Solder paste printing device for SMT (Surface Mount Technology)

Abstract

The utility model relates to the technical field of SMT patch production, in particular to a solder paste printing device for SMT patches, which comprises a base, a mounting rail is arranged at the upper end of the base, a placing seat is movably mounted at the upper end of the mounting rail, a printing seat is detachably mounted at the upper end of the placing seat, a screw hole steel plate is detachably mounted in the printing seat, and a screw hole is formed in the screw hole steel plate. A placement groove is formed in one side of the printing base, an adjusting support is fixedly installed at the upper end of the base, a printing frame is movably installed on one side of the adjusting support, a user places a PCB in the placement groove of the printing base, the printing frame moves on the surface of the adjusting support, and a printing head at the lower end of the printing frame moves to the position above the printing base. Solder paste is sprayed out through the solder paste spray head and falls on the surface of the screw hole steel plate, the solder paste can be scraped through the scraping plate along with transverse movement of the printing frame, the solder paste can conveniently penetrate through holes in the surface of the screw hole steel plate to be connected with a PCB, and therefore rapid printing of the PCB is facilitated.

Description

Technical Field

[0001] This utility model relates to a solder paste printing device, and more particularly to a solder paste printing device for SMT (Surface Mount Technology) assembly, belonging to the field of SMT assembly technology. Background Technology

[0002] In the SMT (Surface Mount Technology) assembly process, a stencil corresponding to the pad positions is fabricated and mounted on a solder paste printer to ensure solder paste is applied to specific pads. The PCB (Printed Circuit Board) position is monitored to ensure the stencil mesh aligns with the pad positions on the PCB. Once positioned, the squeegee on the solder paste printer moves back and forth across the stencil, allowing solder paste to pass through the mesh and cover the specific pads on the PCB. This solder paste printing process on the PCB, followed by reflow soldering to connect electronic components, is a common method used in the modern electronics manufacturing industry.

[0003] A solder paste printing device based on an SMT (Surface Mount Technology) production line, disclosed in publication number CN215835618U, includes a control console, a connector, and a printing head for solder paste printing. The control console includes: a working surface at the top; a substrate to be printed; support rods mounted above; crossbars connecting the support rods; and sliders mounted on the crossbars. This solder paste printing device for an SMT production line is equipped with a connector and a printing head. The appropriate printing head can be changed promptly according to different solder paste printing requirements. Solder paste is pressed from a storage tank along a guide tube and a connecting tube into a flow channel inside the printing head. The flow channel is connected to multiple solder outlets, allowing for simultaneous multi-point printing and improving processing efficiency. An annular groove is provided on the outer side of the solder outlet. A squeegee with an arc-shaped inclined structure can be selected to any angle along the annular groove to adapt to different angles of solder paste printing and ensure printing quality.

[0004] In existing SMT (Surface Mount Technology) production lines, solder paste printing equipment uses a squeegee to scrape solder paste through the mesh of a stencil and print it onto the PCB. However, with the use of the squeegee, solder paste easily adheres to its surface. When the squeegee stops working, the solder paste solidifies on its surface, affecting its subsequent use and causing solder paste to fall onto the workbench, contaminating the work environment.

[0005] Therefore, it is urgent to improve the solder paste printing equipment in the SMT assembly line to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of this invention is to provide a solder paste printing device for SMT assembly, which can solve the problem that in the existing SMT assembly line solder paste printing device, the solder paste is scraped by a squeegee to print onto the PCB board through the mesh on the stencil surface. However, with the use of the squeegee, solder paste easily adheres to the surface of the squeegee. When the squeegee is no longer in use, the solder paste solidifies on the surface of the squeegee, affecting the subsequent use of the squeegee. It also easily causes solder paste on the squeegee surface to fall onto the workbench, polluting the working environment.

[0007] To achieve the above objectives, the main technical solution adopted by this utility model includes: a solder paste printing device for SMT assembly, comprising a base, an installation rail at the upper end of the base, a placement seat movably mounted at the upper end of the installation rail, a printing seat detachably mounted at the upper end of the placement seat, a perforated steel plate detachably mounted inside the printing seat, a placement groove on one side of the printing seat, an adjustment bracket fixedly mounted at the upper end of the base, a printing frame movably mounted on one side of the adjustment bracket, a printing head mounted at the lower end of the printing frame, a solder paste nozzle on one side of the printing head, and squeegees detachably mounted on both sides of the printing head, with scraping structures provided on the surfaces of the squeegees and the solder paste nozzle.

[0008] Preferably, the scraping structure includes a movable rod that is movably inserted through both sides of the printing frame. A counterweight ring is fixedly installed at the upper end of the movable rod, and a scraper plate is fixedly installed at the lower end of the movable rod. The scraper plate has a groove on its surface that mates with the scraper and the solder paste nozzle.

[0009] Preferably, the solder paste nozzle is provided with mounting rails on both sides, and the upper end of the scraper is fixedly installed with a mounting strip, which is movably inserted inside the mounting rail.

[0010] Preferably, a slot is provided on one side of the upper end of the assembly strip, and an installation groove is provided inside one end of the assembly rail. A locking spring is installed inside the installation groove, and a limiting block is fixedly installed at the lower end of the locking spring. The lower end of the limiting block is movably inserted inside the slot, and a pull rod is fixedly installed at the upper end of the limiting block. The upper end of the pull rod is located outside the installation groove.

[0011] Preferably, an installation rod is fixedly installed inside the assembly rail, the installation rod is movably inserted inside the assembly strip, and a pop-out spring is sleeved on the surface of the installation rod, with one end of the pop-out spring abutting against the assembly strip.

[0012] Preferably, the printing base has assembly slots on both sides inside, and assembly holes are provided on both sides of the upper end of the assembly slots. An assembly block passes through the interior of the assembly hole, and the upper end of the assembly block is fixedly connected to the wire hole steel plate.

[0013] Preferably, the assembly block has a movable groove inside, and pop-out blocks are movably inserted on both sides of the movable groove. One side of the pop-out blocks is in contact with the upper end of the inner wall of the assembly groove. A return spring is installed between the two pop-out blocks, and one side of the lower end of the pop-out blocks is inclined.

[0014] Preferably, movable grooves are provided inside both sides of the printing base, and a counterweight is movably inserted at the upper end of the movable groove. The upper end of the counterweight is movably inserted inside the assembly groove and a reset strip is installed thereon. Reset holes are provided at both ends of the reset strip.

[0015] This utility model has at least the following beneficial effects:

[0016] 1. In this utility model, the user places the PCB board inside the placement slot of the printing stand, the printing frame moves on the surface of the adjusting bracket, the printing head at the lower end of the printing frame moves above the printing stand, and the solder paste is sprayed out through the solder paste nozzle and falls on the surface of the wire-perforated stencil. As the printing frame moves laterally, the solder paste can be scraped by the scraper, so that the solder paste can pass through the surface holes of the wire-perforated stencil and connect with the PCB board, thereby facilitating the rapid printing of the PCB board.

[0017] 2. In this utility model, when the printing frame and printing head move downwards, the squeegee is in contact with the upper end of the printing base. As the printing frame and printing head continue to move downwards, the printing frame moves downwards along the movable rod, and the squeegee and solder paste nozzle can move downwards through the squeegee. After printing, the printing head and printing frame move upwards, and the squeegee and solder paste nozzle move upwards along the squeegee. Under the action of the squeegee, it is easy to clean the surface of the squeegee and solder paste nozzle, avoiding solder paste from adhering to the surface of the squeegee and solder paste nozzle, thus avoiding pollution of the working environment.

[0018] 3. In this utility model, the user places the wire-hole steel plate inside the printing base, inserts the assembly block into the assembly hole, and when the pop-out blocks on both sides of the assembly block contact the assembly hole, the pop-out blocks are squeezed into the movable groove, compressing the return spring. When the wire-hole steel plate moves downward to the maximum position inside the printing base, the pop-out blocks move into the assembly groove and pop out under the action of the return spring, so that the upper end of the pop-out blocks fits with the upper end inside the assembly groove, thereby facilitating the quick installation of the wire-hole steel plate. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0020] Figure 1 This is a three-dimensional structural diagram of the device of this utility model;

[0021] Figure 2 This is a schematic diagram of the printing rack structure in the device of this utility model;

[0022] Figure 3 This is a schematic diagram of the scraper mounting location in the device of this utility model;

[0023] Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0024] Figure 5 This is a schematic diagram of the printing seat structure in the device of this utility model;

[0025] Figure 6 This is a half-sectional structural diagram of the wire hole steel plate mounting location in the printing seat of this utility model.

[0026] Figure 7 This is a half-section diagram of the side of the wire hole steel plate in the printing seat of this utility model.

[0027] In the diagram: 1. Base; 2. Mounting rail; 3. Placement seat; 4. Printing seat; 5. Adjustment bracket; 6. Printing rack; 7. Printing head; 8. Solder paste nozzle; 9. Scraper; 10. Movable rod; 11. Counterweight ring; 12. Scraper plate; 13. Assembly rail; 14. Mounting rod; 15. Pop-out spring; 16. Slot; 17. Mounting slot; 18. Limiting block; 19. Locking spring; 20. Pull rod; 21. Perforated steel plate; 22. Assembly slot; 23. Assembly block; 24. Reset bar; 25. Reset hole; 26. Counterweight seat; 27. Pop-out block; 28. Reset spring; 29. ​​Placement slot. Detailed Implementation

[0028] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0029] like Figures 1 to 7 As shown, this embodiment provides an SMT solder paste printing device, including a base 1, an mounting rail 2 at the upper end of the base 1, a placement seat 3 movably mounted at the upper end of the mounting rail 2, a printing seat 4 detachably mounted at the upper end of the placement seat 3, a perforated steel plate 21 detachably mounted inside the printing seat 4, a placement groove 29 opened on one side of the printing seat 4, an adjusting bracket 5 fixedly mounted at the upper end of the base 1, a printing frame 6 movably mounted on one side of the adjusting bracket 5, a printing head 7 mounted at the lower end of the printing frame 6, a solder paste nozzle 8 provided on one side of the printing head 7, and squeegees 9 detachably mounted on both sides of the printing head 7.

[0030] In this embodiment, the user places the PCB board inside the placement slot 29 of the printing plate 4. The printing frame 6 moves on the surface of the adjusting bracket 5. The printing head 7 at the lower end of the printing frame 6 moves above the printing plate 4. Solder paste is sprayed out through the solder paste nozzle 8 and falls on the surface of the wire-perforated stencil 21. As the printing frame 6 moves laterally, the solder paste can be scraped by the scraper 9, which facilitates the solder paste to connect with the PCB board through the surface holes of the wire-perforated stencil 21, thereby facilitating the rapid printing of the PCB board.

[0031] like Figures 1 to 3 As shown, this embodiment provides a solder paste printing device for SMT assembly. The surfaces of the squeegee 9 and the solder paste nozzle 8 are provided with a scraping structure. The scraping structure includes a movable rod 10, which is movably inserted through both sides of the printing frame 6. A counterweight ring 11 is fixedly installed at the upper end of the movable rod 10, and a scraper plate 12 is fixedly installed at the lower end of the movable rod 10. The scraper plate 12 has a groove on its surface that cooperates with the squeegee 9 and the solder paste nozzle 8.

[0032] In this embodiment, when the printing frame 6 and the printing head 7 move downward, the squeegee 12 is in contact with the upper end of the printing base 4. As the printing frame 6 and the printing head 7 continue to move downward, the printing frame 6 moves downward along the movable rod 10, and the squeegee 9 and the solder paste nozzle 8 can move downward through the squeegee 12. After printing, the printing head 7 and the printing frame 6 move upward, and the squeegee 9 and the solder paste nozzle 8 move upward along the squeegee 12. Under the action of the squeegee 12, it is convenient to clean the surface of the squeegee 9 and the solder paste nozzle 8, so as to avoid solder paste adhering to the surface of the squeegee 9 and the solder paste nozzle 8 and avoid contaminating the working environment.

[0033] like Figure 3 and Figure 4 As shown, this embodiment provides a solder paste printing device for SMT assembly. Assembly rails 13 are provided on both sides of the solder paste nozzle 8. An assembly strip is fixedly installed on the upper end of the squeegee 9, and the assembly strip is movably inserted into the assembly rail 13. A slot 16 is provided on one side of the upper end of the assembly strip. An installation groove 17 is provided inside one end of the assembly rail 13. A retaining spring 19 is installed inside the installation groove 17. A limiting block 18 is fixedly installed on the lower end of the retaining spring 19, and the lower end of the limiting block 18 is movably inserted into the slot 16. A pull rod 20 is fixedly installed on the upper end of the limiting block 18, and the upper end of the pull rod 20 is located outside the installation groove 17. An installation rod 14 is fixedly installed inside the assembly rail 13, and the installation rod 14 is movably inserted into the assembly strip. A pop-out spring 15 is sleeved on the surface of the installation rod 14, and one end of the pop-out spring 15 is in contact with the assembly strip.

[0034] In this embodiment, the user pulls the lever 20 upward, which causes the limiting block 18 to move upward. The limiting block 18 can be pulled out from inside the slot 16, so that the limiting block 18 compresses the locking spring 19 and retracts into the mounting groove 17, allowing the assembly strip to move inside the assembly rail 13. When the limiting block 18 disengages from the slot 16, the assembly strip moves to the outside of the assembly rail 13 under the action of the pop-out spring 15, which facilitates the quick installation and removal of the scraper 9.

[0035] like Figures 5 to 7 As shown, this embodiment provides a solder paste printing device for SMT assembly. The printing base 4 has assembly slots 22 on both sides inside. Assembly holes are provided on both sides of the upper end of the assembly slots 22. Assembly blocks 23 pass through the assembly holes. The upper end of the assembly blocks 23 is fixedly connected to the wire hole steel plate 21. The assembly blocks 23 have movable slots inside. Pop-out blocks 27 are movably inserted on both sides of the movable slots. One side of the pop-out blocks 27 is in contact with the upper end of the inner wall of the assembly slots 22. A return spring 28 is installed between the two pop-out blocks 27. One side of the lower end of the pop-out blocks 27 is inclined.

[0036] In this embodiment, the user places the perforated steel plate 21 inside the printing base 4, and the assembly block 23 is inserted into the assembly hole. When the pop-out blocks 27 on both sides of the assembly block 23 contact the assembly hole, the pop-out blocks 27 are pressed into the movable groove, compressing the return spring 28. When the perforated steel plate 21 moves downward to its maximum position inside the printing base 4, the pop-out blocks 27 move into the assembly groove 22. Under the action of the return spring 28, the pop-out blocks 27 pop out, so that the upper end of the pop-out blocks 27 fits against the upper end of the assembly groove 22, thereby facilitating the quick installation of the perforated steel plate 21.

[0037] like Figures 5 to 7 As shown, this embodiment provides a solder paste printing device for SMT assembly. The printing base 4 has movable slots on both sides. A counterweight 26 is movably inserted into the upper end of the movable slot. The upper end of the counterweight 26 is movably inserted into the assembly slot 22 and a reset strip 24 is installed thereon. Both ends of the reset strip 24 have reset holes 25.

[0038] In this embodiment, the user flips the printing base 4 over, and the reset bar 24 moves downward under the action of the counterweight 26, so that the reset bar 24 is fitted onto the surface of the assembly block 23, so that the pop-out block 27 is squeezed into the interior of the assembly block 23, and the assembly block 23 can be pulled out from the interior of the assembly hole, thereby facilitating the quick disassembly and replacement of the wire hole steel plate 21.

[0039] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0040] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.

[0041] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A solder paste printing apparatus for SMT assembly, comprising a base (1), characterized in that: The upper end of the base (1) is provided with an installation track (2), and the upper end of the installation track (2) is movably installed with a placement seat (3). The upper end of the placement seat (3) is detachably installed with a printing seat (4). The inside of the printing seat (4) is detachably installed with a perforated steel plate (21). A placement groove (29) is opened on one side of the printing seat (4). The upper end of the base (1) is fixedly installed with an adjustment bracket (5). The side of the adjustment bracket (5) is movably installed with a printing frame (6). The lower end of the printing frame (6) is installed with a printing head (7). The side of the printing head (7) is provided with a solder paste nozzle (8). Both sides of the printing head (7) are detachably installed with scrapers (9). The surfaces of the scrapers (9) and the solder paste nozzle (8) are provided with scraping structures.

2. The solder paste printing apparatus for SMT assembly according to claim 1, characterized in that: The scraping structure includes a movable rod (10), which is movably inserted through both sides of the printing frame (6). A counterweight ring (11) is fixedly installed at the upper end of the movable rod (10), and a scraper plate (12) is fixedly installed at the lower end of the movable rod (10). The scraper plate (12) has a groove on its surface that cooperates with the scraper plate (9) and the solder paste nozzle (8).

3. The solder paste printing apparatus for SMT assembly according to claim 1, characterized in that: The solder paste nozzle (8) is provided with mounting rails (13) on both sides, and the upper end of the scraper (9) is fixedly installed with a mounting strip, which is movably inserted inside the mounting rail (13).

4. The solder paste printing apparatus for SMT assembly according to claim 3, characterized in that: A slot (16) is provided on one side of the upper end of the assembly strip, and an installation groove (17) is provided inside one end of the assembly rail (13). A locking spring (19) is installed inside the installation groove (17). A limiting block (18) is fixedly installed at the lower end of the locking spring (19). The lower end of the limiting block (18) is movably inserted inside the slot (16). A pull rod (20) is fixedly installed at the upper end of the limiting block (18). The upper end of the pull rod (20) is located outside the installation groove (17).

5. The solder paste printing apparatus for SMT assembly according to claim 4, characterized in that: An installation rod (14) is fixedly installed inside the assembly rail (13). The installation rod (14) is movably inserted inside the assembly strip. A pop-out spring (15) is sleeved on the surface of the installation rod (14). One end of the pop-out spring (15) is in contact with the assembly strip.

6. The solder paste printing apparatus for SMT assembly according to claim 1, characterized in that: The printing base (4) has an assembly groove (22) on both sides inside. The assembly groove (22) has an assembly hole on both sides at the upper end. An assembly block (23) passes through the assembly hole. The upper end of the assembly block (23) is fixedly connected to the wire hole steel plate (21).

7. The solder paste printing apparatus for SMT assembly according to claim 6, characterized in that: The assembly block (23) has an internal movable groove, and both sides of the movable groove are movably inserted into the pop-out block (27). One side of the pop-out block (27) is in contact with the upper end of the inner wall of the assembly groove (22). A return spring (28) is installed between the two pop-out blocks (27). One side of the lower end of the pop-out block (27) is inclined.

8. The solder paste printing apparatus for SMT assembly according to claim 7, characterized in that: The printing base (4) has movable slots on both sides. A counterweight (26) is movably inserted at the upper end of the movable slot. The upper end of the counterweight (26) is movably inserted inside the assembly slot (22) and a reset strip (24) is installed thereon. Both ends of the reset strip (24) have reset holes (25).

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