Rubber scrap cleaning system of rubber plate carving machine

Abstract

The utility model provides a rubber scrap cleaning system of a rubber plate carving machine. The rubber scrap cleaning system comprises a scrap discharging pipeline, a collecting bin, a vacuumizing device, a negative pressure monitoring meter, an air compression valve, an air compression pipeline and an air compressor. The chip removal pipeline is connected with a rubber chip generation area and a collection bin of the rubber plate carving machine; the vacuumizing device is connected with the collecting bin so as to provide suction force enabling gas in the chip removal pipeline to flow to the collecting bin, and the rubber chips are sucked into the collecting bin. The negative pressure monitoring meter is installed on the chip removal pipeline and used for monitoring negative pressure changes in the chip removal pipeline. The air compression pipeline comprises an input end and an output end, the input end of the air compression pipeline is connected with the air compressor, and the output end of the air compression pipeline is connected with the chip removal pipeline; and the air compression valve is arranged at the output end of the air compression pipeline. The negative pressure change in the chip removal pipeline can be monitored in time, the air compressor and the air compression valve are controlled to be opened when the chip removal pipeline is blocked and the pressure is abnormally increased, the blockage can be broken through by pressurization, and the normal operation of rubber chip cleaning work is ensured.

Description

Technical Field

[0001] This utility model relates to a glue debris cleaning system for a rubber plate engraving machine. Background Technology

[0002] Rubber plate engraving machines are used to engrave patterns on the surface of rubber sheets. They can engrave various patterns on rubber sheets according to requirements, meeting the needs of different roller-type rubber sheets. Because the machine has a built-in blade heating system, cutting rubber is easy and effortless.

[0003] The glue debris generated during the engraving process of the rubber plate engraving machine is usually sucked into the pipe and discharged in a centralized manner by the negative pressure generated by the vacuum system.

[0004] However, because the shavings produced by the engraving of the rubber plate are very thin and have a certain temperature, they are prone to sticking together in the pipes that transport the shavings, causing blockages. Once the shavings have cooled down, they are difficult to clean, and usually require cutting the pipes open for cleaning. This operation is difficult and time-consuming (about a week), which seriously affects production efficiency. Utility Model Content

[0005] The purpose of this utility model is to provide a chip removal system for a rubber plate engraving machine, including a chip removal pipe, a collection chamber, and a vacuum device; the chip removal pipe includes a chip inlet and a chip outlet; the chip inlet is used to suck in the rubber chips from the rubber plate engraving machine; the chip outlet is connected to the collection chamber; the vacuum device is connected to the collection chamber to provide suction to make the gas in the chip removal pipe flow to the collection chamber.

[0006] The chip removal system of the rubber plate engraving machine also includes a negative pressure monitoring meter, an air pressure valve, an air pressure pipeline, and an air compressor; the negative pressure monitoring meter is installed on the chip removal pipeline to monitor the negative pressure changes in the chip removal pipeline; the air pressure pipeline includes an input end and an output end, the input end of the air pressure pipeline is connected to the air compressor, and the output end of the air pressure pipeline is connected to the chip removal pipeline; the air pressure valve is located at the output end of the air pressure pipeline.

[0007] This invention can monitor changes in negative pressure within the chip removal pipe in a timely manner. When the chip removal pipe becomes blocked, the pressure rises abnormally. At this time, the air compressor and air valve are opened to pressurize and clear the blockage. This technical solution provides hardware facilities for preventing blockages in chip removal, enabling the chips to be cleared in the initial stage of blockage, preventing serious blockages, reducing the maintenance difficulty of the cleaning system, and ensuring the normal operation of chip removal. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of this utility model.

[0009] Figure 2 This is a partial structural schematic diagram of the present invention.

[0010] Figure 3 This is a schematic diagram of the collection chamber of this utility model. Detailed Implementation

[0011] The following description, in conjunction with the accompanying drawings, further illustrates the proposed solution:

[0012] See appendix Figure 1-3 A chip removal system for a rubber plate engraving machine includes a chip discharge pipe 1, a collection chamber 2, a vacuum device 3, a negative pressure monitoring gauge 4, an air pressure valve 5, an air pressure pipe 61, an air compressor 6, and a controller 7.

[0013] The chip removal pipe 1 includes a chip inlet 101 and a chip outlet 102; the chip inlet 101 is used to suck in the glue chips from the glue plate engraving machine; the chip outlet 102 is connected to the collection chamber 2; the vacuum device 3 is connected to the collection chamber 2 to provide suction to make the gas in the chip removal pipe 1 flow to the collection chamber 2; thereby driving the glue chips from the chip inlet 101 to the collection chamber 2.

[0014] The negative pressure monitoring meter 4 is installed on the chip removal pipe 1 to monitor the negative pressure changes in the chip removal pipe 1; the air pressure pipe 61 includes an input end and an output end, the input end of the air pressure pipe 61 is connected to the air compressor 6, and the output end of the air pressure pipe 61 is connected to the chip removal pipe 1; the air pressure valve 5 is located at the output end of the air pressure pipe 61.

[0015] This technical solution can monitor the negative pressure changes in the chip discharge pipe 1 in a timely manner. When the chip discharge pipe 1 is blocked, causing the pressure to rise abnormally, the air compressor 6 and the air valve 5 are opened to pressurize and clear the blockage.

[0016] The chip removal pipe 1 includes a main pipe 11 and a branch pipe 12; the branch pipe 12 is connected to the main pipe 11; the chip inlet 101 is located on the branch pipe 12, and the chip outlet 102 is located on the main pipe 11; along the gas flow direction within the main pipe 11, the negative pressure monitoring gauge 4 and the air pressure valve 5 are located behind the connection point 13 between the branch pipe 12 and the main pipe 11. The gas flow direction is shown in the attached figure. Figure 1 As indicated by the middle arrow.

[0017] Since adhesive residue can easily cause blockage at the connection between branch pipe 12 and main pipe 11, this technical solution places the negative pressure monitoring gauge 4 and the air pressure valve 5 behind the connection between branch pipe 12 and main pipe 11. When the negative pressure monitoring gauge 4 detects an increase in pressure, it proves that there is a blockage in front of the negative pressure monitoring gauge 4 (i.e., at the connection between branch pipe 12 and main pipe 11).

[0018] The branch pipe 12 includes multiple branches, and each branch pipe 12 is evenly spaced along the extension direction of the main pipe 11; the number of negative pressure monitoring gauges 4 and air pressure valves 5 corresponds to the number of branch pipes 12, and a set of negative pressure monitoring gauges 4 and air pressure valves 5 is matched behind the connection 13 between each branch pipe 12 and the main pipe 11; the air pressure pipeline 61 is provided with multiple output ends corresponding to the number and position of each air pressure valve 5, and each output end is connected to the corresponding air pressure valve 5.

[0019] The adhesive residue cleaning system in this technical solution uses multiple branch pipes 12 connected in parallel to simultaneously suck up adhesive residue from multiple adhesive plate engraving machines, improving cleaning efficiency. Furthermore, each branch pipe 12 is equipped with a negative pressure monitoring gauge 4 and an air pressure valve 5 at its connection point with the main pipe 11, enabling negative pressure monitoring of the corresponding pipe area and pressurizing and clearing of blocked areas, thus improving the accuracy and efficiency of blockage clearing work.

[0020] In this embodiment, each branch pipe 12 is arranged in parallel and perpendicular to the main pipe 11.

[0021] Each branch pipe 12 has a chip inlet 101 for absorbing the glue chips generated by the corresponding glue plate engraving machine. Specifically, each branch pipe 12 is connected to the glue chip collection hopper of the corresponding glue plate engraving machine, or each branch pipe 12 is connected to the vacuum cover covering the worktable of the glue plate engraving machine.

[0022] Each negative pressure monitoring meter 4 is electrically connected to the controller 7 to feed back the negative pressure monitoring data from the negative pressure monitoring meter 4 to the controller 7; the air compressor 6 and the air pressure valve 5 are electrically connected to the controller 7, and the opening and closing of the air compressor 6 and each air pressure valve 5 are controlled by the controller 7; the information of the negative pressure monitoring meters 4 and air pressure valve 5 in the same group is bound in the control terminal; the controller 7 is used to control the opening and closing of the air compressor 6 and the corresponding air pressure valve 5 according to the feedback data from each negative pressure monitoring meter 4.

[0023] The collection chamber 2 includes a feed inlet 21 and a vacuum inlet 22, with the vacuum inlet 22 being higher than the feed inlet 21. The feed inlet 21 is connected to the chip outlet 102. The vacuum inlet 22 is connected to the vacuum pump 3 via a vacuum pipe 31. The collection chamber 2 contains a filter cylinder 23 and a receiving container 24. The filter cylinder 23 is connected to the feed inlet 21. The filter cylinder 23 has a discharge outlet connected to the receiving container 24. In this embodiment, the discharge outlet of the filter cylinder 23 is located at the bottom, and the receiving container 24 is located below the filter cylinder 23. The collection chamber 2 has a sealed door 25. The adhesive chips sucked into the collection chamber 2 first enter the filter cylinder 23 and then fall into the receiving container 24, preventing the adhesive chips from entering the vacuum inlet 22.

[0024] At least two vacuum devices 3 are provided, connected in parallel through vacuum pipes to increase the pumping power and are suitable for cleaning adhesive residue from multiple rubber plate engraving machines.

[0025] The working principle of the adhesive residue cleaning system of the adhesive plate engraving machine in this technical solution is as follows:

[0026] When the negative pressure monitoring meter 4 detects an increase in negative pressure, it indicates that there is a blockage. The negative pressure monitoring meter 4 converts the monitoring data into an electrical signal and feeds it back to the controller 7. After receiving the signal from the negative pressure monitoring meter 4, the controller 7 controls the air compressor 6 and the corresponding air valve 5 to open, pressurizing the blocked area of ​​the main pipe 11, so that the rubber debris can be flushed out in the initial stage of the blockage.

[0027] When the negative pressure monitoring meter 4 detects that the negative pressure is within a normal range, the controller 7 controls the air compressor 6 and the air valve 5 to close based on the signal fed back by the negative pressure monitoring meter 4.

[0028] This technical solution can flush away adhesive residue in the initial stage of blockage, prevent serious blockage, reduce the maintenance difficulty of the cleaning system, and ensure the normal operation of adhesive residue cleaning.

[0029] The above preferred embodiments should be regarded as illustrative examples of the embodiments of the present application. Any technical deductions, substitutions, improvements, etc. that are similar to or based on the present application should be considered within the scope of protection of this patent.

Claims

1. A chip removal system for a rubber plate engraving machine, comprising a chip discharge pipe, a collection chamber, and a vacuum device; The chip removal pipe includes a chip inlet and a chip outlet; the chip inlet is used to suck in the glue chips from the glue plate engraving machine; the chip outlet is connected to the collection chamber. The vacuum device is connected to the collection chamber to provide suction that causes the gas in the chip removal pipe to flow into the collection chamber; Its features are: It also includes negative pressure monitoring meters, air valves, air pipelines, and air compressors; The negative pressure monitoring meter is installed on the chip removal pipe to monitor changes in negative pressure within the chip removal pipe. The compressed air pipeline includes an input end and an output end. The input end of the compressed air pipeline is connected to the air compressor, and the output end of the compressed air pipeline is connected to the chip discharge pipeline. The air pressure valve is located at the output end of the air pressure pipeline.

2. The adhesive residue cleaning system for a rubber plate engraving machine according to claim 1, characterized in that: The chip removal pipe includes a main pipe and branch pipes; The branch pipe is connected to the main pipe; the chip inlet is located on the branch pipe, and the chip outlet is located on the main pipe. Along the gas flow direction within the main pipe, the negative pressure monitoring gauge and the air pressure valve are located behind the connection point between the branch pipe and the main pipe.

3. The adhesive residue cleaning system for a rubber plate engraving machine according to claim 2, characterized in that: The branch pipe includes multiple branches, each branch pipe being spaced apart along the extension direction of the main pipe; The number of negative pressure monitoring meters and air pressure valves corresponds to the number of branch pipes, and a set of negative pressure monitoring meters and air pressure valves are matched behind the connection point between each branch pipe and the main pipe. The compressed air pipeline is equipped with multiple output terminals corresponding to the number and position of each compressed air valve, and each output terminal is connected to the corresponding compressed air valve.

4. The adhesive residue cleaning system for a rubber plate engraving machine according to claim 3, characterized in that: It also includes the controller; Each negative pressure monitoring meter is electrically connected to the controller to feed back the negative pressure monitoring data from the negative pressure monitoring meter to the controller; The air compressor and air valves are electrically connected to the controller, and the opening and closing of the air compressor and each air valve are controlled by the controller. The controller is used to control the opening and closing of the air compressor and air valve based on the data fed back from each negative pressure monitoring meter.

5. The adhesive residue cleaning system for a rubber plate engraving machine according to any one of claims 1-4, characterized in that: The collection chamber includes a feeding port and an exhaust port, the exhaust port being higher than the feeding port; the feeding port is connected to the chip outlet; the exhaust port is connected to a vacuum pumping device via a vacuum pipe. The collection chamber is equipped with a filter screen cylinder and a receiving bucket. The filter screen cylinder is connected to the feed inlet. The filter screen cylinder is equipped with a discharge outlet, which is connected to the receiving bucket.

6. The adhesive residue cleaning system for a rubber plate engraving machine according to claim 5, characterized in that: At least two vacuum pumping devices are provided.

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