Laser processing head device

Abstract

The utility model belongs to the technical field of laser processing devices, and discloses a laser processing head device. The laser machining head device comprises a ceramic ring, a connector assembly, a locking ring, a slag stopping assembly and a probe assembly. The ceramic ring is provided with an annular through hole; the connector assembly comprises a connector body and a nozzle, the connector body is provided with a third through hole, the top end of the connector body penetrates through the annular through hole, the bottom end of the connector body is connected with the nozzle, and the nozzle is communicated with the third through hole. The locking ring is located in the annular through hole and connected with the ceramic ring and the connector body. The slag stopping assembly is located at the bottom of the ceramic ring and connected to the connector body in a sleeving mode, the slag stopping assembly is made of metal materials, a protruding part is arranged on the outer wall of the slag stopping assembly, and the distance from the outer side edge of the protruding part to the center of the slag stopping assembly is larger than the radius of the ceramic ring in the radial direction of the slag stopping assembly; and the probe assembly sequentially penetrates through and is connected with the ceramic ring and the joint body. The laser processing head device can effectively isolate the influence of metal return slag on the capacitance head, so that the processing quality stability is high.

Description

Technical Field

[0001] This utility model relates to the field of laser processing equipment technology, and in particular to a laser processing head device. Background Technology

[0002] Laser processing utilizes the energy of light, which, after being focused by a lens, reaches a very high energy density at the focal point, and is processed through a photothermal effect. Laser processing requires no tools, has high processing speed, minimal surface deformation, and can process various materials, thus it is widely used in various material processing applications, especially cutting. However, existing laser processing heads are prone to generating metal slag during processing. This slag tends to adhere to the ceramic body, affecting the capacitance stability of the laser processing head. This results in unstable distances between the laser processing head and the workpiece surface, significantly impacting processing results and increasing the risk of equipment damage.

[0003] Therefore, there is an urgent need to develop a laser processing head device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a laser processing head device that can effectively isolate the influence of metal slag on the capacitor head, thereby ensuring high processing quality stability.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] Laser processing head assembly, including:

[0007] A ceramic ring, wherein the ceramic ring is provided with an annular through hole;

[0008] A connector assembly, comprising a connector body and a nozzle, wherein the connector body is provided with a third through hole, the top end of the connector body passes through the annular through hole, the bottom end of the connector body is connected to the nozzle, and the nozzle communicates with the third through hole;

[0009] A locking ring, located within the annular through hole, connects the ceramic ring and the connector body;

[0010] A slag-blocking assembly is located at the bottom of the ceramic ring and is sleeved and connected to the connector body. The slag-blocking assembly is made of metal material and has a protrusion on its outer wall. Along the radial direction of the slag-blocking assembly, the distance from the outer edge of the protrusion to the center of the slag-blocking assembly is greater than the radius of the ceramic ring.

[0011] A probe assembly is sequentially inserted and connected to the ceramic ring and the connector body.

[0012] As an optional technical solution for the laser processing head device, the annular through hole includes a first through hole and a second through hole, the first through hole and the second through hole are arranged in a stepped manner from top to bottom, the radial dimension of the first through hole is larger than the radial dimension of the second through hole, and the locking ring is sleeved on the top of the connector body and abuts against the step of the annular through hole.

[0013] As an optional technical solution for the laser processing head device, the outer wall of the connector body located in the first through hole is provided with a first external thread, the inner wall of the locking ring is provided with a first internal thread, and the connector body and the locking ring are connected through the first external thread and the first internal thread.

[0014] As an optional technical solution for laser processing head device, the inner wall of the third through hole is provided with a second internal thread, and the nozzle is connected to the connector body through the second internal thread.

[0015] As an optional technical solution for laser processing head device, the outer wall of the connector body is provided with a second external thread, and the slag-blocking component is connected to the connector body through the second external thread.

[0016] As an optional technical solution for the laser processing head device, the connector assembly further includes a connecting ear, which is arranged in a closed loop around the outer wall of the connector body and sandwiched between the ceramic ring and the slag-blocking assembly. The probe assembly passes through the side wall of the ceramic ring and the connecting ear in sequence.

[0017] As an optional technical solution for the laser processing head device, the probe assembly includes a bending head, a square bar, and a cylindrical bar. The bending head is perpendicularly connected to one end of the square bar, and the cylindrical bar is coaxially connected to the other end of the square bar. The square bar passes through the side wall of the ceramic ring, the bending head is hung on the top surface of the ceramic ring, and the cylindrical bar passes through the connecting ear and abuts against the top of the side wall of the slag-blocking assembly.

[0018] As an optional technical solution for laser processing head device, the ceramic ring has a first positioning hole at the bottom and the connecting ear has a second positioning hole at the top. The positioning pin passes through the first positioning hole and the second positioning hole to connect the ceramic ring and the connector body.

[0019] As an optional technical solution for the laser processing head device, the laser processing head device further includes a sealing ring. A first annular groove is provided on the connecting ear along the circumferential direction of the outer wall of the connector body. The sealing ring is sleeved on the outer wall of the connector body and located in the first annular groove.

[0020] As an optional technical solution for the laser processing head device, the ceramic ring sidewall is provided with a first through hole, the connecting ear is provided with a second through hole, the top surface of the slag-blocking assembly sidewall is provided with a second annular groove, and the bottom of the second annular groove is provided with a plurality of ventilation holes spaced apart along the circumference of the second annular groove. The first through hole, the second through hole, the second annular groove and the ventilation holes are connected in sequence.

[0021] The beneficial effects of this utility model are:

[0022] The laser processing head device provided by this utility model includes a ceramic ring, a connector assembly, a locking ring, a slag-blocking assembly, and a probe assembly. The ceramic ring has an annular through-hole. The connector assembly includes a connector body and a nozzle. The connector body has a third through-hole, with its top end passing through the annular through-hole to achieve a sleeve connection between the ceramic ring and the connector body. The bottom end of the connector body connects to the nozzle, which communicates with the third through-hole, which is the main cutting gas path for the cutting gas to pass through. The locking ring is located within the annular through-hole and connects the ceramic ring and the connector body, fixing the connector body to the ceramic ring. This ensures a high connection strength and simple connection between the ceramic ring and the connector body, thereby improving the connection strength and ease of assembly of the laser processing head device. The slag-blocking assembly is located at the bottom of the ceramic ring and sleeved onto the connector body. The slag-blocking assembly is made of metal and has a protrusion on its outer wall. Along the radial direction of the slag-blocking assembly, the distance from the outer edge of the protrusion to the center of the slag-blocking assembly is greater than the radius of the ceramic ring. The probe assembly passes through the ceramic ring and the connector body sequentially. The connector body serves as a receiver, connecting the ceramic ring and the slag-blocking assembly. The connector assembly, locking ring, slag-blocking assembly, and probe assembly are all capacitive sensing areas of the laser processing head device. The ceramic ring isolates these capacitive sensing areas from the capacitive head area of ​​the laser processing head device, preventing signal interference. The probe assembly transmits signals from the capacitive sensing areas to the capacitive head of the laser processing head device. The slag-blocking assembly effectively isolates metal slag generated during the cutting process from the ceramic ring, preventing it from adhering to the ceramic ring and thus effectively isolating the metal slag from affecting the laser processing head device, improving the stability of processing quality. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the laser processing head device provided in this embodiment of the utility model;

[0024] Figure 2 yes Figure 1 Cross-sectional view at point AA;

[0025] Figure 3 This is a first structural schematic diagram of the ceramic ring of the laser processing head device provided in this embodiment of the present invention;

[0026] Figure 4This is a schematic diagram of the second structure of the ceramic ring of the laser processing head device provided in this embodiment of the present invention;

[0027] Figure 5 This is a first structural schematic diagram of the connector body of the laser processing head device provided in this embodiment of the present invention;

[0028] Figure 6 This is a second structural schematic diagram of the connector body of the laser processing head device provided in this embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the locking ring structure of the laser processing head device provided in this embodiment of the utility model;

[0030] Figure 8 This is a first structural schematic diagram of the slag-blocking assembly of the laser processing head device provided in this embodiment of the present invention;

[0031] Figure 9 This is a second structural schematic diagram of the slag-blocking assembly of the laser processing head device provided in this embodiment of the present invention;

[0032] Figure 10 This is a schematic diagram of the probe assembly of the laser processing head device provided in this embodiment of the present invention.

[0033] In the picture:

[0034] 100, Ceramic ring; 110, First through hole; 120, Second through hole; 130, First through hole; 140, First positioning hole; 200, Connector assembly; 210, Connector body; 211, Third through hole; 212, Connecting lug; 213, Second through hole; 214, Second positioning hole; 220, Nozzle; 300, Locking ring; 400, Slag-blocking assembly; 410, Second annular groove; 420, Vent hole; 500, Probe assembly; 510, Bending head; 520, Square bar; 530, Columnar bar; 600, Sealing ring. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0036] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0039] The laser processing head device provided in this embodiment can effectively isolate the influence of metal slag on the capacitor head, resulting in high processing quality stability.

[0040] Specifically, such as Figures 1 to 10As shown, the laser processing head device includes a ceramic ring 100, a connector assembly 200, a locking ring 300, a slag-blocking assembly 400, and a probe assembly 500. The ceramic ring 100 has an annular through-hole; the connector assembly 200 includes a connector body 210 and a nozzle 220. The connector body 210 has a third through-hole 211, with its top end passing through the annular through-hole and its bottom end connected to the nozzle 220, which communicates with the third through-hole 211. The locking ring 300 is located within the annular through-hole and connects the ceramic ring 100 and the connector body 210. The slag-blocking assembly 400 is located at the bottom of the ceramic ring 100 and is sleeved onto the connector body 210. The slag-blocking assembly 400 is made of metal material. The outer wall of the slag-blocking assembly 400 has a protrusion. Along the radial direction of the slag-blocking assembly 400, the distance from the outer edge of the protrusion to the center of the slag-blocking assembly 400 is greater than the radius of the ceramic ring 100. The probe assembly 500 is sequentially inserted through and connected to the ceramic ring 100 and the connector body 210.

[0041] Based on the above design, the ceramic ring 100 is provided with an annular through hole. The connector assembly 200 includes a connector body 210 and a nozzle 220. The connector body 210 is provided with a third through hole 211, and the top end of the connector body 210 passes through the annular through hole, realizing the sleeve connection between the ceramic ring 100 and the connector body 210. The bottom end of the connector body 210 is connected to the nozzle 220, and the nozzle 220 communicates with the third through hole 211. The third through hole 211 is the main cutting gas passage for the cutting gas to pass through. The locking ring 300 is located in the annular through hole and connects the ceramic ring 100 and the connector body 210, fixing the connector body 210 to the ceramic ring 100. This results in a high connection strength and simple connection between the ceramic ring 100 and the connector body 210, thereby improving the connection strength and assembly convenience of the laser processing head device. The slag-blocking assembly 400 is located at the bottom of the ceramic ring 100 and is sleeved and connected to the connector body 210. The slag-blocking assembly 400 is made of metal and has a protrusion on its outer wall. Along the radial direction of the slag-blocking assembly 400, the distance from the outer edge of the protrusion to the center of the slag-blocking assembly 400 is greater than the radius of the ceramic ring 100. The probe assembly 500 is sequentially inserted and connected to the ceramic ring 100 and the connector body 210. The connector body 210 serves as a receiving element, connecting the ceramic ring 100 and the slag-blocking assembly 400. The connector assembly 200, locking ring 300, slag-blocking assembly 400, and probe assembly 500 are all capacitive sensing areas of the laser processing head device. The ceramic ring 100 is used to isolate the aforementioned capacitive sensing areas from the capacitive head area of ​​the laser processing head device to avoid signal interference. The probe assembly 500 is used to transmit the signals from the aforementioned capacitive sensing areas to the capacitive head of the laser processing head device. The slag-blocking component 400 can isolate the metal slag generated during the cutting process outside the ceramic ring 100, preventing the metal slag from sticking to the ceramic ring 100, thereby effectively isolating the metal slag from affecting the laser processing head device and improving the stability of processing quality.

[0042] It should be noted that the connector assembly 200, locking ring 300, and probe assembly 500 are also made of metal.

[0043] In this embodiment, the slag-blocking assembly 400 includes a cylinder and a surrounding edge. The surrounding edge extends circumferentially along the outer wall of the cylinder and is arranged in a closed loop. The surrounding edge is located near the top of the cylinder, and the cylinder is fitted onto the outer wall of the connector body 210. The surrounding edge can improve the isolation effect of the slag-blocking assembly 400.

[0044] It should be noted that the protrusion is located on the outer wall of the cylinder.

[0045] In this embodiment, the cylinder is a polygonal column, and the distance from the outermost edge (protrusion) of the polygonal column to the center of the slag-blocking component 400 is greater than the radius of the ceramic ring 100, which makes the slag-blocking component 400 have high slag-blocking efficiency and uniform slag-blocking, thus resulting in a good slag-blocking effect.

[0046] Furthermore, the annular through hole includes a first through hole 110 and a second through hole 120. The first through hole 110 and the second through hole 120 are stepped from top to bottom. The radial dimension of the first through hole 110 is larger than the radial dimension of the second through hole 120. The locking ring 300 is sleeved on the top of the connector body 210 and abuts against the step of the annular through hole, making it easier for the locking ring 300 to connect the ceramic ring 100 and the connector body 210.

[0047] Furthermore, continue as Figure 2 As shown, the outer wall of the connector body 210 located in the first through hole 110 is provided with a first external thread, and the inner wall of the locking ring 300 is provided with a first internal thread. The connector body 210 and the locking ring 300 are connected by the first external thread and the first internal thread. The threaded connection is simple and has high connection strength.

[0048] Continue as Figure 7 As shown, the top of the locking ring 300 has notches on both sides to facilitate screwing the locking ring 300 onto the connector body 210.

[0049] Optionally, continue as follows Figure 1 and Figure 2 As shown, the inner wall of the third through hole 211 is provided with a second internal thread. The nozzle 220 is connected to the connector body 210 through the second internal thread. The nozzle 220 is screwed onto the connector body 210, which is simple to install.

[0050] Optionally, the outer wall of the connector body 210 is provided with a second external thread, and the slag-blocking assembly 400 is connected to the connector body 210 through the second external thread, which is simple to connect and has high connection strength.

[0051] Optionally, the connector assembly 200 further includes a connecting ear 212, which is arranged in a closed loop around the outer wall of the connector body 210 and sandwiched between the ceramic ring 100 and the slag-blocking assembly 400. The probe assembly 500 passes through the side wall of the ceramic ring 100 and the connecting ear 212 in sequence. The connecting ear 212 increases the connection strength between the ceramic ring 100 and the connector body 210.

[0052] Furthermore, continue as Figure 10 As shown, the probe assembly 500 includes a bending head 510, a square bar 520, and a cylindrical bar 530. The bending head 510 is perpendicularly connected to one end of the square bar 520, and the cylindrical bar 530 is coaxially connected to the other end of the square bar 520. The square bar 520 passes through the side wall of the ceramic ring 100, the bending head 510 is hung on the top surface of the ceramic ring 100, and the cylindrical bar 530 passes through the connecting ear 212 and abuts against the top of the side wall of the slag-blocking assembly 400.

[0053] In this embodiment, the cylindrical rod 530 is welded to the connecting lug 212 to increase the stability of the connection between the probe assembly 500 and the connector body 210.

[0054] Furthermore, continue as Figure 3 and Figure 4 As shown, the top surface of the side wall of the ceramic ring 100 is provided with a groove, and the bending head 510 is embedded in the groove, which improves the stability of the probe assembly 500 and saves space.

[0055] The ceramic ring 100 has a first positioning hole 140 at the bottom and a second positioning hole 214 at the top of the connecting ear 212. The positioning pin passes through the first positioning hole 140 and the second positioning hole 214 to connect the ceramic ring 100 and the connector body 210, which can realize the positioning and assembly of the ceramic ring 100 and the connector assembly 200. The installation is simple and has high installation strength.

[0056] Continue as Figure 2 As shown, the laser processing head device also includes a sealing ring 600. A first annular groove is provided on the connecting ear 212 along the circumference of the outer wall of the connector body 210. The sealing ring 600 is sleeved on the outer wall of the connector body 210 and located in the first annular groove to ensure the airtightness between the connector assembly 200 and the slag-blocking assembly 400. At the same time, the compression of the sealing ring 600 increases the anti-loosening performance between the connector assembly 200 and the slag-blocking assembly 400.

[0057] Continue as Figure 2 , Figure 3 , Figure 5 and Figure 8As shown, the ceramic ring 100 has a first through hole on its sidewall, the connecting lug 212 has a second through hole, and the top surface of the slag-blocking assembly 400 has a second annular groove. Multiple vent holes 420 are spaced apart along the circumference of the bottom of the second annular groove. The first through hole, the second through hole, the second annular groove, and the vent holes 420 are sequentially connected. The first through hole, the second through hole, the second annular groove, and the vent holes 420 form an annular airflow path for cooling the nozzle 220 that generates heat during processing.

[0058] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A laser processing head device, characterized in that, include: A ceramic ring (100) is provided with an annular through hole; A connector assembly (200) includes a connector body (210) and a nozzle (220). The connector body (210) is provided with a third through hole (211). The top end of the connector body (210) passes through the annular through hole, and the bottom end of the connector body (210) is connected to the nozzle (220). The nozzle (220) communicates with the third through hole (211). A locking ring (300) is located in the annular through hole and connects the ceramic ring (100) and the connector body (210); A slag-blocking assembly (400) is located at the bottom of the ceramic ring (100) and is sleeved and connected to the connector body (210). The slag-blocking assembly (400) is made of metal material. The outer wall of the slag-blocking assembly (400) has a protrusion. Along the radial direction of the slag-blocking assembly (400), the distance from the outer edge of the protrusion to the center of the slag-blocking assembly (400) is greater than the radius of the ceramic ring (100). The probe assembly (500) is sequentially connected to the ceramic ring (100) and the connector body (210).

2. The laser processing head device according to claim 1, characterized in that, The annular through hole includes a first through hole (110) and a second through hole (120). The first through hole (110) and the second through hole (120) are stepped from top to bottom. The radial dimension of the first through hole (110) is larger than the radial dimension of the second through hole (120). The locking ring (300) is sleeved on the top of the connector body (210) and abuts against the step of the annular through hole.

3. The laser processing head device according to claim 2, characterized in that, The outer wall of the connector body (210) located in the first through hole (110) is provided with a first external thread, and the inner wall of the locking ring (300) is provided with a first internal thread. The connector body (210) and the locking ring (300) are connected by the first external thread and the first internal thread.

4. The laser processing head device according to claim 1, characterized in that, The inner wall of the third through hole (211) is provided with a second internal thread, and the nozzle (220) is connected to the connector body (210) through the second internal thread.

5. The laser processing head device according to claim 1, characterized in that, The outer wall of the connector body (210) is provided with a second external thread, and the slag-blocking assembly (400) is connected to the connector body (210) through the second external thread.

6. The laser processing head device according to claim 1, characterized in that, The connector assembly (200) further includes a connecting ear (212), which is arranged in a closed loop around the outer wall of the connector body (210) and is sandwiched between the ceramic ring (100) and the slag-blocking assembly (400). The probe assembly (500) passes through and connects the side wall of the ceramic ring (100) and the connecting ear (212) in sequence.

7. The laser processing head device according to claim 6, characterized in that, The probe assembly (500) includes a bending head (510), a square bar (520), and a cylindrical bar (530). The bending head (510) is perpendicularly connected to one end of the square bar (520), and the cylindrical bar (530) is coaxially connected to the other end of the square bar (520). The square bar (520) passes through the side wall of the ceramic ring (100), and the bending head (510) is hung on the top surface of the ceramic ring (100). The cylindrical bar (530) passes through the connecting ear (212) and abuts against the top of the side wall of the slag-blocking assembly (400).

8. The laser processing head device according to claim 6, characterized in that, The ceramic ring (100) has a first positioning hole (140) at its bottom and a second positioning hole (214) at its top. The positioning pin passes through the first positioning hole (140) and the second positioning hole (214) to connect the ceramic ring (100) and the connector body (210).

9. The laser processing head device according to claim 6, characterized in that, The laser processing head device also includes a sealing ring (600). The connecting ear (212) is provided with a first annular groove along the circumference of the outer wall of the connector body (210). The sealing ring (600) is sleeved on the outer wall of the connector body (210) and located in the first annular groove.

10. The laser processing head device according to claim 6, characterized in that, The ceramic ring (100) has a first through hole on its side wall, the connecting ear (212) has a second through hole, the top surface of the slag-blocking assembly (400) has a second annular groove, and the bottom of the second annular groove has a plurality of vent holes (420) spaced apart along the circumference of the second annular groove. The first through hole, the second through hole, the second annular groove and the vent holes (420) are connected in sequence.

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