Capacitor welding mechanism with chip mounted on base

Abstract

The utility model relates to the technical field of chip pasting welding, in particular to a base chip pasting capacitor welding mechanism which comprises a welding assembly, a gluing assembly and a chip pasting assembly, the welding assembly comprises a mounting frame, an adjusting unit and a working unit, the adjusting unit is fixed on one side of the mounting frame, and the working unit comprises a movable frame, a heating box and a working plate. The movable frame is connected with the adjusting unit, the two ends of the top face of the working plate are connected with the bottom face of the movable frame through lifting air cylinders, a notch is formed in one side of the working plate, the heating box is arranged in the notch, transverse fine adjustment air cylinders are arranged on the edges of the two ends of the notch, and the heating box is connected with the transverse fine adjustment air cylinders through connecting rods. According to the utility model, through the arrangement of the welding assembly, the gluing assembly and the chip mounting assembly, compared with manual chip mounting and welding, the chip mounting and welding device can realize very accurate chip mounting and welding, improves the reliability and stability of products, reduces errors and labor cost possibly brought by manual operation, and improves the production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip bonding technology, and in particular to a chip bonding capacitor bonding mechanism for a base. Background Technology

[0002] "Surface mount soldering" typically refers to a step in surface mount technology (SMT). Specifically, it refers to the process of mounting and soldering surface mount devices (SMDs, such as resistors, capacitors, and integrated circuits) onto a printed circuit board (PCB). It is an important step in the electronics manufacturing process, mainly used to process various electronic components to make them into fully functional electronic products. In particular, it is part of the PCB assembly process.

[0003] In current surface mount technology (SMT) chip placement operations, which are typically performed manually, operators usually need tools such as a pointed soldering iron, flux, and a magnifying glass. First, an appropriate amount of flux is applied to the chip's pads to improve soldering results. Then, the chip is held with tweezers and accurately placed on the corresponding pad. Next, the soldering iron is used to heat the pads and chip leads, melting the solder and connecting the leads to the pads.

[0004] This operation has the following drawbacks:

[0005] 1) Inefficient: Manual welding is slow and cannot meet the needs of large-scale production;

[0006] 2) Unstable quality: Due to differences in operator skill level and operating habits, welding quality may vary greatly, and problems such as incomplete welding and short circuits are prone to occur.

[0007] 3) High requirements for operators: Operators need to have high skills and experience, and be proficient in parameters such as soldering temperature, time and pressure, otherwise the chip may be easily damaged.

[0008] 4) High labor intensity: Prolonged manual welding operations can easily lead to operator fatigue, affecting work efficiency and quality. Suitable for low production capacity or the prototyping stage;

[0009] Therefore, in order to solve the above-mentioned technical problems, this application proposes a base-mounted chip capacitor welding mechanism. Utility Model Content

[0010] The purpose of this utility model is achieved through the following method: a base-mounted chip capacitor welding mechanism, including a welding component, an adhesive application component, and a chip-mounting component. The adhesive application component and the chip-mounting component are both located on one side of the welding component. The welding component, the adhesive application component, and the chip-mounting component are connected by a conveyor belt. The welding component includes a mounting frame, an adjustment unit, and a working unit. The adjustment unit is fixed on one side of the mounting frame. The working unit is connected to the adjustment unit. The working unit includes a movable frame, a heating box, and a working plate. The movable frame is connected to the adjustment unit. Both ends of the top surface of the working plate are connected to the bottom surface of the movable frame through lifting cylinders. A notch is provided on one side of the working plate. The heating box is located in the notch. A horizontal fine-tuning cylinder is provided on the edge of both ends of the notch. The heating box is connected to the horizontal fine-tuning cylinder through a connecting rod. A heating port is provided on the bottom surface of the heating box. Heating tubes are distributed around the heating box, with one end of the heating tubes extending towards the outer side of the heating box.

[0011] In a further embodiment of the above description, the adjustment unit includes a height adjustment slide and a lateral adjustment slide. The lateral adjustment slide is located at one end of the top surface of the mounting frame. A movable guide rail and a slider are provided on the side of the top surface of the mounting frame away from the lateral adjustment slide. A connecting plate is provided on the side of the height adjustment slide near the lateral adjustment slide. The end of the connecting plate near the lateral adjustment slide is connected to the lateral adjustment slide, and the side of the connecting plate near the slider is fixedly connected to the slider. The height adjustment slide and the lateral adjustment slide are used to provide the effect of adjusting the position of the heating box.

[0012] In a further embodiment of the above description, a discharge unit is provided at the lower end of the mounting frame near the heating box. The discharge unit includes a discharge cylinder, a pusher plate, and a guide frame. The guide frame has an inlet and an outlet at both ends, respectively. The pusher plate is positioned between the inlet and the outlet. A pusher cylinder is located on the bottom surface of the guide frame and is connected to the pusher plate. The discharge cylinder is positioned on the side of the guide frame away from the outlet. The push rod of the discharge cylinder passes through the guide frame and is aligned with the outlet. One end of the conveyor belt is connected to the inlet. The discharge cylinder and the discharge plate are used to provide a guiding effect for the chip placement tray.

[0013] In a further embodiment of the above description, the adhesive application assembly includes a spray gun, a worktable, an upper cylinder, and a masking plate. The worktable is located on one side of the movable frame, the upper cylinder is located inside the worktable, the spray gun is located above the worktable, a retaining plate is provided between the spray gun and the worktable, and the masking plate is detachably installed in the retaining plate. An insertion channel is provided on the side of the worktable away from the movable frame, and the side of the worktable closer to the movable frame is connected to the conveyor belt. The detachable masking plate can provide the effect of spraying welding adhesive on specific areas.

[0014] In a further embodiment of the above description, the card plate is connected to the top surface of the workbench via support columns. The support columns are located at the four corners of the top surface of the workbench, and a mounting plate is provided on the top of the support columns. The spray gun is fixedly connected to the mounting plate. A push plate is provided on the top of the workbench near the conveyor belt. The push plate is movably connected to the workbench. A movable position matching the push plate is provided on the workbench near the push plate. A recovery cylinder is provided on the conveyor belt near the push plate. The push rod of the recovery cylinder is connected to one end of the push plate. The recovery cylinder is used to carry the base coated with welding glue toward the conveyor belt after the glue spraying is completed.

[0015] In a further embodiment of the above description, the chip bonding assembly includes a storage box, a collection box, a chip placement tray, and a gripping unit. The storage box is located in the middle of the conveyor belt, and the chip placement tray is placed on the storage box. The storage box is connected to the top of the collection box. The collection box has a storage slot in the middle, and the top surface of the collection box has an opening that communicates with the chip placement tray. A movable baffle is located on the top surface of the collection box near the opening. The lower end of the collection box has a take-out port, which is covered with a sealing cap. The gripping unit works in conjunction with a robotic arm, and the storage slot is used to store the chip placement tray whose chips have been removed.

[0016] In a further embodiment of the above description, the gripping unit includes a positioning suction head and a pressing cylinder. The push rod of the pressing cylinder is connected to the top surface of the positioning suction head. A connecting frame is provided above the pressing cylinder. The pressing cylinders are distributed on both sides of the bottom surface of the connecting frame. Limiting cylinders are installed at both ends of the bottom surface of the connecting frame. The push rod of the limiting cylinder is connected to a limiting plate. The pressing cylinder is used to drive the positioning suction head to pick up the chip.

[0017] In a further embodiment of the above description, a vision detector is installed on the conveyor belt, and the vision detector is connected to the conveyor belt through a support frame; the vision detector is used to identify and locate the pads and chips on the base.

[0018] Compared with the prior art, the beneficial effects of this utility model are: by setting up welding components, glue application components and core bonding components, this utility model can achieve very precise chip mounting and welding compared with manual core bonding, ensuring that the quality and position of each solder joint are highly consistent, thereby improving the reliability and stability of the product.

[0019] At the same time, it can quickly complete the mounting and soldering of a large number of chips, greatly shortening the production cycle and meeting the needs of large-scale production. It also reduces the reliance on a large number of skilled workers, reduces the errors and labor costs that may be caused by manual operation, and improves production efficiency. Attached Figure Description

[0020] Figure 1This is a schematic diagram illustrating the working effect of the base-mounted chip capacitor welding mechanism of this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the chip-attached capacitor welding mechanism for the base of this utility model;

[0022] Figure 3 This is a three-dimensional structural diagram of the welding components in the base-mounted chip capacitor welding mechanism of this utility model;

[0023] Figure 4 This is a three-dimensional structural diagram of the welding components in the base-mounted chip capacitor welding mechanism of this utility model from another perspective;

[0024] Figure 5 This is a utility model Figure 4 A partially enlarged schematic diagram of structure A in the middle;

[0025] Figure 6 This is a three-dimensional structural diagram of the chip-attaching component in the base-attached chip capacitor welding mechanism of this utility model;

[0026] Figure 7 This is a three-dimensional structural diagram of the chip-attaching component in the base-attached chip capacitor welding mechanism of this utility model from another perspective;

[0027] Figure 8 This is a three-dimensional structural diagram of the adhesive application component in the base-mounted chip capacitor welding mechanism of this utility model;

[0028] Figure 9 This is a cross-sectional view of the adhesive application component in the base-mounted chip capacitor welding mechanism of this utility model;

[0029] In the diagram: 1-Conveyor belt, 2-Welding assembly, 3-Glue application assembly, 4-Core bonding assembly, 5-Vision detector, 6-Support frame;

[0030] 201-Mounting rack, 202-Movable rack, 203-Heating box, 204-Working plate;

[0031] 205-Lifting cylinder, 206-Notch, 207-Horizontal fine-tuning cylinder, 208-Connecting rod, 209-Heating port;

[0032] 2010 - Heating element; 2011 - Height adjustment slide; 2012 - Lateral adjustment slide; 2013 - Movable guide rail;

[0033] 2014 - Slider, 2015 - Connecting plate, 2016 - Discharge cylinder, 2017 - Pusher plate, 2018 - Guide frame;

[0034] 2019 - Feed inlet, 2020 - Discharge outlet, 2021 - Pusher cylinder.

[0035] 301-Spray gun, 302-Workbench, 303-Top cylinder, 304-Cover plate, 305-Clamping plate;

[0036] 306-Insertion channel, 307-Support column, 308-Mounting plate, 309-Push plate, 3010-Movable position;

[0037] 3011 - Recycling Cylinder.

[0038] 401-Storage box, 402-Collection box, 403-Chip placement tray, 404-Storage slot, 405-Opening;

[0039] 406-Modible baffle, 407-Dispensing outlet, 408-Sealing cover, 409-Positioning suction head, 4010-Pressing cylinder;

[0040] 4011-Connecting frame, 4012-Limit cylinder, 4013-Limit plate. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0042] For this embodiment, please refer to Figures 1-9 The specific implementation of the base-mounted chip capacitor welding mechanism includes a welding assembly 2, an adhesive application assembly 3, and a chip-mounting assembly 4. The adhesive application assembly 3 and the chip-mounting assembly 4 are both located on one side of the welding assembly 2. The welding assembly 2, adhesive application assembly 3, and chip-mounting assembly 4 are connected by a conveyor belt 1. The welding assembly 2 includes a mounting frame 201, an adjustment unit, and a working unit. The adjustment unit is fixed to one side of the mounting frame 201, and the working unit is connected to the adjustment unit. The working unit includes a movable frame 202, a heating box 203, and a working plate 204. The movable frame 202 is connected to the adjustment unit. The top surfaces of the work plate 204 are connected to the bottom surfaces of the movable frame 202 via lifting cylinders 205. A notch 206 is provided on one side of the work plate 204, and the heating box 203 is installed inside the notch 206. A horizontal fine-tuning cylinder 207 is provided on the edges of both ends of the notch 206. The heating box 203 is connected to the horizontal fine-tuning cylinder 207 via a connecting rod 208. A heating port 209 is provided on the bottom surface of the heating box 203. Heating tubes 2010 are distributed around the heating box 203, and one end of the heating tubes 2010 extends toward the outer side of the heating box 203.

[0043] The adjustment unit includes a height adjustment slide 2011 and a lateral adjustment slide 2012. The lateral adjustment slide 2012 is located at one end of the top surface of the mounting frame 201. A movable guide rail 2013 and a slider 2014 are provided on the side of the top surface of the mounting frame 201 away from the lateral adjustment slide 2012. A connecting plate 2015 is provided on the side of the height adjustment slide 2011 near the lateral adjustment slide 2012. The end of the connecting plate 2015 near the lateral adjustment slide 2012 is connected to the lateral adjustment slide 2012. The side of the connecting plate 2015 near the slider 2014 is fixedly connected to the slider 2014.

[0044] The mounting frame 201 is provided with a discharge unit at its lower end near the heating box 203. The discharge unit includes a discharge cylinder 2016, a pusher plate 2017, and a guide frame 2018. The guide frame 2018 has an inlet 2019 and an outlet 2020 at its two ends, respectively. The pusher plate 2017 is located between the inlet 2019 and the outlet 2020. The bottom surface of the guide frame 2018 is provided with a pusher cylinder 2021, which is connected to the pusher plate 2017. The discharge cylinder 2016 is located on the side of the guide frame away from the outlet 2020. The push rod of the discharge cylinder 2016 passes through the guide frame and is aligned with the outlet 2020. One end of the conveyor belt 1 is connected to the inlet 2019.

[0045] The adhesive application assembly 3 includes a spray gun 301, a worktable 302, an upper cylinder 303, and a cover plate 304. The worktable 302 is located on one side of the movable frame 202, the upper cylinder 303 is located inside the worktable 302, the spray gun 301 is located above the worktable 302, a clamping plate 305 is provided between the spray gun 301 and the worktable 302, and the cover plate 304 is detachably installed in the clamping plate 305. The side of the worktable 302 away from the movable frame 202 is provided with an insertion channel 306, and the side of the worktable 302 closer to the movable frame 202 is connected to the conveyor belt 1.

[0046] The card plate 305 is connected to the top surface of the workbench 302 via support columns 307. The support columns 307 are located at the four corners of the top surface of the workbench 302. The top of the support columns 307 is provided with a mounting plate 308. The spray gun 301 is fixedly connected to the mounting plate 308. The top of the workbench 302 is provided with a push plate 309 near the conveyor belt 1. The push plate 309 is movably connected to the workbench 302. The workbench 302 is provided with a movable position 3010 that matches the push plate 309 near the push plate 309. The conveyor belt 1 is provided with a recovery cylinder 3011 near the push plate 309. The push rod of the recovery cylinder 3011 is connected to one end of the push plate 309.

[0047] The chip-attaching assembly 4 includes a storage box 401, a collection box 402, a chip placement tray 403, and a clamping unit. The storage box 401 is located in the middle of the conveyor belt 1. The chip placement tray 403 is placed on the storage box 401. The storage box 401 is connected to the top of the collection box 402. The collection box 402 has a storage slot 404 in the middle. The top surface of the collection box 402 has an opening 405 that communicates with the chip placement tray 403. The opening 405 communicates with the storage slot 404. The top surface of the collection box 402 has a movable baffle 406 near the opening 405. The lower end of the collection box 402 has a take-out port 407, and a sealing cover 408 is placed on the take-out port 407.

[0048] The gripping unit includes a positioning suction head 409 and a pressing cylinder 4010. The push rod of the pressing cylinder 4010 is connected to the top surface of the positioning suction head 409. A connecting frame 4011 is provided above the pressing cylinder 4010. The pressing cylinders 4010 are distributed on both sides of the bottom surface of the connecting frame 4011. Limiting cylinders 4012 are installed at both ends of the bottom surface of the connecting frame 4011. The push rod of the limiting cylinder 4012 is connected to a limiting plate 4013.

[0049] A vision detector 5 is installed on the conveyor belt 1, and the vision detector 5 is connected to the conveyor belt 1 through a support frame 6.

[0050] The working process of this utility model is as follows: After the base containing the product is placed into the workbench 302 from the storage channel, the lifting cylinder 303 lifts the base. When the base moves to the top surface of the workbench 302, the spray gun 301 starts to work and sprays the base. Due to the obstruction of the cover plate 304, only specific areas are sprayed with welding glue.

[0051] Then the recovery cylinder 3011 is activated, which drives the push plate 309 and the base to move toward the conveyor belt 1. The base moves on the conveyor belt 1. When it enters the working range of the bonding component 4, the conveyor belt 1 stops moving. The mechanical wall uses the positioning suction head 409 on the clamping unit to clamp the chip and then places the chip in the area sprayed with solder adhesive.

[0052] Then, the conveyor belt 1 continues to move the base into the visual inspection area to check whether the chip and solder are placed correctly. After confirmation, the base is conveyed to the feed inlet 2019. The pusher plate 2017 pushes the base to the processing area. The height adjustment slide 2011 moves the movable frame 202 and the heating box 203 downward. When the heating box 203 is closed on the base, the heating tube 2010 starts heating to achieve the welding effect. After completion, the height adjustment slide 2011 is raised, and the discharge cylinder 2016 pushes out the welded base.

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0054] Furthermore, in the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0055] Finally, it should be noted that the above embodiments are merely specific implementations of this utility model, used to illustrate the technical solution of this utility model, and not to limit it. The protection scope of this utility model is not limited thereto. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this utility model. These modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A base-mounted chip capacitor soldering mechanism, comprising a soldering assembly, an adhesive application assembly, and a chip mounting assembly, characterized in that: The gluing assembly and the core-applying assembly are both located on one side of the welding assembly. The welding assembly, the gluing assembly, and the core-applying assembly are connected by a conveyor belt. The welding assembly includes a mounting frame, an adjustment unit, and a working unit. The adjustment unit is fixed to one side of the mounting frame. The working unit is connected to the adjustment unit. The working unit includes a movable frame, a heating box, and a working plate. The movable frame is connected to the adjustment unit. Both ends of the top surface of the working plate are connected to the bottom surface of the movable frame through lifting cylinders. A notch is provided on one side of the working plate. The heating box is located in the notch. A horizontal fine-tuning cylinder is provided on the edge of both ends of the notch. The heating box is connected to the horizontal fine-tuning cylinder through a connecting rod. A heating port is provided on the bottom surface of the heating box. Heating tubes are distributed around the heating box, with one end of the heating tubes extending towards the outer side of the heating box.

2. The base-mounted chip capacitor welding mechanism according to claim 1, characterized in that: The adjustment unit includes a height adjustment slide and a lateral adjustment slide. The lateral adjustment slide is located at one end of the top surface of the mounting frame. The top surface of the mounting frame away from the lateral adjustment slide is provided with a movable guide rail and a slider. The height adjustment slide is provided with a connecting plate on the side near the lateral adjustment slide. The end of the connecting plate near the lateral adjustment slide is connected to the lateral adjustment slide, and the side of the connecting plate near the slider is fixedly connected to the slider.

3. The base-mounted chip capacitor welding mechanism according to claim 1, characterized in that: The lower end of the mounting frame, near the heating box, is equipped with a discharge unit. The discharge unit includes a discharge cylinder, a pusher plate, and a guide frame. The two ends of the guide frame are respectively equipped with a feed inlet and a discharge outlet. The pusher plate is located between the feed inlet and the discharge outlet. The bottom surface of the guide frame is equipped with a pusher cylinder, which is connected to the pusher plate. The discharge cylinder is located on the side of the guide frame away from the discharge outlet. The push rod of the discharge cylinder passes through the guide frame and is aligned with the discharge outlet. One end of the conveyor belt is connected to the feed inlet.

4. The base-mounted chip capacitor welding mechanism according to claim 1, characterized in that: The adhesive application assembly includes a spray gun, a worktable, an upper cylinder, and a masking plate. The worktable is located on one side of the movable frame, the upper cylinder is located inside the worktable, the spray gun is located above the worktable, a retaining plate is provided between the spray gun and the worktable, and the masking plate is detachably installed in the retaining plate. An insertion channel is provided on the side of the worktable away from the movable frame, and the side of the worktable closer to the movable frame is connected to the conveyor belt.

5. The base-mounted chip capacitor welding mechanism according to claim 4, characterized in that: The card plate is connected to the top surface of the workbench via support columns. The support columns are located at the four corners of the top surface of the workbench. The top of the support columns is equipped with a mounting plate. The spray gun is fixedly connected to the mounting plate. A push plate is located on the top of the workbench near the conveyor belt. The push plate is movably connected to the workbench. The workbench is equipped with a matching movable position near the push plate. A recovery cylinder is located on the conveyor belt near the push plate. The push rod of the recovery cylinder is connected to one end of the push plate.

6. The base-mounted chip capacitor welding mechanism according to claim 1, characterized in that: The chip bonding assembly includes a storage box, a collection box, a chip placement tray, and a gripping unit. The storage box is located in the middle of the conveyor belt, and the chip placement tray is placed on the storage box. The storage box is connected to the top of the collection box. The collection box has a storage slot in the middle. The top surface of the collection box has an opening that communicates with the chip placement tray. A movable baffle is located on the top surface of the collection box near the opening. The lower end of the collection box has an outlet, which is covered with a sealing cap.

7. The base-mounted chip capacitor welding mechanism according to claim 6, characterized in that: The gripping unit includes a positioning suction head and a pressing cylinder. The push rod of the pressing cylinder is connected to the top surface of the positioning suction head. A connecting frame is provided above the pressing cylinder. The pressing cylinders are distributed on both sides of the bottom surface of the connecting frame. Limiting cylinders are installed at both ends of the bottom surface of the connecting frame. The push rod of the limiting cylinder is connected to a limiting plate.

8. The base-mounted chip capacitor welding mechanism according to claim 1, characterized in that: A vision detector is installed on the conveyor belt, and the vision detector is connected to the conveyor belt through a support frame.

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