Partition plate cooling runner mechanism of sputter coating machine

Abstract

The utility model provides a partition plate cooling runner mechanism of a sputter coating machine, which comprises a process cavity, the process cavity is of a hollow structure, a wafer conveying port is arranged on one side edge of the process cavity, and partition plate cooling runner mechanisms are arranged outside two side edges of the process cavity adjacent to the wafer conveying port. The partition plate cooling flow channel mechanism comprises a partition plate, the partition plate is of a hollow structure, a cooling flow channel is formed in the hollow structure, a water inlet is formed in one end of the cooling flow channel, a water outlet is formed in the other end of the cooling flow channel, and cooling water is introduced from the water inlet, flows through the cooling flow channel and then flows out from the water outlet, so that the side wall of the process cavity is cooled; therefore, the whole process cavity is cooled, and the coating effect is prevented from being affected by too high temperature in the process cavity.

Description

Technical Field

[0001] This utility model relates to the field of sputtering coating technology, and more specifically, to a partition cooling channel mechanism for a sputtering coating machine. Background Technology

[0002] Sputtering deposition technology uses ions to bombard the surface of a target material, ejecting atoms from the target. The resulting atomic deposition on a substrate is called sputtering film. To obtain high-quality optical thin films, a specific amount of working gas is introduced into a magnetron sputtering apparatus. The gas is ionized by igniting the target gun, and ions, under the influence of electric and magnetic fields, bombard the target material, sputtering out target atoms that are deposited onto the substrate to form a film. Accurate control of parameters such as the reactive gas pressure, the target-substrate distance, and the sputtering power precisely controls the deposition rate to obtain high-quality optical thin film materials.

[0003] Certain specific process reactions require very high temperatures, and if these high temperatures are maintained continuously, the electrical system of the heating chamber can be damaged due to overheating. Therefore, a cooling device is necessary. Existing technology, such as CN 117305791 B, discloses a constant temperature heating device for a magnetron sputtering coating machine, which discloses a water-cooling mechanism inside the heating chamber, including a water tank, a fan assembly, cooling pipes, and a water pump. The water pump draws cold water from the water tank into the cooling pipes, which then dissipate heat to the outer shell. The fan assembly cools the water inside the chamber, and the water pump draws the water back into the water tank after the water inside the chamber has cooled down. However, this design has a large space occupied by the cooling pipes, and requires the water pump to continuously pump water and the fan assembly to continuously blow air onto the water tank. Although it can achieve a cooling effect by circulating water, it also increases energy consumption.

[0004] Therefore, there is a need to provide a cooling mechanism that is small in size, energy-efficient, and ensures effective cooling. Utility Model Content

[0005] In view of this, in order to solve the above problems, this utility model proposes a partition cooling channel mechanism for a sputtering coating machine, including a process cavity 10, which is a hollow structure. A wafer transport port 11 is provided on one side of the process cavity 10. A partition cooling channel mechanism 20 is provided on the two sides of the process cavity 10 adjacent to the wafer transport port 11. The partition cooling channel mechanism 20 includes a partition 30, which is a hollow structure. A cooling channel 40 is provided inside the hollow structure. A water inlet 41 is provided at one end of the cooling channel 40, and a water outlet 47 is provided at the other end. Cooling water is introduced from the water inlet 41, flows through the cooling channel 40, and then flows out from the water outlet 47, thereby cooling the side wall of the process cavity 10 and cooling the entire process cavity 10. This prevents the coating effect from being affected by excessively high temperature inside the process cavity 10. The partition cooling channel design has a small footprint and can achieve the cooling effect without a water pump, saving energy.

[0006] A partition cooling channel mechanism for a sputtering coating machine includes a process cavity 10, which is a hollow structure. A wafer transport port 11 is provided on one side of the process cavity 10. The mechanism is characterized in that a partition cooling channel mechanism 20 is provided on the two sides of the process cavity 10 adjacent to the wafer transport port 11. The partition cooling channel mechanism 20 includes a partition 30, which is a hollow structure. A cooling channel 40 is provided inside the hollow structure. One end of the cooling channel 40 is provided with an inlet 41, and the other end is provided with an outlet 47. Cooling water is introduced from the inlet 41, flows through the cooling channel 40, and then flows out from the outlet 47, thereby cooling the side wall of the process cavity 10.

[0007] Furthermore, the cooling channel 40 is S-shaped, which increases the cooling area and improves the cooling effect.

[0008] Furthermore, the cooling channel 40 includes, from top to bottom, a first channel 42, a second channel 43, a third channel 44, and a fourth channel 45.

[0009] Furthermore, a curved flow channel 46 is provided between the first flow channel 42 and the second flow channel 43, the second flow channel 43 and the third flow channel 44, and the third flow channel 44 and the fourth flow channel 45.

[0010] Furthermore, the first flow channel 42, the second flow channel 43, the third flow channel 44, and the fourth flow channel 45 are transverse flow channels, and the curved flow channel 46 is a vertical flow channel.

[0011] Furthermore, the input end of the first flow channel 42 is the inlet 41, and the output end of the first flow channel 42 is connected to the input end of the second flow channel 43 through the bend flow channel 46.

[0012] Furthermore, the output end of the second flow channel 43 is connected to the input end of the third flow channel 44 through the bend flow channel 46.

[0013] Furthermore, the output end of the third flow channel 44 is connected to the input end of the fourth flow channel 45 through a bend in the flow channel 46, and the output end of the fourth flow channel 45 is the outlet 47.

[0014] Furthermore, the partition 30 is also provided with multiple sealing flanges 50 for connecting external equipment.

[0015] The beneficial effects of this utility model are as follows: This utility model proposes a partition cooling channel mechanism for a sputtering coating machine, including a process cavity 10, which is a hollow structure. A wafer transport port 11 is provided on one side of the process cavity 10. A partition cooling channel mechanism 20 is provided on the two sides of the process cavity 10 adjacent to the wafer transport port 11. The partition cooling channel mechanism 20 includes a partition 30, which is a hollow structure. A cooling channel 40 is provided inside the hollow structure. One end of the cooling channel 40 has an inlet 41, and the other end has an outlet 47. Cooling water is introduced through the inlet 41, flows through the cooling channel 40, and then flows out through the outlet 47, thereby cooling the sidewalls of the process cavity 10 and cooling the entire process cavity 10. This prevents the coating effect from being affected by excessively high temperatures inside the process cavity 10. The partition cooling channel design has a small footprint, achieves cooling effect without the need for a water pump, and saves energy. Attached Figure Description

[0016] Figure 1 This is an overall structural diagram of the partition cooling channel mechanism of the sputtering coating machine of this utility model.

[0017] Figure 2 This is a perspective view of the partition plate of the partition plate cooling channel mechanism of the sputtering coating machine of this utility model.

[0018] Explanation of main component symbols

[0019] Process cavity 10, wafer transport port 11, partition cooling channel mechanism 20, partition 30, cooling channel 40, water inlet 41, first channel 42, second channel 43, third channel 44, fourth channel 45, bend channel 46, water outlet 47, sealing flange 50.

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation Example 1:

[0021] like Figure 1 The diagram shown is an overall structural diagram of the partition cooling channel mechanism of the sputtering coating machine of this utility model; as shown... Figure 2 The image shown is a perspective view of the partition plate of the partition plate cooling channel mechanism of the sputtering coating machine of this utility model.

[0022] A partition cooling channel mechanism for a sputtering coating machine includes a process cavity 10, which is a hollow structure. A wafer transport port 11 is provided on one side of the process cavity 10. The mechanism is characterized in that a partition cooling channel mechanism 20 is provided on the two sides of the process cavity 10 adjacent to the wafer transport port 11. The partition cooling channel mechanism 20 includes a partition 30, which is a hollow structure. A cooling channel 40 is provided inside the hollow structure. One end of the cooling channel 40 is provided with an inlet 41, and the other end is provided with an outlet 47. Cooling water is introduced from the inlet 41, flows through the cooling channel 40, and then flows out from the outlet 47, thereby cooling the side wall of the process cavity 10.

[0023] The cooling channel 40 is S-shaped, which increases the cooling area and improves the cooling effect.

[0024] The cooling channel 40 includes, from top to bottom, a first channel 42, a second channel 43, a third channel 44, and a fourth channel 45.

[0025] A curved flow channel 46 is provided between the first flow channel 42 and the second flow channel 43, the second flow channel 43 and the third flow channel 44, and the third flow channel 44 and the fourth flow channel 45.

[0026] The first flow channel 42, the second flow channel 43, the third flow channel 44, and the fourth flow channel 45 are transverse flow channels, and the curved flow channel 46 is a vertical flow channel.

[0027] The input end of the first flow channel 42 is the inlet 41, and the output end of the first flow channel 42 is connected to the input end of the second flow channel 43 through the bend flow channel 46.

[0028] The output end of the second flow channel 43 is connected to the input end of the third flow channel 44 through the bend flow channel 46.

[0029] The output end of the third flow channel 44 is connected to the input end of the fourth flow channel 45 through a bend in the flow channel 46, and the output end of the fourth flow channel 45 is the outlet 47.

[0030] The partition 30 is also provided with multiple sealing flanges 50 for connecting external equipment.

[0031] The beneficial effects of this utility model are as follows: This utility model proposes a partition cooling channel mechanism for a sputtering coating machine, including a process cavity 10, which is a hollow structure. A wafer transport port 11 is provided on one side of the process cavity 10. A partition cooling channel mechanism 20 is provided on the two sides of the process cavity 10 adjacent to the wafer transport port 11. The partition cooling channel mechanism 20 includes a partition 30, which is a hollow structure. A cooling channel 40 is provided inside the hollow structure. One end of the cooling channel 40 has an inlet 41, and the other end has an outlet 47. Cooling water is introduced through the inlet 41, flows through the cooling channel 40, and then flows out through the outlet 47, thereby cooling the sidewalls of the process cavity 10 and cooling the entire process cavity 10. This prevents the coating effect from being affected by excessively high temperatures inside the process cavity 10. The partition cooling channel design has a small footprint, achieves cooling effect without the need for a water pump, and saves energy.

[0032] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A partition cooling channel mechanism for a sputtering coating machine, comprising a process cavity (10), wherein the process cavity (10) is a hollow structure, and a wafer transport port (11) is provided on one side of the process cavity (10), characterized in that: The process cavity (10) is provided with a partition cooling channel mechanism (20) on both sides adjacent to the wafer transport port (11). The partition cooling channel mechanism (20) includes a partition (30). The partition (30) is a hollow structure. A cooling channel (40) is provided inside the hollow structure. One end of the cooling channel (40) is provided with an inlet (41) and the other end is provided with an outlet (47). Cooling water is introduced from the inlet (41), flows through the cooling channel (40), and then flows out from the outlet (47), so that the side wall of the process cavity (10) is cooled.

2. The partition cooling channel mechanism of the sputtering coating machine as described in claim 1, characterized in that: The cooling channel (40) is S-shaped.

3. The partition cooling channel mechanism of the sputtering coating machine as described in claim 1, characterized in that: The cooling channels (40) include, from top to bottom, a first channel (42), a second channel (43), a third channel (44), and a fourth channel (45).

4. The partition cooling channel mechanism of the sputtering coating machine as described in claim 3, characterized in that: A curved flow channel (46) is provided between the first flow channel (42) and the second flow channel (43), the second flow channel (43) and the third flow channel (44), and the third flow channel (44) and the fourth flow channel (45). The curved flow channel (46) is arc-shaped and its port matches the port of the cooling flow channel (40).

5. The partition cooling channel mechanism of the sputtering coating machine as described in claim 4, characterized in that: The first flow channel (42), the second flow channel (43), the third flow channel (44), and the fourth flow channel (45) are transverse flow channels, and the curved flow channel (46) is a vertical flow channel.

6. The partition cooling channel mechanism of the sputtering coating machine as described in claim 4, characterized in that: The input end of the first flow channel (42) is the inlet (41), and the output end of the first flow channel (42) is connected to the input end of the second flow channel (43) through a bend (46).

7. The partition cooling channel mechanism of the sputtering coating machine as described in claim 4, characterized in that: The output end of the second flow channel (43) is connected to the input end of the third flow channel (44) through a bend flow channel (46).

8. The partition cooling channel mechanism of the sputtering coating machine as described in claim 4, characterized in that: The output end of the fourth flow channel (45) is the outlet (47), and the output end of the third flow channel (44) is connected to the input end of the fourth flow channel (45) through a bend (46).

9. The partition cooling channel mechanism of the sputtering coating machine as claimed in claim 1, characterized in that: The partition (30) is also provided with multiple sealing flanges (50) for connecting external equipment.

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