Glue pouring equipment for LED nixie tube
By introducing heating and infrared drying technologies into LED digital tube potting equipment, the problems of circuit damage and corrosion caused by uncured adhesive have been solved, achieving faster drying speed and higher stability in use.
Patent Information
- Application Number
- CN202422750437.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-12
AI Technical Summary
Existing LED digital tube potting equipment does not perform heat drying after potting, resulting in the glue not being fully cured, increasing the risk of circuit damage, and may attract dust or moisture, causing internal components to corrode or become contaminated, thus shortening the service life.
A device comprising a heating mechanism and a dispensing mechanism was designed. The digital tube after dispensing is heat-dried by a heater and an infrared lamp. Heat is dissipated by a heating wall and holes, and the temperature is controlled by a slider and a baffle. The infrared lamp penetrates the adhesive layer to heat the internal area, ensuring that the adhesive cures quickly.
It speeds up the drying process of the adhesive, reduces the risk of circuit damage caused by uncured adhesive, and improves the stability and lifespan of the digital tube.
Smart Images

Figure CN223543336U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a potting device, and more particularly to a potting device for LED digital tubes. Background Technology
[0002] The glue-filling equipment for LED digital tubes is a device used to inject glue into the LED digital tubes during the manufacturing process.
[0003] The existing LED digital tube dispensing equipment (CN207592167U) includes: a workbench, on which a mounting frame, a dispensing mechanism, a dispensing tube, and a tank containing adhesive are installed; the dispensing mechanism includes a dispensing seat, a holding seat, and an extrusion seat; a support plate is installed on the mounting frame; several first dispensing channels are provided on the holding seat; a second dispensing channel is provided on the dispensing seat; a chamber is formed between the dispensing seat and the holding seat; a dispensing control plate is slidably installed in the chamber; a connecting channel is provided on the dispensing control plate; a dispensing connector is also provided on the holding seat; the tank is connected to the dispensing connector through a connecting tube; a heating device and a stirring device are installed in the tank; a dispensing connector is provided at the bottom of the dispensing seat; one end of the dispensing tube is sleeved on the dispensing connector; the extrusion seat includes a pressure plate and an extrusion shaft; a first cylinder that drives the pressure plate to move up and down is connected to the upper surface of the pressure plate.
[0004] When the above-mentioned device pots the LED digital tube, it uses a cylinder to squeeze the adhesive into the digital tube through the injection tube. However, after potting the digital tube, the adhesive is not heat-dried, so the adhesive may not be fully cured, resulting in an unstable protective layer, which increases the risk of circuit damage. Furthermore, the uncured adhesive may attract dust or moisture, causing corrosion or contamination of internal components and shortening the lifespan of the digital tube. Utility Model Content
[0005] In order to overcome the defects of the prior art, this utility model provides a potting device for LED digital tubes that performs heat drying of the glue after potting.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0007] A potting device for LED digital tubes includes a heating mechanism and a potting mechanism. The potting mechanism is located inside the heating mechanism. The potting mechanism includes a glue container and a glue outlet pipe. The glue outlet pipe is located on one side of the glue container. The heating mechanism includes a housing. A rotating rod is provided at one end of the housing. The rotating rod is rotatably connected to a door. Heating walls are provided on both sides inside the housing. A cavity is formed at the connection between the heating wall and the housing. A heater is provided in the cavity. Several holes are provided on one side of the heating wall. The heater dissipates heat through the holes.
[0008] Preferably, one end of the heating wall is provided with several mounting plates, each mounting plate has a groove, a slider is slidably connected to the groove, and a baffle is fixedly connected to the slider, the size of the baffle being the same as the hole.
[0009] Preferably, a hydraulic cylinder is installed at the top of the outer casing, the bottom end of the hydraulic cylinder passes through the outer casing and is connected to a hydraulic rod, and an infrared lamp is fixedly connected to the bottom end of the hydraulic rod.
[0010] Preferably, the glue container is equipped with a stirring motor, the bottom end of the stirring motor is connected to a rotating shaft, and the bottom end of the rotating shaft is connected to a stirrer.
[0011] Preferably, a motor is provided at the top of the housing, the motor is electrically connected to a fan, and the fan is located inside the housing.
[0012] Preferably, the glue container has a placement groove on one side, and the placement groove is lined with a soft padding material.
[0013] Compared with the prior art, the present invention has the following beneficial effects:
[0014] (1) This utility model creates a sealed environment by closing the door and then starting the heater to radiate heat through the holes on both sides to heat dry the glue in the digital tube inside the shell. Compared with the existing glue potting equipment for LED digital tubes, it speeds up the drying of the glue and reduces the risk of damage to the digital tube circuit caused by the glue not curing.
[0015] (2) This utility model uses a slider to slide in the groove, thereby blocking the hole with a baffle, thus achieving temperature control inside the shell, and drying materials with different heat requirements, making it more flexible to use.
[0016] (3) This utility model uses infrared lamps to irradiate the digital tube at the bottom. The infrared rays can penetrate the glue layer and heat the internal area of the glue, so that it dries and cures quickly. Attached Figure Description
[0017] Figure 1 A first-view structural schematic diagram of the potting equipment for LED digital tubes provided by this utility model;
[0018] Figure 2 A second-view structural schematic diagram of the potting equipment for LED digital tubes provided by this utility model;
[0019] Figure 3 A schematic diagram of the heating wall structure of the potting equipment for LED digital tubes provided by this utility model;
[0020] Figure 4 A schematic diagram of the stirrer structure of the potting equipment for LED digital tubes provided by this utility model;
[0021] The corresponding names of the reference numerals in the attached drawings are as follows: 100, heating mechanism; 101, outer shell; 102, hydraulic cylinder; 103, motor; 104, heating wall; 105, hydraulic rod; 106, infrared lamp; 107, rotating rod; 108, door; 109, placement slot; 110, fan; 111, heater; 112, hole; 113, mounting plate; 114, groove; 115, slider; 116, baffle; 200, glue dispensing mechanism; 201, glue container; 202, glue outlet pipe; 203, rotating shaft; 204, agitator; 205, agitator motor. Detailed Implementation
[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.
[0023] First embodiment:
[0024] like Figure 1-4 As shown, the present invention provides a potting device for LED digital tubes, comprising: a heating mechanism 100 and a potting mechanism 200. The potting mechanism 200 is located inside the heating mechanism 100 and includes a glue container 201 and a glue outlet pipe 202. The glue outlet pipe 202 is located on one side of the glue container 201. The heating mechanism 100 includes a housing 101, with a rotating rod 107 at one end of the housing 101. The rotating rod 107 is rotatably connected to a door 108. Heating walls 104 are provided on both sides inside the housing 101. A cavity is formed at the connection between the heating wall 104 and the housing 101. A heating element is provided in the cavity. The heater 111 has several holes 112 on one side of the heating wall 104. The heater 111 dissipates heat through the holes 112. When in use, the digital tube is placed inside the outer shell 101, and glue is poured into the digital tube through the glue dispensing tube 202. After the glue is poured, the door 108 is rotated to the closed state with the outer shell 101 by rotating the rotating rod 107, forming a closed structure for the digital tube inside the outer shell 101. The heaters 111 in the heating walls 104 on both sides start to work. The heaters 111 dissipate heat and scatter it through the holes 112 to heat dry the glue in the digital tube inside the outer shell 101.
[0025] This invention creates a sealed environment for the outer casing 101 by closing the door 108, and then starts the heater 111 to radiate heat through the holes 112 on both sides to heat-dry the glue in the digital tube inside the outer casing 101. Compared with existing LED digital tube potting equipment, this invention speeds up the drying of the glue and reduces the risk of damage to the digital tube circuit caused by the glue not curing properly.
[0026] Second embodiment:
[0027] like Figure 1 , Figure 2 , Figure 3As shown, one end of the heating wall 104 is provided with several mounting plates 113. The mounting plates 113 are provided with grooves 114. A slider 115 is slidably connected to the grooves 114. A baffle 116 is fixedly connected to the slider 115. The size of the baffle 116 is the same as that of the hole 112. When the number of digital tubes inside the housing 101 is small, such a high temperature is not required for heat drying. The slider 115 is moved on the grooves 114 of the mounting plate 113, so that the baffle 116 on the slider 115 blocks the hole 112 on the heating wall 104, thereby controlling the heat drying temperature of the glue.
[0028] By sliding the slider 115 within the groove 114, the baffle 116 blocks the hole 112, thereby controlling the temperature inside the outer shell 101 and drying materials with different heat requirements, thus providing greater flexibility in use.
[0029] Third embodiment:
[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a hydraulic cylinder 102 is installed at the top of the outer casing 101. The bottom end of the hydraulic cylinder 102 passes through the outer casing 101 and is connected to a hydraulic rod 105. An infrared lamp 106 is fixedly connected to the bottom end of the hydraulic rod 105. When the hydraulic cylinder 102 is started, it drives the hydraulic rod 105 to move, thereby enabling the infrared lamp 106 at the bottom of the hydraulic rod 105 to move vertically and illuminate the digital tube at the bottom.
[0031] The infrared lamp 106 illuminates the digital tube at the bottom, allowing the infrared rays to penetrate the adhesive layer and heat the internal area of the adhesive, causing it to dry and cure quickly.
[0032] Fourth embodiment:
[0033] like Figure 4 As shown, the glue container 201 is equipped with a stirring motor 205. The bottom end of the stirring motor 205 is connected to a rotating shaft 203, and the bottom end of the rotating shaft 203 is connected to a stirrer 204. When the stirring motor 205 is turned on, the stirring motor 205 drives the rotating shaft 203 to work, thereby causing the stirrer 204 to stir inside the glue container 201. Combined with the external temperature environment, the glue liquid inside the glue container 201 always maintains good fluidity.
[0034] Fifth embodiment:
[0035] like Figure 1 , Figure 2 As shown, a motor 103 is provided at the top of the housing 101. The motor 103 is electrically connected to a fan 110. The fan 110 is located inside the housing 101. Turning on the motor 103 causes the fan 110 to rotate, increasing the airflow speed inside the housing 101 and helping to accelerate the evaporation and curing of the adhesive.
[0036] In use, the digital tube is placed inside the outer casing 101, and glue is poured into the digital tube through the glue dispensing tube 202. After the glue is poured, the door 108 is rotated to the closed state with the outer casing 101 by rotating the rotating rod 107, forming a closed structure for the digital tube inside the outer casing 101. The heaters 111 in the heating walls on both sides start to work. The heaters 111 emit heat and scatter it through the holes 112 to heat dry the glue in the digital tube inside the outer casing 101. The hydraulic cylinder 102 is activated, and the hydraulic cylinder 102 drives the hydraulic rod 105 to move, thereby enabling the infrared lamp 106 at the bottom of the hydraulic rod 105 to move vertically and irradiate the digital tube at the bottom.
[0037] The above embodiments are merely one of the preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications or refinements made to the main design concept and spirit of this utility model that are not of substantial significance, but solve the same technical problem as this utility model, should be included within the scope of protection of this utility model.
Claims
1. A potting device for LED digital tubes, characterized in that, include: The heating mechanism (100) and the dispensing mechanism (200) are located inside the heating mechanism (100). The dispensing mechanism (200) includes a glue container (201) and a glue outlet pipe (202). The glue outlet pipe (202) is located on one side of the glue container (201). The heating mechanism (100) includes a housing (101). One end of the housing (101) is provided with a rotating rod (107). The rotating rod (107) is rotatably connected to a door (108). Heating walls (104) are provided on both sides inside the housing (101). A cavity is formed at the connection between the heating wall (104) and the housing (101). A heater (111) is provided in the cavity. A plurality of holes (112) are provided on one side of the heating wall (104). The heater (111) dissipates heat through the holes (112).
2. The potting equipment for LED digital tubes according to claim 1, characterized in that, The heating wall (104) has several mounting plates (113) at one end. The mounting plates (113) have grooves (114) on them. A slider (115) is slidably connected to the grooves (114). A baffle (116) is fixedly connected to the slider (115). The size of the baffle (116) is the same as that of the hole (112).
3. The potting equipment for LED digital tubes according to claim 2, characterized in that, A hydraulic cylinder (102) is installed at the top of the outer shell (101). The bottom end of the hydraulic cylinder (102) passes through the outer shell (101) and is connected to a hydraulic rod (105). An infrared lamp (106) is fixedly connected to the bottom end of the hydraulic rod (105).
4. The potting equipment for LED digital tubes according to claim 2, characterized in that, The glue container (201) is equipped with a stirring motor (205), the bottom end of the stirring motor (205) is connected to a rotating shaft (203), and the bottom end of the rotating shaft (203) is connected to a stirrer (204).
5. The potting equipment for LED digital tubes according to claim 4, characterized in that, The top of the housing (101) is provided with a motor (103), which is electrically connected to a fan (110), and the fan (110) is located inside the housing (101).
6. The potting equipment for LED digital tubes according to claim 4, characterized in that, The glue container (201) has a placement groove (109) on one side, and the placement groove (109) is lined with a soft pad material.
Citation Information
Patent Citations
A equipment for processing of LED charactron encapsulating
CN207592167U