Rapid thermal annealing anti-flying machine table
By setting a ramp surface on the edge ring to improve the groove structure, the problem of wafer fly-off in the rapid thermal annealing process is solved, the probability of wafer breakage is reduced, and the wafer yield is improved.
Patent Information
- Application Number
- CN202422978241.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing edge rings can easily cause wafer fly-off in rapid thermal annealing processes, affecting wafer yield.
A wafer-proof edge ring is designed. By setting a sloping surface on the edge ring to improve the groove structure, the wafer can naturally slide to the bottom of the groove when there is slight wafer slippage, thus avoiding detachment from the edge ring.
It effectively reduces the probability of wafer breakage caused by wafer fly-off during rapid thermal annealing, and improves wafer yield.
Smart Images
Figure CN223539586U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a rapid thermal annealing anti-flying wafer machine. Background Technology
[0002] In the RTP (rapid thermal annealing) chamber, the edge ring rests directly on the support cylinder. During wafer rollover, the wafer sits on the edge ring, and multiple light bulbs heat the ion-implanted wafer to a specific temperature to repair the crystal lattice and activate the implanted ions. To achieve uniform and stable heating, the wafer rotates at 240 revolutions per minute within a nitrogen-filled chamber. Figure 1 As shown, the drive mechanism 1 in the machine chamber drives the support sleeve 2 to rotate, and the edge ring 4 that carries the wafer 3 will rotate together with the support sleeve 2 under the action of friction.
[0003] like Figure 2 As shown, the existing edge ring 4 is a ring-shaped component made of silicon-coated silicon carbide. It usually has a groove in the inner ring to hold the wafer 3. However, because the groove is shallow, the wafer 3 is prone to detaching from the edge ring 4 during rapid thermal annealing when it rotates at a speed of 240 revolutions per minute on the edge ring 4. If the groove is deepened, the mass of the entire edge ring 4 will inevitably increase. The increased mass of the edge ring 4 will cause friction between the edge ring 4 and the support sleeve 2 during rotation, generating particles and ultimately affecting the yield of the wafer 3. Utility Model Content
[0004] The purpose of this invention is to provide a rapid hot annealing anti-flying sheet machine to solve the problem of existing edge rings easily flying sheet during rapid hot annealing processes.
[0005] To achieve the above objectives, this utility model provides an anti-flying disc edge ring, including a support sleeve, a driving mechanism, and the anti-flying disc edge ring. The support sleeve is mounted on the driving mechanism and rotates under the drive of the driving mechanism. The anti-flying disc edge ring is mounted on the support sleeve. The anti-flying disc edge ring comprises:
[0006] The support portion is annular, and a groove for placing the wafer is formed in the inner ring;
[0007] A connecting portion is disposed around the outside of the bearing portion, one end of the connecting portion is connected to the bearing portion, and the other end extends obliquely upward in a direction away from the bearing portion to form a slope surface;
[0008] The mounting part is located at the other end of the connecting part and is used to fix the edge ring of the entire anti-flying plate.
[0009] Optionally, the groove is annular and coaxially arranged with the bearing portion.
[0010] Optionally, the size of the groove is adapted to a 12-inch wafer.
[0011] Optionally, the supporting part, the connecting part, and the mounting part are all coaxially arranged.
[0012] Optionally, the mounting part has a slot along the circumference, with the slot opening facing downwards.
[0013] Optionally, the slope angle is greater than or equal to 30° and less than or equal to 75°.
[0014] Optionally, the support sleeve is annular, and the support sleeve is coaxially arranged with the edge ring of the anti-flying plate.
[0015] Optionally, the drive mechanism is a magnetically levitated rotor and is coaxially arranged with the support sleeve.
[0016] Optionally, the rapid thermal annealing anti-flying wafer machine also includes a reflector and a temperature probe. The reflector is located inside the support sleeve and below the edge ring. The reflector is parallel to the back side of the wafer and has a gap. The temperature probe is mounted on the reflector and is used to receive the radiant energy from the back side of the heated wafer.
[0017] Optionally, the rapid thermal annealing anti-flying wafer machine also includes a ejector pin, which is disposed on the reflector plate and used to push the wafer upward out of the groove of the anti-flying wafer edge ring.
[0018] In the rapid thermal annealing anti-flying wafer machine provided by this utility model, the edge height of the groove is increased by setting a sloping surface on the edge ring. While ensuring that the quality does not increase, even if the wafer experiences slight flying on the edge ring, it will naturally slide to the bottom of the groove and will not completely detach from the edge ring. This greatly reduces the probability of wafer breakage caused by flying during rapid thermal annealing. Attached Figure Description
[0019] Those skilled in the art will understand that the accompanying drawings are provided to better understand the present invention and do not constitute any limitation on the scope of the present invention. Wherein:
[0020] Figure 1 A three-dimensional structural diagram of an edge ring provided in the prior art;
[0021] Figure 2A vertical sectional view of the edge ring and support sleeve provided in the prior art;
[0022] Figure 3 This is a schematic diagram of the structure of a rapid thermal annealing anti-flying sheet machine provided in an embodiment of the present invention;
[0023] Figure 4 A vertical cross-sectional view of the edge ring of the anti-flying plate provided in an embodiment of this utility model;
[0024] in:
[0025] 1-Drive mechanism; 2-Support sleeve; 3-Wafer; 4-Edge ring;
[0026] 100-Anti-flying plate edge ring; 110-Bearing part; 120-Connecting part; 130-Mounting part; 200-Wafer; 300-Support sleeve; 400-Reflector; 500-Temperature probe; 600-Ejector pin. Detailed Implementation
[0027] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the purpose of the embodiments of this utility model. Please refer to the accompanying drawings for a clearer understanding of the objectives, features, and advantages of this utility model. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes and to enable those skilled in the art to understand and read the content disclosed in the specification. They are not intended to limit the implementation conditions of this utility model. Any modifications to the structure, changes in proportions, or adjustments to the size, provided they produce the same or similar effects and achieve the same objectives as this utility model, should still fall within the scope of the technical content disclosed in this utility model.
[0028] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects unless otherwise expressly indicated. As used in this invention, the term “or” is generally used to include “and / or” unless otherwise expressly indicated. As used in this invention, the term “a number” is generally used to include “at least one” unless otherwise expressly indicated. As used in this invention, the term “at least two” is generally used to include “two or more” unless otherwise expressly indicated. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature.
[0029] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0030] Please refer to Figure 3 and Figure 4 This utility model embodiment provides a rapid thermal annealing anti-flying wafer machine for rapid thermal annealing processes of wafers 200. It includes a support sleeve 300, a drive mechanism (not shown in the figure), and an anti-flying wafer edge ring 100. The support sleeve 300 is mounted on the drive mechanism and rotates under its drive. The anti-flying wafer edge ring 100 is mounted on the support sleeve 300. The anti-flying wafer edge ring 100 includes:
[0031] The support portion 110 is annular and has a groove formed in the inner ring for placing the wafer 200;
[0032] A connecting portion 120 is provided around the outside of the supporting portion 110. One end of the connecting portion 120 is connected to the supporting portion 110, and the other end extends obliquely upward in a direction away from the supporting portion 110 to form a slope surface.
[0033] The mounting part 130 is located at the other end of the connecting part 120 and is used to fix the entire edge ring 100 of the anti-flying plate.
[0034] During the rapid thermal annealing process of wafer 200, the drive mechanism drives the support sleeve 300 to rotate. The rotation of the support sleeve 300 causes the anti-flying wafer edge ring 100 on it to rotate, which in turn causes the wafer 200 on the anti-flying wafer edge ring 100 to rotate. By setting a sloping surface on the outer ring of the anti-flying wafer edge ring 100 to increase the edge height of the groove, it is equivalent to improving the existing right-angled groove of the edge ring into a wedge-shaped sloping groove. While ensuring that the mass does not increase, even if a slight flyaway occurs on the anti-flying wafer edge ring 100, the wafer 200 will naturally slide to the bottom of the groove and will not completely detach from the edge ring. This greatly reduces the probability of wafer breakage caused by flyaway during rapid thermal annealing.
[0035] In this embodiment, the groove is a horizontal step surface formed by the inner ring of the bearing part 110 being recessed downwards. The wafer 200 is placed on the horizontal step surface, and the outer edge of the groove can be used to limit the wafer 200, preventing the wafer 200 from moving arbitrarily on the edge ring 100 of the anti-flying plate.
[0036] Preferably, the groove is annular and coaxially arranged with the support portion 110. Since the wafer 200 is circular, the annular groove and coaxial arrangement with the support portion 110 allow the groove and the wafer 200 to be matched in shape, and keep the center of the wafer 200 and the center of the groove coincide, preventing the wafer 200 from shifting due to centrifugal force during rotation.
[0037] In this embodiment, the size of the groove is adapted to a 12-inch wafer, meaning that the rapid thermal annealing anti-flyaway machine provided in this embodiment is mainly used for the rapid thermal annealing process of 12-inch wafers. Of course, this application does not limit the size of the groove and it can be adjusted according to the size of the wafer.
[0038] Preferably, the support portion 110, the connecting portion 120, and the mounting portion 130 are all coaxially arranged. This design ensures that the center of the entire anti-flying plate edge ring 100 coincides with the center of the wafer 200.
[0039] In this embodiment, the mounting part 130 is provided with a slot along the circumference, with the slot opening facing downward. The slot is used to engage with the support sleeve 300 below the edge ring 100 of the anti-flying plate, so that the edge ring 100 of the anti-flying plate can rotate under the drive of the support sleeve 300.
[0040] Preferably, the inclination angle of the ramp surface is greater than or equal to 30° and less than or equal to 75°, so that even if a slight chip fly-off occurs on the anti-fly-off edge ring 100, the wafer 200 can easily slide naturally to the bottom of the groove. Of course, this application does not impose a specific limitation on the inclination angle of the ramp surface, and it can be adjusted according to actual needs.
[0041] Preferably, the support sleeve 300 is annular, and the support sleeve 300 is coaxially arranged with the edge ring 100 of the anti-flying plate to keep the center of the support sleeve 300 and the edge ring 100 of the anti-flying plate coincide, so as to prevent the edge ring 100 of the anti-flying plate from shifting due to centrifugal force during rotation, causing friction with the support sleeve 300 and generating particles, which would affect the yield of the wafer 200. At the same time, since the center of the wafer 200 coincides with the center of the edge ring 100 of the anti-flying plate, this design can also prevent the wafer 200 from shifting due to centrifugal force during rotation.
[0042] In this embodiment, the driving mechanism is a magnetic levitation rotor and is coaxially arranged with the support sleeve 300. The magnetic levitation rotor can drive the support sleeve 300 to rotate around its central axis.
[0043] Preferably, the rapid thermal annealing anti-flying wafer machine also includes a reflector plate 400 and a temperature probe 500. The reflector plate 400 is located inside the support sleeve 300 and below the edge ring. The reflector plate 400 is parallel to the back of the wafer 200 and has a gap. The temperature probe 500 is mounted on the reflector plate 400 and is used to receive the radiant energy from the back of the heated wafer 200, thereby monitoring the heating temperature of the wafer 200.
[0044] Furthermore, the rapid thermal annealing anti-flying wafer machine also includes a ejector pin 600, which is mounted on the reflector plate 400 and used to eject the wafer 200 upwards out of the groove of the anti-flying wafer edge ring 100. For example, when the wafer 200 needs to be removed by a robotic arm, the ejector pin 600 ejects the wafer 200 upwards out of the groove of the anti-flying wafer edge ring 100, and then the robotic arm removes the wafer 200. The robotic arm is similar to a harpoon, with two arms that can pick up the wafer 200 from beside the ejector pin 600. When the robotic arm moves the wafer 200 directly above the anti-flying wafer edge ring 100, the ejector pin 600 can receive the wafer 200, and then the robotic arm is moved away, allowing the ejector pin 600 to lower the wafer 200 into the groove of the anti-flying wafer edge ring 100.
[0045] In summary, this utility model embodiment provides a rapid thermal annealing anti-flying wafer machine. By setting a sloping surface on the outer ring of the anti-flying wafer edge ring 100 to increase the edge height of the groove, it is equivalent to improving the existing right-angled groove of the edge ring into a wedge-shaped sloping groove. While ensuring that the quality does not increase, even if the wafer 200 experiences slight flying on the anti-flying wafer edge ring 100, it will naturally slide to the bottom of the groove and will not completely detach from the edge ring. This greatly reduces the probability of wafer breakage caused by flying wafers during rapid thermal annealing.
[0046] Furthermore, it should be understood that although the present invention has been disclosed above with reference to preferred embodiments, these embodiments are not intended to limit the present invention. For any person skilled in the art, many possible variations and modifications can be made to the present invention's technical solutions using the disclosed technical content, or equivalent embodiments can be modified accordingly, without departing from the scope of the present invention's technical solutions. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention's technical solutions, shall still fall within the protection scope of the present invention's technical solutions.
Claims
1. A rapid heat annealing anti-flying sheet machine, characterized in that, The device includes a support sleeve, a drive mechanism, and an anti-flying disc edge ring. The support sleeve is mounted on the drive mechanism and rotates under its drive. The anti-flying disc edge ring is mounted on the support sleeve. The anti-flying disc edge ring comprises: The support portion is annular, and a groove for placing the wafer is formed in the inner ring; A connecting portion is disposed around the outside of the bearing portion, one end of the connecting portion is connected to the bearing portion, and the other end extends obliquely upward in a direction away from the bearing portion to form a slope surface; The mounting part is located at the other end of the connecting part and is used to fix the edge ring of the entire anti-flying plate.
2. The rapid thermal annealing anti-flying sheet machine according to claim 1, characterized in that, The groove is annular and coaxially arranged with the bearing portion.
3. The rapid thermal annealing anti-flying sheet machine according to claim 2, characterized in that, The dimensions of the groove are adapted to a 12-inch wafer.
4. The rapid thermal annealing anti-flying sheet machine according to claim 2, characterized in that, The supporting part, the connecting part, and the mounting part are all coaxially arranged.
5. The rapid thermal annealing anti-flying sheet machine according to claim 1, characterized in that, The mounting part has a slot along the circumference, with the slot opening facing downwards.
6. The rapid thermal annealing anti-flying sheet machine according to claim 1, characterized in that, The slope angle is greater than or equal to 30° and less than or equal to 75°.
7. The rapid thermal annealing anti-flying sheet machine according to claim 1, characterized in that, The support sleeve is circular, and the support sleeve is coaxially arranged with the edge ring of the anti-flying plate.
8. The rapid thermal annealing anti-flying sheet machine according to claim 7, characterized in that, The drive mechanism is a magnetically levitated rotor and is coaxially arranged with the support sleeve.
9. The rapid thermal annealing anti-flying sheet machine according to claim 1, characterized in that, The rapid thermal annealing anti-flying wafer machine also includes a reflector and a temperature probe. The reflector is located inside the support sleeve and below the edge ring. The reflector is parallel to the back side of the wafer and has a gap. The temperature probe is mounted on the reflector and is used to receive the radiant energy from the back side of the heated wafer.
10. The rapid thermal annealing anti-flying sheet machine according to claim 9, characterized in that, The rapid thermal annealing anti-flying wafer machine also includes a ejector pin, which is disposed on the reflector plate and used to push the wafer upward out of the groove of the edge ring of the anti-flying wafer.