Bernoulli chuck applied to flat-edge wafer

Abstract

The utility model discloses a Bernoulli chuck applied to a flat edge wafer in the field of Bernoulli chucks, which comprises a top cover and a sucker base, the side surface of the top cover is uniformly provided with a plurality of airflow channels for realizing exhaust, the airflow channels penetrate through the surface of the top cover, the top cover is uniformly provided with a plurality of flow guide holes, and the flow guide holes are communicated with the sucker base. The flow guide hole is annularly formed in the surface of the top cover, the bottom of the suction cup base extends outwards to form a connecting rod, the surface of the connecting rod is sunken inwards to form a clamping groove, and one end of the connecting rod extends outwards to form two clamping blocks; according to the Bernoulli chuck applied to the flat-edge wafer, the plurality of airflow channels are uniformly arranged on the side surface of the top cover, and the flow guide holes are annularly arranged on the top cover, so that airflow distribution is further optimized, and the condition that unstable eddy current is easily formed at the edge parts of the wafer and the chuck base when nitrogen is exhausted is effectively improved; the problem of acid gas corrosion of the front edge of the wafer can be improved.

Description

Technical Field

[0001] This utility model relates to the field of Bernoulli chucks, specifically a Bernoulli chuck applied to flat-edge wafers. Background Technology

[0002] Single-wafer cleaning involves placing the wafer inside a cleaning chamber, protecting the side of the wafer that does not need cleaning, and then spraying cleaning agent onto the side that needs cleaning. Currently, the most widely used single-wafer backside cleaning equipment mainly uses a Bernoulli wafer chuck base. During the cleaning process, the wafer is placed with its front side down and its back side up. High-purity nitrogen gas is blown evenly onto the front side of the wafer at a certain angle and speed through a ring of evenly distributed small holes on the Bernoulli wafer chuck base. On the one hand, the high-purity nitrogen gas provides a vertically upward lifting force for the wafer, preventing the front side of the wafer from contacting the base and damaging its surface pattern; on the other hand, the nitrogen gas rapidly passing over the wafer surface creates a vertically downward pressure on the back side of the wafer due to the Bernoulli effect. Under the influence of aerodynamics, the wafer is suspended on the surface of the Bernoulli chuck base, thus achieving backside cleaning without damaging the front side of the wafer.

[0003] The acidic reagent used to clean the back of the wafer generates a large amount of acid gas during use, which easily crystallizes on the Bernoulli wafer chuck base. This causes nitrogen gas, blown out through the small holes in the Bernoulli wafer chuck base, to form unstable airflow patterns at the edges of the wafer and chuck base due to its high flow rate, creating eddies. The acidic reagent is then blown onto the front of the wafer by the rotating airflow, resulting in severe acid corrosion at the wafer edges, especially at flat edges. Existing Bernoulli wafer chuck bases are generally installed using screws. While this method is secure, it is cumbersome to install and remove, and requires considerable time and effort to disassemble and reinstall the screws, as well as the use of screwdrivers and other tools, increasing maintenance costs and operational difficulty. The screw-based installation method presents a problem with the inconvenience of installing and removing the chuck base. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a Bernoulli chuck for flat-edge wafers, which can effectively solve the technical problems that the front edge of the wafer is easily corroded by acid gas and that it is inconvenient to install and remove the suction cup base.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a Bernoulli chuck applied to flat-edge wafers, including a top cover and a suction cup base. The side of the top cover is evenly provided with a plurality of airflow channels for exhaust. The airflow channels all penetrate the surface of the top cover. The top cover is evenly provided with a plurality of guide holes. The guide holes are arranged in a ring on the surface of the top cover. The bottom of the suction cup base extends outward to form a connecting rod. The surface of the connecting rod is recessed inward to form a slot. One end of the connecting rod extends outward to form two locking blocks.

[0006] Furthermore, the suction cup base is surrounded by several push rods, with adjacent push rods arranged at equal intervals.

[0007] Furthermore, the suction cup base is surrounded by several edge-stopping pins, with adjacent edge-stopping pins arranged at equal intervals.

[0008] Furthermore, the suction cup base is provided with a suction cup base core cover inside, and a first sealing ring and a second sealing ring are provided inside the suction cup base.

[0009] Furthermore, the card block is semi-circular in shape.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model provides a Bernoulli chuck for flat-edge wafers. By uniformly setting several airflow channels on the side of the top cover and the annular guide holes on the top cover, the airflow distribution is further optimized, improving the flow of Bernoulli airflow. This effectively improves the situation where unstable vortices are easily formed at the edge of the wafer and the suction cup base when nitrogen is discharged, reducing airflow turbulence and improving the problem of acid corrosion on the edge of the wafer front side. The connecting rod extending from the bottom of the suction cup base and the slots and blocks on its surface provide convenience for the stable connection of the suction cup base with other components, and facilitate the installation and disassembly of the suction cup base. Attached Figure Description

[0011] Figure 1 This is a perspective view of a Bernoulli chuck applied to flat-edge wafers according to the present invention;

[0012] Figure 2 An exploded view of a Bernoulli chuck applied to flat-edge wafers according to this utility model;

[0013] Figure 3 This is a perspective view of a suction cup base for a Bernoulli chuck applied to a flat-edge wafer according to the present invention.

[0014] Figure 4 This is a perspective view of a connecting rod for a Bernoulli chuck applied to a flat-edge wafer according to this utility model.

[0015] Numbering on the map:

[0016] 1-Suction cup base; 2-Top cover; 3-Side guard pin; 4-Top rod; 5-Connecting rod; 6-Airflow channel; 7-Guide hole; 8-Suction cup base core cover; 9-First sealing ring; 10-Second sealing ring; 11-Slot; 12-Slot block. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] like Figures 1-4 As shown, this utility model provides a Bernoulli chuck for flat-edge wafers, including a top cover 2 and a suction cup base 1. The top cover 2 has a plurality of airflow channels 6 evenly arranged on its side for exhaust, and the airflow channels 6 all penetrate the surface of the top cover 2. The top cover 2 has a plurality of guide holes 7 evenly arranged in a ring on the surface of the top cover 2. The bottom of the suction cup base 1 extends outward to form a connecting rod 5. The surface of the connecting rod 5 is recessed inward to form a slot 11. One end of the connecting rod 5 extends outward to form two locking blocks 12. The edge of the suction cup base 1 is surrounded by a plurality of top rods 4, and adjacent top rods 4 are equidistantly distributed. The edge of the suction cup base 1 is surrounded by a plurality of edge-stopping pins 3, and adjacent edge-stopping pins 3 are equidistantly distributed. The suction cup base 1 has a suction cup base core cover 8 inside, and a first sealing ring 9 and a second sealing ring 10 inside. The locking blocks 12 are semi-circular in shape.

[0019] In this embodiment, the suction cup base core cover 8 on the suction cup base 1 is raised by 5mm relative to the overall suction cup base 1. The shape of the suction cup base 1 is consistent with the flat-edge wafer. One end of the suction cup base 1 also extends to form a 1.5mm high flat-edge baffle. The suction cup base 1 is provided with 8 top rods 4 and 9 edge-blocking pins around it to block the side of the wafer and prevent the wafer from flying out of the suction cup base 1. The suction cup base core cover 8, the first sealing ring 9 and the second sealing ring 10 provided inside the suction cup base 1 ensure the sealing and reliability of the suction cup base 1 when adsorbing the wafer, prevent gas leakage and improve adsorption efficiency. By setting the connecting rod 5, it is not only convenient for the suction cup base 1 to quickly and accurately dock with other connecting parts, but also enhances the firmness and stability of the connection, reduces the risk of failure caused by loose connection, and improves the reliability of the entire Bernoulli chuck. During installation, the suction cup base 1 is installed by engaging the corresponding position with the locking block 12 and locking the corresponding position into the locking slot 11.

[0020] This embodiment of a Bernoulli chuck applied to flat-edge wafers optimizes airflow distribution and improves Bernoulli airflow by uniformly arranging several airflow channels 6 on the side of the top cover 2 and annularly arranged guide holes 7 on the top cover 2. This effectively improves the situation where unstable vortices are easily formed at the edge of the wafer and the suction cup base 1 when nitrogen is discharged, reduces airflow turbulence, and can improve the problem of acid corrosion on the edge of the wafer front side. The connecting rod 5 extending from the bottom of the suction cup base 1 and the slot 11 and the locking block 12 on its surface provide convenience for the stable connection of the suction cup base 1 with other components, and facilitate the installation and disassembly of the suction cup base 1.

[0021] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A Bernoulli chuck for flat-edge wafers, comprising a top cover and a suction cup base, characterized in that: The top cover has several airflow channels evenly arranged on its side for exhaust. The airflow channels all penetrate the surface of the top cover. The top cover has several guide holes evenly arranged in a ring on the surface of the top cover. The bottom of the suction cup base extends outward to form a connecting rod. The surface of the connecting rod is recessed inward to form a slot. One end of the connecting rod extends outward to form two locking blocks.

2. A Bernoulli chuck for flat-edge wafers according to claim 1, characterized in that: The suction cup base is surrounded by several top rods, with adjacent top rods arranged at equal intervals.

3. A Bernoulli chuck for flat-edge wafers according to claim 1, characterized in that: The suction cup base is surrounded by several edge-stopping pins, with adjacent edge-stopping pins arranged at equal intervals.

4. A Bernoulli chuck for flat-edge wafers according to claim 1, characterized in that: The suction cup base has a suction cup base core cover inside, and a first sealing ring and a second sealing ring inside.

5. A Bernoulli chuck for flat-edge wafers according to any one of claims 1-4, characterized in that: The card block is semi-circular in shape.

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