Front open type interface mechanical standard system and semiconductor process equipment

Abstract

The utility model discloses a front open type interface mechanical standard system and semiconductor process equipment, and relates to the field of semiconductors. A front open type interface mechanical standard system comprises a main board and a sliding table mechanism arranged on the main board. The sliding table mechanism comprises a support, a sliding table body and a plurality of positioning assemblies, the support is connected to the side face of the main board, the sliding table body is slidably connected to the support in the direction close to or away from the main board, and the multiple positioning assemblies are arranged on the sliding table body; each positioning assembly comprises a positioning part and a driving part, the positioning parts are movably connected to the sliding table body and can move in the direction perpendicular to the surface of the sliding table body, and the driving parts are connected to the sliding table body and are in transmission connection with the positioning parts. The problems that the operation is tedious and the equipment productivity is reduced due to manual adjustment of the positioning pin can be solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a front-opening interface mechanical standard system and semiconductor process equipment. Background Technology

[0002] Vertical thermal processing equipment is a crucial part of the semiconductor manufacturing process, and the transfer system is the most important component in completing this process. Currently, the semiconductor industry primarily uses front-opening wafer pods (FOUPs) as wafer storage containers. The transfer system's role is to open the FOUP, allowing wafers to be cleanly removed from or placed into it. It is the first and last step in the vertical thermal processing equipment's manufacturing process.

[0003] With the development of the semiconductor industry, wafer manufacturers, while adhering to SEMI standards, are also optimizing their manufacturing processes, resulting in some FOUP parameters not being entirely consistent, such as material type and housing rigidity. Vertical heat treatment equipment has extremely stringent requirements for sealing and oxygen content. Unlike general atmospheric transfer systems, vertical heat treatment equipment often fills the chamber with positive-pressure inert gas to protect the wafer being processed. Therefore, the transfer requirements for FOUPs are even more stringent to meet sealing performance requirements. Furthermore, during transfer, the FOUP's sealing surface must maintain relative horizontality with the sealing surface of the front-opening interface mechanical standard system (FIMS) to ensure effective sealing.

[0004] In related technologies, the FIMS slide has three positioning pins, and correspondingly, the bottom of the FOUP has a positioning groove. The positioning pins and the positioning grooves work together to position the FOUP. Considering the requirement for the FOUP to be level, the three positioning pins need to be repeatedly adjusted. During the adjustment process, the locking nut needs to be loosened manually, and the positioning pins need to be rotated with a wrench to rotate them up or down. After the adjustment is completed, the locking nut is locked again.

[0005] However, the above adjustment methods are rather cumbersome and require shutdown operations, which reduces equipment capacity. Utility Model Content

[0006] The purpose of this application is to provide a front-opening interface mechanical standard system and semiconductor process equipment, which can solve the problems of cumbersome operation and reduced equipment capacity caused by manually adjusting the positioning pin.

[0007] To solve the above-mentioned technical problems, this application is implemented as follows:

[0008] This application provides a front-opening interface mechanical standard system for carrying a wafer cassette and driving the wafer cassette to move. The front-opening interface mechanical standard system includes: a motherboard and a slide mechanism disposed on the motherboard.

[0009] The slide mechanism includes a bracket, a slide body, and multiple positioning components. The bracket is connected to the side of the motherboard, and the slide body is slidably connected to the bracket in a direction close to or away from the motherboard. The multiple positioning components are respectively disposed on the slide body.

[0010] Each of the positioning components includes a positioning element and a driving component. The positioning element is movably connected to the slide body and is movable in a direction perpendicular to the surface of the slide body. The driving component is connected to the slide body and is drively connected to the positioning element.

[0011] In this embodiment, a driving component can move a positioning element along a direction perpendicular to the surface of the slide body, thereby adjusting the height of a local area of ​​the wafer cassette corresponding to the positioning element. The levelness of the wafer can be adjusted by adjusting at least some of the multiple positioning components. By simultaneously moving the positioning elements of each of the multiple positioning components along a direction perpendicular to the surface of the slide body, the entire wafer cassette can be raised and lowered to adjust its height. Compared to related technologies that use manual tightening of locking nuts to raise and lower the positioning pins to adjust the levelness and height of the wafer cassette, this embodiment achieves automated movement of the positioning element, greatly reducing the complexity of the adjustment method. Furthermore, the levelness and height of the positioning element can be adjusted without stopping the machine, thereby increasing equipment productivity. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the assembly of a front-opening interface mechanical standard system and a wafer cassette in related technologies.

[0013] Figure 2 This is a schematic diagram of the structure of the front-opening interface mechanical standard system disclosed in the embodiments of this application;

[0014] Figure 3 This is a schematic diagram of the slide mechanism disclosed in the embodiments of this application;

[0015] Figure 4 This is a first partial schematic diagram of the slide mechanism disclosed in the embodiments of this application;

[0016] Figure 5 This is a second partial schematic diagram of the slide mechanism disclosed in the embodiments of this application;

[0017] Figure 6 This is a third partial schematic diagram of the slide mechanism disclosed in the embodiments of this application;

[0018] Figure 7 This is a front view of the positioning component disclosed in the embodiments of this application;

[0019] Figure 8 This is a left view of the positioning element disclosed in the embodiments of this application;

[0020] Figure 9 This is a front view of the driven wheel disclosed in an embodiment of this application;

[0021] Figure 10 This is a left view of the driven wheel disclosed in an embodiment of this application;

[0022] Figure 11 This is a schematic diagram of the assembly of the positioning component and the driven wheel disclosed in the embodiments of this application;

[0023] Figure 12 This is a schematic diagram of the structure of the transmission device, cavity, front-opening interface mechanical standard system and wafer cell disclosed in the embodiments of this application;

[0024] Figure 13 This is a schematic diagram of the structure of the wafer cassette and wafer disclosed in the embodiments of this application;

[0025] Figure 14 This is a schematic diagram of the wafer cassette and the wafer tilted in the XZ plane as disclosed in the embodiments of this application;

[0026] Figure 15 This is a schematic diagram of the wafer cassette and the wafer tilted in the YZ plane as disclosed in the embodiments of this application;

[0027] Figure 16 This is a schematic diagram of the control relationship disclosed in the embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1- Front-opening interface mechanical standard system;

[0030] 100 - Motherboard; 110 - Window;

[0031] 200-Slide mechanism;

[0032] 210-Standard;

[0033] 220 - Slide body; 221 - Through hole; 222 - Fixing component;

[0034] 230 - Positioning assembly; 231 - Positioning element; 2311 - Slide groove; 232 - Drive component; 2321 - Rotary drive component; 233 - Transmission component; 2331 - Driven wheel; 23311 - Slide rail; 23312 - Flange; 23313 - Ring protrusion; 2332 - Drive wheel; 2333 - Transmission belt;

[0035] 240-Bearing;

[0036] 251 - Position detection element; 252 - Limiting element;

[0037] 2-Wafer box;

[0038] 3-Transmission device. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0041] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0042] refer to Figures 2 to 16 This application discloses a front-opening interface mechanical standard system 1 for carrying a wafer cassette 2 and driving its movement. The front-opening interface mechanical standard system 1 can be applied to vertical heat treatment equipment. In this case, the front-opening interface mechanical standard system 1 can move the wafer cassette 2 to a position opposite to the microenvironment chamber of the vertical heat treatment equipment, facilitating the removal or placement of clean wafers from or into the wafer cassette 2 via a transfer system. Of course, the front-opening interface mechanical standard system 1 can also be applied to other equipment, which are not specifically limited here. The disclosed front-opening interface mechanical standard system 1 includes a main board 100 and a slide mechanism 200.

[0043] The motherboard 100 is a basic component that provides an installation base for the slide mechanism 200. The slide mechanism 200 is mounted on the motherboard 100, which ensures the airtightness of the microenvironment chamber. The slide mechanism 200 is used to support and move the wafer cassette 2. In some embodiments, the motherboard 100 has a window 110. When the slide mechanism 200 moves the wafer cassette 2 to a position opposite the window 110, it stops moving the wafer cassette 2. Subsequently, the wafer cassette 2 is opened through the door opening mechanism of the front-opening interface mechanical standard system 1 to facilitate the removal or insertion of wafers from or into the wafer cassette 2.

[0044] The slide mechanism 200 includes a support 210, a slide body 220, and multiple positioning components 230, such as... Figure 3 As shown. The bracket 210 is connected to the side of the motherboard 100, and the slide body 220 is slidably connected to the bracket 210 in a direction approaching or away from the motherboard 100. Multiple positioning components 230 are respectively disposed on the slide body 220. Based on this configuration, when the wafer cassette 2 is placed on the slide body 220, the multiple positioning components 230 are adapted to the mating grooves provided on the bottom of the wafer cassette 2, thereby achieving the positioning of the wafer cassette 2. At the same time, it also ensures that the wafer cassette 2 does not move relative to the slide body 220 when it moves with the slide body 220.

[0045] For example, the bracket 210 can be fixedly mounted to the motherboard 100 with screws to ensure the firmness and stability of the bracket 210 installation; the slide body 220 slides relative to the bracket 210 to allow the wafer cassette 2 carried by the slide body 220 to be tightly fitted to and detached from the motherboard 100. In addition, there can be three positioning components 230, and of course, there can also be four, five, etc., the specific number is not limited.

[0046] In this embodiment of the application, each positioning component 230 includes a positioning element 231 and a driving component 232, such as... Figures 4 to 6 As shown. Positioning member 231 is movably connected to the slide body 220 and is movable in a direction perpendicular to the surface of the slide body 220. Driving member 232 is connected to the slide body 220 and is drively connected to the positioning member 231. Based on this configuration, the driving member 232 can drive the positioning member 231 to move in a direction perpendicular to the surface of the slide body 220, thereby adjusting the height of a local area of ​​the wafer cassette 2 corresponding to the positioning member 231. The levelness of the wafer can be adjusted by adjusting at least some of the positioning components 230. By simultaneously moving the positioning members 231 of each of the multiple positioning components 230 in a direction perpendicular to the surface of the slide body 220, the wafer cassette 2 can be raised and lowered as a whole to adjust its height.

[0047] Compared to the method of manually tightening the locking nut in related technologies to raise and lower the positioning pin in order to adjust the level and height of the wafer cassette 2, the present application embodiment realizes the automated movement of the positioning component 231, which can greatly reduce the cumbersomeness of the adjustment method, and the level and height of the positioning component 231 can be adjusted without stopping the machine, thereby improving the equipment's production capacity.

[0048] Continue to refer to Figures 4 to 6 In some embodiments, the positioning component 230 may further include a transmission component 233, which includes a driven wheel 2331. The driven wheel 2331 is rotatably disposed on the slide body 220 and is connected to the drive component 232. The positioning component 231 is threadedly connected to one of the slide body 220 and the driven wheel 2331, and slidably connected to the other. Based on this configuration, the drive component 232 can drive the driven wheel 2331 to rotate relative to the slide body 220. In addition, when the positioning component 231 is threadedly connected to the driven wheel 2331 and slidably connected to the slide body 220, the rotation of the driven wheel 2331 can drive the positioning component 231 to move relative to the slide body 220, thereby changing the relative position of the positioning component 231 with respect to the surface of the slide body 220, so as to adjust the levelness or height of the wafer cassette 2.

[0049] When the positioning element 231 is threadedly connected to the slide body 220 and slidably connected to the driven wheel 2331, the driven wheel 2331 can drive the positioning element 231 to rotate, thereby allowing the positioning element 231 to move relative to the slide body 220, so as to change the relative position of the positioning element 231 with respect to the surface of the slide body 220.

[0050] By using a sliding connection, rotational motion can be converted into translation, thereby enabling adjustment of the position of the positioning component 231.

[0051] It should be noted that when the positioning member 231 is slidably connected to the slide body 220, a limiting structure can be provided to prevent the positioning member 231 from rotating relative to the slide body 220. For example, one of the positioning member 231 and the slide body 220 can be provided with a limiting groove, and the other with a limiting protrusion. The cooperation between the limiting protrusion and the limiting groove ensures that the positioning member 231 will not rotate relative to the slide body 220. In this case, the driven wheel 2331 drives the positioning member 231 to move through a threaded engagement, thereby changing the relative position of the positioning member 231 with respect to the surface of the slide body 220.

[0052] When the positioning member 231 is slidably connected to the driven wheel 2331, a limiting structure can be provided to prevent the positioning member 231 from rotating relative to the driven wheel 2331. For example, one of the positioning member 231 and the slide body 220 can be provided with a limiting groove, and the other with a limiting protrusion. The cooperation between the limiting protrusion and the limiting groove ensures that the positioning member 231 will not rotate relative to the driven wheel 2331. In this case, the driven wheel 2331 drives the positioning member 231 to rotate, and the positioning member 231 moves through the threaded connection between the positioning member 231 and the slide body 220, thereby changing the relative position of the positioning member 231 with respect to the surface of the slide body 220.

[0053] refer to Figures 7 to 11 In some embodiments, the driven wheel 2331 is provided with a slide rail 23311 along its own axis, and the positioning member 231 is at least partially inserted into the slide rail 23311. One of the outer wall of the positioning member 231 and the inner wall of the slide rail 23311 may be provided with a groove 2311, and the other may be provided with a flange 23312, which slides in engagement with the groove 2311. Based on this arrangement, the sliding engagement of the flange 23312 and the groove 2311 allows the positioning member 231 to move relative to the driven wheel 2331, preventing the driven wheel 2331 from interfering with the movement of the positioning member 231. Furthermore, the engagement of the flange 23312 and the groove 2311 also ensures the synchronous rotation of the positioning member 231 and the driven wheel 2331, facilitating the rotation of the positioning member 231 by the driven wheel 2331.

[0054] Furthermore, the slide body 220 may be provided with a through hole 221, through which the positioning member 231 passes and is threadedly connected. Thus, during the rotation of the positioning member 231 driven by the driven wheel 2331, the threaded connection causes the positioning member 231 to both rotate and move relative to the slide body 220, thereby achieving automatic adjustment of the position of the positioning member 231.

[0055] In some embodiments, the transmission component 233 may further include a drive pulley 2332 and a transmission belt 2333, such as Figure 5 and Figure 6 As shown. The driving wheel 2332 and the driven wheel 2331 are connected by a transmission belt 2333. Additionally, the drive component 232 includes a rotary drive member 2321, with the driving wheel 2332 connected to the shaft of the rotary drive member 2321. Based on this configuration, the rotary drive member 2321 drives the driving wheel 2332 to rotate, and the driving wheel 2332 drives the driven wheel 2331 to rotate via the transmission belt 2333. The rotation of the driven wheel 2331 can move the positioning member 231 relative to the slide body 220, thereby adjusting the level or height of the wafer cassette 2 through the movement of at least a portion of the positioning member 231.

[0056] For example, the rotary drive component 2321 can be a motor, such as a servo motor, etc. Of course, it can also be other components, which are not specifically limited here.

[0057] In some embodiments, both the driving pulley 2332 and the driven pulley 2331 can be synchronous pulleys, and the transmission belt 2333 can be a synchronous belt. The synchronous belt is meshed with the driving pulley 2332 and the driven pulley 2331 respectively. In this way, the transmission accuracy can be guaranteed, thereby improving the adjustment accuracy of the level or height of the wafer cassette 2.

[0058] In other embodiments, the driving wheel 2332 and the driven wheel 2331 can both be in the form of sprockets, ordinary pulleys, etc. Correspondingly, the transmission belt 2333 can be a chain, ordinary belt, such as a V-belt, etc. This method can also be used for transmission.

[0059] In other embodiments, the drive component 232 and the transmission component 233 may also adopt a gear meshing transmission method, a coupling transmission method, etc., as long as the transmission can be achieved, and the specific form is not limited.

[0060] In this embodiment of the application, the slide body 220 may include a fixing member 222, such as... Figures 4 to 6 As shown. The fixing member 222 is connected to the bottom end face of the slide body 220. The driven wheel 2331 is rotatably connected to the fixing member 222 through the bearing 240. In this way, the fixing member 222 can play a role in installing and supporting the bearing 240, and the setting of the bearing 240 ensures the smooth rotation of the driven wheel 2331.

[0061] Considering that the positioning component 231 bears the weight of the wafer cassette 2 and the bearing 240 is mainly subjected to axial force, in this embodiment of the application, the bearing 240 can be a thrust bearing. The thrust bearing can withstand a large axial force and ensure the smooth rotation of the positioning component 231.

[0062] Furthermore, one end of the driven wheel 2331 may be provided with an annular protrusion 23313, such as... Figure 9 As shown, the annular protrusion 23313 is fitted into the shaft hole of the thrust bearing, and the end face of one end of the driven wheel 2331 abuts against the end face of the thrust bearing. Based on this configuration, the fit between the annular protrusion 23313 and the shaft hole ensures the stability of the driven wheel 2331. The abutment between the driven wheel 2331 and the end face of the thrust bearing allows the thrust bearing to withstand the axial force from the driven wheel 2331, thus ensuring the smooth rotation of the driven wheel 2331. Furthermore, the fit between the annular protrusion 23313 and the shaft hole provides a horizontal constraint on the driven wheel 2331. The abutment between the driven wheel 2331 and the end face of the thrust bearing also provides a vertical constraint on the driven wheel 2331.

[0063] refer to Figure 5 and Figure 6 In some embodiments, the front-opening interface mechanical standard system 1 may further include a position detection element 251, which is disposed on the slide body 220 and used to detect the position of the positioning member 231 in a direction perpendicular to the surface of the slide body 220. Additionally, the position detection element 251 may be drive-connected to the drive component 232, thereby controlling the operation of the drive component 232 based on the detected height information of the positioning member 231, so that the positioning member 231 can reach a preset height.

[0064] For example, the position detection element 251 can be a position sensor, a distance sensor, etc., and of course, it can also be other types of components, which are not specifically limited here.

[0065] Additionally, the position detection element 251 can be mounted on the positioning member 231 so that the position detection element 251 is supported by the positioning member 231.

[0066] Continue to refer to Figure 5 and Figure 6 In some embodiments, the front-opening interface mechanical standard system 1 may further include a limiting element 252, which is disposed on the slide body 220 and used to limit the position of the positioning member 231 in a direction perpendicular to the surface of the slide body 220. Additionally, the limiting element 252 may be drive-connected to the drive component 232, so that after the positioning member 231 moves to its limit position, a control signal can be sent to the drive component 232 via the limiting element 252 to stop the drive component 232.

[0067] For example, the limiting element 252 can be a limit sensor, a limit switch, or other components. Of course, it can also be other types of components, which are not specifically limited here.

[0068] Based on the aforementioned front-opening interface mechanical standard system 1, this application embodiment also discloses a semiconductor process equipment, including a microenvironment chamber and the aforementioned front-opening interface mechanical standard system 1, wherein the motherboard 100 is connected to the side wall of the microenvironment chamber, or a partial side wall of the microenvironment chamber serves as the motherboard 100.

[0069] In some embodiments, the positioning component (230) may further include a transmission component (233), which includes a driven wheel (2331) that is rotatably connected to the driving component (232). The driven wheel (2331) is rotatably disposed on the slide body (220). The positioning element (231) is threadedly connected to one of the slide body (220) and the driven wheel (2331), and slidably connected to the other. The semiconductor process equipment may also include a control element. In addition, the driving component 232 may include a rotary drive 2321 and a driver. The rotary drive 2321 is a servo motor, which is rotatably connected to the driven wheel 2331. The driver is electrically connected to the control element. The control element controls the servo motor to rotate the driven wheel 2331 through the driver, so as to move the positioning element 231 through the driven wheel 2331. Based on this configuration, automatic adjustment of the positioning element 231 is achieved, thereby improving adjustment efficiency.

[0070] In some embodiments, the positioning member 231 may include a head end and a rod body, wherein the head end is connected to one end of the rod body; in addition, the outer wall of the head end may be provided with an adjustment surface so that if the position of the positioning member 231 cannot be automatically adjusted due to damage to the drive component 232 or other factors, the positioning member 231 can be rotated by using an auxiliary tool in cooperation with the adjustment surface.

[0071] In addition, a tool retraction groove can be provided at the connection between the rod body and the head end to facilitate tool retraction.

[0072] The end of the head that is away from the rod can be provided with two arc structures, which are used to fit with the groove at the bottom of the wafer box 2.

[0073] In this embodiment, after the wafer cassette 2 enters the wafer transfer system, its information is first read by a reading device (RFID Reader) on the device. After reading, the wafer cassette 2 is moved onto the slide mechanism 200 by the transfer device 3 (e.g., a robotic arm). The information of the wafer cassette 2 is transmitted to the host computer via the PLC and the lower computer. It is compared with the list of wafer cassette 2 stored in the host computer to obtain the height adjustment value of the positioning component 231 corresponding to each wafer cassette 2. Then, the lower computer and the PLC control the drivers of the multiple rotary drive components 2321 to control the rotation of the multiple rotary drive components 2321, thereby automatically adjusting the multiple positioning components 231.

[0074] Furthermore, for semiconductor process equipment, the coordination between the front-open interface mechanical standard system 1 (FIMS) and the transfer device 3 is a critical step in completing the process. During the wafer pick-up process of the transfer device 3, there are coordination issues in multiple directions. If there is a misalignment in one or more directions, it can lead to problems such as wafer pick-up / placement failure, wafer scraping, wafer slippage, and wafer detachment, causing significant production losses. An XYZ coordinate system is specified within a wafer cassette 2, such as... Figure 13 As shown, generally speaking, the rotation of the XY plane can be guaranteed by the tolerance requirements of the machined parts, while the levelness adjustment of the YZ and XZ planes needs to be adjusted by the front-opening interface mechanical standard system 1.

[0075] refer to Figure 14 and Figure 15 In actual operation, the transmission device 3 is kept horizontal. Different types of wafer boxes 2 move under the same positioning component 231 adjustment parameters. Due to the different materials and mechanical properties of each wafer box 2, they may tilt on the XZ and YZ planes during the movement, causing the wafers to be out of horizontal position, resulting in uncontrollable wafer transfer process and reduced yield.

[0076] Therefore, in practical applications, to ensure the level of the wafer, the laboratory pre-calibrates the height values ​​corresponding to various wafer cassettes 2 and stores the height values ​​of multiple positioning elements 231 in a table to form a configuration file, which is then sent to the field. During calibration, a wafer sensor capable of outputting levelness is first placed into the wafer cassette 2 to be tested. The bottom of the wafer cassette 2 remains in contact with multiple positioning elements 231, and the levelness (x0, y0) of the wafer cassette 2 is recorded. Taking three positioning elements 231 as an example, their corresponding numbers are as follows: Figure 3 As shown, the surface of the slide body 220 can be considered as a horizontal plane. The heights of the three positioning elements 231 relative to the surface of the slide body 220 are denoted as h1, h2, and h3, respectively. The distance between positioning element 231-1 and positioning element 231-3 is denoted as L1. The distance between the line connecting positioning element 231-1 and positioning element 231-3 and the perpendicular line from positioning element 231-2 is denoted as L2. The technical formula for the levelness adjustment is as follows:

[0077]

[0078]

[0079] Based on the x and y values ​​of the levelness of the wafer box 2, each positioning component 231 has a corresponding adjustment method:

[0080]

[0081] The adjusted levelness of wafer cassette 2 is denoted as (x1, y1). When both x1 and y1 are less than 0.05 mm / m, the levelness adjustment is considered complete. h1, h2, and h3 are recorded as the adjustment parameters for wafer cassette 2. Other wafer cassette 2 calibration methods follow the same logic, thus forming various adjustment parameter configuration files for wafer cassette 2.

[0082] Meanwhile, to prevent the adjustment from exceeding the limit and causing equipment damage, a limit element 252, such as a limit sensor, is set. When the limit element 252 is triggered, the movement in that direction will stop. To increase the system adjustment accuracy, a position detection element 251, such as a position sensor, can also be set to detect the height of the positioning component 231 in real time and match it with the data of the rotation drive component 2321. If the height is within the fixed tolerance range, the adjustment is complete.

[0083] During the on-site generation process, the operational relationships are as follows: Figure 16 As shown, after wafer cassette 2 enters the wafer warehouse (Stocker), it is first read by the RFID reader to obtain its type information. This information is then transmitted to the host computer via the PLC and lower-level machine. The host computer compares this information with the wafer cassette 2 adjustment configuration file. The height of the positioning element 231 is then sent to the driver via the lower-level machine and PLC. The driver controls the servo motor and actuator to complete the predetermined height adjustment of the positioning element 231. The position detection element 251 confirms the completion. If the type of wafer cassette 2 is not found in the configuration file, the machine issues an alarm, requiring manual intervention.

[0084] In summary, the front-opening interface mechanical standard system 1 in this application embodiment can automatically adjust the positioning parts 231 of each of the multiple positioning components 230 without tooling assistance or direct manual intervention. Compared with the method of adjusting the position of the positioning parts 231 by manually tightening the locking nut, this application embodiment improves the adjustment efficiency, effectively overcomes the problem of time and labor consumption, and can adjust the position of the positioning parts 231 without stopping the machine, thereby increasing the equipment capacity and reducing the difficulty of operation and the degree of assistance.

[0085] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A front-opening interface mechanical standard system for carrying a wafer cassette (2) and driving the wafer cassette (2) to move, characterized in that, The front-opening interface mechanical standard system (1) includes: a main board (100) and a slide mechanism (200) disposed on the main board (100). The slide mechanism (200) includes a bracket (210), a slide body (220), and a plurality of positioning components (230). The bracket (210) is connected to the side of the main board (100), and the slide body (220) is slidably connected to the bracket (210) in a direction close to or away from the main board (100). The plurality of positioning components (230) are respectively disposed on the slide body (220). Each of the positioning components (230) includes a positioning element (231) and a driving element (232). The positioning element (231) is movably connected to the slide body (220) and is movable in a direction perpendicular to the surface of the slide body (220). The driving element (232) is connected to the slide body (220) and is drively connected to the positioning element (231).

2. The front-opening interface mechanical standard system according to claim 1, characterized in that, The positioning component (230) further includes a transmission component (233), which includes a driven wheel (2331) that is connected to the driving component (232) in a transmission manner. The driven wheel (2331) is rotatably disposed on the slide body (220). The positioning element (231) is threadedly connected to one of the slide body (220) and the driven wheel (2331), and slidably connected to the other.

3. The front-opening interface mechanical standard system according to claim 2, characterized in that, The driven wheel (2331) is provided with a slide rail (23311) along its own axis, and the positioning member (231) is at least partially inserted in the slide rail (23311); One of the outer wall of the positioning member (231) and the inner wall of the slide (23311) is provided with a groove (2311), and the other is provided with a flange (23312). The flange (23312) slides in conjunction with the groove (2311). The slide body (220) is provided with a through hole (221), and the positioning member (231) passes through the through hole (221) and is threadedly connected to the through hole (221).

4. The front-opening interface mechanical standard system according to claim 2, characterized in that, The transmission component (233) also includes a drive pulley (2332) and a transmission belt (2333). The drive component (232) includes a rotary drive component (2321), the drive wheel (2332) is driven to the shaft of the rotary drive component (2321), and the drive wheel (2332) and the driven wheel (2331) are driven to be connected by the drive belt (2333).

5. The front-opening interface mechanical standard system according to claim 4, characterized in that, Both the driving pulley (2332) and the driven pulley (2331) are synchronous belt pulleys, and the transmission belt (2333) is a synchronous belt; The synchronous belt is engaged with the driving pulley (2332) and the driven pulley (2331) respectively.

6. The front-opening interface mechanical standard system according to claim 2, characterized in that, The slide body (220) includes a fixing member (222), which is connected to the bottom end face of the slide body (220); The driven wheel (2331) is rotatably connected to the fixed member (222) via a bearing (240).

7. The front-opening interface mechanical standard system according to claim 6, characterized in that, The bearing (240) is a thrust bearing; One end of the driven wheel (2331) is provided with an annular protrusion (23313), which is fitted with the shaft hole of the thrust bearing. The end face of one end of the driven wheel (2331) abuts against the end face of the thrust bearing.

8. The front-opening interface mechanical standard system according to claim 1 or 6, characterized in that, The front-opening interface mechanical standard system (1) further includes a position detection element (251), which is disposed on the slide body (220) and is used to detect the position of the positioning member (231) in a direction perpendicular to the surface of the slide body (220).

9. The front-opening interface mechanical standard system according to claim 1 or 6, characterized in that, The front-opening interface mechanical standard system (1) also includes a limiting element (252), which is disposed on the slide body (220) and is used to limit the position of the positioning member (231) in a direction perpendicular to the surface of the slide body (220).

10. A semiconductor process apparatus, characterized in that, Includes a microenvironment chamber and the front-opening interface mechanical standard system as described in any one of claims 1 to 9; The motherboard (100) is connected to the side wall of the microenvironment chamber, or a portion of the side wall of the microenvironment chamber serves as the motherboard (100).

11. The semiconductor process equipment according to claim 10, characterized in that, The positioning component (230) further includes a transmission component (233), which includes a driven wheel (2331) that is pulverically connected to the driving component (232). The driven wheel (2331) is rotatably mounted on the slide body (220). The positioning component (231) is threadedly connected to one of the slide body (220) and the driven wheel (2331), and slidably connected to the other. The semiconductor process equipment also includes control elements; The driving component (232) includes a rotary drive (2321) and a driver. The rotary drive (2321) is a servo motor. The servo motor is connected to the driven wheel (2331) for transmission. The driver is electrically connected to the control element. The control element controls the servo motor to drive the driven wheel (2331) to rotate through the driver, so as to drive the positioning component (231) to move through the driven wheel (2331).

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