Degassing device and thin film deposition equipment thereof

Abstract

The utility model discloses a degassing device and film deposition equipment thereof, the degassing device comprises a degassing pipe, a heating unit and a vibration unit, the heating unit is used for heating liquid flowing through the degassing pipe, the vibration unit is arranged on the outer side of the degassing pipe, and the degassing pipe is used for heating the liquid flowing through the degassing pipe. The vibration unit is used for vibrating liquid flowing through the degassing pipe so as to accelerate bubble precipitation. Wherein the degassing pipe is a material pipe fitting which can separate out gas but does not permeate liquid. The heating unit and the vibration unit are additionally arranged outside the degassing pipe, and the Teflon pipe fitting capable of separating out bubbles is adopted to heat and vibrate liquid flowing through the degassing pipe so as to quickly and efficiently separate out the bubbles, so that bubble residues in the liquid are reduced, and the detection accuracy of the external flow detection unit is improved. According to the thin film deposition equipment adopting the degassing device, the flow detection precision of the reaction source flowing through the degassing pipe can be improved, so that the control precision is higher, and the thin film deposition quality is better.

Description

Technical Field

[0001] This utility model relates to the field of thin film deposition equipment technology, and in particular to a degassing device and its thin film deposition equipment. Background Technology

[0002] In thin film deposition equipment, high-purity liquid reaction sources, such as TEOS, are often used. These require pressurization with inert gas for long-distance transport, inevitably introducing gas into the high-purity liquid. Degassing devices are typically installed in the semiconductor material delivery system (LDS) or directly mounted on the thin film deposition equipment. The presence of air bubbles in the liquid can cause deviations in the liquid flow meter readings at the equipment end, resulting in flow fluctuations and affecting normal equipment operation and thin film deposition quality. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a degassing device and its thin film deposition equipment to solve the technical problem of inaccurate flow detection caused by bubbles in the existing reaction source.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] In a first aspect, embodiments of the present invention provide a degassing device, comprising: a degassing tube, a heating unit, and a vibration unit. The heating unit is used to heat the liquid flowing through the degassing tube, and the vibration unit is disposed on the outside of the degassing tube to vibrate the liquid flowing through the degassing tube to accelerate the precipitation of bubbles.

[0006] The degassing pipe is a pipe made of a material that can release gas but is not permeable to liquid.

[0007] The degassing pipe is made of Teflon.

[0008] The degassing tube is made of Teflon. TM AF 1600X material.

[0009] The heating unit consists of several heating rods surrounding the outside of the degassing tube.

[0010] The vibration unit is an ultrasonic vibrator.

[0011] The ultrasonic vibrator is attached to the outer wall of the degassing tube.

[0012] The degassing device further includes a sealed housing, and the degassing pipe, the heating unit, and the vibration unit are all disposed within the sealed housing.

[0013] The sealing housing is also provided with an air outlet, and the upper and lower ports of the degassing pipe both protrude outside the sealing housing.

[0014] Secondly, embodiments of the present invention provide a thin film deposition apparatus, the thin film deposition apparatus including the degassing device as described in any of the above claims.

[0015] This invention relates to a degassing device and its thin-film deposition equipment. By adding a heating and vibration unit to the outside of the degassing tube and using Teflon tubing capable of releasing bubbles, the liquid flowing through the degassing tube is heated and vibrated to rapidly and efficiently release bubbles, thereby reducing residual bubbles in the liquid and improving the accuracy of the external flow detection unit. The thin-film deposition equipment using this degassing device can improve the accuracy of flow detection of the reaction source flowing through the degassing tube, resulting in higher control precision and better thin-film deposition quality.

[0016] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the degassing device according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the degassing tube section of the degassing device according to an embodiment of the present invention, showing the analysis of bubbles.

[0019] Explanation of reference numerals in the attached figures:

[0020] Degassing device 100, sealing housing 1, air outlet 11, heating unit 2, degassing pipe 3, upper port 31, lower port 32, vibration unit 4. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] In thin film deposition equipment, high-purity liquid reaction sources, such as TEOS, are often used, requiring pressurization with inert gas for long-distance transport. This inevitably introduces gas into the high-purity liquid. Degassing devices are typically installed in the semiconductor material delivery system (LDS) or directly mounted on the thin film deposition equipment. The presence of air bubbles in the liquid can cause deviations in the liquid flow meter readings at the equipment end, resulting in flow fluctuations and affecting normal equipment operation. To address these issues, this embodiment discloses a degassing device 100.

[0029] Please see Figures 1 to 2 In this embodiment, a degassing device 100 is disclosed. The degassing device 100 can be applied to semiconductor equipment or to liquid bubble precipitation scenarios in other chemical equipment.

[0030] The degassing device 100 includes a degassing pipe 3, a heating unit 2, and a vibration unit 4. The heating unit 2 is used to heat the liquid flowing through the degassing pipe 3. The vibration unit 4 is disposed on the outside of the degassing pipe 3 and is used to vibrate the liquid flowing through the degassing pipe 3 to accelerate the precipitation of bubbles.

[0031] Compared to existing degassing devices, the degassing device 100 of this embodiment, by setting a vibration unit 4 and a heating unit 2 on the outside of the degassing pipe 3, heats the flowing liquid. Different liquids have different solubility rates for gases; therefore, based on the volume fraction of different liquids, the liquid is heated to a suitable temperature range. At this temperature, the solubility rate of bubbles in the liquid is lowest, resulting in more dissolved or trapped bubbles being expelled from the liquid. To further improve the bubble expulsion speed, a vibration unit 4 is also set on the outside of the degassing pipe 3. The vibration unit 4 generates high-frequency vibration, which is transmitted to the liquid, causing dissolved or trapped bubbles in the liquid to quickly coalesce into larger bubbles. These larger bubbles are more easily and quickly expelled from the liquid.

[0032] The vibration unit 4 can transmit high-frequency vibrations to the liquid through sound wave vibration, mechanical vibration, or other means to accelerate the aggregation and discharge of bubbles in the liquid.

[0033] The degassing pipe 3 is made of a material that allows gas to escape but does not allow liquid to permeate. That is, the pipe wall of the degassing pipe 3 allows only gas to pass through and does not allow liquid to permeate, thus achieving gas-liquid separation.

[0034] In this embodiment, the degassing pipe 3 is a Teflon pipe.

[0035] Specifically, the degassing tube 3 is made of Teflon. TM AF 1600X material. Teflon. TM AF 1600X material is a fluoropolymer with excellent optical transparency and breathability. (Teflon) TM AF (amorphous fluoropolymer) resins possess optical transparency and mechanical properties as excellent as amorphous polymers. These resins exhibit superior performance over a wide temperature range while maintaining excellent electrical properties and chemical resistance. Their unique chemical structure enhances the versatility of the resin products, making this grade of resin superior to other fluoropolymers.

[0036] Teflon TM AF resin is a high-performance fluoropolymer resin with excellent chemical resistance and heat resistance. This amorphous fluoropolymer resin has a special molecular structure that provides the following additional advantages: excellent optical transparency, low refractive index, excellent UV stability and transmittance, dimensional stability, reduced molding shrinkage, low dielectric constant (1.89 to 1.93) even at gigahertz frequencies, low loss factor, good moisture sensitivity / hygroscopicity, high compressibility, good air permeability, and solubility in perfluorinated solvents.

[0037] The heating unit 2 consists of several heating rods surrounding the outside of the degassing tube 3. It is understood that in other embodiments, the heating unit 2 can also be any other heating module capable of generating heat. Its function is to heat the liquid flowing through the degassing tube 3 to the temperature of lowest solubility.

[0038] In this embodiment, the vibration unit 4 is an ultrasonic vibrator. The ultrasonic vibrator is attached to the outer wall of the degassing tube 3.

[0039] Please refer to it again. Figure 1 The degassing device 100 also includes a sealed housing 1, and the degassing pipe 3, the heating unit 2 and the vibration unit 4 are all disposed inside the sealed housing 1.

[0040] The sealed housing 1 is also provided with a vent 11, and the upper port 31 and lower port 32 of the degassing pipe 3 both protrude outside the sealed housing 1. Gas precipitated from the wall of the degassing pipe 3 enters the sealed housing 1 and is discharged through the vent 11. The upper port 31 of the degassing pipe 3 is connected to external equipment to transport the degassed liquid to the reaction or processing space. The lower port 32 is connected to an external liquid input device for inputting liquid raw materials into the degassing pipe 3 for degassing treatment.

[0041] An embodiment of this utility model also provides a thin film deposition apparatus, which includes a degassing device 100 as described in any of the above embodiments. This degassing device 100 is mainly used for degassing the reaction source of process gases in the thin film deposition apparatus.

[0042] The degassing device and its thin-film deposition equipment in this embodiment, by adding a heating unit and a vibration unit to the outside of the degassing tube and using Teflon tubing that can precipitate bubbles, heats and vibrates the liquid flowing through the degassing tube to rapidly and efficiently precipitate bubbles, thereby reducing residual bubbles in the liquid and improving the accuracy of the external flow detection unit. The thin-film deposition equipment using this degassing device can improve the accuracy of flow detection of the reaction source flowing through the degassing tube, resulting in higher control precision and better thin-film deposition quality.

[0043] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A degassing device, characterized in that, include: The system includes a degassing tube, a heating unit, and a vibration unit. The heating unit is used to heat the liquid flowing through the degassing tube. The vibration unit is located on the outside of the degassing tube and is used to vibrate the liquid flowing through the degassing tube to accelerate the precipitation of bubbles.

2. The degassing device according to claim 1, characterized in that, The degassing pipe is made of a material that can release gas but is not permeable to liquid.

3. The degassing device according to claim 2, characterized in that, The degassing pipe is made of Teflon.

4. The degassing device according to claim 3, characterized in that, The degassing tube is made of Teflon. TM AF 1600X material.

5. The degassing device according to claim 1, characterized in that, The heating unit consists of several heating rods surrounding the outside of the degassing tube.

6. The degassing device according to claim 1, characterized in that, The vibration unit is an ultrasonic vibrator.

7. The degassing device according to claim 6, characterized in that, The ultrasonic vibrator is attached to the outer wall of the degassing tube.

8. The degassing apparatus according to any one of claims 1 to 7, characterized in that, The degassing device also includes a sealed housing, and the degassing pipe, the heating unit and the vibration unit are all disposed inside the sealed housing.

9. The degassing device according to claim 8, characterized in that, The sealing housing is also provided with an air outlet, and the upper and lower ports of the degassing pipe both protrude outside the sealing housing.

10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus includes a degassing device as described in any one of claims 1 to 9.

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