Uniform film pressing device for high-frequency circuit board

Abstract

The utility model relates to the technical field of circuit board production, in particular to a uniform film pressing device for a high-frequency circuit board. Comprising a conveyor, a shell and a workbench are arranged on the conveyor, the workbench is located on the front side of the conveyor and used for containing a circuit board, openings are formed in the front side and the rear side of the shell, a shielding plate is arranged at the position of the opening in the front side of the shell, a film pressing assembly used for pressing a film is arranged on the shielding plate, and a mounting plate is further arranged between the two inner sides of the shell. And a heating assembly for heating the film body and the circuit board is mounted on the mounting plate. According to the utility model, through the roller plate and the pressing plate which are ingeniously designed, a film body and a circuit board are more tightly attached, so that the uniformity and tightness of the film pressing process are ensured, in addition, through the synergistic effect of the heating pipe and the heat transfer cylinder, the circuit board is preheated while the uniform distribution of heat is ensured, and the production efficiency is improved. By means of the direct and efficient heating mode, the heat conduction speed is remarkably increased, and then the overall working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and more specifically, to a high-frequency circuit board uniform pressing device. Background Technology

[0002] High-frequency circuit boards (PCBs) are printed circuit boards specifically designed for high-frequency signal transmission. They are widely used in applications requiring rapid data transmission or high-frequency radio frequency signal processing, such as communication equipment, radar systems, satellite communications, wireless network equipment, and high-performance computing devices. During PCB manufacturing, a film-coating process is performed to protect conductors and other components. To ensure a tight bond between the film and the PCB, a lamination process is also required. This process is crucial for ensuring the performance and reliability of the PCB.

[0003] A search revealed a circuit board laminating device for uniformly heating pressure-sensitive film, according to patent publication number CN118139295A. This device includes a conveying mechanism and a frame mounted on the conveying mechanism. A hot press roller and a film feeding roller are respectively positioned near the bottom and top of the frame. A fixed frame is positioned near the input end of the frame, and a horizontally mounted lifting rod is mounted on the fixed frame. A horizontally positioned air collection box is mounted below the lifting rod, and multiple sets of transverse air knives are mounted on the lower surface of the air collection box. The air inlet of the connecting pipe is connected to an industrial hot air blower. This device aims to preheat circuit boards in low-temperature environments by blowing hot air onto the circuit boards through the air knives to improve the hot-pressing bonding effect of the pressure-sensitive film under low-temperature conditions. However, due to the high fluidity of the hot air, the preheating transfer efficiency is low. This not only prolongs the residence time of the circuit board in the device, reducing overall work efficiency, but may also affect the bonding quality between the film and the circuit board. Therefore, there is an urgent need to develop a more efficient high-frequency circuit board uniform laminating device to solve the above problems. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a more efficient high-frequency circuit board uniform pressing device.

[0005] The technical solution of this utility model is as follows: a high-frequency circuit board uniform pressing device, comprising a conveyor, a housing, a worktable, a shield, a pressing assembly, a straightening assembly, a pusher, a mounting plate, a heating assembly, and contact elements. The conveyor is provided with the housing and the worktable. The worktable is located on the front side of the conveyor for placing the circuit board. The front and rear sides of the housing are open. A shield is provided at the front opening of the housing. A pressing assembly for pressing the film is provided on the shield. Straightening assemblies for straightening the position of the circuit board are provided on both sides of the conveyor. A set of pushers is provided on the moving parts of the straightening assemblies. A mounting plate is also provided between the inner two sides of the housing. A heating assembly for heating the film and the circuit board is mounted on the mounting plate. Contact elements for contacting and cooperating with the pushers on the same side are symmetrically provided on the heating assembly to push the heating assembly close to the film.

[0006] As a further preferred embodiment, the film pressing assembly includes an electric push rod, a roller plate, and a pressure plate. An electric push rod with its telescopic end facing downward is installed on the mask plate. The telescopic end of the electric push rod is connected to the roller plate. The roller plate can press down to press the film body into contact with the circuit board. A pressure plate located inside the housing is also provided on the mask plate to facilitate smoothing the film surface.

[0007] As a further preferred embodiment, the correction assembly includes two electric push rods and a pulley frame. A set of two electric push rods is installed on each side of the conveyor. The telescopic ends of the two sets of electric push rods are arranged facing each other and pass through the housing of the conveyor. A pulley frame located inside the housing is provided between the telescopic ends of the electric push rods on the same side. The pulley frames on both sides cooperate to correct the position of the circuit board, and the two push rods are respectively connected to the pulley frame on the same side.

[0008] As a further preferred embodiment, the heating assembly includes a heater, heating tubes, and heat-conducting cylinders. Two heating tubes are mounted on the mounting plate, and the heating tubes are slidably fitted to the mounting plate. A heater is provided between the top ends of the two heating tubes, and heat-conducting cylinders for conducting heat are also provided at intervals on the heating tubes.

[0009] As a further preferred embodiment, the contact element includes a bracket, a sliding block, an elastic element, and a contact rod. The brackets are symmetrically arranged on both heating tubes, and the sliding blocks are slidably arranged inside the brackets. An elastic element is arranged between the bottom end of the sliding block and the corresponding bracket, so that the sliding block and the corresponding bracket form an abutment fit. The top of the sliding block is inclinedly arranged with a contact rod, which respectively contacts and engages with the adjacent push frame to push the heating tube to move.

[0010] As a further preferred embodiment, a fan assembly is also included, which is located above the workbench on the baffle plate and is used to blow away impurities from the surface of the circuit board.

[0011] Compared with the prior art, the present invention has the following advantages: 1. The present invention achieves a tighter fit between the film and the circuit board through the cleverly designed roller plate and pressure plate, thereby ensuring the uniformity and tightness of the film pressing process. In addition, through the synergistic effect of the heating tube and the heat transfer cylinder, the circuit board is preheated while ensuring uniform heat distribution. This direct and efficient heating method significantly improves the heat conduction speed, thereby improving the overall work efficiency.

[0012] 2. This utility model introduces a pulley frame, which can automatically correct the position of the circuit board during transportation to ensure that it is centered. At the same time, it will drive the push frame and the contact rod to work together, so that the heating tube and the heat-conducting cylinder can be close to the circuit board, ensuring that the heat can be quickly and directly transferred to the circuit board. This not only improves the pressing efficiency, but also further improves the pressing quality. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a three-dimensional structural diagram of the internal components after the outer shell of this utility model has been cut open.

[0015] Figure 3 This is a three-dimensional structural diagram of the pressure plate, electric push rod 2, and pulley frame of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the cover plate, electric push rod, roller plate and pressure plate of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the electric push rod, pulley frame, and push frame of this utility model.

[0018] Figure 6 This is a three-dimensional structural diagram of the components of this utility model, such as the mounting plate, heater, and heating tube.

[0019] The components are: 1. Conveyor, 2. Outer shell, 3. Workbench, 4. Shelter, 5. Electric push rod one, 6. Roller plate, 7. Pressure plate, 8. Electric push rod two, 9. Pulley frame, 10. Push frame, 11. Mounting plate, 12. Heater, 13. Heating tube, 14. Heat conducting cylinder, 15. Support, 16. Sliding block, 17. Elastic element, 18. Contact rod, 19. Fan assembly. Detailed Implementation

[0020] First, it should be noted that in different described embodiments, the same components are given the same reference numerals or the same component names. The disclosure contained throughout this specification can be applied semantically to the same components having the same reference numerals or the same component names. The location descriptions selected in the specification, such as upper, lower, lateral, etc., also refer to the directly described and illustrated figures and are semantically applied to the new location when the location changes.

[0021] Example: A high-frequency circuit board uniform lamination device, such as... Figures 1-6 As shown, the device includes a conveyor 1, a housing 2, a worktable 3, a shield 4, a film pressing assembly, a straightening assembly, a pusher frame 10, a mounting plate 11, a heating assembly, and contact components. The conveyor 1 is equipped with the housing 2 and the worktable 3. The conveyor 1, as the main conveying component, transports the circuit boards into the device. The housing 2 then surrounds and encloses the device, protecting the internal components and providing a closed processing environment. The worktable 3 is located in front of the conveyor 1 for placing the circuit boards to be processed. The housing 2 has openings on both the front and back sides. A shield 4 is located at the front opening of the housing 2. A film pressing assembly is located on the side of the shield 4 facing inwards from the housing 2. The left and right sides of the housing 2 are provided with correction components to correct the position of the circuit board, so that the position of the circuit board can be kept in the center, thereby stabilizing the overall film pressing effect. A set of pushers 10 are respectively provided on the moving parts of the correction components. A mounting plate 11 is also provided between the left and right sides of the housing 2. A heating component for heating the film and the circuit board is installed on the mounting plate 11, which can preheat and heat the bonding between the film and the circuit board, improve the mechanical energy of the film pressing efficiency, and effectively improve the bonding effect of the film. The heating component is symmetrically provided with contact parts that contact and cooperate with the pushers 10 on the same side to push the heating component close to the film and control the position between the heating component and the circuit board.

[0022] like Figures 2-4 As shown, the film pressing assembly includes an electric push rod 5, a roller plate 6, and a pressure plate 7. An electric push rod 5 with its telescopic end facing down is installed on the cover plate 4. The telescopic end of the electric push rod 5 is connected to the roller plate 6. The roller plate 6 can press down to press the film body to fit the circuit board. A pressure plate 7 located inside the outer shell 2 is also provided on the cover plate 4 to facilitate smoothing the film surface.

[0023] like Figure 2 , Figure 3 and Figure 5As shown, the correction assembly includes an electric push rod 8 and a pulley frame 9. A set of electric push rods 8 is installed on the left and right sides of the conveyor 1 respectively. The telescopic ends of the two sets of electric push rods 8 are arranged facing each other and pass through the housing of the conveyor 1. A pulley frame 9 located inside the housing 2 is arranged between the telescopic ends of the electric push rods 8 on the same side. The pulley frames 9 on both sides cooperate to correct the position of the circuit board, ensuring that the position of the transported circuit board remains centered. The two push frames 10 are respectively connected to the pulley frame 9 on the same side.

[0024] like Figure 6 As shown, the heating assembly includes a heater 12, a heating tube 13, and a heat-conducting cylinder 14. Two heating tubes 13 are mounted on the mounting plate 11, and the heating tubes 13 are slidably fitted to the mounting plate 11. The heater 12 is positioned between the top ends of the two heating tubes 13. Heat-conducting cylinders 14 for conducting heat are also spaced apart on the heating tubes 13. Through the arrangement of the heater 12 and the heating tubes 13, the circuit board can be heated more directly and quickly, thereby effectively improving the working efficiency. Furthermore, the spaced arrangement of the heat-conducting cylinders 14 disperses the temperature, ensuring a uniform temperature distribution. This results in a more uniform heat distribution on the circuit board, leading to a better lamination effect.

[0025] like Figure 6 As shown, the contact element includes a bracket 15, a sliding block 16, an elastic element 17, and a contact rod 18. A bracket 15 is symmetrically arranged on each of the two heating tubes 13. A sliding block 16 is slidably arranged inside each bracket 15. An elastic element 17, which is a spring, is arranged between the bottom end of the sliding block 16 and the corresponding bracket 15, forming an abutting fit between the sliding block 16 and the corresponding bracket 15. A contact rod 18 is inclinedly arranged on the top end of the sliding block 16. The contact rod 18 contacts and engages with the adjacent push frame 10 to push the heating tube 13 to move, thereby bringing the heating tube 13 and the heat transfer cylinder 14 closer to the circuit board, allowing heat to be more directly conducted to the circuit board to ensure operating efficiency.

[0026] like Figure 1 and Figure 2 As shown, it also includes a fan assembly 19, which is provided on the baffle 4 above the workbench 3. The fan assembly 19 is used to blow away impurities from the surface of the circuit board.

[0027] When a circuit board needs to be laminated, the conveyor 1 is started, and the laminated circuit board is placed on the workbench 3 and pushed into the conveyor 1. Simultaneously, the fan assembly 19 blows air onto the circuit board surface to remove impurities. Then, the electric push rod 5 is activated, driving the roller plate 6 to move downwards and adhere to the film surface, causing the film to adhere tightly to the circuit board, achieving a compaction effect. Next, the electric push rod 8 is activated, driving the pulley frame 9 to approach the circuit board. The pulley frames 9 on both sides work in sync to adhere to the sides of the circuit board, creating a central pushing action that positions the circuit board in the middle of the conveyor 1, achieving a positional correction effect. Then, the circuit board contacts the pressure plate 7, which smooths the film and circuit board, improving the adhesion. At the same time, the heater 12 is activated, transferring heat to the heating tube 13, and simultaneously... The heat is further transferred to the heat-conducting cylinder 14, whereby the high temperature is dispersed to form a more uniform temperature layer. This allows the circuit board coming from the pressure plate 7 to receive a more uniform and suitable heating temperature. Here, due to the movement of the pulley frame 9, the push frame 10 on it will come into contact with the corresponding contact rod 18 and follow the inclined surface of the contact rod 18 to push it down. This will cause the connected sliding block 16 to operate synchronously, so as to push the bracket 15 and the heating tube 13 together. The elastic element 17 deforms accordingly and provides elastic support for the movement of the heating tube 13. The sliding block 16 will simultaneously form a resisting state with the bracket 15, so that the heating tube 13 and the heat-conducting cylinder 14 can maintain a certain distance from the circuit board. The distance between the heating tube 13 and the circuit board will be closer, ensuring that the temperature can be uniformly heated on the film, making the heating efficiency of the film faster, thereby achieving a more uniform and effective film pressing effect.

[0028] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Therefore, all equivalent changes made based on the content described in the claims of the present utility model should be included within the scope of the claims of the present utility model.

Claims

1. A high-frequency circuit board uniform lamination device, characterized in that, The system includes a conveyor (1), a housing (2) and a worktable (3) on the conveyor (1). The worktable (3) is located on the front side of the conveyor (1) for placing circuit boards. The housing (2) has openings on both the front and back sides. A cover plate (4) is provided at the front opening of the housing (2). A film pressing assembly for pressing the film is provided on the cover plate (4). Correction assemblies for correcting the position of the circuit boards are provided on both sides of the conveyor (1). A set of push frames (10) is provided on the moving parts of the correction assembly. A mounting plate (11) is also provided between the inner sides of the housing (2). A heating assembly for heating the film and the circuit board is installed on the mounting plate (11). The heating assembly has symmetrically arranged contact parts that contact and cooperate with the push frames (10) on the same side to push the heating assembly close to the film.

2. The high-frequency circuit board uniform lamination device as described in claim 1, characterized in that, The film pressing assembly includes an electric push rod (5), a roller plate (6), and a pressure plate (7). An electric push rod (5) with its telescopic end facing down is installed on the cover plate (4). The telescopic end of the electric push rod (5) is connected to the roller plate (6). The roller plate (6) can press the film body to fit the circuit board when it is pressed down. A pressure plate (7) located inside the outer shell (2) is also provided on the cover plate (4) to smooth the film surface.

3. The high-frequency circuit board uniform lamination device as described in claim 2, characterized in that, The correction assembly includes an electric push rod (8) and a pulley frame (9). A set of electric push rods (8) is installed on both sides of the conveyor (1). The telescopic ends of the two sets of electric push rods (8) are arranged facing each other and pass through the housing of the conveyor (1). A pulley frame (9) located inside the housing (2) is provided between the telescopic ends of the electric push rods (8) on the same side. The pulley frames (9) on both sides cooperate to correct the position of the circuit board. The two sets of push frames (10) are respectively connected to the pulley frames (9) on the same side.

4. The high-frequency circuit board uniform lamination device as described in claim 3, characterized in that, The heating assembly includes a heater (12), a heating tube (13), and a heat-conducting cylinder (14). Two heating tubes (13) are mounted on the mounting plate (11), and the heating tubes (13) are slidably fitted with the mounting plate (11). A heater (12) is provided between the top ends of the two heating tubes (13), and heat-conducting cylinders (14) for conducting heat are also provided at intervals on the heating tubes (13).

5. The high-frequency circuit board uniform lamination device as described in claim 4, characterized in that, The contact element includes a bracket (15), a sliding block (16), an elastic element (17), and a contact rod (18). The two heating tubes (13) are symmetrically provided with brackets (15). The sliding block (16) is slidably provided in the bracket (15). The bottom end of the sliding block (16) is provided with an elastic element (17) between it and the corresponding bracket (15), so that the sliding block (16) and the corresponding bracket (15) form an abutment fit. The top end of the sliding block (16) is inclinedly provided with a contact rod (18). The contact rod (18) respectively contacts and engages with the adjacent push frame (10) to push the heating tube (13) to move.

6. The high-frequency circuit board uniform lamination device as described in claim 5, characterized in that, It also includes a fan assembly (19), which is provided on the shield (4) above the workbench (3) and is used to blow away impurities from the surface of the circuit board.

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