Direct connection type heat dissipation structure and electronic equipment

Abstract

The utility model discloses a direct connection type heat dissipation structure and electronic equipment. The direct connection type heat dissipation structure comprises a heat dissipation shell, an insulating heat conduction layer and a heat conduction metal sheet; the outer surface of the heat dissipation shell comprises a mounting surface and a side wall surface adjacent to the mounting surface; the insulating heat-conducting layer covers the mounting surface and at least part of the side wall surface; and the heat-conducting metal sheet is attached to one side, deviating from the mounting surface, of the insulating heat-conducting layer and is used for mounting a functional device. According to the utility model, the heat generated by the functional device is transmitted to the heat dissipation shell for heat dissipation through the heat conduction metal sheet and the insulating heat conduction film, so that the heat conduction path is shortened, the heat dissipation efficiency is improved, and the stability of equipment during high-load work is ensured. The insulating heat conduction layer at least partially covers the side wall of the heat dissipation shell, so that the creepage risk of current in a high-voltage environment can be reduced; while the heat dissipation efficiency is ensured, the electrical performance under a high-voltage working condition is improved, so that the safety and the stability of equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, and in particular to a direct-connection heat dissipation structure and electronic device. Background Technology

[0002] With the rapid development of industries such as electric vehicles, 5G communications, AI computing, and consumer electronics, the power density of electronic devices is constantly increasing, and the miniaturization and integration of devices are continuously improving. Thermally conductive and heat-dissipating materials have become crucial fundamental materials. In the future, the research and development of thermally conductive and heat-dissipating materials will focus on reducing thermal resistance, improving thermal conductivity, enhancing material flexibility, and facilitating processing.

[0003] Common thermal conductive and heat dissipation materials include: thermally conductive silicone pads, thermally conductive ceramic pads, and metal-based insulating thermally conductive and heat dissipation materials.

[0004] Thermally conductive silicone pads are inherently thick, requiring additional layers to improve performance, resulting in long heat conduction and dissipation paths and low efficiency. Chinese utility model patent CN214316013U discloses a "silicone pad with good thermal conductivity," which includes a silicone pad body and a thermally conductive layer. The outer side of the silicone pad body is coated with the thermally conductive layer, the outer side of the thermally conductive layer is coated with thermally conductive adhesive, and carbon fiber is bonded to the outer side of the thermally conductive adhesive. The thermally conductive layer includes a thermally conductive silicone grease layer and a silicate refractory layer. CN214316013U suffers from numerous layers, significant thickness, high thermal resistance, low heat conduction and dissipation efficiency, and insufficient reliability under long-term use at high temperatures.

[0005] Thermally conductive ceramic sheets are difficult to manufacture, have low yield rates, and are costly, generally used in a few specialized fields. Chinese utility model patent CN114864521A discloses "An IGBT module heat dissipation structure and its polymer composite heat dissipation material," whose technical solution includes DBC (direct copper-clad ceramic plate), requiring the ceramic to be combined with a copper plate under high temperature (usually above 1000℃) and high pressure, resulting in a difficult process, low yield rate, and high cost.

[0006] Metal-based insulating and thermally conductive heat dissipation materials are typically formed by bonding insulating materials and metal layers through a high-temperature, high-pressure lamination process to improve the material's thermal conductivity and electrical insulation. Chinese utility model patent CN204585969U discloses "a copper-clad laminate with good heat dissipation," whose technical solution involves coating an insulating resin onto an aluminum substrate and then laminating it with a copper foil containing a thermally conductive film. This technical solution uses traditional copper-clad laminate manufacturing processes, which are complex and have a low yield rate. Furthermore, the adhesive used is an epoxy resin system, which lacks reliability at high temperatures. The insulating layer in this structure does not cover the thermally conductive heat dissipation layer, posing a risk of creepage under high-voltage environments, potentially leading to insulation failure, short circuits, and equipment damage. Utility Model Content

[0007] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a direct-connection heat dissipation structure, which can improve the insulation capability of the structure under high voltage environment, enabling electronic equipment to maintain stable operation under high voltage, high frequency and high temperature conditions.

[0008] This invention also proposes an electronic device having the above-mentioned direct-connection heat dissipation structure.

[0009] According to a first aspect embodiment of the present invention, the direct-connection heat dissipation structure includes: a heat dissipation housing, the outer surface of which includes a mounting surface and a side wall adjacent to the mounting surface; an insulating and thermally conductive layer covering the mounting surface and at least a portion of the side wall; and a thermally conductive metal sheet attached to the side of the insulating and thermally conductive layer opposite to the mounting surface, and used for mounting functional devices.

[0010] The direct-connection heat dissipation structure according to the embodiments of this utility model has at least the following beneficial effects: The direct-connection heat dissipation structure transfers the heat generated by the functional device to the heat dissipation shell for heat dissipation through a thermally conductive metal sheet and an insulating thermally conductive film, enabling heat to be transferred from the functional device to the heat dissipation shell more quickly, thereby improving heat dissipation efficiency and ensuring stability under high load operation. The insulating thermally conductive layer not only provides good electrical insulation performance but also has thermal conductivity. Furthermore, compared with traditional metal-based insulating thermally conductive heat dissipation materials, in the direct-connection heat dissipation structure of this application, the insulating thermally conductive layer at least partially covers the sidewall of the heat dissipation shell, which can effectively reduce the risk of current creepage under high voltage conditions; thus, while ensuring heat dissipation efficiency, it improves electrical performance under high voltage operating conditions, thereby improving safety and stability.

[0011] According to some embodiments of this utility model, along a direction perpendicular to the mounting surface, the extension length of the portion of the sidewall surface covered by the insulating and heat-conducting layer is h, and the total extension length of the sidewall surface is H, wherein h ≥ 0.01H; or, the outer surface of the heat dissipation housing further includes a bottom surface, the mounting surface and the bottom surface are disposed opposite to each other, and the sidewall surface connects the edge of the mounting surface and the edge of the bottom surface; the insulating and heat-conducting layer completely covers the mounting surface, the sidewall surface and the bottom surface.

[0012] According to some embodiments of the present invention, the projection of the heat-conducting metal sheet along a direction perpendicular to the mounting surface is located within the outer contour of the insulating heat-conducting layer.

[0013] According to some embodiments of the present invention, the thermally conductive metal sheet includes a first mounting portion and a second mounting portion, the first mounting portion being attached to the insulating thermally conductive layer; the second mounting portion is located outside the outer contour of the insulating thermally conductive layer along a projection perpendicular to the mounting surface, and the second mounting portion is used to mount functional devices.

[0014] According to some embodiments of the present invention, the thermally conductive metal sheet further includes a connecting portion that connects the first mounting portion and the second mounting portion, and the connecting portion is at least partially flexible.

[0015] According to some embodiments of the present invention, there are multiple thermally conductive metal sheets, and the multiple thermally conductive metal sheets are spaced apart on the side of the insulating thermally conductive layer away from the mounting surface.

[0016] According to some embodiments of the present invention, the plurality of thermally conductive metal sheets include a first metal sheet and a second metal sheet, wherein the insulating thermally conductive layer between the first metal sheet and the mounting surface has a first thickness, and the insulating thermally conductive layer between the second metal sheet and the mounting surface has a second thickness, wherein the second thickness is greater than the first thickness.

[0017] According to some embodiments of this utility model, the thermally conductive metal sheet and the insulating thermally conductive layer are hot-pressed together.

[0018] According to some embodiments of the present invention, the insulating and thermally conductive layer includes at least one polyimide film.

[0019] According to a second aspect of the present invention, the electronic device includes a functional component and the direct-connection heat dissipation structure described in the first aspect, wherein the functional component is connected to the heat-conducting metal sheet.

[0020] The electronic device according to the embodiments of this utility model has at least the following beneficial effects: When the electronic device is running, the heat generated by the functional components can be transferred to the heat sink housing for heat dissipation through the thermally conductive metal sheet and the insulating thermally conductive film, allowing heat to be transferred from the functional components to the heat sink housing more quickly, thereby improving heat dissipation efficiency and ensuring the stability of the electronic device under high load operation. The insulating thermally conductive layer not only provides good electrical insulation performance but also has thermal conductivity; and the insulating thermally conductive layer at least partially covers the sidewall of the heat sink housing, which can effectively reduce the risk of current creepage under high voltage conditions; thus, while ensuring heat dissipation efficiency, it improves electrical performance under high voltage operating conditions, thereby improving the safety and stability of the electronic device.

[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a schematic diagram of the structure of an electronic device in one embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of a direct-connection heat dissipation structure in one embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the direct-connection heat dissipation structure in another embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of an electronic device in another embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the direct-connection heat dissipation structure in another embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the heat-conducting metal sheet including a first mounting part and a second mounting part in one embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the heat-conducting metal sheet including a first mounting part and a second mounting part in another embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of a flexible structure between the first mounting part and the second mounting part in one embodiment of the present invention.

[0031] Figure label:

[0032] 1000. Electronic devices;

[0033] 100. Direct-connection heat dissipation structure;

[0034] 10. Heat sink housing; 11. Mounting surface; 12. Side wall surface; 13. Bottom surface;

[0035] 20. Insulating and thermally conductive layer; 21. Polyimide film;

[0036] 30. Thermally conductive metal sheet; 30a. First metal sheet; 30b. Second metal sheet; 31. First mounting part; 32. Second mounting part; 33. Connecting part.

[0037] 200. Functional devices. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0039] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0041] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0042] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] Firstly, this utility model provides a direct-connection heat dissipation structure, in some embodiments, such as... Figures 1 to 3 As shown, the direct-connection heat dissipation structure 100 includes a heat dissipation housing 10, an insulating and thermally conductive layer 20, and a thermally conductive metal sheet 30; the outer surface of the heat dissipation housing 10 includes a mounting surface 11 and a side wall surface 12 adjacent to the mounting surface 11; the insulating and thermally conductive layer 20 covers the mounting surface 11 and at least part of the side wall surface 12; the thermally conductive metal sheet 30 is attached to the side of the insulating and thermally conductive layer 20 away from the mounting surface 11 and is used to mount the functional device 200.

[0044] In this embodiment, the direct-connection heat dissipation structure 100 transfers the heat generated by the functional device 200 to the heat dissipation housing 10 through the thermally conductive metal sheet 30 and the insulating thermally conductive film, shortening the heat conduction path and improving heat dissipation efficiency. This allows heat to be transferred from the functional device 200 to the heat dissipation housing 10 more quickly, thereby ensuring stability under high load operation. The insulating thermally conductive layer 20 not only provides good electrical insulation performance but also has thermal conductivity; moreover, the insulating thermally conductive layer 20 at least partially covers the sidewall of the heat dissipation housing 10, which can effectively reduce the risk of current creepage under high voltage conditions. Thus, while ensuring heat dissipation efficiency, it improves electrical performance under high voltage operating conditions, thereby improving safety and stability.

[0045] The direct-connection heat dissipation structure 100 can be applied to high-power devices, optoelectronics, high-computing-power chips, and other fields. Specifically, the direct-connection heat dissipation structure 100 is applied to electronic device 1000, such as a computer host, mobile phone, smart home device, or electrical component in a vehicle; the functional device 200 can be a power amplifier, driver, photodetector, graphics processing unit, processor, etc., which are not limited in this embodiment.

[0046] According to the formula for total heat flow in steady-state heat conduction: Q = kAΔT / L, where Q represents the heat transferred (unit: W / m³). 2 k represents the thermal conductivity of the material (unit: W / mk), and A represents the cross-sectional area for heat conduction (unit: m). 2 ΔT represents the temperature difference (unit: K or ℃). L represents the length of the heat conduction path (unit: m). Ways to improve heat dissipation efficiency include reducing material thermal resistance, increasing material thermal conductivity, and increasing the heat conduction cross-sectional area. Therefore, this invention proposes a direct-connection heat dissipation structure 100, which simplifies the heat dissipation structure, shortens the heat conduction path, and improves heat dissipation efficiency. Furthermore, through partial or full coverage design of the insulating thermally conductive layer 20, the insulation capability of the structure under high-voltage environments is improved, enabling electronic equipment to maintain stable operation under high voltage and high temperature conditions.

[0047] In some embodiments, the heat sink 10 may be the housing or chassis of the electronic device 1000. To ensure heat dissipation performance, the heat sink 10 may be made of metal or ceramic. Heat dissipation fins or other structures that improve heat dissipation efficiency may also be designed on the heat sink 10; this embodiment does not limit this approach.

[0048] For ease of description, the outer surface of the heat sink 10 is divided into a mounting surface 11 and a side wall surface 12. The mounting surface 11 is typically designed as a flat surface with good thermal conductivity to ensure that heat is effectively conducted from the functional device 200 to the heat sink 10. The side wall surface 12 is typically perpendicular to the mounting surface 11 and surrounds the edge of the heat sink 10. The side wall surface 12 may include multiple different walls to form the overall structure of the housing. These walls may have different shapes and sizes to meet heat dissipation requirements and specific installation requirements.

[0049] In other embodiments, the outer surface of the heat sink 10 may include a mounting surface 11 and a bottom surface 13 disposed opposite to each other, and other wall surfaces connecting the edge of the mounting surface 11 and the edge of the bottom surface 13 are all side wall surfaces 12. Heat dissipation efficiency can be further improved by designing structures such as heat dissipation fins on the bottom surface 13.

[0050] The insulating and thermally conductive layer 20 includes at least one polyimide film. The polyimide is characterized by its ability to be hot-pressed and bonded to the thermally conductive metal sheet 30 under certain temperature and pressure conditions. In this embodiment, the polyimide film is a hot-pressable bondable polyimide film, which simplifies the manufacturing process, reduces difficulty, and helps improve product yield and reduce manufacturing costs compared to the traditional DBC structure.

[0051] In some optional embodiments, the polyimide film can be a commercially available product, such as the MCC7825 polyimide film manufactured by Shenzhen Momaclai Chemical Technology Co., Ltd. Of course, other types of polyimide films with similar properties can also be used, and this embodiment does not limit this choice.

[0052] In some embodiments, the total thickness of the insulating thermally conductive layer 20 is designed to be from 5 μm to 300 μm. The thickness of the insulating thermally conductive layer 20 should be selected in accordance with relevant safety specifications (such as electrical safety standards, thermal management requirements, etc.) to ensure safety and reliability under specific working environments and conditions.

[0053] In practical applications, the thickness of the insulating and thermally conductive layer 20 can be less than 5 μm or greater than 300 μm; this embodiment does not impose any limitations on this. Design requirements can be met by selecting a polyimide film of appropriate thickness, simplifying the production process. Alternatively, the required total thickness can be achieved by stacking multiple layers of polyimide films. This allows for adjustment of material properties and optimization of performance between different layers, for example, by using different combinations of polyimide films to achieve better overall performance.

[0054] Comparative tests were conducted on polyimide films and K10 insulating and thermally conductive composite films of different specifications. The testing equipment was a DRL-III manufactured by Xiangtan Xiangyi Instrument Co., Ltd., and the testing reference standard was ASTM D5470.

[0055] The test results are shown in the table below:

[0056]

[0057] Note: The thermal conductivity of both MCC 7825 polyimide film and MCC 7425 polyimide film is 0.2 W / mk. The structure of K10 insulating and thermally conductive composite film is a layered thermally conductive silicone and polyimide thermally conductive silicone, wherein the thickness of polyimide is 25 μm. The thermal conductivity of K10 insulating and thermally conductive composite film is 1.3 W / mk.

[0058] According to safety regulations, the insulation class is determined by the polyimide. Therefore, the insulation class of Example 2 is equivalent to the insulation class of Comparative Examples 1 and 2.

[0059] As can be seen from the data in the table above, although the thermal conductivity of Examples 1 and 2 is lower than that of Comparative Examples 1 and 2, Examples 1 and 2 have certain advantages in terms of thermal conductivity because the insulation layer of Examples 1 and 2 is thinner and the thermal resistance is lower.

[0060] In some embodiments, such as Figure 1 and Figure 2 As shown, the insulating and thermally conductive layer 20 can completely cover the mounting surface 11 and the portion of the side wall 12 that connects to the mounting surface 11. Therefore, the side of the heat sink 10 facing the functional device 200 has no exposed surface; and the covering of the side wall 12 by the insulating and thermally conductive layer 20 creates a certain isolation distance between the heat sink 10 and the functional device 200 in a direction perpendicular to the mounting surface 11. In high-power or high-temperature environments, the coverage of the insulating and thermally conductive layer 20 can reduce the risk of electrical short circuits, protecting the functional device 200 and the circuitry.

[0061] The coverage of the insulating and thermally conductive layer 20 over the sidewall surface 12 can be from 1% to 100%. When the coverage is 1%, only a very small portion of the sidewall surface 12 is covered. The main purpose of this design is to ensure complete coverage of the mounting surface 11, avoiding any exposed areas. When the coverage is 100%, this further improves the insulation performance between the functional device 200 and the heat sink housing 10.

[0062] Furthermore, the direction perpendicular to the mounting surface 11 is Figure 1 In the vertical direction, that is, along the vertical direction, the extension length of the portion of the sidewall 12 covered by the insulating and heat-conducting layer 20 is h, and the total extension length of the sidewall 12 is H, where h ≥ 0.01H; that is, at least 1% of the sidewall 12 is covered by the insulating and heat-conducting layer 20, thereby forming a certain isolation distance between the heat dissipation housing 10 and the functional device 200, enhancing electrical isolation performance, and reducing the risk of electrical short circuit.

[0063] like Figure 3 As shown, the insulating and thermally conductive layer 20 covers the outer surface of the heat sink housing 10. The insulating and thermally conductive layer 20 can completely cover the outer surface of the heat sink housing 10. This design can not only effectively improve the insulation performance of the heat sink housing 10, but also enhance its durability and prevent environmental factors such as humidity and pollution from affecting the housing.

[0064] In some embodiments, the thermally conductive metal sheet 30 may also be made of aluminum, copper, nickel, stainless steel, etc. The thermally conductive metal sheet 30 is hot-pressed to the insulating thermally conductive layer 20. The thermally conductive metal sheet 30 and the insulating thermally conductive layer 20 are combined by heating and applying pressure. Applying a certain pressure while heating can effectively eliminate the air layer between the two, increase the contact area, reduce thermal resistance, and enhance the thermal conductivity.

[0065] Furthermore, hot pressing can improve the connection stability between the thermally conductive metal sheet 30 and the insulating thermally conductive layer 20, preventing the thermally conductive metal sheet 30 from shifting or falling off during use.

[0066] In the first example of the above embodiments, as Figure 4 and Figure 5 As shown, the projection of the thermally conductive metal sheet 30 along the direction perpendicular to the mounting surface 11 lies within the outer contour of the insulating thermally conductive layer 20. The side of the thermally conductive metal sheet 30 facing away from the insulating thermally conductive layer 20 is used to mount the functional device 200. In this example, the thermally conductive metal sheet 30, the insulating thermally conductive layer 20, and the heat sink housing 10 are stacked in the vertical direction to form a compact integrated design, which improves interlayer strength while reducing the package volume. The projection of the thermally conductive metal sheet 30 lies within the outer contour of the insulating thermally conductive layer 20, effectively utilizing the space of the insulating thermally conductive layer 20; reducing the direct contact between the thermally conductive metal sheet 30 and the external environment, thereby reducing the potential risk of electrical short circuits.

[0067] In the second example of the above embodiments, such as Figure 6 and Figure 7 As shown, the thermally conductive metal sheet 30 includes a first mounting portion 31 and a second mounting portion 32. The first mounting portion 31 is attached to the insulating thermally conductive layer 20. The second mounting portion 32 is located outside the outer contour of the insulating thermally conductive layer 20 along a projection perpendicular to the mounting surface 11. The second mounting portion 32 is used to mount the functional device 200. The second mounting portion 32 can protrude outside the insulating thermally conductive layer 20, providing additional space for mounting the functional device 200, and can accommodate devices of different shapes and sizes, providing greater flexibility for the mounting of the functional device 200.

[0068] Specifically, the functional device 200 can be located on the same side of the thermally conductive metal sheet 30 as the insulating thermally conductive layer 20, or on different sides of the thermally conductive metal sheet 30. Whether the functional device 200 and the insulating thermally conductive layer 20 are located on the same side or different sides of the thermally conductive metal sheet 30 can be appropriately arranged according to specific application requirements and space constraints. A configuration on the same side offers significant advantages in heat conduction efficiency and space utilization, while a configuration on different sides offers better flexibility and equipment adaptability.

[0069] Based on the second example above, such as Figure 8 As shown, the thermally conductive metal sheet 30 also includes a connecting portion 33 that connects the first mounting portion 31 and the second mounting portion 32. The connecting portion 33 is at least partially flexible. This allows it to absorb minor errors during installation, ensuring connection stability. The flexible portion effectively absorbs deformation caused by thermal expansion and mechanical stress, ensuring connection stability under different operating conditions (such as temperature changes and mechanical vibrations), reducing stress concentration caused by thermal expansion or external forces, thereby lowering the risk of failure. It can also effectively mitigate vibrations caused by the operation of the functional device 200, contributing to improved long-term operational stability of the equipment.

[0070] The flexible design allows the thermally conductive metal sheet 30 to be adjusted within a certain range, thereby ensuring good contact between the functional device 200 and the thermally conductive metal sheet 30 and guaranteeing heat conduction efficiency. Specifically, the first mounting part 31 and the second mounting part 32 can be at different heights, or the first mounting part 31 and the second mounting part 32 can be set at a certain angle.

[0071] The flexible portion between the first mounting part 31 and the second mounting part 32 can be made of flexible material or have a specific geometry, such as a wavy or curved shape, so that this portion can adapt to minor errors and deviations during installation.

[0072] In some embodiments, such as Figure 4 and Figure 5 As shown, multiple thermally conductive metal sheets 30 are disposed on the side of the insulating thermally conductive layer 20 facing away from the mounting surface 11, with each metal sheet corresponding to a functional device 200. This design allows for the integration of multiple functional devices 200 within the same space, thus achieving a compact layout. The spacing between adjacent thermally conductive metal sheets 30 effectively disperses stress concentration caused by thermal expansion or mechanical stress, reducing the risk of localized temperature rise and material fatigue. This characteristic helps extend the service life of the equipment.

[0073] Depending on the type of functional device 200 installed, the multiple thermally conductive metal sheets 30 can be divided into a first metal sheet 30a and a second metal sheet 30b. For example, the thermally conductive metal sheet 30 used for installing low-frequency, low-voltage, high-power devices is the first metal sheet 30a, and the insulating thermally conductive layer 20 between the first metal sheet 30a and the mounting surface 11 has a first thickness; the thermally conductive metal sheet 30 used for installing high-frequency, high-voltage, high-power devices is the second metal sheet 30b, and the insulating thermally conductive layer 20 between the second metal sheet 30b and the mounting surface 11 has a second thickness, which is greater than the first thickness.

[0074] In practical applications, a first layer of polyimide film can be first applied to the mounting surface 11 and sidewalls of the heat sink housing 10. Then, corresponding to the position where the first metal sheet 30a is mounted, a second layer of polyimide film is stacked on top of the first layer of polyimide film. The thickness of the first layer of polyimide film is determined based on the low-frequency, low-voltage, high-power device, and the thickness of the second layer of polyimide film is determined based on the mounting of the high-frequency, high-voltage, high-power device and the thickness of the first layer of polyimide film.

[0075] It should be noted that the first metal sheet 30a and the second metal sheet 30b described above are only illustrative examples. In actual applications, the first thickness can also be greater than the second thickness. This embodiment does not limit this, as long as the second thickness is different from the first thickness when the first metal sheet 30a and the second metal sheet 30b are used to install different types of functional devices 200.

[0076] Secondly, this utility model provides an electronic device, such as... Figure 1 As shown, the electronic device 1000 includes a functional device 200 and a direct-connection heat dissipation structure 100 as described in the first aspect, wherein the functional device 200 is connected to a heat-conducting metal sheet 30. The electronic device 1000 of the second aspect embodiment of this utility model has the same technical effects as the direct-connection heat dissipation structure 100 in the embodiments of the first aspect described above, and will not be repeated here.

[0077] Functional device 200 may be a power amplifier, driver, photodetector, graphics processing unit, processor, etc., and electronic device 1000 may be an electrical component in a computer host, mobile phone, smart home device, or vehicle; this embodiment does not limit this.

[0078] The thermally conductive metal sheet 30 and the functional device 200 can be fixed by welding. Welding not only provides a solid mechanical connection, but also ensures good thermal contact.

[0079] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A direct-connection heat dissipation structure, characterized in that, include: A heat dissipation housing, the outer surface of which includes a mounting surface and a side wall surface adjacent to the mounting surface; An insulating and thermally conductive layer covers the mounting surface and at least a portion of the sidewall surface; A thermally conductive metal sheet is attached to the side of the insulating and thermally conductive layer opposite to the mounting surface and is used to mount functional devices.

2. The direct-connection heat dissipation structure according to claim 1, characterized in that, Along a direction perpendicular to the mounting surface, the extension length of the portion of the sidewall surface covered by the insulating and thermally conductive layer is h, and the total extension length of the sidewall surface is H, where h ≥ 0.01H; or, The outer surface of the heat dissipation housing also includes a bottom surface, the mounting surface is disposed opposite to the bottom surface, and the side wall surface connects the edge of the mounting surface and the edge of the bottom surface; the insulating and thermally conductive layer completely covers the mounting surface, the side wall surface and the bottom surface.

3. The direct-connection heat dissipation structure according to claim 1, characterized in that, The projection of the thermally conductive metal sheet along a direction perpendicular to the mounting surface is located within the outer contour of the insulating thermally conductive layer.

4. The direct-connection heat dissipation structure according to claim 1, characterized in that, The thermally conductive metal sheet includes a first mounting portion and a second mounting portion. The first mounting portion is attached to the insulating thermally conductive layer. The second mounting portion is located outside the outer contour of the insulating thermally conductive layer along a projection perpendicular to the mounting surface. The second mounting portion is used to mount functional devices.

5. The direct-connection heat dissipation structure according to claim 4, characterized in that, The thermally conductive metal sheet further includes a connecting portion that connects the first mounting portion and the second mounting portion, and the connecting portion is at least partially flexible.

6. The direct-connection heat dissipation structure according to claim 1, characterized in that, The number of thermally conductive metal sheets is multiple, and the thermally conductive metal sheets are spaced apart on the side of the insulating thermally conductive layer away from the mounting surface.

7. The direct-connection heat dissipation structure according to claim 6, characterized in that, The plurality of thermally conductive metal sheets include a first metal sheet and a second metal sheet, wherein the insulating thermally conductive layer between the first metal sheet and the mounting surface has a first thickness; and the insulating thermally conductive layer between the second metal sheet and the mounting surface has a second thickness, the second thickness being greater than the first thickness.

8. The direct-connection heat dissipation structure according to any one of claims 1 to 7, characterized in that, The thermally conductive metal sheet is hot-pressed together with the insulating thermally conductive layer.

9. The direct-connection heat dissipation structure according to any one of claims 1 to 7, characterized in that, The insulating and thermally conductive layer includes at least one polyimide film.

10. An electronic device, characterized in that, The electronic device includes functional components and a direct-connection heat dissipation structure as described in any one of claims 1 to 9, wherein the functional components are connected to the thermally conductive metal sheet.

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