Radiator

Abstract

The utility model provides a radiator. The radiator comprises a first sub-radiator, a second sub-radiator and a plastic part. The two sides of the first sub-radiator in the first direction are provided with a first installation face and a first binding face respectively, wherein the first installation face is used for assembling and installing a first heating device. The two sides of the second sub-radiator in the first direction are provided with a second installation face and a second binding face respectively, the second installation face is used for assembling and installing a second heating device, the first binding face is attached to the second binding face to form a radiator body, and the radiator body is provided with an installation end face and a radiating end face in the second direction. The second direction is perpendicular to the first direction, the mounting end face faces the circuit board, and the first heating device and the second heating device are electrically connected to the circuit board. The plastic part covers the mounting end face and is arranged between the radiator body and the circuit board.

Description

Technical Field

[0001] This utility model relates to an assembly structure for electronic components, and more particularly to a heat sink. Background Technology

[0002] Existing semiconductor power devices generate a significant amount of heat during operation, thus requiring mounting on metal heat sinks. Common mounting methods fall into two categories. One method involves attaching thermally conductive and insulating materials, such as insulating thermally conductive cloth, thermally conductive caps, ceramic sheets, and thermally conductive silicone grease, between the semiconductor power device and the heat sink. Then, mechanical mechanisms such as screws and springs are used to press the device firmly onto the heat sink. The other method involves attaching a thermally conductive and insulating adhesive sheet between the semiconductor power device and the heat sink. Under a certain external pre-pressure, the device is pressed firmly onto the thermally conductive and insulating adhesive sheet, held for a certain period, and then cured by heating. This provides fixation, heat conduction, and insulation.

[0003] Currently, heat sinks typically only have thermally conductive insulating adhesive sheets and components attached to one side, which presents several technical disadvantages. In space-constrained applications, the heat sink itself still occupies a significant amount of space, failing to meet high power density requirements. While attaching thermally conductive insulating adhesive sheets to both sides of the heat sink saves space, applying pressure during the manufacturing process becomes difficult. When components are attached to one side and pressure is applied to the other, it can compress and damage the adhesive sheets and components on that side. Furthermore, with components on both sides, implementing insulation between the components and the heat sink, as well as between the circuit board and the heat sink, becomes challenging.

[0004] In view of this, it is necessary to provide a heat sink and overcome the shortcomings of known technologies. Summary of the Invention

[0005] The purpose of this invention is to provide a heat sink. Through ingenious structural design, the double-sided heat sink is divided into two sub-heat sinks, which are combined into a whole using thermal grease and countersunk screws as the heat sink body. The top of the heat sink body has an insulating plastic part that contacts the circuit board for insulation, ensuring a safe distance.

[0006] Another objective of this invention is to provide a heat sink. After attaching thermally conductive insulating adhesive sheets and heating elements to each of the two sub-heat sinks, thermally conductive silicone grease can be applied to the mating surfaces, and then the surfaces are pressed together horizontally. This allows the two sub-heat sinks to come into contact and adhere together. Furthermore, the tops of the two sub-heat sinks can be vertically engaged to form mounting faces towards the circuit board. The bottoms of the two sub-heat sinks have corresponding locking holes, which can be used to secure them together with countersunk screws, ensuring good heat dissipation. Since both sub-heat sinks of the main body are made of metal, a plastic component made of insulating plastic can be placed between the mounting face of the main body facing the circuit board and the circuit board for insulation. The bottom surface of the plastic component protrudes from its outer periphery and covers the mounting face, so that the planar area of ​​the main body in the vertical direction is included within the planar area of ​​the plastic component, ensuring a safe distance. The bottom surface of the plastic part can be recessed to align with the receiving groove on the mounting end face of the heat sink body, providing mating and positioning functions during assembly of the heat sink body and the plastic part. Additionally, the top surface of the plastic part has a positioning protrusion that aligns with the positioning opening on the circuit board, facilitating the vertical insertion of the heat-generating device into the mounting holes on the circuit board for soldering, thus completing the assembly of the heat sink and the circuit board. The combination of the positioning protrusion with fasteners and support ribs further secures the plastic part firmly between the circuit board and the heat sink body, effectively providing insulation and maintaining safety distances. Furthermore, the center of the positioning protrusion is a through hole for installing fasteners that secure the heat sink to the cold plate or housing. The fasteners can pass through the through hole and, through the fixing holes in the heat sink body, fix the heat sink, along with the circuit board, to the cold plate or housing. The operating end of the fastener can be accommodated in the receiving groove on the mounting end face, ensuring that the safety distance is not affected by the fasteners, allowing the heat sink to achieve optimal heat dissipation. It should be understood that the "fitting" or "contact" mentioned in this utility model does not mean direct fitting or direct contact. It also includes fitting or contacting with a certain air gap or after inserting an insulating medium between the two. Since the two sub-heaters constituting the heat sink body are both made of metal, in order to meet the safety insulation requirements, a thermally conductive insulating adhesive sheet needs to be inserted between the heating device and the mounting surface of the sub-heater before contacting or fitting with the heat sink body. The thermally conductive insulating adhesive sheet can be thermally conductive insulating tape, thermally conductive insulating adhesive, thermally conductive insulating pad, etc., and this utility model does not limit it.

[0007] To achieve the above objectives, one aspect of this utility model provides a heat sink, including a first sub-heat sink, a second sub-heat sink, and a plastic component. The first sub-heat sink has a first mounting surface and a first mating surface on both sides along a first direction, wherein the first mounting surface is used for assembling and mounting a first heating element. The second sub-heat sink has a second mounting surface and a second mating surface on both sides along the first direction, wherein the second mounting surface is used for assembling and mounting a second heating element. The first mating surface is mated to the second mating surface to form a heat sink body. The heat sink body has a mounting end face and a heat dissipation end face along a second direction, which is perpendicular to the first direction. The mounting end face faces the circuit board, and the first and second heating elements are electrically connected to the circuit board. The plastic component covers the mounting end face and is disposed between the heat sink body and the circuit board.

[0008] In one embodiment, thermally conductive silicone grease is provided between the first bonding surface and the second bonding surface.

[0009] In one embodiment, the first sub-heater has a first upper end and a first lower end opposite to each other in the second direction, and the second sub-heater has a second upper end and a second lower end opposite to each other in the second direction. The first upper end and the second upper end engage to form the mounting end face of the heat sink body, and the second lower end covers the first lower end to form the heat dissipation end face of the heat sink body.

[0010] In one embodiment, the first sub-heater further includes a first engaging member disposed adjacent to the first upper end, and the second sub-heater further includes a second engaging member disposed adjacent to the second upper end, wherein the first engaging member and the second engaging member engage along a second direction.

[0011] In one embodiment, the first sub-heater further includes a first locking hole disposed adjacent to the first lower end, and the second sub-heater further includes a second locking hole disposed adjacent to the second lower end. The first locking hole and the second locking hole are aligned and connected in a second direction, and the screw locks the first sub-heater and the second sub-heater through the first locking hole and the second locking hole.

[0012] In one embodiment, the first sub-heater further includes a first fixing through hole penetrating the first upper end and the first lower end, and the second sub-heater further includes a second fixing through hole penetrating the second lower end, wherein the first fixing through hole and the second fixing through hole are connected along a second direction, so that the fastener can fix the heater body to the cold plate or the housing through the first upper end, the first lower end and the second lower end.

[0013] In one embodiment, the first sub-heat sink further includes a receiving groove recessed at the first upper end.

[0014] In one embodiment, the plastic part includes a first surface, a second surface, and at least one protrusion. The second surface covers the mounting end face of the heat sink body, the first surface faces the circuit board, and the at least one protrusion protrudes from the first surface toward the second surface. When the plastic part and the heat sink body are assembled, the at least one protrusion is aligned and received in a receiving groove and provides a positioning function.

[0015] In one embodiment, the first lower end of the first sub-heat sink is attached to the second sub-heat sink in the second direction and connected by thermal grease.

[0016] In one embodiment, the plastic part includes a first surface, a second surface, and at least one positioning protrusion. The second surface covers the mounting end face of the heat sink body, the first surface faces the circuit board, and the at least one positioning protrusion is disposed on the first surface to mate with at least one positioning opening on the circuit board and provide a positioning function during the assembly of the heat sink and the circuit board.

[0017] In one embodiment, the plastic part includes a clamping member, the clamping member having an outer peripheral wall with at least one positioning protrusion, the clamping member being tightly fitted with the at least one positioning opening when the at least one positioning protrusion passes through the at least one positioning opening.

[0018] In one embodiment, the plastic component includes a support rib disposed on a first surface of the plastic component facing the circuit board, connecting to the outer peripheral wall of at least one positioning protrusion, and abutting against the surface of the circuit board during the assembly of the heat sink and the circuit board.

[0019] In one embodiment, the radiator body includes a fixing through hole extending through the radiator body in a second direction, and at least one positioning protrusion has a through hole spatially aligned with the fixing through hole. The fastener allows the radiator body to be fixed to a cold plate or a housing through the through hole and the fixing through hole.

[0020] In one embodiment, the planar area of ​​the heat sink body in the second direction is included within the planar area of ​​the plastic part.

[0021] In one embodiment, the first heating device and the second heating device are each a plurality of power devices, arranged along a third direction, and inserted into a mounting hole on the circuit board along a second direction to form an electrical connection, the third direction being perpendicular to the first and second directions.

[0022] In one embodiment, the first heating device and the second heating device are respectively attached to the first mounting surface of the first sub-heat sink and the second mounting surface of the second sub-heat sink via thermally conductive insulating adhesive sheets.

[0023] The beneficial effects of this utility model are that the embodiments of this utility model provide a heat sink, which divides the double-sided heat sink body into two sub-heat sinks through a clever mechanism design, and then uses thermal grease and countersunk screws to combine them into a whole for use. There is a plastic part made of insulating plastic on the top of the heat sink body to separate it from the circuit board, which effectively exerts the best heat dissipation effect of the heat sink, while meeting the safety distance requirements. Attached Figure Description

[0024] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above content, and are not intended to limit the present invention.

[0025] Figure 1 A three-dimensional structural view of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present utility model is disclosed.

[0026] Figure 2 An exploded view from above shows the structure of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present invention.

[0027] Figure 3 An exploded view of the structure of the heat sink, circuit board, and heat-generating device according to an embodiment of the present invention is disclosed from a bottom view.

[0028] Figure 4 A three-dimensional structural view of the radiator body according to an embodiment of this utility model is disclosed;

[0029] Figure 5 An exploded view of the radiator body according to an embodiment of this utility model is disclosed;

[0030] Figure 6 A top view of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present invention is disclosed;

[0031] Figure 7 A bottom view of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present utility model is disclosed;

[0032] Figure 8 public Figure 1 Cross-sectional view along line segment AA'; and

[0033] Figure 9 public Figure 1 Cross-sectional view along line segment BB'. Detailed Implementation

[0034] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in different ways without departing from its scope, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the invention. For example, if the following description of a first feature disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features may be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatially related terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. For example, the term "thermal coupling" as used herein can refer to either direct contact forming a heat transfer path or indirect heat transfer path formed through other components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that although terms such as "first," "second," and "third" may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term “and / or” as used here includes any or all of the combinations of one or more of the related listed items.

[0035] Figure 1 A three-dimensional structural view of the heat sink combined with the circuit board and the heating element of this utility model embodiment is disclosed. Figure 2 The present invention discloses an exploded view of the structure of the heat sink combined with the circuit board and the heat-generating device from an upper perspective. Figure 3 The present invention discloses an exploded view of the structure of the heat sink combined with the circuit board and the heat-generating device from a bottom view. Figure 4 A three-dimensional structural view of the radiator body according to an embodiment of the present utility model is disclosed. Figure 5 An exploded view of the structure of the radiator body according to an embodiment of this utility model is disclosed. Figure 6 A top view of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present invention is disclosed. Figure 7 A bottom view of the heat sink combined with the circuit board and the heat-generating device according to an embodiment of the present invention is disclosed. Figure 8 public Figure 1 Cross-sectional view along line segment AA'. Figure 9 public Figure 1 Cross-sectional view along line segment BB'.

[0036] refer to Figures 1 to 9 In this embodiment, the present invention provides a heat sink 1, which is assembled to provide heat dissipation for a first heating element 51 and a second heating element 52 that are vertically inserted on a circuit board 40. The heat sink 1 includes a first sub-heat sink 10, a second sub-heat sink 20, and a plastic part 30. The first sub-heat sink 10 has a first mounting surface 12 and a first contact surface 11 on both sides along a first direction, such as the X-axis, wherein the first mounting surface 12 is used to assemble and install the first heating element 51. The second sub-heat sink 20 has a second mounting surface 22 and a second contact surface 21 on both sides along a first direction, such as the X-axis, wherein the second mounting surface 22 is used to assemble and install the second heating element 52. The first contact surface 11 is attached to the second contact surface 21 to form a heat sink body 2. The heat sink body 2 has a mounting end surface 2a and a heat dissipation end surface 2b along a second direction, such as the Z-axis. The second direction is perpendicular to the first direction. The mounting end surface 2a faces the circuit board 40. The first heating element 51 and the second heating element 52 are vertically inserted on the circuit board 40 and electrically connected to the circuit board 40. Plastic part 30 covers mounting end face 2a and is disposed between heat sink body 2 and circuit board 40.

[0037] In this embodiment, the first heating device 51 and the second heating device 52 are each a plurality of semiconductor power devices, arranged along a third direction, such as the Y-axis, and electrically connected by being inserted into a mounting hole 42 on the circuit board 40 along a second direction (i.e., the Z-axis). The third direction is perpendicular to the first and second directions. In this embodiment, the first heating device 51 is attached to the first mounting surface 12 of the first sub-heat sink 10 via a thermally conductive insulating adhesive sheet 53, and the second heating device 52 is attached to the second mounting surface 22 of the second sub-heat sink 20 via a thermally conductive insulating adhesive sheet 54. In addition, thermally conductive silicone grease 2c is provided between the first bonding surface 11 of the first sub-heat sink 10 and the second bonding surface 21 of the second sub-heat sink 20, and the first bonding surface 11 and the second bonding surface 21 can be connected by applying thermally conductive silicone grease 2c. In one embodiment, after attaching thermally conductive insulating adhesive sheets 53, 54 and first heating element 51 and second heating element 52 to the first sub-heat sink 10 and the second sub-heat sink 20 respectively, thermally conductive silicone grease can be applied to the surfaces of the first mating surface 11 of the first sub-heat sink 10 and the second mating surface 21 of the second sub-heat sink 20, which are opposite to each other, and then pressed together along the first direction (i.e., the X-axis direction). In this way, the first sub-heat sink 10 and the second sub-heat sink 20 will come into contact with each other and be assembled together to form the heat sink body 2, providing efficient heat dissipation function for the first heating element 51 and the second heating element 52 that are vertically inserted on the circuit board 40.

[0038] In this embodiment, the first sub-heat sink 10 has a first upper end 13 and a first lower end 14 opposite to each other in the second direction (i.e., the Z-axis direction). The second sub-heat sink 20 has a second upper end 23 and a second lower end 24 opposite to each other in the second direction (i.e., the Z-axis direction). In this embodiment, the first upper end 13 and the second upper end 23 engage with each other to form the mounting end face 2a of the heat sink body 2, and the second lower end 24 covers the first lower end 14 to form the heat dissipation end face 2b of the heat sink body 2. The first lower end 14 of the first sub-heat sink 10 is in contact with the second sub-heat sink 20 in the second direction (i.e., the Z-axis direction) and is connected by thermal grease (not shown). Of course, this utility model is not limited thereto. In this embodiment, the first sub-heat sink 10 also includes a first engaging member 15 disposed adjacent to the first upper end 13, and the second sub-heat sink 20 also includes a second engaging member 25 disposed adjacent to the second upper end 23. The first engaging member 15 and the second engaging member 25 are, for example, paired convex and concave engaging members. In this embodiment, the first engaging member 15 and the second engaging member 25 engage with each other along the second direction (i.e., the Z-axis direction). Additionally, in this embodiment, the first sub-heater 10 further includes a first locking hole 16 adjacent to the first lower end 14, and the second sub-heater 20 further includes a second locking hole 26 adjacent to the second lower end 24. The first locking hole 16 and the second locking hole 26 are aligned and connected to each other in the second direction (i.e., the Z-axis direction), and the screw 2d can lock the first sub-heater 10 and the second sub-heater 20 together through the first locking hole 16 and the second locking hole 26.

[0039] In other words, in addition to being bonded to the first mating surface 11 and the second mating surface 21 in the first direction (i.e., the X-axis direction) by thermal grease 2c, the top ends of the first sub-heater 10 and the second sub-heater 20 can be engaged with each other in the second direction (i.e., the Z-axis direction) to form a mounting end face 2a facing the circuit board. The bottom ends of the first sub-heater 10 and the second sub-heater 20 have corresponding first locking holes 16 and second locking holes 26, which can be fixed together by countersunk screws 2d through the locking holes at the bottom ends of the first sub-heater 10 and the second sub-heater 20, thus ensuring good heat dissipation.

[0040] In this embodiment, the plastic component 30 is made of insulating plastic. Since the first sub-heater 10 and the second sub-heater 20 constituting the heat sink body 2 are both made of metal, placing the plastic component made of insulating plastic between the mounting end face 2a of the heat sink body 2 facing the circuit board 40 and the circuit board 40 can effectively perform the function of insulation.

[0041] In this embodiment, the plastic component 30 includes a first surface 31, a second surface 32, and at least one positioning protrusion 34. The second surface 32 covers the mounting end surface 2a of the heat sink body 2, the first surface 31 faces the circuit board 40, and the at least one positioning protrusion 34 is disposed on the first surface 31. The at least one positioning protrusion 34 is, for example, a hollow cylinder with a through hole 37, disposed on the first surface 31 of the plastic component 30 along the second direction (i.e., the Z-axis direction). When the heat sink 1 and the circuit board 40 are assembled, the at least one positioning protrusion 34 will mate with at least one positioning opening 41 on the circuit board 40, so that the at least one positioning protrusion 34 passes through the at least one positioning opening 41 and provides a positioning function. Thus, after the first heating device 51 and the second heating device 52 are attached to the two opposite sides of the heat sink body 2, they can be assembled onto the circuit board 40 together with the plastic component 30 on the mounting end surface 2a. The pairing of at least one positioning protrusion 34 and at least one positioning opening 41 facilitates the vertical insertion of the first heating element 51 and the second heating element 52 into the mounting hole 42 of the circuit board 40 along the second direction (i.e., the Z-axis direction) and soldering, so that the heat sink 1 and the circuit board 40 are assembled.

[0042] In this embodiment, the plastic part 30 includes a clamping member 35. The clamping member 35 is provided with an outer peripheral wall of at least one positioning protrusion 34. When the at least one positioning protrusion 34 passes through at least one positioning opening 41, the clamping member 35 is tightly fitted with the at least one positioning opening 41.

[0043] In this embodiment, the plastic component 30 further includes a support rib 36 disposed on the first surface 31 of the plastic component 30 facing the circuit board 40, connecting to the outer peripheral wall of at least one positioning protrusion 34. During the assembly of the heat sink 1 and the circuit board 40, the top edge of the support rib 36 abuts against the surface 43 of the circuit board 40 to stably support the circuit board 40. Through the combination of the positioning protrusion 34, the clamping member 35, and the support rib 36, the plastic component 30 can be more securely fixed between the circuit board 40 and the heat sink body 2, effectively performing the functions of insulation and maintaining safety distance. Of course, the size, shape, and configuration of the at least one positioning protrusion 34, the clamping member 35, and the support rib 36 can also be varied according to actual application requirements, and this utility model is not limited thereto.

[0044] In this embodiment, the first sub-heat sink 10 further includes a first fixing through hole 17, which extends through the first upper end 13 and the first lower end 14 along the second direction (i.e., the Z-axis direction). The second sub-heat sink 20 further includes a second fixing through hole 27, which extends through the second lower end 24 along the second direction (i.e., the Z-axis direction). In this embodiment, the first fixing through hole 17 and the second fixing through hole 27 are spatially opposite to the through hole 37 of at least one positioning protrusion 34 on the plastic part 30 and at least one positioning opening 41 on the circuit board 40. After the heat sink 1 and the circuit board 40 are assembled, the first fixing through hole 17 and the second fixing through hole 27 can still be connected outward along the second direction (i.e., the Z-axis direction) through the through hole 37 of at least one positioning protrusion 34. In other words, the first fixing through hole 17 and the second fixing through hole 27 can be regarded as the fixing through hole of the heat sink body 2 connected along the second direction (i.e., the Z-axis direction). Since the first fixing through hole 17 and the second fixing through hole 27 are connected along the second direction (i.e., the Z-axis direction) and connected outward through the through hole 37 of at least one positioning protrusion 34, the fastener 9, for example, a long screw, can use the through hole 37 of at least one positioning protrusion 34, the first fixing through hole 17 and the second fixing through hole 27 to fix the heat sink body 2 to the cold plate or housing (not shown) through the first upper end 13, the first lower end 14 and the second lower end 24. Of course, the operation of the fastener 9 can also be completed through other through holes on the circuit board 40, and this utility model is not limited to this.

[0045] On the other hand, in this embodiment, the first sub-heat sink 10 also includes a receiving groove 18 recessed at the first upper end 13, which accommodates the operating end 90 of the locking fastener 9. Thus, the locking fastener 9 can pass through the through hole 37 on the plastic part 30 along the second direction (Z-axis direction), through the first fixing through hole 17 and the second fixing through hole 27 on the heat sink body 2, to fix the assembled heat sink body 2 and circuit board 40 to the cold plate or housing. After the locking fastener 9 completes the fixing operation, the operating end 90 is accommodated in the receiving groove 18, spaced apart from the circuit board 40, ensuring that the safety distance is not affected by the locking fastener 9, and allowing the heat sink 1 to achieve optimal heat dissipation.

[0046] On the other hand, in this embodiment, the plastic part 30 includes a first surface 31, a second surface 32, and at least one protrusion 33. The second surface 32 of the plastic part 30 covers the mounting end face 2a of the heat sink body 2, and the first surface 31 faces the circuit board 40. The at least one protrusion 33 is, for example, a hollow protruding column, protruding from the first surface 31 towards the second surface 32. When the plastic part 30 and the heat sink body 2 are assembled, the at least one protrusion 33 is further aligned and received in the receiving groove 18, further providing mating and positioning functions. It is worth noting that, in this embodiment, the second surface 32 of the plastic part 30 protrudes further downward at its outer periphery and covers the mounting end face 2a of the heat sink body 2, so that the planar area (footprint) of the heat sink body 2 in the second direction (i.e., the Z-axis direction) is included within the planar area of ​​the plastic part 30, which can ensure safety distances. Of course, the size, shape, and configuration of the plastic part 30 between the circuit board 40 and the heat sink body 2 can also be varied according to actual application requirements, and this utility model is not limited thereto.

[0047] As can be seen from the above, the heat sink 1, through a clever mechanism design, divides the double-sided heat sink body 2 into a first sub-heat sink 10 and a second sub-heat sink 20. These are then combined into a single unit using thermal grease 2c and countersunk screws 2d. An insulating plastic component 30 separates the heat sink body 2 from the circuit board 40, which helps to achieve the best heat dissipation effect of the heat sink 1 while meeting safety distance requirements. Of course, this utility model is not limited to this.

[0048] In summary, this utility model provides a heat sink. Through ingenious structural design, the double-sided heat sink is divided into two sub-heat sinks, which are assembled into a single unit using thermally conductive silicone grease and countersunk screws. An insulating plastic component on the top of the heat sink unit contacts the circuit board for insulation and to ensure a safe distance. After attaching thermally conductive insulating adhesive sheets and heat-generating components to each of the two sub-heat sinks, thermally conductive silicone grease is applied to the surfaces where they meet, and then they are pressed together horizontally. This allows the two sub-heat sinks to come into contact and adhere together. Furthermore, the tops of the two sub-heat sinks can be vertically engaged to form mounting faces towards the circuit board. The bottoms of the two sub-heat sinks have corresponding locking holes, which can be used to secure them together using countersunk screws, ensuring good heat dissipation. Since both sub-heat sinks of the heat sink unit are made of metal, an insulating plastic component can be placed between the mounting face of the heat sink unit facing the circuit board and the circuit board for insulation. The bottom surface of the plastic part protrudes from its outer periphery and covers the mounting end face, so that the planar area of ​​the heat sink body in the vertical direction is included within the planar area of ​​the plastic part, ensuring safety distances. The bottom surface of the plastic part may have a concave surface to align with the receiving groove on the mounting end face of the heat sink body, providing mating and positioning functions during assembly of the heat sink body and the plastic part. Additionally, the top surface of the plastic part has a positioning protrusion that aligns with the positioning opening on the circuit board, facilitating the vertical insertion of the heat-generating device into the mounting holes on the circuit board for soldering, thus completing the assembly of the heat sink and the circuit board. The combination of the positioning protrusion with fasteners and support ribs further secures the plastic part firmly between the circuit board and the heat sink body, effectively providing insulation and maintaining safety distances. Furthermore, the positioning protrusion has a through hole in the center for installing fasteners to secure the heat sink to the cold plate or housing. The fasteners can pass through the through hole and, through the fixing holes in the heat sink body, fix the heat sink, along with the circuit board, to the cold plate or housing. The operating end of the locking fastener can be accommodated in the receiving groove on the mounting end face, ensuring that the safety distance is not affected by the locking fastener, allowing the heat sink to achieve the best heat dissipation effect. It should be understood that the "fitting" or "contacting" mentioned in this utility model does not mean direct fitting or direct contact, but also includes fitting or contacting with a certain air gap or after inserting an insulating medium between the two. Since the two sub-heat sinks constituting the heat sink body are both made of metal, in order to meet the safety insulation requirements, a thermally conductive insulating adhesive sheet needs to be inserted between the heating device and the mounting surface of the sub-heat sink before contacting or fitting with the heat sink body. This thermally conductive insulating adhesive sheet can be thermally conductive insulating tape, thermally conductive insulating adhesive, thermally conductive insulating pad, etc., and this utility model does not limit it.

[0049] This utility model may be modified in various ways by those skilled in the art, but none of them shall depart from the scope of protection intended by the claims of this utility model.

Claims

1. A radiator, characterized in that, include: A first sub-heat sink has a first mounting surface and a first contact surface on both sides along a first direction, wherein the first mounting surface is used to assemble and install a first heating device. A second sub-heat sink has a second mounting surface and a second contact surface on both sides along the first direction, wherein the second mounting surface is used to assemble and mount a second heating element, and the first contact surface is attached to the second contact surface to form a heat sink body. The heat sink body has a mounting end face and a heat dissipation end face along a second direction, the second direction being perpendicular to the first direction. The mounting end face faces a circuit board, and the first heating element and the second heating element are electrically connected to the circuit board. A plastic component covers the mounting end face and is disposed between the heat sink body and the circuit board.

2. The radiator as described in claim 1, characterized in that, Thermal grease is applied between the first bonding surface and the second bonding surface.

3. The radiator as described in claim 1, characterized in that, The first sub-heater has a first upper end and a first lower end opposite to each other in the second direction, and the second sub-heater has a second upper end and a second lower end opposite to each other in the second direction. The first upper end and the second upper end engage to form the mounting end face of the heat sink body, and the second lower end covers the first lower end to form the heat dissipation end face of the heat sink body.

4. The radiator as described in claim 3, characterized in that, The first sub-heater also includes a first engaging member disposed adjacent to the first upper end, and the second sub-heater also includes a second engaging member disposed adjacent to the second upper end, and the first engaging member and the second engaging member engage along the second direction.

5. The radiator as described in claim 3, characterized in that, The first sub-radiator also includes a first locking hole adjacent to the first lower end, and the second sub-radiator also includes a second locking hole adjacent to the second lower end. The first locking hole and the second locking hole are connected in the second direction, and a screw is used to lock the first sub-radiator and the second sub-radiator through the first locking hole and the second locking hole.

6. The radiator as described in claim 3, characterized in that, The first sub-heater also includes a first fixing through hole that passes through the first upper end and the first lower end, and the second sub-heater also includes a second fixing through hole that passes through the second lower end, wherein the first fixing through hole and the second fixing through hole are connected along the second direction, so that a fastener can fix the heater body to a cold plate or a housing through the first upper end, the first lower end and the second lower end.

7. The radiator as described in claim 6, characterized in that, The first sub-radiator also includes a receiving groove recessed at the upper end of the first sub-radiator.

8. The radiator as described in claim 7, characterized in that, The plastic part includes a first surface, a second surface, and at least one protrusion. The second surface covers the mounting end face of the heat sink body. The first surface faces the circuit board. The at least one protrusion protrudes from the first surface toward the second surface. When the plastic part and the heat sink body are assembled, the at least one protrusion is aligned and received in the receiving groove and provides a positioning function.

9. The radiator as described in claim 3, characterized in that, The first lower end of the first sub-heat sink is attached to the second sub-heat sink in the second direction and is connected by thermal grease.

10. The radiator as claimed in claim 1, characterized in that, The plastic part includes a first surface, a second surface, and at least one positioning protrusion. The second surface covers the mounting end face of the heat sink body, the first surface faces the circuit board, and the at least one positioning protrusion is disposed on the first surface. When the heat sink and the circuit board are assembled, the protrusion mates with at least one positioning opening on the circuit board and provides a positioning function.

11. The radiator as claimed in claim 10, characterized in that, The plastic part includes a clamping member, which has an outer peripheral wall provided with the at least one positioning protrusion. When the at least one positioning protrusion passes through the at least one positioning opening, the clamping member is tightly fitted with the at least one positioning opening.

12. The radiator as claimed in claim 10, characterized in that, The plastic component includes a support rib disposed on the first surface of the plastic component facing the circuit board, connecting to the outer peripheral wall of the at least one positioning protrusion, and abutting against the surface of the circuit board during the assembly of the heat sink and the circuit board.

13. The radiator as claimed in claim 10, characterized in that, The radiator body includes a fixing through hole that extends through the radiator body along the second direction. The at least one positioning protrusion has a through hole that is spatially aligned with the fixing through hole. A fastener allows the radiator body to be fixed to a cold plate or a housing through the through hole and the fixing through hole.

14. The radiator as claimed in claim 1, characterized in that, The planar area of ​​the heat sink body in the second direction is included within the planar area of ​​the plastic part.

15. The radiator as claimed in claim 1, characterized in that, The first heating element and the second heating element are each a plurality of power devices, arranged along a third direction, and electrically connected by a mounting hole on the circuit board inserted along the second direction. The third direction is perpendicular to the first direction and the second direction.

16. The radiator as claimed in claim 1, characterized in that, The first heating element and the second heating element are respectively attached to the first mounting surface of the first sub-heater and the second mounting surface of the second sub-heater via a thermally conductive insulating adhesive sheet.

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