, which is used to fit against a portion of the outer surface of the temperature measuring device to support the temperature measuring device. The top end of the spring is elastically connected to the bottom surface of the support portion, and the bottom end is elastically connected to the fixing component. The spring is in a compressed state. The adjustment component is connected to the bottom surface of the support portion, and the adjustment component is mounted on the fixing component and can rise or fall relative to the fixing component as the spring deforms.

[0007] In one possible implementation of the first aspect of this utility model, the support part is a support block, and the top surface of the support block is recessed into the bottom surface to form the arc-shaped surface.

[0008] In one possible implementation of the first aspect of this utility model, the support block has a first surface and a second surface that are parallel to each other, one end of the arc-shaped surface along its bending direction is connected to the first surface and the connection is smoothly transitioned, and the other end is connected to the second surface and the connection is also smoothly transitioned.

[0009] In one possible implementation of the first aspect of this utility model, the fixing component includes a support portion and a connecting portion, wherein the support portion is fixedly connected to the cavity wall of the reaction chamber through the connecting portion;

[0010] The adjustment assembly includes an adjustment column and an operating part. The top end of the adjustment column is fixedly connected to the bottom surface of the support part, and the bottom end extends to the bottom of the bearing part and is connected to the operating part. An external thread is formed on the outer surface of the adjustment column, and an internal thread that mates with the external thread is formed on the operating part.

[0011] One of the supporting part and the adjusting column is provided with an opening, and the other is inserted into the opening. The adjusting column can be raised and lowered relative to the supporting part.

[0012] In one possible implementation of the first aspect of this utility model, the connecting part includes two mounting members, the supporting part and the adjusting component are located between the two mounting members, and the two ends of the bearing part are respectively connected to the two mounting members.

[0013] In one possible implementation of the first aspect of this utility model, the mounting component includes a first plate and a second plate that are vertically connected, the second plates of the two mounting components are arranged opposite to each other, and the second plates of the two mounting components are used to be located on both sides of the temperature measuring device; the first plates of the two mounting components are both used to be fixedly connected to the cavity wall of the reaction chamber.

[0014] In one possible implementation of the first aspect of this utility model, the opening is provided on the support portion, the bottom end of the adjusting column passes through the opening and extends to the bottom of the support portion, and the opening is clearance-fitted with the adjusting column.

[0015] In one possible implementation of the first aspect of this utility model, the opening is provided on the adjusting column, the supporting part passes through the opening, and the height of the opening in the vertical direction is greater than the dimension of the supporting part in the vertical direction.

[0016] Secondly, this utility model provides a semiconductor heat treatment device, including: a reaction chamber, a temperature measuring device, and any of the adjustment brackets provided in the first aspect of this utility model, wherein a portion of the temperature measuring device is located within the reaction chamber.

[0017] In one possible implementation of the second aspect of this utility model, the reaction chamber includes a process outer tube and a support base, the process outer tube is mounted on the support base, and the fixing component is connected to the support base.

[0018] In one possible implementation of the second aspect of this utility model, the reaction chamber includes an inner process tube, and the inner wall of the support base is provided with a support ring protruding toward the interior of the reaction chamber. The inner process tube is mounted on the support ring and nested inside the outer process tube.

[0019] The fixing component is fixedly connected to the support ring, and the adjusting bracket is located below the support ring.

[0020] This utility model has the following beneficial effects:

[0021] The adjustment bracket provided by this utility model has several advantages. Firstly, by designing the support portion of the bracket to have an arc-shaped surface that fits against a portion of the outer surface of the temperature measuring device, the contact surface between the support portion and the temperature measuring device is arc-shaped, resulting in surface contact and a relatively large contact area. Thus, under the same conditions, the temperature measuring device experiences less pressure and more even force distribution, thereby reducing the possibility of damage to the part of the temperature measuring device in contact with the support portion due to excessive pressure.

[0022] On the other hand, by designing a spring, the spring can adapt to deformation when the support deforms, and the adjustment component will automatically rise and fall accordingly. This allows the supporting force of the support on the temperature measuring device to adapt to its degree of deformation, so as to ensure that the pressure between the support and the temperature measuring device is within a suitable range. This can further reduce the possibility of damage to the part of the temperature measuring device that is in contact with the support due to excessive pressure. Attached Figure Description

[0023] Figure 1 This is a schematic diagram illustrating an application scenario of a semiconductor heat treatment device in related technologies.

[0024] Figure 2 This is a schematic diagram of another semiconductor heat treatment device in the related technology;

[0025] Figure 3 This is a schematic diagram illustrating an application scenario of another semiconductor heat treatment device in related technologies.

[0026] Figure 4This is a partial schematic diagram of another semiconductor heat treatment device in the related technology;

[0027] Figure 5 This is a schematic diagram of the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0028] Figure 6 This is a partial schematic diagram of the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0029] Figure 7 A perspective view of the connection between the support and the adjusting rod in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0030] Figure 8 This is a three-dimensional schematic diagram of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0031] Figure 9 This is a front view of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0032] Figure 10 This is a schematic diagram of the structure of the fixing component in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0033] Figure 11 This is a bottom view of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0034] Figure 12 This is a side view of the adjustment bracket and temperature measuring device cooperating in the semiconductor heat treatment equipment provided in Embodiment 1 of this application;

[0035] Figure 13 This is a schematic diagram of the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0036] Figure 14 This is a partial schematic diagram of the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0037] Figure 15 This is a perspective view of the connection between the support and the adjusting rod in the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0038] Figure 16 This is a front view of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0039] Figure 17 This is a perspective view of the connection portion of the fixing component in the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0040] Figure 18This is a schematic diagram of the structure of the fixing component in the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0041] Figure 19 This is a bottom view of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 2 of this application;

[0042] Figure 20 This is a side view of the adjustment bracket and temperature measuring device in the semiconductor heat treatment equipment provided in Embodiment 2 of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 100 - Semiconductor heat treatment equipment;

[0045] 10-Reaction chamber; 11-Outer process tube; 12-Support base; 13-Inner process tube; 14-Support ring; 15-Pressure block; 16-Process door;

[0046] 20 - Temperature measuring device; 21 - Horizontal section; 22 - Vertical section; 23 - Arc section;

[0047] 30-Crystal Boat;

[0048] 40 - Adjust the bracket;

[0049] 41-Support part; 411-Arc-shaped surface; 412-First surface;

[0050] 42-Fixing component; 421-Bearing part; 422-Bearing plate; 4221, 4311-Openings; 423-Bearing column; 424-Connecting part; 425A, 425B-Mounting parts; 4251-First plate; 4252-Second plate; 4253-First through hole; 4254-Second through hole; 426-Reinforcing plate; 427-Locking nut;

[0051] 43-Adjusting component; 431-Adjusting column; 432-Operating unit;

[0052] 50 - Retaining ring; 51 - Sealing ring;

[0053] 60-Spring. Detailed Implementation

[0054] In some related technologies, such as Figure 1As shown, the temperature measuring device 20a includes a horizontal section 21a and a vertical section 22a connected to each other. The horizontal section 21a extends from outside the reaction chamber 10a to inside the reaction chamber 10a, and the vertical section 22a extends from one end of the crystal boat 30a to the other end of the crystal boat 30a. The vertical section 22a is long and thin, and its length is greater than that of the horizontal section 21a. This causes the temperature measuring device 20a to easily tilt towards the side where the vertical section 22a is located under the action of gravity. As a result, the vertical section 22a is easy to tip over and hit the crystal boat 30a, causing the material on the surface of the vertical section 22a and / or the crystal boat 30a to peel off and contaminate the reaction chamber 10a.

[0055] To address this technical problem, in some other related technologies, based on Figure 2 The semiconductor heat treatment apparatus 100b shown has a mounting plate 42b protruding from the wall of the reaction chamber 10b towards the inside of the reaction chamber 10b. The mounting plate 42b has a through-hole threaded through it. A screw 41b is also provided inside the reaction chamber 10b, passing through the screw hole and threaded into it. The tip of the screw 41b abuts against the horizontal section 21b of the temperature measuring device 20b to support the temperature measuring device 20b. However, in practical applications, the part of the temperature measuring device 20b that abuts against the screw 41b is easily damaged, such as... Figure 3 As shown, the part of the temperature measuring device 20b that abuts against the screw 41b is prone to breakage, causing the vertical section 22b to tip over and collide with the crystal boat 30b.

[0056] The inventors of this application, through careful research, discovered that the cause of this problem is that the contact area between the screw 41b and the temperature measuring device 20b is relatively small, resulting in greater pressure on the temperature measuring device 20b and making the contact area between the temperature measuring device 20b and the screw 41b prone to damage. Furthermore, during the heat treatment process, the reaction chamber 10b needs to be continuously heated and cooled. As a result, the screw 41b is prone to thermal expansion and contraction due to temperature variations, leading to concentrated stress at the contact point between the temperature measuring device 20b and the screw 41b, further increasing the likelihood of damage at this contact point.

[0057] To solve this technical problem, according to Figure 4 The semiconductor heat treatment apparatus shown includes a reinforcing block 23c fixedly mounted at the bottom of the temperature measuring device 20c. A quartz frame 60c is also provided inside the reaction chamber 10c. The quartz frame 60c includes a connected horizontal portion 62c and a vertical portion 61c. The horizontal portion 62c is located below the reinforcing block 23c, and the vertical portion 61c is located between the vertical section 22c and the crystal boat 30c. The vertical portion 61c is connected to the outer surface of the vertical section 22c. In this example, a screw 41c passes through and is screwed into the horizontal portion 62c, with the tip of the screw 41c abutting against the bottom surface of the reinforcing block 23c.

[0058] By designing reinforcing blocks, the structural strength of the temperature measuring device was improved. Simultaneously, the vertical portion of the quartz frame was connected to the vertical section to support it, thus enhancing the stability of the vertical section. However, in Figure 4 In the related technologies shown, the addition of reinforcing blocks increases the difficulty of manufacturing the temperature measuring device and raises its manufacturing cost.

[0059] In view of the above, this application provides an adjustment bracket and a semiconductor heat treatment device. To enable those skilled in the art to better understand the technical solution of this utility model, the adjustment bracket and semiconductor heat treatment device provided by this utility model will be described in detail below with reference to the accompanying drawings.

[0060] Example 1

[0061] like Figure 5 As shown, this application provides a semiconductor heat treatment apparatus 100, which can be used to perform processes such as low-pressure chemical vapor deposition (LPCVD). This semiconductor heat treatment apparatus 100 can be a vertical heat treatment apparatus, but this is not limiting. The following description uses a vertical heat treatment apparatus as an example.

[0062] The semiconductor thermal processing equipment 100 includes a reaction chamber 10 and a temperature measuring device 20. The reaction chamber 10 includes a process outer tube 11 and an annular support base 12. The process outer tube 11 is mounted on the support base 12, and the bottom of the process outer tube 11 is open to form an opening. The process outer tube 11 and the support base 12 together form the cavity wall of the reaction chamber 10.

[0063] To improve the installation stability of the process outer tube 11, the semiconductor heat treatment equipment 100 may also include a pressure block 15, which presses the process outer tube 11 onto the support base 12.

[0064] The semiconductor thermal processing apparatus 100 also includes a wafer boat 30 and a process gate 16. The wafer boat 30 is used to carry the wafer and is fixedly mounted on the process gate 16. The process gate 16 can move relative to the reaction chamber 10 to open and close its opening. Thus, the process gate 16 can be moved to fit against the bottom surface of the support base 12, allowing the wafer boat 30 to move into the reaction chamber 10. The process gate 16 and the reaction chamber 10 together form a space for the thermal processing reaction to heat-process the wafer. After the thermal processing is completed, the process gate 16 can be moved away from the bottom surface of the support base 12, allowing the wafer boat 30 to be removed. When the semiconductor thermal processing apparatus 100 is a vertical thermal processing apparatus, the wafer boat 30 is vertically mounted in the reaction chamber 10, and the reaction chamber 10 can be up to 1.5m high.

[0065] The reaction chamber 10 may further include an inner process tube 13. The inner wall of the support base 12 is provided with a support ring 14 protruding towards the interior of the reaction chamber 10. The inner process tube 13 is mounted on the support ring 14 and nested inside the outer process tube 11. When the crystal boat 30 is moved into the reaction chamber 10, the inner process tube 13 surrounds the outside of the crystal boat 30. The inner process tube 13 may be closed at the top and open at the bottom. Alternatively, as... Figure 5 As shown, the top and bottom of the inner process tube 13 are open, so that the reaction gas can be introduced between the inner process tube 13 and the crystal boat 30. The reaction gas flows from the top of the inner process tube 13 to the space between the inner process tube 13 and the outer process tube 11, and then is discharged to the outside of the reaction chamber 10.

[0066] The semiconductor thermal processing apparatus 100 also includes a temperature measuring device 20 for detecting the temperature inside the reaction chamber 10. The temperature measuring device 20 can be implemented using a thermocouple (Inner TC) or other types of temperature sensors. Exemplarily, the temperature measuring device 20 includes a horizontal section 21 and a vertical section 22. A through hole is provided on the support base 12. One end of the horizontal section 21 is located outside the reaction chamber 10, and the other end extends through the through hole into the reaction chamber 10 and connects to the vertical section 22. The vertical section 22 is located between the crystal boat 30 and the process inner tube 13, and extends from one end of the crystal boat 30 to the other end of the crystal boat 30, enabling the detection of the temperature at various points along the vertical direction of the crystal boat 30. For ease of understanding, in the various figures of the embodiments of this application, the extension direction of the horizontal section 21 is shown as X, and the extension direction of the vertical section 22 is shown as Z. Figure 5 In the middle, the connection between the horizontal segment 21 and the vertical segment 22 can be an arc segment 23, so that the connection between the two is smooth. Compared with the right angle of the connection between the horizontal segment 21 and the vertical segment 22, this helps to reduce stress concentration.

[0067] In some embodiments, the semiconductor heat treatment apparatus 100 further includes a retaining ring 50 located outside the reaction chamber 10. The retaining ring 50 is sleeved on the outer side of one end of the horizontal section 21 to fix one end of the horizontal section 21. To improve sealing performance, a sealing ring 51 is also provided between the retaining ring 50 and the horizontal section 21, and the sealing ring 51 is located outside the reaction chamber 10.

[0068] The semiconductor heat treatment equipment 100 also includes an adjustment bracket 40, which is disposed within the reaction chamber 10. For example... Figure 6 , Figure 7 and Figure 8As shown, the adjustment bracket 40 includes a support part 41, a fixing component 42, and an adjustment component 43 located below the temperature measuring device 20. The support part 41 supports the temperature measuring device 20 and is connected to the adjustment component 43. The adjustment component 43 is mounted on the fixing component 42, and the fixing component 42 is fixedly connected to the cavity wall of the reaction chamber 10, so that the fixing component 42 can stably provide installation and support for the adjustment component 43.

[0069] The support part 41 has an arc-shaped surface 411, which is in contact with part of the outer surface of the temperature measuring device 20.

[0070] The adjusting component 43 is configured to be raised or lowered relative to the fixed component 42. In this way, by raising or lowering the adjusting component 43, the other end of the horizontal segment 21 can be raised or lowered, thereby changing the horizontal segment 21, and thus adjusting the angle of the vertical segment 22 relative to the vertical direction, that is, adjusting the verticality of the vertical segment 22, so as to reduce the possibility of interference between the vertical segment 22 and the crystal boat 30.

[0071] Furthermore, the adjusting bracket 40 may also include a spring 60, with its top end elastically connected to the bottom surface of the support portion 41 and its bottom end elastically connected to the bearing portion 421. The spring 60 is also in a compressed state. It should be noted that the compression of the spring 60 in its initial state is less than its maximum compression, meaning that the spring 60 can continue to compress even when in a compressed state. During the deformation of the spring 60, the distance between the bottom surface of the support portion 41 and the bearing portion 421 changes accordingly, and the adjusting component 43 can rise or fall accordingly.

[0072] In this embodiment, during the heat treatment process of the semiconductor heat treatment equipment 100, if the support portion 41 expands due to high temperature, the expanded and deformed support portion 41 compresses the spring 60, causing the top of the spring 60 to move downwards. This reduces the distance between the bottom surface of the support portion 41 and the bearing portion 421, and the adjusting component 43 moves downwards accordingly until the support portion 41 stops expanding. This prevents the expanded and deformed support portion 41 from excessively compressing the temperature measuring device 20, which could lead to damage at the contact point between the temperature measuring device 20 and the support portion 41. If the support portion 41 contracts due to low temperature, since the spring 60 is in a compressed state, the top of the spring 60 moves upwards to restore its deformation, increasing the distance between the bottom surface of the support portion 41 and the bearing portion 421. The adjusting component 43 moves upwards accordingly until the support portion 41 stops contracting. This ensures that the contracted and deformed support portion 41 can still support the temperature measuring device 20.

[0073] Based on the above, it can be seen that compared to Figure 2 and Figure 3In the semiconductor heat treatment equipment 100b shown, the adjusting bracket 40 is designed with an arc-shaped contact surface between the support part 41 and the temperature measuring device 20, resulting in a relatively large contact area between the support part 41 and the temperature measuring device 20. Thus, without changing the supporting force of the adjusting bracket 40 on the temperature measuring device 20, the temperature measuring device 20 experiences less pressure and more uniform force in this embodiment, thereby reducing the possibility of damage to the part of the temperature measuring device 20 in contact with the support part 41 due to excessive pressure.

[0074] Meanwhile, in related technologies, the contact between screw 41b and temperature measuring device 20b, and between screw 41c and temperature measuring device 20c, is a hard contact. However, in this embodiment, by designing a spring 60, the spring 60 has a buffering effect to prevent the expansion and deformation of the support part 41 from excessively squeezing the temperature measuring device 20, which greatly reduces the possibility of damage to the contact part between the temperature measuring device 20 and the support part 41.

[0075] In summary, this embodiment optimizes the contact area between the support part 41 and the temperature measuring device 20, as well as the contact method between the support part 41 and the temperature measuring device 20, thereby reducing the possibility of damage to the contact area between the temperature measuring device 20 and the support part 41.

[0076] In addition, it should be pointed out that, with Figure 4 Compared with the related technologies shown that improve the stability of the temperature measuring device 20 by setting the reinforcing block 23c, in this embodiment the contact surface between the support part 41 and the temperature measuring device 20 is an arc-shaped surface 411, which has a larger contact area. Under the premise that the temperature measuring device 20 is subjected to the same pressure, the support force of the adjustment bracket 40 on the temperature measuring device 20 in this embodiment is greater and the support strength is higher. It is also beneficial to avoid the increase in manufacturing difficulty and manufacturing cost caused by the design of the reinforcing block 23c.

[0077] It should be understood that the contact point between the temperature measuring device 20 and the support portion 41 is not limited, as long as the support portion 41 can support the temperature measuring device 20. Specifically, the arc-shaped surface 411 can fit against a portion of the outer surface of the arc segment 23 to support the arc segment 23. Or, as... Figure 8 As shown, the arc-shaped surface 411 can be fitted with a portion of the outer surface of the horizontal segment 21. In this case, the support portion 41 is used to support the horizontal segment 21, which facilitates the adjustment of the horizontality of the horizontal segment 21. Alternatively, the arc-shaped surface 411 can be fitted with a portion of the outer surface of the horizontal segment 21 and a portion of the outer surface of the arc segment 23.

[0078] In the semiconductor heat treatment apparatus 100 disclosed in this embodiment, the support portion 41 can be implemented in various ways.

[0079] For example, the support portion 41 can be a plate-like structure, that is, the support portion 41 is an arc-shaped plate. In an embodiment where the arc-shaped surface 411 is in contact with part of the outer surface of the horizontal segment 21, the arc-shaped plate surrounds the outside of the horizontal segment 21, and the center of the arc-shaped plate is collinear with the central axis of the horizontal segment 21. In this example, the two sides of the arc-shaped plate along its thickness direction are the arc-shaped surface 411 and the arc-shaped back surface, respectively.

[0080] For example, please continue to refer to Figures 6 to 8 The support portion 41 can be a block structure, that is, the support portion 41 is a support block, and the top surface of the support block is recessed to the bottom surface to form an arc-shaped surface 411. In the embodiment where the arc-shaped surface 411 is in contact with part of the outer surface of the horizontal segment 21, one end of the arc-shaped surface 411 along its bending direction and the other end are equal to the diameter of the horizontal segment 21 in the radial direction. Then the contact surface between the support portion 41 and the temperature measuring device 20 is equivalent to a semi-circular surface with a large contact area, which helps to ensure that the support portion 41 can stably support the temperature measuring device 20. It should be noted that in the various figures of the embodiments of this application, the radial direction of the horizontal segment 21 is shown as Y, and the radial direction Y of the horizontal segment 21 is perpendicular to the extension direction X of the horizontal segment 21 and the extension direction Z of the vertical segment 22.

[0081] When the support part 41 is a support block, the support block further has a first surface 412 and a second surface that are parallel to each other along the radial Y direction of the horizontal segment 21. The first surface 412 is connected to one end of the arc-shaped surface 411 along its curvature direction, and the connection is smoothly transitioned. In other words, a rounded chamfer is formed at the connection between the first surface 412 and one end of the arc-shaped surface 411. Compared with a right-angle chamfer at the connection between the first surface 412 and one end of the arc-shaped surface 411, this arrangement helps to avoid the connection between the first surface 412 and one end of the arc-shaped surface 411 forming a sharp corner, thereby preventing the sharp corner from scratching the outer surface of the temperature measuring device 20 during the installation and adjustment of the bracket 40, and also reducing stress concentration at the connection. Similarly, the second surface is connected to the other end of the arc-shaped surface 411 along its curvature direction, and the connection is smoothly transitioned.

[0082] In the semiconductor heat treatment apparatus 100 disclosed in this embodiment, the fixing component 42 can be connected to the support base 12. Alternatively, such as... Figure 5 and Figure 6 As shown, the fixing component 42 can also be fixedly connected to the support ring 14, and the adjusting bracket 40 is located below the support ring 14.

[0083] Please combine them together Figure 6 , Figure 8 , Figure 9 and Figure 10As shown, the fixing assembly 42 includes a supporting part 421 and a connecting part 424. The supporting part 421 is fixedly connected to the cavity wall of the reaction chamber 10 through the connecting part 424. The adjusting assembly 43 includes an adjusting column 431 and an operating part 432. The top end of the adjusting column 431 is fixedly connected to the bottom surface of the supporting part 41, and the bottom end extends to the bottom of the supporting part 421 and connects to the operating part 432. An external thread is formed on the outer surface of the adjusting column 431, and an internal thread that mates with the external thread is formed on the upper surface of the operating part 432. That is, the operating part 432 is provided with an internal thread hole.

[0084] Rotating the operating part 432 by turning it causes the adjusting column 431 to rotate, which in turn causes the adjusting column 431 to continue to screw into the internal threaded hole. This causes the adjusting column 431 to rise, and the support part 41 to rise accordingly. The distance between the bottom surface of the support part 41 and the bearing part 421 increases, and the compression of the spring 60 decreases accordingly. Alternatively, rotating the operating part 432 by turning it causes the adjusting column 431 to rotate, which causes the adjusting column 431 to screw out of the internal threaded hole. This causes the adjusting column 431 to fall, and the support part 41 to fall accordingly. The distance between the bottom surface of the support part 41 and the bearing part 421 decreases, and the compression of the spring 60 increases accordingly. Therefore, when the adjustment bracket 40 is first assembled into the reaction chamber 10, or in scenarios such as the shutdown and restart of the semiconductor heat treatment equipment 100, the adjustment column 431 can be raised or lowered by turning the operating part 432, so that the compression of the spring 60 can be adjusted to a suitable value. This not only allows for the adjustment of the verticality of the vertical section 22, but also prevents the support part 41 from excessively compressing the temperature measuring device 20.

[0085] The top end of the adjusting column 431 and the bottom end of the support portion 41 can be fixedly connected by welding, snap-fitting, bonding, or other methods. In some embodiments, the adjusting column 431 and the support portion 41 can also be formed into a single piece by an integral molding process.

[0086] In the adjustment bracket 40 disclosed herein, the operating part 432 can be implemented as a nut with an internal threaded hole, and the nut is screwed to the bottom end of the adjustment column 431.

[0087] In some embodiments, the connecting part 424 can be a connecting plate, one end of which is fixedly connected to the inner wall of the support base 12 and the other end is a free end, and the bearing part 421 can overlap the other end of the connecting plate.

[0088] In some embodiments, such as Figures 8 to 10As shown, the connecting part 424 may specifically include two mounting members 425A and 425B. A portion of the temperature measuring device 20, the support part 41, and the adjusting assembly 43 are located between the two mounting members 425. Both ends of the bearing part 421 are connected to the two mounting members 425 respectively. In this embodiment, along the radial direction Y of the horizontal segment 21, the fixing assembly 42 spans across both sides of the temperature measuring device 20, and both mounting members 425 are connected to the cavity wall of the reaction chamber 10. The fixing assembly 42 has high installation stability.

[0089] Among them, mounting components 425A and 425B are not limited to plate-like structures or block-like structures. For example Figures 8 to 10 As shown, optionally, mounting components 425A and 425B can each include a first plate 4251 and a second plate 4252 that are vertically connected. In this embodiment, when the fixing assembly 42 is installed in the reaction chamber 10, the second plates 4252 of the two mounting components 425 are arranged opposite to each other, and the second plates 4252 of the two mounting components 425 are located on both sides of the temperature measuring device 20 along the radial Y of the horizontal segment 21.

[0090] For example, in one possibility, the inner wall of the support base 12 may protrude into the reaction chamber 10 to form a boss, and the mounting parts 425A and 425B may be connected to the boss. When the mounting parts 425A and 425B are in a block structure, the block structure may be stacked on the boss. The mounting parts 425A and 425B, as... Figures 8 to 10 As shown, the first plate 4251 of the mounting parts 425A and 425B can overlap the boss.

[0091] For example, in another possibility, mounting components 425A and 425B can be connected to the bottom surface of the support ring 14. In this way, the fixing assembly 42 can be mounted using the support ring 14 without the need for additional components. Mounting components 425A and 425B are as follows... Figures 8 to 10 As shown, the first plate 4251 of the mounting parts 425A and 425B is attached to and connected to the bottom surface of the support ring 14.

[0092] The first plate 4251 of mounting parts 425A and 425B can be fixedly connected to the cavity wall of the reaction chamber 10 by a non-removable method such as welding or bonding. Alternatively, the first plate 4251 can be connected to the cavity wall of the reaction chamber 10 by a detachable method such as snap-fit ​​or screw connection. This facilitates the removal of the adjustment bracket 40 for maintenance of the temperature measuring device 20.

[0093] In a specific example, taking the screw connection between the first plate 4251 and the support ring 14 as an example, the first plate 4251 may be provided with a first through hole 4253 that penetrates its thickness, and the support ring 14 is provided with a screw hole. The first plate 4251 and the support ring 14 are fitted together and the first through hole 4253 is directly opposite the screw hole. A fastening screw can be used to pass through the first through hole 4253 to be screwed into the screw hole.

[0094] In some embodiments, such as Figure 7 and Figure 9 As shown, the supporting part 421 can be a plate-shaped structure, that is, the supporting part 421 is a supporting plate 422. When the mounting parts 425A and 425B include a first plate 4251 and a second plate 4252, the two ends of the supporting plate 422 are respectively connected to the second plate 4252 of the mounting part 425A and the second plate 4252 of the mounting part 425B.

[0095] Please refer to this example. Figure 9 and Figure 10 The support plate 422 has an opening 4221 extending through its own thickness. The bottom end of the adjusting column 431 passes through the opening 4221 and extends to the bottom of the support plate 422. In other words, the adjusting column 431 passes through the opening 4221 in the support portion 421. Furthermore, the opening 4221 and the adjusting column 431 are in clearance fit. In this way, the adjusting column 431 can rise and fall relative to the support portion 421. When the support portion 41 deforms, the spring 60 deforms accordingly. The deformed support portion 41 and the connected adjusting component 43 can automatically rise and fall, so that the supporting force of the support portion 41 on the temperature measuring device 20 can adapt to its degree of deformation, thereby ensuring that the pressure between the support portion 41 and the temperature measuring device 20 is within a suitable range.

[0096] The positional relationship between spring 60 and adjusting column 431 is not limited. For example, please combine them together. Figure 9 and Figure 12 The spring 60 is sleeved on the outer periphery of the adjusting column 431. In this example, the two ends of the spring 60 can be fixedly connected to the support part 41 and the bearing part 421, or they can simply abut against each other. Alternatively, the spring 60 may not be sleeved on the outer periphery of the adjusting column 431. In this example, the two ends of the spring 60 can be fixedly connected to the support part 41 and the bearing part 421.

[0097] In any of the above embodiments, the adjusting bracket 40 may be made of a material resistant to high temperatures and acid / alkali corrosion. Specifically, the material of the adjusting bracket 40 may be quartz, Hastelloy, or stainless steel. On the one hand, because the material of the adjusting bracket 40 has high-temperature resistance, it helps to reduce the impact of continuous temperature changes within the reaction chamber 10 on the adjusting bracket 40, thereby reducing the risk of damage to the temperature measuring device 20 due to thermal expansion and contraction of the adjusting bracket 40. On the other hand, because the material of the adjusting bracket 40 has acid / alkali corrosion resistance, it reduces the possibility of the adjusting bracket 40 reacting chemically with the reaction gas to release organic substances, thus avoiding interference with subsequent heat treatment processes.

[0098] Example 2

[0099] like Figures 13 to 15 As shown, this application provides another semiconductor heat treatment apparatus 100, which is basically the same as that in Embodiment 1, except that in Embodiment 1, the support part 421 is a plate-like structure, that is, the support part 421 is a support plate 422, and the opening is provided on the support plate 422. In this embodiment, the support part 421 is a column-like structure, that is, the support part 421 is a support column 423, and the opening is provided on the adjusting column 431. That is, based on the above description, one of the support part 421 and the adjusting column 431 has an opening, and the other is inserted into the opening, so that the adjusting column 431 can be raised and lowered relative to the support part 421.

[0100] In this embodiment, the two ends of the supporting column 423 are connected to the mounting parts 425A and 425B respectively, and the connection method can be any one of welding, screwing, bonding, or snap-fitting. When the mounting parts 425A and 425B include a first plate 4251 and a second plate 4252, the two ends of the supporting column 423 are connected to the second plate 4252 of the mounting parts 425A and 4252 respectively.

[0101] according to Figures 16 to 19 In one specific example, the second plate 4252 has a second through hole 4254 extending through its thickness. The support column 423 passes through the second through hole 4254 of the mounting members 425A and 425B, and both ends of the support column 423 are screwed to the locking nut 427. In this way, the locking nut 427 prevents the support column 423 from coming out of the second through hole 4254, thus achieving the connection between the support column 423 and the mounting members 425A and 425B. Alternatively, in some feasible embodiments, the second through hole 4254 can also be a threaded hole, with the support column 423 screwed into the threaded hole, so that the support column 423 is screwed to the mounting members 425A and 425B. Of course, in other embodiments, one end of the support column 423 can be connected to a bolt head, and the other end can be threaded to the locking nut 427, thus the support column 423 is connected to the mounting members 425A and 425B by bolts.

[0102] In this embodiment, in mounting parts 425A and 425B, such as Figure 14 , Figure 16 and Figure 17 When the first plate 4251 and the second plate 4252 are shown, the connecting portion 424 of the fixing assembly 42 may further include a reinforcing plate 426, with both ends of the reinforcing plate 426 connected to the second plate 4252 of the mounting member 425A and the second plate 4252 of the mounting member 425B, respectively. This design helps to improve the structural strength of the connecting portion 424. In any case, the reinforcing plate 426 may be located below the supporting column 423, or, as... Figure 14 As shown, the thickness direction of the reinforcing plate 426 can be parallel to the extension direction X of the horizontal segment 21.

[0103] The connection method between the reinforcing plate 426 and the second plate 4252 is not limited; for example, it can be achieved by welding, snap-fitting, bonding, screwing, etc. Of course, the reinforcing plate 426 and the second plate 4252 can also be formed into a single piece through an integral molding process. This would save the assembly process between the reinforcing plate 426 and the second plate 4252, making assembly convenient.

[0104] like Figure 14 , Figure 15 and Figure 20 The adjusting column 431 has a through-hole 4311, and the supporting part 421 (i.e., the supporting column 423) passes through the through-hole 4311. The height of the through-hole 4311 in the vertical direction Z is greater than the dimension of the supporting column 423 in the vertical direction Z. In this way, the adjusting column 431 can be raised and lowered relative to the supporting part 421. When the supporting part 41 deforms, the spring 60 deforms accordingly. The deformed supporting part 41 and the connected adjusting assembly 43 can automatically rise and fall, so that the supporting force of the supporting part 41 on the temperature measuring device 20 can adapt to its degree of deformation, so as to ensure that the pressure between the supporting part 41 and the temperature measuring device 20 is within a suitable range. Specifically, taking the initial state where the support column 423 abuts against the bottom end of the opening 4311 as an example, during the heat treatment process, if the support part 41 expands due to high temperature, the expanded and deformed support part 41 will compress the spring 60, and the spring 60 will be compressed. The adjusting component 43 will then move downward until the support column 423 abuts against the top end of the opening 4311, at which point the adjusting component 43 can no longer descend.

[0105] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. An adjustment bracket, applied to a semiconductor heat treatment device, the semiconductor heat treatment device comprising a reaction chamber and a temperature measuring device, wherein a portion of the temperature measuring device is located within the reaction chamber; characterized in that, The adjustment bracket includes: A fixing assembly for fixing to the wall of the reaction chamber; A support portion having an arc-shaped surface formed thereon, the arc-shaped surface being used to fit against a portion of the outer surface of the temperature measuring device to support the temperature measuring device; A spring, with its top end elastically connected to the bottom surface of the support and its bottom end elastically connected to the fixing component, is in a compressed state; and An adjustment component is connected to the bottom surface of the support portion. The adjustment component is mounted on the fixed component and can rise or fall relative to the fixed component as the spring deforms.

2. The adjustment bracket according to claim 1, characterized in that, The support part is a support block, and the top surface of the support block is recessed into the bottom surface to form the arc-shaped surface.

3. The adjustment bracket according to claim 2, characterized in that, The support block has a first surface and a second surface that are parallel to each other. One end of the arc-shaped surface along its bending direction is connected to the first surface with a smooth transition at the connection point, and the other end is connected to the second surface with a smooth transition at the connection point.

4. The adjustment bracket according to claim 1, characterized in that, The fixing component includes a support part and a connecting part, wherein the support part is fixedly connected to the cavity wall of the reaction chamber through the connecting part; The adjustment assembly includes an adjustment column and an operating part. The top end of the adjustment column is fixedly connected to the bottom surface of the support part, and the bottom end extends to the bottom of the bearing part and is connected to the operating part. An external thread is formed on the outer surface of the adjustment column, and an internal thread that mates with the external thread is formed on the operating part. One of the supporting part and the adjusting column is provided with an opening, and the other is inserted into the opening. The adjusting column can be raised and lowered relative to the supporting part.

5. The adjustment bracket according to claim 4, characterized in that, The connecting part includes two mounting members, the supporting part and the adjusting component are located between the two mounting members, and the two ends of the bearing part are respectively connected to the two mounting members.

6. The adjustment bracket according to claim 5, characterized in that, The mounting component includes a first plate and a second plate that are vertically connected. The second plates of the two mounting components are arranged opposite to each other and are located on both sides of the temperature measuring device. The first plate of each of the two mounting components is used to be fixedly connected to the cavity wall of the reaction chamber.

7. The adjustment bracket according to claim 4, characterized in that, The opening is provided on the supporting part, and the bottom end of the adjusting column passes through the opening and extends to the bottom of the supporting part, with the opening and the adjusting column having a clearance fit; or... The opening is provided on the adjusting column, the supporting part passes through the opening, and the height of the opening in the vertical direction is greater than the dimension of the supporting part in the vertical direction.

8. A semiconductor heat treatment apparatus, characterized in that, include: Reaction chamber; A temperature measuring device, a portion of which is located within the reaction chamber; as well as The adjustment bracket according to any one of claims 1 to 7.

9. The semiconductor heat treatment apparatus according to claim 8, characterized in that, The reaction chamber includes a process outer tube and a support base. The process outer tube is mounted on the support base, and the fixing component is connected to the support base.

10. The semiconductor heat treatment apparatus according to claim 9, characterized in that, The reaction chamber includes an inner process tube, and the inner wall of the support base is provided with a support ring protruding toward the interior of the reaction chamber. The inner process tube is mounted on the support ring and nested inside the outer process tube. The fixing component is fixedly connected to the support ring, and the adjusting bracket is located below the support ring.

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