Laser deflection system and multi-axis linkage laser processing system

Abstract

The utility model relates to a laser deflection system and a multi-axis linkage laser processing system. The laser deflection system comprises a processing platform configured to place a workpiece to be processed; the first light beam deflection device is configured to deflect the laser beam in the first direction; the second light beam deflection device is configured to deflect the laser beam along a second direction, and the second direction is not collinear with the first direction; the first displacement device is configured to regulate and control the relative position of the workpiece to be machined and the first light beam deflection device in the third direction; and the second displacement device is configured to regulate and control the relative position of the workpiece to be machined and the second light beam deflection device in the fourth direction, and the fourth direction and the third direction are not collinear. By the adoption of the laser deflection system and the multi-axis linkage laser machining system, the laser machining quality of the large-breadth workpiece can be improved.

Description

Technical Field

[0001] This application relates to the field of optical processing technology, and in particular to laser oscillation systems and multi-axis linkage laser processing systems. Background Technology

[0002] Laser processing technology is a processing technology that uses high-energy laser beams to cut, weld, mark, and perform other operations on materials. It is widely used in aerospace, automobile manufacturing, electronic information and other fields.

[0003] In traditional technology, laser processing based on the processing pattern is mainly achieved by using a scanning galvanometer to deflect the laser beam according to the processing pattern.

[0004] However, due to limitations imposed by the scanning galvanometer's tilt angle and the focusing lens's window size, the processing range of laser processing equipment is limited. For processing large-format workpieces, only partitioned processing can be performed. That is, the large processing area on the workpiece is divided into multiple smaller partitions, each processed separately, and then pieced together to form the entire processing area. This partitioned processing method may introduce graphic or point-to-point splicing errors between the partitions, thus affecting the product's processing accuracy and quality stability. Utility Model Content

[0005] Therefore, it is necessary to provide a laser oscillation system and a multi-axis linkage laser processing system that can improve the laser processing quality of large-format workpieces.

[0006] In a first aspect, this application provides a laser deflection system, the laser deflection system comprising:

[0007] The processing platform is configured to hold the workpiece to be processed.

[0008] The first beam deflection device is configured to deflect the laser beam along a first direction;

[0009] The second beam deflection device is configured to deflect the laser beam along a second direction, which is not collinear with the first direction;

[0010] The first displacement device is configured to adjust the relative position of the workpiece to be processed and the first beam deflection device in a third direction;

[0011] The second displacement device is configured to adjust the relative position of the workpiece to be processed and the second beam deflection device in a fourth direction, which is not collinear with the third direction.

[0012] In one embodiment, the first displacement device includes a first drive motor and a first guide rail extending in a third direction;

[0013] The first guide rail is configured as an installation and processing platform;

[0014] The first drive motor is configured to drive the processing platform to move in a third direction under the guidance of the first guide rail.

[0015] In one embodiment, the first displacement device further includes a third-party position feedback grating ruler.

[0016] In one embodiment, the second displacement device includes a second drive motor and a second guide rail extending in a fourth direction;

[0017] The second guide rail is configured to install the machining platform;

[0018] The second drive motor is configured to drive the processing platform to move in the fourth direction under the guidance of the second guide rail.

[0019] In one embodiment, the second displacement device further includes a fourth-direction position feedback grating ruler.

[0020] In one embodiment, the first displacement device includes a first base, a first drive motor, and a first guide rail arranged along a third direction, with the processing platform slidably connected to the first guide rail; the second displacement device includes a second drive motor and a second guide rail arranged along a fourth direction, with the first base slidably connected to the second guide rail; wherein...

[0021] The first base is configured to fix the first guide rail;

[0022] The first drive motor is configured to drive the processing platform to move in a third direction under the guidance of the first guide rail;

[0023] The second drive motor is configured to drive the first base to move in the fourth direction under the guidance of the second guide rail.

[0024] In one embodiment, the second direction is perpendicular to the first direction;

[0025] The third direction is the same as the first direction;

[0026] The fourth direction is the same as the second direction.

[0027] In one embodiment, the first beam deflection device includes at least one of a first scanning mirror and a first acousto-optic deflector; the second beam deflection device includes at least one of a second scanning mirror and a second acousto-optic deflector.

[0028] Secondly, this application also provides a multi-axis linkage laser processing system, which includes the laser tilting system described above, and further includes:

[0029] A laser, configured to emit a laser beam;

[0030] A focusing lens is placed in the output optical path of the laser deflection system and is configured to focus the laser beam, after being deflected by the laser deflection system, onto the workpiece to be processed on the processing platform for processing.

[0031] In one embodiment, the multi-axis linkage laser processing system further includes a controller, which is communicatively connected to the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device, respectively, for controlling multiple of the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device to perform multi-axis linkage.

[0032] The aforementioned laser deflection system and multi-axis linkage laser processing system place the workpiece to be processed on a processing platform. The laser beam is deflected in coordination by a first beam deflection device, a second beam deflection device, a first displacement device, and a second displacement device. This deflected laser beam acts on the workpiece, processing it. Through the combined effect of the displacement device and the beam deflection device, the effective processing range of the entire processing system can overcome the limitations of the beam deflection device's width, enabling processing over a larger area than the beam deflection device's width. This reduces the number of processing zones for large-format workpieces, reduces the number of joints between zones, thus reducing splicing errors, improving product processing accuracy and quality stability, and producing higher-quality products. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of a laser deflection system in one embodiment.

[0034] Figure 2 This is a schematic diagram of a scenario in which the beam deflection device and the displacement device work together in one embodiment.

[0035] Figure 3 This is a schematic diagram of a multi-axis linkage laser processing system in one embodiment.

[0036] Figure 4 This is a schematic diagram of the structure of a multi-axis linkage laser processing system in another embodiment. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] See Figure 1 , Figure 1 A schematic diagram of the structure of a laser deflection system according to an embodiment of this application is shown. The laser deflection system provided in an embodiment of this application includes a processing platform 102, a first beam deflection device 106, a second beam deflection device 108, a first displacement device 110, and a second displacement device 112.

[0044] For example, the laser beam emitted by laser 114 is deflected by the first beam deflection device 106 and the second beam deflection device 108 before being incident on the workpiece 104 placed on the processing platform 102. During the process of deflecting the laser beam by the first beam deflection device 106 and the second beam deflection device 108, the first displacement device 110 and the second displacement device 112 can synchronously adjust the relative positional relationship between the workpiece 104 and the beam deflection device.

[0045] The workpiece to be processed refers to the object or material that needs to be laser-processed. The processing platform refers to the device used to support the workpiece. Laser processing technology is a technique that uses a high-energy laser beam to precisely process materials. Through the thermal, chemical, or physical effects of the laser beam, the physical or chemical properties of the material are changed, thereby achieving processing purposes such as cutting, welding, marking, engraving, and drilling.

[0046] A beam deflection device can refer to an optical element or system that can change the propagation direction of a laser beam by changing its operating state. It includes at least one of a galvanometer, a rotating mirror, an acousto-optic deflector, and an electro-optic deflector. The changing operating state of a galvanometer can refer to the rotation of the galvanometer, the changing operating state of a rotating mirror can refer to the rotation of the rotating mirror, the changing operating state of an acousto-optic deflector can refer to the change of the acoustic wave mode, diffraction efficiency, etc. of the acousto-optic deflector, and the changing operating state of an electro-optic deflector can refer to the change of the electric field.

[0047] The beam deflection device includes a first beam deflection device and a second beam deflection device. The first beam deflection device is configured to deflect the laser beam along a first direction, and the second beam deflection device is configured to deflect the laser beam along a second direction. The second direction is not collinear with the first direction; they can be perpendicular to each other or form an angle. One beam deflection device can continuously deflect the laser beam in one direction. By setting two beam deflection devices, the laser beam can be deflected in two non-collinear directions respectively. By coordinating the working states of the two devices through a control system, precise scanning on a two-dimensional plane can be achieved.

[0048] In some embodiments, the first beam deflection device includes at least one of a first scanning mirror and a first acousto-optic deflector; the second beam deflection device includes at least one of a second scanning mirror and a second acousto-optic deflector.

[0049] In some feasible implementations, the first direction and the second direction can be perpendicular to each other. When the first direction and the second direction are perpendicular, the deflection of the laser beam by the first beam deflection device and the deflection of the laser beam by the second beam deflection device will not affect each other. Therefore, the position of the laser beam in the first and second directions can be easily controlled independently by controlling the corresponding drive signals of the first and second beam deflection devices, which simplifies the design and calibration process of the entire system and helps to improve the accuracy and stability of laser positioning. When the first direction and the second direction are not perpendicular, the deflection of the laser beam along the first direction and the deflection along the second direction can both be converted into components in two mutually perpendicular directions. The control system can still accurately calculate and control the position of the laser beam through more complex algorithms to achieve laser processing of the workpiece.

[0050] A displacement device can refer to a device that can change the position of an object in space through mechanical, electrical, or hydraulic means. A displacement device can include a moving mechanism and a drive module. The moving mechanism can refer to mechanical components used to move objects in space, such as slide rail modules or belts. A slide rail module includes at least a guide rail and may also include connecting parts such as sliders, gears, and pistons. These connecting parts are used to fix the object to be moved, thereby driving the object to move. It is understood that if the object to be moved has connecting parts that can match the guide rail, then the slide rail module does not need to have additional connecting parts. The drive module can refer to a device used to drive the object to move in space, such as a stepper motor, servo motor, linear motor, or hydraulic cylinder.

[0051] As an example, the displacement device can be a machining platform displacement device, which refers to a device that can change the position of the machining platform in space through mechanical, electrical, or hydraulic means. As the machining platform moves, the workpiece placed on it also moves. Therefore, if the position of the beam deflection device and the position of the workpiece on the machining platform remain unchanged, moving the machining platform can change the relative position between the machining platform and the beam deflection device, thereby changing the relative position between the workpiece and the beam deflection device.

[0052] As another example, the displacement device can be a workpiece displacement device, which refers to a device that can change the position of the workpiece in space through mechanical, electrical, or hydraulic means. Without changing the position of the beam deflection device, moving the workpiece can change the relative position between the workpiece and the beam deflection device.

[0053] As another example, the displacement device can be an optical path module displacement device. An optical path module displacement device refers to a device capable of changing the position of an optical path module in space through mechanical, electrical, or hydraulic means. An optical path module can refer to a collection of optical elements and mechanical structures used to achieve functions such as light transmission, deflection, focusing, and filtering, including lasers, beam deflection devices, and focusing lenses. As the optical path module moves, the optical path of the laser beam shifts along with the entire optical path module, causing a shift in the point of action of the laser beam on the workpiece. Therefore, without changing the positions of the processing platform and the workpiece, moving the optical path module can change the relative position between the workpiece and the beam deflection device.

[0054] The displacement device includes a first displacement device and a second displacement device. The first displacement device is configured to adjust the relative position of the workpiece to be processed and the first beam deflection device in a third direction. The second displacement device is configured to adjust the relative position of the workpiece to be processed and the second beam deflection device in a fourth direction. The fourth direction is not collinear with the third direction; they can be perpendicular to each other or form a certain angle. One displacement device can control the continuous change of the relative position of the workpiece to be processed and the first beam deflection device in one direction. By setting two beam deflection devices, the relative positions of the workpiece to be processed and the first beam deflection device in different directions can be controlled separately. By coordinating the movement of the two devices through the control system, precise control of the relative position of the workpiece to be processed and the first beam deflection device in a two-dimensional plane can be achieved.

[0055] In some feasible implementations, the first displacement device and the second displacement device can be used to control the positional changes of different modules in space. For example, the first displacement device can be used to control the positional changes of the processing platform in the third direction, and the second displacement device can be used to control the positional changes of the optical path module in the fourth direction; the first displacement device can be used to control the positional changes of the workpiece to be processed in the third direction, and the second displacement device can be used to control the positional changes of the processing platform in the fourth direction, etc. The specifics can be determined according to the actual situation, and this embodiment does not impose any restrictions on this.

[0056] In some feasible implementations, the third and fourth directions can be perpendicular to each other. When the third and fourth directions are perpendicular, the adjustment of the relative position of the workpiece to be processed and the first beam deflection device in the third direction by the first displacement device will not affect the adjustment of the relative position of the workpiece to be processed and the second beam deflection device in the third direction by the second displacement device. Therefore, the change of the relative position between the workpiece to be processed and the first beam deflection device in the third and fourth directions can be easily controlled independently by controlling the corresponding drive signals of the first and second displacement devices. This simplifies the design and calibration process of the entire system and helps to improve the accuracy and stability of laser positioning. When the third and fourth directions are not perpendicular, the adjustment of the relative position of the workpiece to be processed and the first beam deflection device in the third and fourth directions can be converted into components in two mutually perpendicular directions. The control system can still accurately calculate and control the relative positional relationship between the workpiece to be processed and the second beam deflection device through more complex algorithms to achieve laser processing of the workpiece to be processed.

[0057] In some embodiments, the second direction is perpendicular to the first direction; the third direction is the same as the first direction; and the fourth direction is the same as the second direction.

[0058] In this way, with the beam deflection device and the displacement device working together, the beam deflection device deflects the laser beam, while the displacement device adjusts the relative position between the entire optical path and the workpiece. Thus, the position of the point of action of the laser beam on the surface of the workpiece is affected not only by the laser beam deflection but also by the relative position between the entire optical path and the workpiece. Under the superposition of the two, the actual moving distance of the point of action increases at the same deflection angle. Therefore, the effective processing range of the entire processing system breaks through the width limitation of the beam deflection device, enabling processing of a larger range beyond the processing width of the beam deflection device. For ease of understanding, let's take the example where the first and third directions are both X-axis directions, and the second and fourth directions are both Y-axis directions, with the X-axis and Y-axis directions perpendicular to each other. Assume the maximum deflection distance of the first beam deflection device is X1, the maximum deflection distance of the second beam deflection device is Y1, and the size of the workpiece to be processed is X2 × Y2, where X2 is greater than X1 and Y2 is greater than Y1. If the beam deflection device works alone, the workpiece can only be processed by piecing together parts through partitioned processing. However, if the beam deflection device and the displacement device work together, such as... Figure 2 As shown, before movement and deflection, the laser beam's point of action on the workpiece 206 is P1. The first beam deflection device 202 deflects the laser beam in the positive X-axis direction, causing the point of action P1 to be deflected to the point of action P2. The dashed arrow represents the laser beam after deflection. During the process of the first beam deflection device 202 deflecting the laser beam in the positive X-axis direction, the first displacement device drives the workpiece to move in the negative X-direction. The workpiece 206 and the processing platform 204 after movement are represented by dashed lines. The point of action P1 moves to P1' along with the workpiece. Therefore, the actual distance the laser beam's point of action on the workpiece moves is equal to P1'P1 + P1P2, which is much greater than the moving distance P1P2 of the beam deflection device working alone.

[0059] In some embodiments, the first displacement device includes a first drive motor and a first guide rail extending in a third direction; the first guide rail is configured to mount a processing platform; the first drive motor is configured to drive the processing platform to move in a third direction under the guidance of the first guide rail.

[0060] The machining platform is mounted on a first guide rail. The mounting method includes either sliding the machining platform onto the first guide rail, or fixing the machining platform to other modules and then sliding the other modules onto the first guide rail. The first guide rail guides the movement of the machining platform when the first drive motor is operating. Extending along a third direction, the first guide rail allows the machining platform to move along that direction under the drive of the first drive motor.

[0061] In some embodiments, the first displacement device further includes a third-party position feedback grating ruler.

[0062] Among them, the third-party position feedback grating ruler is used to provide real-time feedback on the current position of the processing platform.

[0063] In some embodiments, the second displacement device includes a second drive motor and a second guide rail extending in a fourth direction; the second guide rail is configured to mount a processing platform; the second drive motor is configured to drive the processing platform to move in the fourth direction under the guidance of the second guide rail.

[0064] The machining platform is mounted on a second guide rail. The mounting method includes either sliding the machining platform onto the second guide rail, or fixing the machining platform to other modules and then sliding the other modules onto the second guide rail. The second guide rail guides the movement of the machining platform when the second drive motor is operating. Extending in a fourth direction, the second guide rail allows the machining platform to move along that direction under the drive of the second drive motor.

[0065] In some embodiments, the second displacement device further includes a fourth direction position feedback grating ruler.

[0066] The fourth-direction position feedback grating ruler is used to provide real-time feedback on the current position of the processing platform.

[0067] In some embodiments, the first displacement device includes a first base, a first drive motor, and a first guide rail arranged along a third direction, with the processing platform slidably connected to the first guide rail; the second displacement device includes a second drive motor and a second guide rail arranged along a fourth direction, with the first base slidably connected to the second guide rail; wherein, the first base is configured to fix the first guide rail; the first drive motor is configured to drive the processing platform to move along a third direction under the guidance of the first guide rail; and the second drive motor is configured to drive the first base to move along a fourth direction under the guidance of the second guide rail.

[0068] For example, such as Figure 3 As shown, the first displacement device includes a first base 3200, a first drive motor 3203, and a first guide rail 3202 arranged along a third direction. The first displacement device may also include a third-direction position feedback grating ruler 3201. The processing platform 3300 is slidably connected to the first guide rail 3202. The first drive motor 3203 is configured to drive the processing platform 3300 to move along a third direction under the guidance of the first guide rail 3202. The processing platform 3300 can drive the workpiece 3400 to be processed to slide in the third direction.

[0069] The second displacement device includes a second drive motor 3103 and a second guide rail 3102 arranged along the fourth direction. The second displacement device may also include a fourth-direction position feedback grating ruler 3101. A first base 3200 is slidably connected to the second guide rail 3102, and the first guide rail 3202 is fixed to the first base 3200. The second drive motor 3103 is configured to drive the first base 3200 to move along the fourth direction under the guidance of the second guide rail 3102. The first base 3200 can drive the first guide rail 3202, the processing platform 3300, and the workpiece 3400 to be processed to slide in the fourth direction. In some feasible embodiments, the second guide rail 3102 may be fixed to the second base 3100.

[0070] Thus, the laser beam emitted by laser 3504, after being deflected by the first beam deflection device 3501 and the second beam deflection device 3502, is incident on the focusing lens 3503, and after being focused by the focusing lens 3503, it is incident on the workpiece 3400 placed on the processing platform 3300. During the process of the first beam deflection device 3501 and the second beam deflection device 3502 deflecting the laser beam, the first displacement device and the second displacement device can synchronously adjust the relative positional relationship between the workpiece 4400 and the beam deflection device.

[0071] In some feasible embodiments, the laser processing process can be controlled by a controller 3600, which is configured to receive and process real-time position information fed back by a third-direction position feedback grating ruler 3201, a fourth-direction position feedback grating ruler 3101, a first beam deflection device 3501, and a second beam deflection device 3502; control the first drive motor 3203 and the second drive motor 3103 to move the processing platform 3300; control the first beam deflection device 3501 and the second beam deflection device 3502 to deflect the laser beam; and control the laser 3503 to emit the laser beam.

[0072] In some feasible implementations, the first beam deflection device is an X-axis scanning galvanometer, and the second beam deflection device is a Y-axis scanning galvanometer. Before laser processing, parameters such as the laser emission frequency, energy value, emission delay, and off-light delay, as well as the acceleration, deceleration, and maximum speed of the first drive motor 3203, the second drive motor 3103, the X-axis scanning galvanometer 3501, and the Y-axis scanning galvanometer 3502 can be set in the system. The controller pre-calculates the processing path for the graphics or points to be processed based on the preset processing content, plans the processing path, and pre-plans the motor movement and galvanometer tilting trajectory during processing. Simultaneously, it controls the first drive motor 3203 and the second drive motor 3103 to move the graphics or points to be processed below the beam deflection device and activates the laser for processing. Under the simultaneous control of the controller, the X-axis scanning galvanometer 3501 and the Y-axis scanning galvanometer 3502 continuously adjust the tilting speed, acceleration, and angle of the galvanometers according to the processing path information. The laser beam emitted by the laser 3504 controlled by the controller 3600 is focused by the focusing lens 3503 and tilted onto the graphics or points to be processed on the workpiece 3400 on the processing platform 3300. The laser beam follows the graphics or points to be processed during motor movement and galvanometer tilting until the laser processing of the workpiece 3400 is completed.

[0073] During the processing, the controller 3600 can adjust the position of the processing platform 3300 in real time according to the real-time position information provided by the encoders of the position feedback grating ruler and scanning galvanometer, and according to the processing trajectory requirements of the processing graphic or point. It can also control the X-axis scanning galvanometer 3501 and Y-axis scanning galvanometer 3502 to adjust their yaw positions in real time, thereby continuously adjusting the position of the laser beam. By controlling the first drive motor 3203, the workpiece 3400 to be processed and the first beam deflection device 3501 can move towards each other or relative to each other. By controlling the second drive motor 3103, the workpiece 3400 to be processed and the Y-axis scanning galvanometer 3502 can move towards each other or relative to each other. This achieves real-time synchronous adjustment of the drive motors, scanning galvanometers and laser, thereby obtaining high-precision processing quality. This laser multi-axis linkage processing device and method is no longer limited by the tilt angle of the scanning galvanometer and the size of the focusing lens window during processing. It enables the controller to simultaneously drive and control multiple motors synchronously, ensuring the continuity of the processed graphics or points during processing. It eliminates the positioning error caused by the start and stop of the worktable movement, and gets rid of the constraints of galvanometer scanning partition processing in traditional laser processing. This results in products without splicing errors and with better product quality.

[0074] The aforementioned laser deflection system and multi-axis linkage laser processing system place the workpiece to be processed on a processing platform. The laser beam is deflected in coordination by a first beam deflection device, a second beam deflection device, a first displacement device, and a second displacement device. This deflected laser beam acts on the workpiece, processing it. Through the combined effect of the displacement device and the beam deflection device, the effective processing range of the entire processing system can overcome the limitations of the beam deflection device's width, enabling processing over a larger area than the beam deflection device's width. This reduces the number of processing zones for large-format workpieces, reduces the number of joints between zones, thus reducing splicing errors, improving product processing accuracy and quality stability, and producing higher-quality products.

[0075] In some embodiments, combined with Figure 4 A multi-axis linkage laser processing system is provided, including the aforementioned laser oscillation system, laser 4504, and focusing lens 4503, wherein:

[0076] Laser 4504 is configured to emit a laser beam;

[0077] The focusing lens 4503 is set in the output optical path of the laser deflection system and is configured to focus the laser beam after it has been deflected by the laser deflection system onto the workpiece to be processed on the processing platform for processing.

[0078] In some embodiments, the multi-axis linkage laser processing system further includes a controller 4600, which is communicatively connected to the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device, respectively, for controlling multiple of the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device to perform multi-axis linkage.

[0079] In some embodiments, the multi-axis linkage laser processing system includes multiple laser deflection systems, each laser deflection system sharing at least one target function module, the target function module including at least one of a processing platform, a first beam deflection device, a second beam deflection device, a first displacement device, and a second displacement device.

[0080] In a multi-axis linkage laser processing system, there can be one or more laser deflection systems. Each laser deflection system includes multiple functional modules, such as a processing platform, a first beam deflection device, a second beam deflection device, a first displacement device, and a second displacement device. When multiple laser deflection systems are deployed, they can share some functional modules. The target functional module refers to the shared functional module among the multiple laser deflection systems, thereby reducing equipment costs. For example... Figure 4The multi-axis linkage laser processing system includes two laser deflection systems, which share the processing platform 4300, the first displacement device, and the second displacement device.

[0081] For example, the first displacement device includes a first base 4200, a first drive motor 4203, and a first guide rail 4202 arranged along a third direction. The first displacement device may also include a third-direction position feedback grating ruler 4201. The processing platform 4300 is slidably connected to the first guide rail 4202. The first drive motor 4203 is configured to drive the processing platform 4300 to move along a third direction under the guidance of the first guide rail 4202. The processing platform 4300 can drive the workpiece 4400 to be processed to slide in the third direction.

[0082] The second displacement device includes a second drive motor 4103 and a second guide rail 4102 arranged along the fourth direction. The second displacement device may also include a fourth-direction position feedback grating ruler 4101. A first base 4200 is slidably connected to the second guide rail 4102, and the first guide rail 4202 is fixed to the first base 4200. The second drive motor 4103 is configured to drive the first base 4200 to move along the fourth direction under the guidance of the second guide rail 4102. The first base 4200 can drive the first guide rail 4202, the processing platform 4300, and the workpiece 4400 to be processed to slide in the fourth direction. In some feasible embodiments, the second guide rail 4102 may be fixed to the second base 4100.

[0083] Thus, the laser beam emitted by laser 4504, after being deflected by the first beam deflection device 4501 and the second beam deflection device 4502, is incident on the focusing lens 4503. After being focused by the focusing lens 4503, it is incident on the workpiece 4400 placed on the processing platform 4300. During the process of deflecting the laser beam by the first beam deflection device 4501 and the second beam deflection device 4502, the first displacement device and the second displacement device can synchronously adjust the relative positional relationship between the workpiece 4400 and the beam deflection device.

[0084] It is understood that when multiple laser deflection systems are set up, the multiple laser deflection systems can share the same set of displacement devices, and different displacement devices can be set and controlled independently. The specifics can be determined according to the actual situation, and this embodiment does not impose any restrictions on this.

[0085] In some feasible embodiments, the laser processing process can be controlled by a controller 4600, which is configured to receive and process real-time position information fed back by a third-direction position feedback grating ruler 4201, a fourth-direction position feedback grating ruler 4101, a first beam deflection device 4501, and a second beam deflection device 4502; control the first drive motor 4203 and the second drive motor 4103 to move the processing platform 4300; control the first beam deflection device 4501 and the second beam deflection device 4502 to deflect the laser beam; and control the laser 4503 to emit the laser beam.

[0086] In some feasible implementations, the first beam deflection device is an X-axis scanning galvanometer, and the second beam deflection device is a Y-axis scanning galvanometer. Before laser processing, parameters such as the laser emission frequency, energy value, emission delay, and off-light delay, as well as the acceleration, deceleration, and maximum speed of the first drive motor 4203, the second drive motor 4103, the X-axis scanning galvanometer 4501, and the Y-axis scanning galvanometer 4502 can be set in the system. The controller pre-calculates the processing path for the graphics or points to be processed based on the preset processing content, plans the processing path, and pre-plans the motor movement and galvanometer tilting trajectory during processing. Simultaneously, it controls the first drive motor 4203 and the second drive motor 4103 to move the graphics or points to be processed below the beam deflection device and activates the laser for processing. Under the simultaneous control of the controller, the X-axis scanning galvanometer 4501 and the Y-axis scanning galvanometer 4502 continuously adjust the tilting speed, acceleration, and angle of the galvanometers according to the processing path information. The laser beam emitted by the laser 4504 controlled by the controller 4600 is focused by the focusing lens 4503 and tilted onto the graphics or points to be processed on the workpiece 4400 on the processing platform 4300. The laser beam follows the graphics or points to be processed during motor movement and galvanometer tilting until the laser processing of the workpiece 4400 is completed.

[0087] During the processing, the controller 4600 can adjust the position of the processing platform 4300 in real time according to the real-time position information provided by the encoders of the position feedback grating ruler and scanning galvanometer, and according to the processing trajectory requirements of the processing graphic or point. It can also control the X-axis scanning galvanometer 4501 and Y-axis scanning galvanometer 4502 to adjust their yaw positions in real time, thereby continuously adjusting the position of the laser beam. By controlling the first drive motor 4203, the workpiece 4400 to be processed and the first beam deflection device 4501 can move towards each other or relative to each other. By controlling the second drive motor 4103, the workpiece 4400 to be processed and the Y-axis scanning galvanometer 4502 can move towards each other or relative to each other. This achieves real-time synchronous adjustment of the drive motors, scanning galvanometers and laser, thereby obtaining high-precision processing quality. This laser multi-axis linkage processing device and method is no longer limited by the tilt angle of the scanning galvanometer and the size of the focusing lens window during processing. It enables the controller to simultaneously drive and control multiple motors synchronously, ensuring the continuity of the processed graphics or points during processing. It eliminates the positioning error caused by the start and stop of the worktable movement, and gets rid of the constraints of galvanometer scanning partition processing in traditional laser processing. This results in products without splicing errors and with better product quality.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser deflection system, characterized in that, The laser deflection system includes: The processing platform is configured to hold the workpiece to be processed. The first beam deflection device is configured to deflect the laser beam along a first direction; The second beam deflection device is configured to deflect the laser beam along a second direction, which is not collinear with the first direction; The first displacement device is configured to adjust the relative position of the workpiece to be processed and the first beam deflection device in a third direction; The second displacement device is configured to adjust the relative position of the workpiece to be processed and the second beam deflection device in a fourth direction, which is not collinear with the third direction.

2. The laser deflection system according to claim 1, characterized in that, The first displacement device includes a first drive motor and a first guide rail extending in a third direction; The first guide rail is configured to mount the machining platform; The first drive motor is configured to drive the processing platform to move in a third direction under the guidance of the first guide rail.

3. The laser deflection system according to claim 2, characterized in that, The first displacement device also includes a third-party position feedback grating ruler.

4. The laser deflection system according to claim 1, characterized in that, The second displacement device includes a second drive motor and a second guide rail extending in a fourth direction; The second guide rail is configured to mount the machining platform; The second drive motor is configured to drive the processing platform to move along the fourth direction under the guidance of the second guide rail.

5. The laser deflection system according to claim 4, characterized in that, The second displacement device also includes a fourth-direction position feedback grating ruler.

6. The laser deflection system according to claim 1, characterized in that, The first displacement device includes a first base, a first drive motor, and a first guide rail arranged along a third direction, with the processing platform slidably connected to the first guide rail; the second displacement device includes a second drive motor and a second guide rail arranged along a fourth direction, with the first base slidably connected to the second guide rail; wherein, The first base is configured to fix the first guide rail; The first drive motor is configured to drive the processing platform to move in a third direction under the guidance of the first guide rail; The second drive motor is configured to drive the first base to move in the fourth direction under the guidance of the second guide rail.

7. The laser deflection system according to claim 1, characterized in that, The second direction is perpendicular to the first direction; The third direction is the same as the first direction; The fourth direction is the same as the second direction.

8. The laser deflection system according to claim 1, characterized in that, The first beam deflection device includes at least one of a first scanning mirror and a first acousto-optic deflector; the second beam deflection device includes at least one of a second scanning mirror and a second acousto-optic deflector.

9. A multi-axis linkage laser processing system, characterized in that, The multi-axis linkage laser processing system includes the laser oscillation system as described in any one of claims 1 to 8, and the system further includes: A laser, configured to emit a laser beam; A focusing lens is disposed in the output optical path of the laser deflection system and is configured to focus the laser beam, after being deflected by the laser deflection system, onto the workpiece to be processed on the processing platform, thereby processing the workpiece.

10. The multi-axis linkage laser processing system according to claim 9, characterized in that, The multi-axis linkage laser processing system also includes a controller, which is communicatively connected to the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device, respectively, and is used to control multiple of the laser, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device to perform multi-axis linkage.

11. The multi-axis linkage laser processing system according to claim 9, characterized in that, The multi-axis linkage laser processing system includes multiple laser deflection systems, and each laser deflection system shares at least one target function module. The target function module includes at least one of the processing platform, the first beam deflection device, the second beam deflection device, the first displacement device, and the second displacement device.

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