Taiko wafer processing device

Abstract

The utility model relates to a Taiko wafer processing device, a scribing film is adhered to the back surface of a Taiko wafer, the Taiko wafer comprises an effective chip area formed after scribing and a waste edge area surrounding the effective chip area, the waste edge area comprises a supporting ring body, the Taiko wafer processing device comprises a bearing table and a removing part, and the bearing table is used for bearing the Taiko wafer adhered with the scribing film; the removing part is movably installed on the bearing table and used for picking up the waste edge area and stripping the waste edge area from the scribing film, according to the technical scheme, ring cutting is not needed, the Taiko wafer is scribed to form the waste edge area comprising the supporting ring body, the removing part picks up the waste edge area and strips the waste edge area from the scribing film, and therefore the cutting efficiency is improved, and the cutting efficiency is improved. According to the Taiko wafer processing device, the effective chip area is reserved on the scribing film, compared with the prior art, the annular cutting process step and annular cutting equipment are omitted, and compared with the annular cutting equipment, the Taiko wafer processing device saves the cost and reduces the chip production cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to a Taiko wafer processing apparatus. Background Technology

[0002] As electronic products become increasingly integrated, semiconductor chips, the core of integrated circuits, are required to be thinner and thinner. Typically, chip thickness is achieved by thinning the wafer. When the wafer is thinned to below 200 micrometers, the mechanical strength of the entire wafer decreases significantly, causing it to bend and making further transport and processing impossible. However, with the Taiko thinning process, only the middle part of the wafer is thinned, using the middle part to form the integrated circuit device. Thicker support rings around the perimeter maintain the mechanical strength of the entire wafer, preventing bending and facilitating subsequent wafer transport and processing.

[0003] After the wafer thinning process is completed, the entire Taiko wafer needs to be diced into individual chips. The existing Taiko wafer processing flow involves fixing the Taiko wafer on a dicing film, first removing the thicker support ring at the edge, and then dicing the remaining thinned part in the middle. In other words, a ring cutting step is required before the Taiko wafer is diced. The ring cutting process requires specific ring cutting equipment, which increases the chip production cost. Utility Model Content

[0004] This application provides a Taiko wafer processing apparatus to solve the technical problem in the related art that Taiko wafers are first circumcised and then diced, and the circumcised process requires specific circumcised equipment, resulting in high chip production costs.

[0005] To achieve the above objectives, according to a first aspect of this application, a Taiko wafer processing apparatus is provided, wherein a dicing film is adhered to the back side of the Taiko wafer, the Taiko wafer includes an effective chip region formed after dicing and a waste edge region surrounding the effective chip region, the waste edge region including a support ring, and the Taiko wafer processing apparatus comprising:

[0006] A support stage for holding the Taiko wafer with the dicing film adhered to it; and,

[0007] A removal unit, movably mounted on the support platform, is used to pick up the waste edge area and peel it off from the dicing film.

[0008] Optionally, the support platform is provided with a base and a boss protruding from the base. The boss is used to be disposed in the support ring body and support the effective chip area; the base is used to support the support ring body.

[0009] Optionally, the protrusion is provided with an adsorption hole for connecting to a negative pressure generating device, so that the effective chip area can be adsorbed onto the protrusion.

[0010] Optionally, the outer periphery of the dicing film extends beyond the outer periphery of the Taiko wafer and is connected to the tension frame;

[0011] The base is provided with a mounting groove surrounding the boss, the mounting groove being used to mount the tension frame so that the portion of the dicing film extending beyond the Taiko wafer is disposed within the mounting groove.

[0012] Optionally, the base is further provided with an operating groove, which is at least partially recessed at the bottom of the mounting groove, and extends from the mounting groove toward a direction away from the boss.

[0013] Optionally, the operating groove extends to the outer periphery of the support platform.

[0014] Optionally, the support platform is provided with a light source, and the support platform is also provided with a plurality of spaced positioning holes that can transmit the light source. The plurality of positioning holes are arranged around the boss and are used to correspond to the support ring body, so that when the Taiko wafer is supported on the support platform, the plurality of positioning holes are blocked by the support ring body.

[0015] Optionally, the removal unit includes a mounting base and a plurality of adsorption units disposed on the mounting base. At least one of the adsorption units is detachably connected to the mounting base, and the plurality of adsorption units are configured to correspond to the waste edge area, so that when the removal unit picks up the waste edge area, the plurality of adsorption units are staggered from the effective chip area.

[0016] Optionally, the Taiko wafer processing apparatus further includes a waste collection tray movably disposed on the support stage, such that the waste collection tray can receive the waste edge area released by the removal unit and move it away from the support stage.

[0017] Optionally, the Taiko wafer processing apparatus further includes:

[0018] Base;

[0019] A first base is movably disposed on the machine base in a vertical direction; and

[0020] The second base is movably mounted on the machine base along the horizontal direction;

[0021] The support platform is located on the machine base, the removal part is located on the first base and can move toward or away from the support platform, and the waste collection tray is located on the second base and can move toward or away from the removal part.

[0022] Optionally, the base is provided with a waste inlet, and the waste collection tray can be located above the waste inlet to pour the collected waste edge area into the waste inlet.

[0023] Optionally, the Taiko wafer processing apparatus further includes a dicing mechanism for dicing the Taiko wafer to form a valid chip region and a waste edge region surrounding the valid chip region.

[0024] In the Taiko wafer processing apparatus of this application embodiment, a Taiko wafer with a dicing film adhered to it and after dicing is placed on a carrier stage. The Taiko wafer includes a valid chip area and a waste edge area formed after dicing. The waste edge area includes a support ring, meaning that circumferential dicing is not required; instead, the waste edge area including the support ring is formed by dicing the Taiko wafer. The removal unit picks up the waste edge area and peels it off from the dicing film, leaving the valid chip area on the dicing film. Compared to related technologies, this eliminates the need for circumferential dicing steps and equipment, resulting in cost savings and reduced chip production costs.

[0025] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0028] Figure 1 This is a schematic diagram of the structure of the Taiko wafer processing apparatus provided in an exemplary embodiment of this disclosure;

[0029] Figure 2 yes Figure 1 Schematic diagram of the structure of the central support platform;

[0030] Figure 3 This is a schematic diagram of the front structure of a Taiko wafer;

[0031] Figure 4 This is a schematic diagram of the back structure of a Taiko wafer;

[0032] Figure 5This is a process flow diagram of Taiko wafers provided in an exemplary embodiment of this disclosure.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Taiko wafer processing apparatus; 1. Support stage; 11. Base; 12. Boss; 13. Mounting slot; 14. Operating slot; 15. Positioning hole; 2. Removal section; 21. Mounting base; 22. Adsorption unit; 3. Waste collection tray; 4. Base; 5. First base; 6. Second base; 7. Waste outlet; 200. Taiko wafer; 210. Effective chip area; 211. Chip; 220. Waste edge area; 230. Thinned wafer body; 240. Support ring; 300. Dicing film. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0036] This application provides a Taiko wafer processing apparatus. Figure 1 and Figure 2 This is a schematic diagram of the structure of the Taiko wafer processing apparatus provided in an embodiment of this application.

[0037] Please see Figure 1 The Taiko wafer processing apparatus 100 includes a support platform 1, which is used to support the Taiko wafer 200 with the dicing film 300 adhered to it. The support platform 1 provides a stable platform for supporting and positioning the Taiko wafer 200 to be processed. During the processing of the Taiko wafer 200, the support platform 1 ensures that the Taiko wafer 200 remains fixed to avoid errors caused by vibration or movement.

[0038] Please refer to the attached diagram for an explanation of the Taiko 200 wafer to be processed. Figure 3 and Figure 4 As is understandable, the Taiko wafer 200 includes a thinned wafer body 230 and a support ring 240 surrounding the thinned wafer body 230. Please refer to [link / reference]. Figure 5Typically, the dicing process of Taiko wafer 200 can only dice the thinned wafer body 230, not the support ring 240. Due to size and shape limitations, most of the thinned wafer body 230 can be diced into individual chips 211, which is the part that needs to be retained and used later, referred to in this application as the effective chip area 210. A small portion of the thinned wafer body 230 remains connected to the support ring 240, which is no longer needed in chip manufacturing and needs to be removed; referred to in this application as the waste edge area 220. Therefore, this application provides a Taiko wafer processing apparatus 100 to remove the waste edge area 220.

[0039] The Taiko wafer processing apparatus 100 also includes a removal unit 2, which is movably mounted on the stage 1. The removal unit 2 is used to pick up the waste edge area 220 and peel the waste edge area 220 off the dicing film 300. That is, the removal unit 2 picks up the waste edge area 220 during the Taiko wafer 200 processing and moves away from the stage 1 after picking up the waste edge area 220, so that the waste edge area 220 overcomes the adhesion force of the dicing film 300 and separates from the dicing film 300, thereby removing the waste edge area 220 and allowing the effective chip area 210 to remain on the dicing film 300.

[0040] Please continue reading. Figure 5 When using the Taiko wafer processing apparatus 100, the process flow of the Taiko wafer 200 includes the following steps: a dicing film 300 is adhered to the back side of the Taiko wafer 200; then the thinned wafer body 230 is diced to form an effective chip region 210 and a waste edge region 220 surrounding the effective chip region 210; then the waste edge region 220 is removed using the Taiko wafer processing apparatus 100, leaving the effective chip region 210 containing individual chips 211 on the dicing film 300.

[0041] That is, in the related technology, the Taiko wafer 200 is first circumcised and then diced. After adopting the Taiko wafer processing apparatus 100, the Taiko wafer 200 is first diced and then the waste edge area 220 is removed. The separate circumcising step is no longer required. The Taiko wafer processing apparatus 100 replaces the more expensive circumcising equipment.

[0042] In the technical solution of this application, a Taiko wafer 200, which has been diced and coated with a dicing film 300, is placed on a support stage 1. The Taiko wafer 200 includes an effective chip region 210 and a waste edge region 220 formed after dicing. The waste edge region 220 includes a support ring 240. That is, circumferential cutting is not required; instead, the waste edge region 220, including the support ring 240, is formed by dicing the Taiko wafer 200. The removal unit 2 picks up the waste edge region 220 and peels it off from the dicing film 300, leaving the effective chip region 210 on the dicing film 300. Compared to related technologies, this eliminates the need for circumferential cutting processes and equipment. The Taiko wafer processing apparatus 100 saves costs compared to circumferential cutting equipment, reducing chip production costs.

[0043] It should be noted that the back side of the Taiko wafer 200 refers to the side of the wafer that has been partially thinned. That is, on the back side of the Taiko wafer 200, there is a height difference between the thinned wafer body 230 and the support ring 240.

[0044] In some embodiments, the support platform 1 is provided with a base 11 and a boss 12 protruding from the base 11. The boss 12 is disposed within the support ring 240 and supports the thinned wafer body 230; the base 11 is used to support the support ring 240. In these embodiments, when the Taiko wafer 200 is supported on the support platform 1, the boss 12 is embedded within the support ring 240 of the Taiko wafer 200 and supports the thinned wafer body 230, and the base 11 supports the support ring 240. By precisely matching the boss 12 with the thinned wafer body... The height difference between the body 230 and the base 11 and the support ring 240 creates a concave-convex fit between the Taiko wafer 200 and the support stage 1, ensuring that the Taiko wafer 200 can be precisely aligned and stably supported during processing, avoiding displacement and vibration during processing. The removal unit 2 can accurately pick up the waste edge, allowing the waste edge area 220 to be removed more accurately and efficiently, while reducing interference and accidental collisions to the effective chip area 210, improving processing efficiency and avoiding processing damage. This design also ensures uniform stress distribution in the thinned wafer body 230 and support ring 240 during bearing, avoiding deformation or damage to the Taiko wafer 200 caused by local stress concentration, thus guaranteeing chip performance and improving production quality. It should be emphasized that in these embodiments, the front side of the Taiko wafer 200 faces away from the support stage 1, and the back side of the Taiko wafer 200 faces the support stage 1. The Taiko wafer 200 does not directly contact the support stage 1, but rather contacts the support stage 1 through the dicing film 300 adhered to its back side. In this way, the Taiko wafer 200 is better protected and avoids damage.

[0045] Understandably, by adjusting the size and shape of the boss 12 and the base 11, the support stage 1 can adapt to different sizes and types of Taiko wafers 200, improving the adaptability and flexibility of the processing equipment to meet different production needs.

[0046] In some embodiments, the boss 12 is provided with an adsorption hole for connecting to a negative pressure generating device, so that the thinned wafer body 230 can be adsorbed onto the boss 12. In these embodiments, the adsorption hole, by connecting to the negative pressure generating device, can generate a stable negative pressure on the boss 12. The dicing film 300 on the thinned wafer body 230 will directly contact the adsorption hole on the boss 12. The negative pressure acts on the dicing film 300 through the adsorption hole, thereby firmly adsorbing the thinned wafer body 230 onto the boss 12, providing a more stable support for the thinned wafer body 230, ensuring the stability and accuracy of the Taiko wafer 200 during the processing. Especially in the operation of peeling off the waste edge area 220, the stable adsorption can avoid uneven adhesion between the waste edge area 220 and the dicing film 300 caused by the movement of the Taiko wafer 200, ensuring that the waste edge area 220 can be smoothly and completely peeled off from the dicing film 300, improving production efficiency and production quality.

[0047] Specifically, boss 12 is a porous vacuum ceramic chuck. The surface of the porous vacuum ceramic chuck has adsorption pores, which are composed of continuous pore structures inside the ceramic material. These pores extend from the inside to the surface, forming a sponge-like structure. During use, negative pressure is created in these pores to achieve adsorption of the workpiece. The porous vacuum ceramic chuck has good flatness and parallelism, which is conducive to high-precision positioning. It has good chemical stability, which ensures the safety of the production environment and the durability of the chuck. High insulation helps to eliminate static electricity and reduce the risk of chip damage. The dense and uniform structure does not easily adsorb impurities and is easy to clean and maintain, thus meeting the production requirements of high precision, high stability and safety of chips.

[0048] In some embodiments, the outer periphery of the dicing film 300 extends beyond the outer periphery of the Taiko wafer 200 and is connected to a tension frame (not shown in the figure). The base 11 is provided with a mounting groove 13 surrounding the boss 12. The mounting groove 13 is used to mount the tension frame so that the portion of the dicing film 300 extending beyond the Taiko wafer 200 is disposed within the mounting groove 13. In these embodiments, the tension frame is a frame structure used to fix the edge of the dicing film 300. The mounting groove 13 accommodates and fixes the tension frame. The portion of the dicing film 300 extending beyond the Taiko wafer 200 is pressed into the mounting groove 13 by the tension frame. The portion of the dicing film 300 extending beyond the wafer is kept flat and taut by the support of the tension frame and the mounting groove 13, providing good conditions for the subsequent stripping of the waste edge area 220. This not only improves the accuracy and stability of the processing, but also reduces damage to the surfaces of the dicing film 300 and the Taiko wafer 200, thereby improving the yield and efficiency of chip production.

[0049] Understandably, the design of the mounting groove 13 needs to take into account the size and shape of the tension frame to ensure that it can be firmly installed on the base 11 and will not shift or deform due to vibration during processing. That is, the contour of the part of the tension frame that is accommodated in the mounting groove 13 is adapted to the shape of the mounting groove 13.

[0050] In some embodiments, the base 11 is further provided with an operating groove 14, which is at least partially recessed in the bottom of the mounting groove 13 and extends from the mounting groove 13 toward the direction away from the boss 12. This design allows the hand or auxiliary tool to be inserted into the operating groove 14 when installing the tension frame, so that the tension frame can be placed in the mounting groove 13 more easily and accurately. Similarly, when the tension frame needs to be removed, it can be easily squeezed through the operating groove 14 to achieve convenient picking, placing and moving. The design of the operating groove 14 also reduces the possibility of direct contact with the dicing film 300 and the Taiko wafer 200 during operation, avoiding contamination of the dicing film 300 or damage to the wafer caused by contact with the hand or disassembly tools. Picking and placing the tension frame through the operating groove 14 can more accurately control the position of the tension frame, ensuring its stability and correctness in the mounting groove 13, thereby improving the accuracy and safety of the processing.

[0051] In some embodiments, the operating slot 14 extends to the outer periphery of the support platform 1. The operating slot 14 can directly access the outer periphery of the support platform 1, that is, it is open on the outer periphery of the support platform 1. This design allows the frame to be approached directly from the outer periphery of the support platform 1 without having to go around or pass through other obstacles, thereby improving work efficiency and reducing the difficulty of operation. The open operating slot 14 is also easy to clean, as the inner surface of the operating slot 14 can be directly contacted for more thorough cleaning and inspection, which helps to maintain the hygiene of the device and extend its service life.

[0052] Understandably, the shape, size, and number of operating slots 14 are set as needed. The setting of operating slots 14 has a slight impact on the fixing effect of the mounting slot 13 on the tension frame. In order to ensure the fixing effect of the tension frame, the size of the operating slots 14 should not be set too large, and the number of operating slots 14 should not be too many. In one embodiment, there are two operating slots 14, and the two operating slots 14 are symmetrically arranged. The symmetrically arranged operating slots 14 can provide more balanced support and convenient operation. For example, the tension frame can be installed and disassembled by both hands. While ensuring the convenience of installing and disassembling the tension frame, the stability of the tension frame in the mounting slot 13 is also ensured.

[0053] In some embodiments, the support platform 1 is provided with a light source, and the support platform 1 is also provided with a plurality of spaced positioning holes 15 that can transmit the light source. The plurality of positioning holes 15 are arranged around the boss 12 and are arranged to correspond to the support ring 240, so that when the Taiko wafer 200 is supported on the support platform 1, the plurality of positioning holes 15 are blocked by the support ring 240. In these embodiments, the light source is located inside the support platform 1, and the plurality of positioning holes 15 can provide multi-point positioning. When placing the wafer, the light source is transmitted through the plurality of positioning holes 15, and the light cannot be seen from other positions. It can be used as a visual reference to align the support ring 240 with the plurality of positioning holes 15, which can help to accurately position the wafer and ensure that the wafer is correctly positioned. The wafer is placed on the support platform 1. When the support ring 240 correctly blocks multiple positioning holes 15, the light source is blocked, which can serve as a status indicator that the wafer has been correctly fixed. This helps to quickly confirm the wafer's fixing status and improves operational efficiency. During the removal of the waste edge area 220, if the light source becomes visible, it indicates that the wafer position has shifted. This can serve as a fault detection signal, reminding for timely inspection and adjustment. In addition, the design of the light source can also serve as a safety protection measure to prevent the equipment from being started when the light source is not blocked, thereby avoiding equipment damage or personal injury caused by improper wafer fixing. In this way, the accuracy of wafer positioning is improved, and the safety of equipment operation and fault detection capabilities are also enhanced.

[0054] Understandably, due to the presence of the boss 12 and the positioning hole 15, the Taiko wafer 200 can be aligned using a combination of operator visual inspection and manual adjustment to achieve precise positioning. In some embodiments, the Taiko wafer processing apparatus 100 includes a module for aligning and automatically adjusting the wafer position, enabling automatic wafer alignment and position adjustment. Specifically, the automation module typically includes high-precision sensors, an image recognition system, and a servo control system. Equipped with high-precision cameras and sensors, it can capture features on the wafer surface, such as marker points, edge contours, or positioning holes 15. The image recognition algorithm analyzes these features to determine the actual position and orientation of the wafer. The system's built-in processor or controller calculates the current position deviation and the angle that needs adjustment based on the image recognition results and preset wafer position information. Based on the calculated position information, the servo control system drives a precision robotic arm or platform to fine-tune the wafer until it reaches the preset precise position.

[0055] This application does not limit the position and number of positioning holes 15. In one embodiment, four positioning holes 15 are provided. The four positioning holes 15 are evenly distributed around the boss 12 to form a symmetrical layout, which can correspond to the four positions of the support ring 240 and provide more balanced positioning, so that the wafer is accurately fixed on the support stage 1. When the support ring 240 is offset, the operator can easily identify the offset direction according to these symmetrically distributed positioning holes 15 and make corresponding adjustments to quickly correct it to the correct position, simplifying the correction process and improving the accuracy of positioning and the convenience of adjustment operation.

[0056] This application does not limit the specific structure and installation method of the light source. Specifically, the back of the support platform 1 is provided with two lamp slots. Process holes are provided on the inner wall of the lamp slots. The lamp tubes are housed in the lamp slots and are used to install in the process holes. Then, the opening of the lamp slots is covered by a cover plate, which is locked and fixed by screws. It can be understood that the positioning hole 15 penetrates the inner wall of the lamp slot and the front of the support platform 1 to transmit the light emitted by the lamp tubes.

[0057] Understandably, different types of Taiko wafers 200 have different shapes and sizes of the effective chip area 210 and waste edge area 220 formed after dicing. The removal unit 2 needs to avoid the effective chip area 210 and accurately pick up the effective chip area 210.

[0058] This application does not limit the specific configuration of the removal unit 2. For example, the removal unit 2 may include a robotic arm, which can provide flexible gripping and peeling operations, is suitable for waste edge areas 220 of various shapes and sizes, and can perform precise positioning and control to reduce damage to the effective chip area 210. However, the cost of the robotic arm is relatively high, and the maintenance and operation complexity is also high. The accuracy of the robotic arm needs to be calibrated and maintained regularly.

[0059] In some embodiments, the removal unit 2 includes a mounting base 21 and a plurality of adsorption units 22 disposed on the mounting base 21. At least one adsorption unit 22 is detachably connected to the mounting base 21. The plurality of adsorption units 22 are configured to correspond to the waste edge area 220, so that when the removal unit 2 picks up the waste edge area 220, the plurality of adsorption units 22 are staggered from the effective chip area 210. The detachable adsorption units 22 allow for quick replacement or adjustment of the adsorption units 22 according to different wafer sizes or waste edge area 220 shapes, thereby adapting to various processing requirements. This design can significantly improve the flexibility and adaptability of the device. The detachable design allows the use of standardized adsorption units 22, reducing the additional costs caused by customizing adsorption units 22 of different sizes.

[0060] Specifically, the mounting base 21 is designed as a disk-shaped structure with a size comparable to the Taiko wafer 200. Multiple vacuum nozzles are arranged around the periphery of the disk, corresponding to the waste edge area 220, enabling effective adsorption and removal of the waste edge area 220. Since these nozzles are far from the effective chip area 210 at the wafer center, interference and potential damage to the effective chip area 210 can be avoided during waste edge removal, ensuring product quality and yield. Depending on actual needs, one or more vacuum nozzles can be detachably connected to the mounting base 21, allowing for adjustment of the nozzle layout to accommodate different Taiko wafer 200 sizes.

[0061] In some embodiments, multiple removal units 2 are provided, and multiple removal units 2 can correspond to waste edge areas 220 of different shapes and sizes. As needed, one of the removal units 2 can be selected for installation. Although the initial cost may be slightly increased by replacing the removal units 2 as a whole, since each removal unit 2 is designed for a specific Taiko wafer 200 specification, this not only simplifies the training and operation process of operators, but also reduces downtime caused by tool adjustment or replacement by quickly replacing the matching removal unit 2, thereby improving the continuity of the production line and the overall production efficiency. It also simplifies maintenance and upkeep, reduces maintenance costs and time, and thus improves long-term economic benefits.

[0062] In some embodiments, the Taiko wafer processing apparatus 100 further includes a waste collection tray 3, which is movably disposed on the support platform 1 so that the waste collection tray 3 can receive the waste edge area 220 released by the removal unit 2 and move it away from the support platform 1. The movable arrangement of the waste collection tray 3 can effectively collect and transfer the waste edge area 220 it receives, preventing waste from scattering on the support platform 1, avoiding contamination and damage to the product, maintaining a clean processing environment, reducing subsequent cleaning work, and by moving it away when not in use, providing more space for other processing activities, optimizing the production layout. The movable design of the waste collection tray 3 also makes it easy to clean and maintain, reducing the complexity and cost of equipment maintenance, and ensuring the long-term stable operation of the processing apparatus.

[0063] This application does not specifically limit the shape of the waste collection tray 3. For example, the waste collection tray 3 is circular, which is slightly larger than the Taiko wafer 200 to facilitate the collection of the waste edge area 220. Of course, the waste collection tray 3 can also be square or other shapes.

[0064] In some embodiments, the Taiko wafer processing apparatus 100 further includes a base 4, a first base 5, and a second base 6. The first base 5 is movably disposed on the base 4 in a vertical direction; the second base 6 is movably disposed on the base 4 in a horizontal direction; a support stage 1 is disposed on the base 4; a removal unit 2 is disposed on the first base 5 and is movable toward or away from the support stage 1; and a waste collection tray 3 is disposed on the second base 6 and is movable toward or away from the removal unit 2. The vertically movable design of the first base 5 allows the removal unit 2 to be precisely positioned and adjusted to approach or move away from the support stage 1, thereby enabling the pickup of the waste edge area 220. The second base 6's horizontal movement capability allows the waste collection tray 3 to flexibly approach and move away from the removal section 2, ensuring effective waste collection. The independent base design ensures that the removal section 2 and the waste collection tray 3 will not interfere with each other during movement, improving the safety and reliability of the processing process. In addition, the independence of the support platform 1, the removal section 2, and the waste collection tray 3 facilitates maintenance and troubleshooting, reduces downtime, ensures production continuity, and allows for independent adjustment and upgrades to adapt to different processing needs and production environments, improving the long-term adaptability and economy of the device.

[0065] Specifically, the outer periphery of the support platform 1 is provided with multiple lugs, each lug having a threaded hole for threaded fasteners to be inserted to fix the support platform 1 to the base 4.

[0066] In some embodiments, the base 4 has a waste inlet 7, and a waste collection tray 3 can be positioned above the waste inlet 7 to pour the collected waste edge area 220 into the waste inlet 7. The waste inlet 7 on the base 4 facilitates the discharge of the waste edge area 220 for waste treatment or recycling, helps maintain the cleanliness of the work area, reduces the risk of cross-contamination, simplifies the waste treatment process, and improves overall processing efficiency and environmental hygiene standards. Specifically, a container is placed below the waste inlet 7, and the waste edge area 220 can be directly poured into the container below through the waste inlet 7. This not only simplifies the waste treatment process but also improves the efficiency of waste collection, avoids waste remaining in the work area for a long time, reduces processing time and costs, improves operational safety, and is conducive to resource recycling.

[0067] In some embodiments, the Taiko wafer processing apparatus 100 further includes a dicing mechanism (not shown) for dicing the Taiko wafer 200 to form an effective chip region 210 and a waste edge region 220 surrounding the effective chip region 210, thereby enabling the Taiko wafer processing apparatus 100 to have a dicing function. Integrating the dicing function and the function of removing the waste edge region 220 into the same apparatus can significantly reduce the wafer transfer time between different processes and improve the overall processing efficiency. This integrated design also simplifies the process flow and reduces the risk of wafer damage or contamination.

[0068] This application does not limit the specific structure of the dicing mechanism. The specific structure of the dicing mechanism can be understood by referring to existing dicing mechanisms. In some embodiments, the dicing mechanism is movably set on the Taiko wafer processing apparatus 100. The dicing mechanism dices the Taiko wafer 200 on the carrier stage 1. After dicing, the dicing mechanism moves away, and the removal unit 2 approaches the carrier stage 1 to pick up and peel off the waste edge area 220. Then the removal unit 2 moves away and replaces the next Taiko wafer 200. The dicing mechanism returns and dices the next Taiko wafer 200. This process is repeated. The carrier stage 1 can be shared during the processing, which reduces the number of devices, saves space, and reduces equipment purchase and maintenance costs. After the Taiko wafer 200 is diced, it does not need to be moved to other devices to remove the waste edge area 220. Instead, it is directly picked up and peeled off in place by the removal unit 2. This significantly reduces the transfer time of the wafer between different processes, improves the overall processing efficiency, reduces the number of wafer movements, reduces the risk of wafer damage or external contamination during transfer, and improves chip yield and production quality.

[0069] In some embodiments, the base 4 is covered with a transparent protective cover to protect the internal processing area. The transparent protective cover allows operators to observe the internal processing status while preventing dust, debris, or harmful chemicals from escaping, thereby maintaining a clean and safe working environment. Specifically, the transparent protective cover has a partition to isolate the space where the support platform 1 and removal section 2 are located from the space where the waste collection tray 3 and waste outlet 7 are located, providing a clean and efficient operating space for removing the waste edge area 220. Of course, the two spaces also need to be interconnected when the waste collection tray 3 collects the waste edge area 220. The partition is movable or has a connecting port so that the waste collection can move between the two spaces.

[0070] Understandably, in order to centrally manage and control all electrical systems and mechanical actions, the Taiko wafer processing unit 100 also includes a circuit control box. The circuit control box typically contains a power management system, drivers, controllers, interface boards, and necessary protective components to ensure stable operation of the equipment and safety of operators. Through the circuit control box, precise control of components such as the removal unit 2, cutting mechanism, waste collection, and transparent protective cover can be achieved, as well as automated monitoring and adjustment of the entire processing process.

[0071] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0072] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0073] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0074] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A Taiko wafer processing apparatus, characterized in that, The back side of the Taiko wafer is adhered with a dicing film, and the Taiko wafer processing apparatus includes: A dicing mechanism for dicing the Taiko wafer to form an effective chip region and a waste edge region surrounding the effective chip region, the waste edge region including a support ring; A support stage for holding the Taiko wafer with the dicing film adhered to it; and, A removal unit, movably mounted on the support platform, is used to pick up the waste edge area and peel it off from the dicing film.

2. The Taiko wafer processing apparatus according to claim 1, characterized in that, The support platform is provided with a base and a protrusion protruding from the base. The protrusion is used to be disposed in the support ring body and to support the effective chip area; the base is used to support the support ring body.

3. The Taiko wafer processing apparatus according to claim 2, characterized in that, The protrusion is provided with an adsorption hole for connecting to a negative pressure generating device, so that the effective chip area can be adsorbed onto the protrusion.

4. The Taiko wafer processing apparatus according to claim 2, characterized in that, The outer periphery of the dicing film extends beyond the outer periphery of the Taiko wafer and is connected to the tension frame; The base is provided with a mounting groove surrounding the boss, the mounting groove being used to mount the tension frame so that the portion of the dicing film extending beyond the Taiko wafer is disposed within the mounting groove.

5. The Taiko wafer processing apparatus according to claim 4, characterized in that, The base is also provided with an operating groove, which is at least partially recessed at the bottom of the mounting groove, and extends from the mounting groove toward the direction away from the boss.

6. The Taiko wafer processing apparatus according to claim 5, characterized in that, The operating groove extends to the outer periphery of the support platform.

7. The Taiko wafer processing apparatus according to claim 2, characterized in that, The support platform is equipped with a light source, and the support platform is also equipped with a plurality of spaced positioning holes that can transmit the light source. The plurality of positioning holes are arranged around the boss and are used to correspond to the support ring body, so that when the Taiko wafer is supported on the support platform, the plurality of positioning holes are blocked by the support ring body.

8. The Taiko wafer processing apparatus according to claim 1, characterized in that, The removal unit includes a mounting base and a plurality of adsorption units disposed on the mounting base. At least one of the adsorption units is detachably connected to the mounting base. The plurality of adsorption units are configured to correspond to the waste edge area, so that when the removal unit picks up the waste edge area, the plurality of adsorption units are staggered from the effective chip area.

9. The Taiko wafer processing apparatus according to claim 1, characterized in that, The Taiko wafer processing apparatus also includes a waste collection tray, which is movably disposed on the support platform so that the waste collection tray can receive the waste edge area released by the removal unit and move it away from the support platform.

10. The Taiko wafer processing apparatus according to claim 9, characterized in that, The Taiko wafer processing apparatus also includes: Base; A first base is movably disposed on the machine base in a vertical direction; and The second base is movably mounted on the machine base along the horizontal direction; The support platform is located on the machine base, the removal part is located on the first base and can move toward or away from the support platform, and the waste collection tray is located on the second base and can move toward or away from the removal part.

11. The Taiko wafer processing apparatus according to claim 10, characterized in that, The base is provided with a waste inlet, and the waste collection tray can be located above the waste inlet to pour the collected waste area into the waste inlet.

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