Circuit assembly for transmitting W-band signal

Abstract

The utility model relates to a circuit assembly used for transmitting W wave band signals, which belongs to the technical field of electronics and comprises an RSIW structure waveguide formed by an upper layer printed board and a lower layer printed board which are arranged in a stacked mode, and an outlet amplifying circuit arranged on a top metal layer of the upper layer printed board is connected with a feed port on the waveguide on the same layer. The inlet amplification circuit arranged on the top metal layer of the lower printed board is connected with the inlet filter, and the inlet filter is further connected with the waveguide lower feed port located in the same layer, so that W-band signals can be transmitted in waveguides, high integration level is achieved, and the antenna is more compact. The component can be used as an element to be integrated with high integration level and applied to various microstrip circuits and antennas required by transmission of W-band signals.

Description

Technical Field

[0001] This utility model relates to the field of electronic technology, and in particular to a circuit component for transmitting W-band signals. Background Technology

[0002] Waveguides for transmitting W signals have broad prospects in the fields of microstrip circuits and antennas, but the integration of existing waveguides capable of transmitting W signals directly into microstrip circuits or antennas is limited by the size of the waveguides themselves, resulting in low integration density.

[0003] Therefore, a structure is needed to achieve high integration by integrating waveguides for transmitting W signals into microstrip circuits or antennas. Utility Model Content

[0004] Based on the above analysis, the present invention aims to provide a circuit component for transmitting W-band signals, thereby solving the problem of integrating waveguides for transmitting W-band signals into microstrip circuits or antennas with high integration.

[0005] The objective of this utility model is mainly achieved through the following technical solutions:

[0006] A circuit assembly for transmitting W-band signals, the assembly comprising a waveguide, an input amplifier circuit, an input filter, and an output amplifier circuit, wherein,

[0007] The waveguide is composed of an upper printed circuit board and a lower printed circuit board stacked together. Both the upper and lower printed circuit boards are rectangular printed circuit boards of the same size, formed by laminating multiple layers of metal substrates and non-metal substrates at intervals.

[0008] All metal layers of the lower printed circuit board, except for the bottommost metal layer, are provided with rectangular waveguide cavities of the same size and corresponding positions.

[0009] The uppermost metal layer substrate of the upper printed circuit board is provided with an upper power feed port.

[0010] The uppermost metal layer of the lower printed circuit board is provided with a bottom power supply port.

[0011] The input amplifier circuit and the input filter are disposed on the top layer of the uppermost metal layer substrate of the lower printed circuit board. The output terminal of the input amplifier circuit is connected to the input terminal of the input filter, and the output terminal of the input filter is connected to the lower feed port.

[0012] The output amplifier circuit is located on the top layer of the uppermost metal layer substrate of the upper printed circuit board, and the input terminal of the output amplifier circuit is connected to the upper feed port.

[0013] Based on further improvements to the above scheme, the substrate layers that constitute the upper and lower printed circuit boards, from top to bottom, are: a top metal layer, a first non-metal layer, a first metal layer, a second non-metal layer, a second metal layer, a third non-metal layer, and a bottom metal layer, wherein...

[0014] The first and third non-metallic layers are made of polyimide and have a thickness of 0.076 mm.

[0015] The second non-metallic layer is made of epoxy resin and has a thickness of 0.1 mm.

[0016] The thickness of the top metal layer and the bottom metal layer is 0.04 mm;

[0017] The thickness of the first metal layer and the second metal layer is 0.03 mm.

[0018] Based on the further improvement of the above scheme, the rectangular waveguide cavity has a length of 1.9 mm and a width of 1.1 mm.

[0019] Based on the further improvement of the above scheme, each long side of the rectangular waveguide cavity of the metal layer of the lower printed circuit board is provided with a single ridge; the lower feed port includes an integrally formed rectangular pad and a microstrip line; the rectangular pad is located in the middle of the rectangular waveguide cavity of the top metal layer of the bottommost printed circuit board, directly opposite the single ridge; the microstrip line of the lower feed port is located in a groove with a width of 0.38mm in the middle of the long side of the rectangular waveguide cavity directly opposite the single ridge.

[0020] Based on the further improvement of the above scheme, the single ridge is 0.6mm long and 0.15mm wide; the rectangular pad is 0.6mm long and 0.35mm wide.

[0021] Based on the further improvement of the above scheme, each long side of the rectangular waveguide cavity of the metal layer of the upper printed circuit board is provided with a double rectangular ridge; the upper power feed port is provided on one of the rectangular ridges of the double rectangular ridges of the top metal layer of the upper printed circuit board. The upper power feed port specifically includes an integrally formed circular pad and a microstrip line. The circular pad is provided with a metal through hole at its center, and the microstrip line of the upper power feed port is provided in a groove with a width of 0.6mm in the middle of the rectangular ridge.

[0022] Based on the further improvement of the above scheme, the rectangular ridge in the double rectangular ridge has a length of 0.7mm and a width of 0.3mm.

[0023] Based on the further improvement of the above scheme, each non-metallic layer of the upper and lower printed circuit boards is provided with uniformly arranged metal vias. The upper and lower ends of the metal vias are respectively connected to the upper and lower metal layers. The spacing between the metal vias located at the edge of the rectangular waveguide cavity is 0.3 mm.

[0024] Based on the further improvement of the above scheme, the bottom metal layer of the upper printed circuit board and the top metal layer of the lower printed circuit board are connected by uniformly arranged metal solder balls, wherein the center-to-center spacing of the metal solder balls near the edge of the rectangular waveguide cavity is 0.8mm.

[0025] Based on further improvements to the above scheme, both the upper and lower feed port microstrip lines are made of copper plated with nickel-palladium-gold.

[0026] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0027] 1. By stacking upper and lower printed circuit boards, a waveguide structure for transmitting W-band signals using the RSIW structure is realized, achieving both high integration and preventing electromagnetic leakage.

[0028] 2. The output amplifier circuit is located on the top metal layer of the upper printed circuit board. The input terminal of the output amplifier circuit is connected to the waveguide feed port microstrip line located on the top metal layer of the upper printed circuit board. The input amplifier circuit and the input filter are sequentially located on the top metal layer of the lower printed circuit board. The output terminal of the input amplifier circuit is connected to the input terminal of the input filter, and the output terminal of the input filter is connected to the waveguide feed port microstrip line located on the top metal layer of the lower printed circuit board. The structure in which the bottom metal layer of the upper printed circuit board and the top metal layer of the lower printed circuit board are connected by metal solder balls ensures high integration. The input terminal of the input amplifier circuit and the output terminal of the output amplifier circuit can be easily connected to other components or circuits, making it easy to implement and apply.

[0029] 3. The upper and lower printed circuit boards are composed of metal substrates and non-metallic materials of different materials stacked and laminated together, which ensures structural stability and high integration, and makes it easy to realize RSIW waveguide structures and component structures.

[0030] 4. The selection of materials for the upper and lower power feed ports enhances the corrosion resistance and toughness of the microstrip line.

[0031] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages will become apparent from the description or be learned by practicing this invention. The objectives and other advantages of this invention can be realized and obtained from the details specifically pointed out in the text and accompanying drawings. Attached Figure Description

[0032] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0033] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0034] Figure 2 This is a schematic diagram of the upper printed circuit board structure in an embodiment of this utility model.

[0035] Figure 3 This is a schematic diagram of the lower printed circuit board structure in an embodiment of this utility model.

[0036] Figure 4 This is a schematic diagram showing the dimensions of the waveguide structure of the top metal layer of the upper printed circuit board in an embodiment of this utility model.

[0037] Figure 5 This is a schematic diagram showing the dimension markings of the waveguide structure of the top metal layer of the lower printed circuit board in an embodiment of this utility model.

[0038] Figure label:

[0039] L1: Upper printed circuit board; L1-1: Upper power supply port; L1-2: Upper power supply port microstrip line; L1-3: Upper power supply port pad; L1-4: Double rectangular ridge; L1-5: Output amplifier circuit; L1-6: Upper printed circuit board rectangular waveguide cavity; L1-7: Metal vias around the upper printed circuit board waveguide cavity;

[0040] L2: Lower printed circuit board; L2-1: Lower feed port; L2-2: Lower feed port microstrip line; L2-3: Lower feed port pad; L2-4: Metal solder ball; L2-5: Entrance filter; L2-6: Entrance amplifier circuit; L2-7: Single ridge; L2-8: Lower printed circuit board rectangular waveguide cavity; L2-9: Metal vias around the waveguide cavity of the lower printed circuit board;

[0041] L3: Waveguide;

[0042] L4: Metal through-hole around the waveguide cavity. Detailed Implementation

[0043] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0044] A specific embodiment of this utility model discloses a circuit component for transmitting W-band signals, such as... Figure 1 As shown.

[0045] The component includes waveguide L4, inlet amplifier circuit L2-6, inlet filter L2-5, and outlet amplifier circuit L1-5, wherein...

[0046] The waveguide is composed of an upper printed circuit board L1 and a lower printed circuit board L2 stacked together. Both the upper printed circuit board L1 and the lower printed circuit board L2 are rectangular printed circuit boards of the same size, constructed by laminating multiple layers of metal substrates and non-metal substrates at intervals.

[0047] All metal layers of the lower printed circuit board L2, except for the bottommost metal layer, are provided with rectangular waveguide cavities L2-8 of the same size and corresponding positions.

[0048] The uppermost metal layer substrate of the upper printed circuit board L1 is provided with an upper power supply port L1-1;

[0049] The uppermost metal layer substrate of the lower printed circuit board L2 is provided with a lower power supply port L2-1;

[0050] The input amplifier circuit L2-6 and the input filter L2-5 are disposed on the top layer of the uppermost metal layer substrate of the lower printed circuit board L2. The output terminal of the input amplifier circuit L2-6 is connected to the input terminal of the input filter L2-5, and the output terminal of the input filter L2-5 is connected to the lower feed port L2-1.

[0051] The output amplifier circuit L1-5 is located on the top layer of the uppermost metal layer substrate of the upper printed circuit board L1, and the input terminal of the output amplifier circuit L1-5 is connected to the upper feed port L1-1.

[0052] The component for transmitting W-band signals disclosed in this embodiment is an extension of the RSIW waveguide structure into a component structure. The overall component structure is formed by stacking an upper printed circuit board L1 and a lower printed circuit board L2 with the same structure and size. The RSIW waveguide structure is realized, and the inlet amplifier circuit L2-6, the inlet filter L2-5 and the waveguide lower feed port L2-1 are placed on the same metal layer. The outlet amplifier circuit L1-5 and the waveguide upper feed port L1-1 are placed on the same metal layer, thus forming a microstrip circuit basic element for transmitting W-band signals. This achieves high integration and is easy to implement and apply.

[0053] Specifically, the upper printed circuit board L1 and the lower printed circuit board L2 are both rectangular printed circuit boards of the same size, which are formed by laminating multiple layers of metal substrates and non-metal substrates.

[0054] Furthermore, the substrate layers that form the upper printed circuit board L1 and the lower printed circuit board L2, stacked and laminated, sequentially include from top to bottom: a top metal layer, a first non-metal layer, a first metal layer, a second non-metal layer, a second metal layer, a third non-metal layer, and a bottom metal layer, wherein,

[0055] The first and third non-metallic layers are made of polyimide and have a thickness of 0.076 mm.

[0056] The second non-metallic layer is made of epoxy resin and has a thickness of 0.1 mm.

[0057] The thickness of the top metal layer and the bottom metal layer is 0.04 mm;

[0058] The thickness of the first metal layer and the second metal layer is 0.03 mm.

[0059] Specifically, the upper printed circuit board L1 and the lower printed circuit board L2 are structures composed of multiple layers of metal substrates and non-metal substrates stacked and laminated. Based on the different dimensions designed for each layer, the thickness of the board and the interlayer spacing are minimized to achieve high integration. At the same time, the spacing between the metal and non-metal layers allows electromagnetic signals, including W-band signals, to be better transmitted in the waveguide cavity in the structure based on the upper and lower printed circuit boards, while ensuring the stability of the overall structure.

[0060] The bottom metal layer of the lower printed circuit board L2 is used for grounding. All other substrate layers of the lower printed circuit board L2 are provided with uniformly distributed and corresponding metal vias. All substrate layers of the upper printed circuit board L1 are provided with uniformly distributed and corresponding metal vias. The walls of the metal vias are copper plated, and the center of the vias is filled with epoxy resin. The metal vias connect the upper and lower metal layers. The top metal layer of the upper printed circuit board L1 and the bottom metal layer of the lower printed circuit board L2 are connected through the metal vias by uniformly distributed metal solder balls L2-4 to form a common ground structure.

[0061] All metal layers of the lower printed circuit board L2, except for the bottommost metal layer, are provided with rectangular waveguide cavities L2-8 of the same size and corresponding positions.

[0062] like Figure 2 As shown, each long side of the rectangular waveguide cavity L1-6 of the upper printed circuit board L1 is provided with a double rectangular ridge L1-4; the upper feed port L1-1 is provided on one of the rectangular ridges of the double rectangular ridges L1-4 of the top metal layer of the upper printed circuit board L1. The upper feed port L1-1 specifically includes an integrally formed circular pad L1-3 and a microstrip line L1-2. The circular pad L1-3 is provided with a metal through hole at its center, and the microstrip line L1-2 of the upper feed port is provided in the groove in the middle of the rectangular ridge L1-4.

[0063] like Figure 3 As shown, each long side of the rectangular waveguide cavity L2-8 of the metal layer of the lower printed circuit board L2 is provided with a single ridge L2-7; the lower feed port L2-1 includes an integrally formed rectangular pad L2-3 and a microstrip line L2-2; the rectangular pad L2-3 is located in the middle of the rectangular waveguide cavity of the top metal layer of the bottommost printed circuit board, directly opposite the single ridge L2-7.

[0064] The lower feed port microstrip line L2-2 is located in the groove in the middle of the long side of the rectangular waveguide cavity, which is directly opposite to the single ridge L2-7; the lower feed port L2-1 and the upper feed port L1-1 are oriented opposite each other.

[0065] According to the RSIW structural principle Figure 4 The upper printed circuit board L1 top metal layer waveguide structure and corresponding dimensions are indicated in the diagram. Figure 5 The waveguide structure and corresponding dimensions of the top metal layer of the lower printed circuit board L2, as indicated in the diagram, enable the transmission of W-band signals within waveguide L3.

[0066] Furthermore, the rectangular waveguide cavities L1-6 are all 1.9 mm long and 1.1 mm wide.

[0067] Furthermore, such as Figure 4 As shown, the rectangular ridges in the double rectangular ridges L1-4 have a length of 0.7 mm and a width of 0.3 mm.

[0068] Furthermore, such as Figure 5 As shown, the single ridge L2-7 is 0.6mm long and 0.15mm wide; the rectangular pad L2-3 is 0.6mm long and 0.35mm wide.

[0069] Furthermore, the groove width of the microstrip line L2-2 at the bottom feed port is set to 0.38mm.

[0070] Furthermore, the groove width of the microstrip line L1-2 at the upper feed port is set to 0.6mm.

[0071] Furthermore, the spacing of the metal vias L4 located at the edge of the rectangular waveguide cavity is 0.3 mm.

[0072] Specifically, such as Figure 2 , Figure 3 As shown, unlike the arrangement of metal vias in other areas of the upper printed circuit board L1 and the lower printed circuit board L2, the metal vias L4 located around the edge of the rectangular waveguide cavity need to be evenly distributed around the edge of the waveguide cavity to form good electromagnetic shielding. Figure 5 As shown, the spacing between adjacent metal vias is 0.3 mm. No metal vias are provided in the non-metallic layer areas corresponding to the rectangular waveguide cavities of each metal layer on the upper printed circuit board L1 and the lower printed circuit board L2.

[0073] like Figure 2 , Figure 3 As shown, the metal solder balls L2-4 located around the edge of the rectangular waveguide cavity need to be evenly distributed along the edge of the waveguide cavity. The metal solder balls L2-4 evenly distributed around the edge of the rectangular waveguide cavity are as follows: Figure 5 As shown, the distance between the centers of adjacent metal solder balls is 0.8 mm.

[0074] The inlet filter L2-5, inlet amplifier circuit L2-6, and bottom feed port L2-1 are sequentially arranged on the top metal layer of the lower printed circuit board L2. The microstrip line L2-2 of the bottom feed port is connected to the output terminal of the inlet filter L2-5. The connection between the input terminal of the inlet filter L2-5 and the output terminal of the inlet amplifier circuit L2-6 does not require extra space. The outlet amplifier circuit L1-5 and top feed port L1-1 are sequentially arranged on the top metal layer of the upper printed circuit board L1. The connection between the microstrip line of the top feed port L1-2 and the input terminal of the outlet amplifier circuit L1-5 does not require extra space, which helps to achieve high integration.

[0075] Furthermore, both the upper feed port microstrip line L1-2 and the lower feed port microstrip line L2-2 are made of copper plated with nickel-palladium-gold. Based on the corrosion resistance and good toughness of copper plated with nickel-palladium-gold, it is beneficial to form a stable and durable microstrip line connection structure between the upper feed port L1-1 and the output amplifier circuit L1-5, and between the lower feed port L2-1 and the input filter L2-5.

[0076] This embodiment discloses a circuit component for transmitting W-band signals, including a waveguide L3, an input amplifier circuit L2-6, an input filter L2-5, and an output amplifier circuit L1-5. The waveguide L3 is composed of an upper printed circuit board L1 and a lower printed circuit board L2 stacked together. Both the upper printed circuit board L1 and the lower printed circuit board L2 are rectangular printed circuit boards of the same size, constructed by laminating multiple layers of metal substrates and non-metal substrates at intervals. By using non-metal substrates of different materials, the thickness of the boards and the interlayer spacing are minimized, thereby achieving high integration. Furthermore, the alternating arrangement of metal and non-metal layers allows electromagnetic signals, including W-band signals, to be better transmitted in the waveguide cavity within the structure based on the upper printed circuit board L1 and the lower printed circuit board L2. Meanwhile, the overall structure is kept stable. The waveguide structure, designed based on the RSIW principle, is capable of transmitting W-band signals based on a set size. The input amplifier circuit L2-6 and the input filter L2-5 are located on the top layer of the uppermost metal layer substrate of the lower printed circuit board L2. The output of the input amplifier circuit L2-6 is connected to the input of the input filter L2-5, and the output of the input filter L2-5 is connected to the lower feed port L2-1. The output amplifier circuit L1-5 is located on the top layer of the uppermost metal layer substrate of the upper printed circuit board L1. The input of the output amplifier circuit L1-5 is connected to the upper feed port L1-1, which facilitates its high-integration integration and implementation as a basic component in various microstrip circuits and antennas that transmit W-band signals.

[0077] Those skilled in the art will understand that the programs / software involved in the above embodiments are common methods in the prior art, and this utility model does not involve any software improvements. This utility model only requires connecting various devices with corresponding functions through the connection relationships given in the embodiments of this utility model, without involving any program or software improvements. As for the connection methods between the various hardware devices with corresponding functions, they can all be implemented by those skilled in the art using existing technology, and will not be described in detail here.

[0078] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit assembly for transmitting W-band signals, characterized in that, The component includes a waveguide, an inlet amplifier circuit, an inlet filter, and an outlet amplifier circuit, wherein, The waveguide is composed of an upper printed circuit board and a lower printed circuit board stacked together. Both the upper and lower printed circuit boards are rectangular printed circuit boards of the same size, formed by laminating multiple layers of metal substrates and non-metal substrates at intervals. All metal layers of the lower printed circuit board, except for the bottommost metal layer, are provided with rectangular waveguide cavities of the same size and corresponding positions. The uppermost metal layer substrate of the upper printed circuit board is provided with an upper power feed port. The uppermost metal layer of the lower printed circuit board is provided with a bottom power supply port. The input amplifier circuit and the input filter are disposed on the top layer of the uppermost metal layer substrate of the lower printed circuit board. The output terminal of the input amplifier circuit is connected to the input terminal of the input filter, and the output terminal of the input filter is connected to the lower feed port. The output amplifier circuit is located on the top layer of the uppermost metal layer substrate of the upper printed circuit board, and the input terminal of the output amplifier circuit is connected to the upper feed port.

2. A circuit assembly for transmitting W-band signals according to claim 1, characterized in that, The substrate layers that constitute the upper and lower printed circuit boards, laminated together, include, from top to bottom, the following: a top metal layer, a first non-metal layer, a first metal layer, a second non-metal layer, a second metal layer, a third non-metal layer, and a bottom metal layer. The first and third non-metallic layers are made of polyimide and have a thickness of 0.076 mm. The second non-metallic layer is made of epoxy resin and has a thickness of 0.1 mm. The thickness of the top metal layer and the bottom metal layer is 0.04 mm; The thickness of the first metal layer and the second metal layer is 0.03 mm.

3. A circuit assembly for transmitting W-band signals according to claim 2, characterized in that, The rectangular waveguide cavity is 1.9 mm long and 1.1 mm wide.

4. A circuit assembly for transmitting W-band signals according to claim 2, characterized in that, Each metal layer rectangular waveguide cavity of the lower printed circuit board has a single ridge on one of its long sides; the lower feed port includes an integrally formed rectangular pad and a microstrip line; the rectangular pad is located in the middle of the top metal layer rectangular waveguide cavity of the bottommost printed circuit board, directly opposite the single ridge; the lower feed port microstrip line is located in a 0.38mm wide groove in the middle of the long side of the rectangular waveguide cavity directly opposite the single ridge.

5. A circuit assembly for transmitting W-band signals according to claim 4, characterized in that, The single ridge is 0.6 mm long and 0.15 mm wide; the rectangular pad is 0.6 mm long and 0.35 mm wide.

6. A circuit assembly for transmitting W-band signals according to claim 2, characterized in that, Each metal layer of the upper printed circuit board has a double rectangular ridge on both long sides of the rectangular waveguide cavity. The upper power feed port is located on one of the double rectangular ridges of the top metal layer of the upper printed circuit board. The upper power feed port specifically includes an integrally formed circular pad and a microstrip line. A metal through-hole is provided at the center of the circular pad, and the microstrip line of the upper power feed port is located in a groove with a width of 0.6 mm in the middle of the rectangular ridge.

7. A circuit assembly for transmitting W-band signals according to claim 6, characterized in that, The rectangular ridge in the double rectangular ridge has a length of 0.7 mm and a width of 0.3 mm.

8. A circuit assembly for transmitting W-band signals according to claim 7, characterized in that, The upper and lower printed circuit boards each have uniformly arranged metal vias on their non-metallic layers. The upper and lower ends of the metal vias are connected to the upper and lower metal layers, respectively. The spacing between the metal vias located at the edge of the rectangular waveguide cavity is 0.3 mm.

9. A circuit assembly for transmitting W-band signals according to claim 8, characterized in that, The bottom metal layer of the upper printed circuit board and the top metal layer of the lower printed circuit board are connected by uniformly arranged metal solder balls, wherein the center-to-center spacing of the metal solder balls near the edge of the rectangular waveguide cavity is 0.8 mm.

10. A circuit assembly for transmitting W-band signals according to claim 9, characterized in that, Both the upper and lower feed port microstrip lines are made of copper plated with nickel-palladium gold.

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