Vacuum coating system

Abstract

The utility model relates to the technical field of solar cell manufacturing, and discloses a vacuum coating system, which comprises a substrate frame, a vacuum coating device, a vacuum coating device and a vacuum coating device, a transition conveying mechanism and a running piece conveying mechanism are arranged in the process coating chamber, a vacuum coating device is further arranged in the process coating chamber, and the vacuum coating device is located on one side of the running piece conveying mechanism and is opposite to the running piece conveying mechanism; in the conveying direction of the substrate frame, the tail part of the transition conveying mechanism is in butt joint with the head part of the running substrate conveying mechanism; the conveying speed of the transition conveying mechanism is larger than that of the running piece conveying mechanism, and the next substrate frame is adjacent to the previous substrate frame on the running piece conveying mechanism. According to the utility model, through the design of the multi-section conveying mechanism and the combination of the novel substrate frame, the substrate frame can be in an adjacent state during the process sheet running, and the gap between the adjacent substrates is greatly reduced, so that the material utilization rate, the production takt and the assembly stability in the coating process are improved.

Description

Technical Field

[0001] This utility model relates to the field of solar cell manufacturing technology, specifically to a vacuum coating system. Background Technology

[0002] Currently, vacuum coating equipment plays a crucial role in the mass production of perovskite solar cells. In mainstream product lines, hole transport layers, buffer layers, electron transport layers, and electrode layers all require vacuum coating equipment, such as magnetron sputtering vacuum equipment, near-space sublimation vacuum equipment, and reactive plasma coating equipment. Material utilization and coating cycle time are key factors affecting cost and yield. Furthermore, the stability of the chamber atmosphere during coating is also significant for the module stability of perovskite solar cells.

[0003] Currently, the material utilization rate, coating cycle time, and chamber atmosphere stability in vacuum coating equipment are limited by the long intervals between substrates. Poor coating continuity of substrates leads to low material utilization rate, slow coating cycle time, and poor module stability. These technical problems are a key link that needs to be solved for the mass production of perovskite solar cells. Utility Model Content

[0004] In view of this, the present invention provides a vacuum coating system to solve the problems of low material utilization, slow coating cycle and poor component stability in existing systems.

[0005] This utility model provides a vacuum coating system, comprising:

[0006] A substrate holder is used to hold the substrate to be coated, and the substrate holder is open on both the front and rear sides in the transport direction;

[0007] The process coating chamber is equipped with a transition conveying mechanism and a wafer conveying mechanism. The process coating chamber is also equipped with a vacuum coating device, which is located on one side of the wafer conveying mechanism and is arranged opposite to it.

[0008] In the transport direction of the substrate carrier, the tail of the transition conveyor docks with the head of the running conveyor; wherein the conveying speed of the transition conveyor is greater than the conveying speed of the running conveyor; the transition conveyor pushes the substrate carrier onto the running conveyor, such that a subsequent substrate carrier is adjacent to a previous substrate carrier on the running conveyor.

[0009] Beneficial effects: (1) Improve material utilization: By designing a substrate holder with open front and rear sides and a multi-section guide rail system, this utility model realizes the adjacent state of the substrate holder during the process of running the substrate, reducing the interval between substrates to a minimum. At the same time, the extremely small substrate interval reduces the ineffective deposition of material in non-target areas such as the substrate holder and the chamber anti-stick plate, thereby improving the utilization of materials.

[0010] (2) Increased Production Cycle Time: The speed of the transition conveyor is greater than that of the wafer conveyor, ensuring that the interval between substrate holders on the wafer conveyor is minimized. This minimized interval means that coating operations can be performed more continuously, avoiding "downtime" caused by longer substrate intervals, and further accelerating the production cycle time. In addition, the speed difference design also makes the entire system operate more smoothly, reduces waiting time, and improves overall production efficiency.

[0011] (3) Improved component stability: Smaller substrate spacing helps maintain a constant concentration of coating material and gas pressure in front of the substrate (facing the coating equipment) during the coating process. For example, for coating equipment that requires the introduction of process gases, this system can ensure the stability of environmental conditions, thereby improving coating quality.

[0012] In an optional embodiment, the vacuum coating system further includes:

[0013] The wafer storage chamber contains several wafer storage devices and a feeding and conveying mechanism for storing substrate holders.

[0014] The wafer assembly chamber is equipped with a wafer assembly conveying mechanism. The feeding conveying mechanism is used to transport the substrate holder on the wafer storage device to the wafer assembly conveying mechanism in sequence.

[0015] In the transport direction of the substrate holder, the wafer storage chamber, the wafer assembly chamber, and the process coating chamber are arranged sequentially and can be selectively connected front to back. The feeding conveyor, the wafer assembly conveyor, and the transition conveyor are arranged sequentially and are all connected end to end. The conveying speed of the wafer assembly conveyor is greater than the conveying speed of the transition conveyor.

[0016] Beneficial effects: On the one hand, the speed difference design between various transfer mechanisms (e.g., wafer assembly transfer mechanism > transition transfer mechanism > wafer running transfer mechanism) ensures that the substrate carrier can move quickly and orderly from one chamber to another, reducing waiting time and improving the overall system's production efficiency. On the other hand, the highly automated transfer mechanisms and chamber design make the transfer of the substrate carrier smoother, reducing the possibility of manual intervention and improving operational safety and reliability.

[0017] Meanwhile, the presence of the substrate storage chamber allows the system to store substrate racks without interruption, avoiding downtime due to material shortages, and also facilitates the management of different batches of substrate racks.

[0018] In an optional embodiment, the vacuum coating system further includes:

[0019] The wafer-splitting chamber has a wafer-splitting conveyor mechanism inside. The wafer-splitting chamber is located downstream of the process coating chamber and is selectively connected to the process coating chamber. The head of the wafer-splitting conveyor mechanism is arranged opposite to the tail of the wafer-running conveyor mechanism, and the conveying speed of the wafer-splitting conveyor mechanism is greater than the conveying speed of the wafer-running conveyor mechanism. The wafer-splitting conveyor mechanism is used to detach the coated substrate holder from the wafer-running conveyor mechanism.

[0020] Beneficial effects: The speed design of the slab transfer mechanism allows it to quickly remove the coated substrate holder from the wafer transport mechanism, thereby improving the separation efficiency of the entire system. Simultaneously, by employing a high-speed slab transfer mechanism, the substrate holder can be separated quickly and gently without compromising substrate quality, reducing the risk of substrate damage due to mechanical contact or improper operation.

[0021] Furthermore, the automated wafer transfer mechanism simplifies the operation process, reduces the need for manual intervention, lowers operational difficulty and error rate, and also improves safety. Moreover, the presence of the wafer-splitting chamber provides a complete closed-loop process for the entire vacuum coating system, with each step—from wafer storage, assembly, coating, to wafer splitting—closely linked, ensuring high production efficiency and stability.

[0022] In an optional embodiment, the wafer storage chamber, the wafer assembly chamber, the process coating chamber, and the wafer splitting chamber are all vacuum chambers and each is equipped with a switchable ventilation device.

[0023] And / or, in the wafer storage chamber, the wafer assembly chamber, the process coating chamber, and the wafer splitting chamber, each pair of adjacent chambers is provided with an openable door to allow selective front-to-back communication between the chambers.

[0024] Beneficial effects: On the one hand, the openable chamber doors allow for flexible control of the connectivity between chambers according to the needs of the actual production process, enabling the system to effectively manage the flow path of the substrate holder, prevent unnecessary air ingress, and support multi-step continuous operation. On the other hand, the chamber doors between each chamber can be closed when needed to prevent gas exchange between different processing stages, ensuring that each chamber can independently maintain the required vacuum or pressure conditions and reducing the risk of cross-contamination. Furthermore, the chamber door design not only improves system safety but also simplifies the operation process, allowing maintenance or adjustment of individual chambers without affecting other parts.

[0025] In an optional embodiment, the vacuum coating system further includes:

[0026] The loading chamber is equipped with a loading conveyor mechanism. The loading chamber is located upstream of the wafer storage chamber and is selectively connected to it. The loading conveyor mechanism is used to transport the wafer holder to the wafer storage device.

[0027] Beneficial effects: From feeding to discharging, the entire system achieves a high degree of automation, reducing manual intervention and improving production efficiency and safety.

[0028] In an optional embodiment, the transition conveying mechanism, the running sheet conveying mechanism, the feeding conveying mechanism, the assembling conveying mechanism, the splitting conveying mechanism, the loading conveying mechanism, and the unloading conveying mechanism are all conveying guides and their conveying directions all coincide with each other.

[0029] Beneficial effects: The design of the transfer guide rail ensures that the substrate holder can smoothly pass through each processing stage along a fixed direction, avoiding unnecessary turning or complex mechanical movements, thereby improving the continuity and smoothness of the entire system.

[0030] Furthermore, since the conveying directions of all the conveying rails coincide, the movement path of the substrate holder between the chambers is linear from loading to unloading. This not only simplifies the system layout but also reduces the operational difficulty and risk of failure caused by complex paths.

[0031] In an optional embodiment, the substrate holder includes a stabilizing frame and two clamping plates, which are respectively disposed on opposite sides of the stabilizing frame, and define a clamping space for clamping the substrate between the two clamping plates.

[0032] Beneficial effects: This embodiment, through the combined design of the stabilizer and clamp, can achieve a frameless design of the substrate holder in the front-to-back direction, so that the substrates can be in a close adjacent state during the process run, reducing the gap between the substrates to a minimum (e.g., 2mm), which greatly improves material utilization and improves the stability of the component; on the other hand, it ensures the stability of the substrates during the transfer and coating process, reducing coating defects caused by mechanical vibration or instability.

[0033] In an optional embodiment, a deflection adjustment mechanism is provided between each of the two clamping plates and the stabilizer, the deflection adjustment mechanism being used to adjust the distance between the clamping plates and the stabilizer to adjust the tilt angle of the substrate.

[0034] Beneficial effects: By adjusting the substrate angle, the system can optimize material deposition and adapt to different types of vacuum coating equipment and process requirements, such as magnetron sputtering and near-space sublimation. For ease of understanding, some specific embodiments of the deflection adjustment mechanism are given below.

[0035] In one alternative embodiment, the stabilizer is any one of a scissor lift, a telescopic mechanism, or a clamping mechanism.

[0036] Beneficial effects: The scissor mechanism, telescopic mechanism, or clamping mechanism allows for flexible adjustment of the distance between the clamps within a wide range, accommodating substrates of different sizes and enhancing the versatility and adaptability of the system.

[0037] In an optional embodiment, the substrate holder is provided with shock-absorbing pads on both the front and rear sides in the transmission direction.

[0038] Beneficial effects: The damping pads effectively reduce the risk of mechanical damage to the substrates during transport and coating processes, improving product yield. Simultaneously, by precisely controlling the thickness of the damping pads, the spacing between substrates can be maintained within an ideal range (e.g., 2mm), ensuring the stability of the process environment and the uniformity of material deposition. Furthermore, the thickness of the damping pads can be adjusted within a certain range to adapt to different substrate sizes and process requirements, enhancing the system's flexibility. Attached Figure Description

[0039] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of the vacuum coating system according to an embodiment of the present invention;

[0041] Figure 2 This is one of the structural schematic diagrams of the substrate holder according to an embodiment of the present utility model;

[0042] Figure 3 This is a second schematic diagram of the substrate holder structure according to an embodiment of the present utility model;

[0043] Figure 4 This is the third schematic diagram of the substrate holder structure according to an embodiment of the present utility model;

[0044] Figure 5 This is a schematic diagram of the substrate holder arranged in the wafer conveying mechanism according to an embodiment of the present invention.

[0045] Explanation of reference numerals in the attached figures:

[0046] 101. Loading chamber; 102. Wafer storage chamber; 103. Wafer assembly chamber; 104. Process coating chamber; 105. Wafer separation chamber; 106. Unloading chamber; 107. Vacuum coating device; 201. First chamber door; 202. Second chamber door; 203. Third chamber door; 204. Fourth chamber door; 205. Fifth chamber door; 206. Sixth chamber door; 207. Seventh chamber door; 300. Loading conveyor mechanism; 301. Wafer storage device 311. Feeding conveyor mechanism; 312. Translation conveyor mechanism; 302. Piece assembly conveyor mechanism; 303. Transition conveyor mechanism; 304. Piece running conveyor mechanism; 305. Piece splitting conveyor mechanism; 306. Discharge conveyor mechanism; 401. Substrate holder; 402. Stabilizer; 4021. First scissor bar; 4022. Second scissor bar; 403. Clamping plate; 404. Shock-absorbing pad; 405. Deflection adjustment mechanism; 501. Substrate. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0048] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0050] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0051] The present invention provides a vacuum coating system with reference to the accompanying drawings.

[0052] like Figure 1 and Figure 2 As shown, the vacuum coating system according to an embodiment of the present invention includes a substrate holder 401 and a process coating chamber 104.

[0053] The substrate holder 401 is used to hold the substrate 501 to be coated, and both the front and rear sides of the substrate holder 401 are open. The process coating chamber 104 is equipped with a transition transfer mechanism 303 and a wafer transfer mechanism 304. The process coating chamber 104 is also equipped with a vacuum coating device 107, which is located on one side of the wafer transfer mechanism 304 and is arranged opposite to the wafer transfer mechanism 304.

[0054] In the transport direction of the substrate holder 401, multiple substrate holders 401 are arranged adjacent to each other on the wafer conveyor 304, with the tail of the transition conveyor 303 docking with the head of the wafer conveyor 304; wherein, the conveying speed of the transition conveyor 303 is greater than the conveying speed of the wafer conveyor 304. The transition conveyor 303 pushes the substrate holders 401 onto the wafer conveyor 304, such that each subsequent substrate holder 401 is adjacent to the previous substrate holder 401 on the wafer conveyor 304.

[0055] To facilitate understanding, the specific structural composition of the vacuum coating system of this utility model and the specific functions of each component will be described in detail below.

[0056] The substrate holder 401 is used to carry the substrate 501 to be coated. Its design features open front and rear sides in the transport direction, without any frame restrictions. This design allows the substrates 501 to be arranged with very small spacing (e.g., 2 mm) when adjacent, thereby improving material utilization and coating consistency.

[0057] Understandably, the borderless design reduces ineffective areas, allowing more material to be deposited onto the substrate 501 instead of being wasted on the border or shielding plate. At the same time, the reduced spacing between the substrates 501 can speed up continuous coating and reduce the impact of the gap caused by the interval on the stability of the coating environment.

[0058] The process coating chamber 104 consists of a transition transfer mechanism 303, a wafer transfer mechanism 304, and a vacuum coating apparatus 107. Specifically, the transition transfer mechanism 303 is located at the entrance of the substrate carrier 401 into the process coating chamber 104. It is responsible for receiving the substrate carrier 401 from the upstream chamber (such as the wafer assembly chamber 103) and transferring it to the wafer transfer mechanism 304. The transition transfer mechanism 303 operates at a high speed, ensuring that the substrate carrier 401 can be quickly connected to the wafer transfer mechanism 304, maintaining a high production cycle, and ensuring that multiple substrate carriers 401 located on the wafer transfer mechanism 304 can remain close to each other.

[0059] Understandably, when the substrate holder 401 is mounted on both the film transport mechanism 304 and the transition transport mechanism 303, the speed of the transition transport mechanism 303 is slightly faster than that of the film transport mechanism 304. This allows the transition transport mechanism 303 to gently push and move the substrate holder 401 toward the substrate holder on the film transport mechanism 304. In other words, the substrate holder 401 can slide a small distance on the transport surface of the film transport mechanism 304 until it comes into contact with the previous substrate holder 401. This ensures that all substrate holders 401 on the film transport mechanism 304 are in a close proximity, and the distance between any two of them remains basically the same.

[0060] During the transfer of substrates to the wafer conveyor 304, at least one substrate holder 401 is present on the transition conveyor 303. When one substrate holder 401 is present, after its transfer to the wafer conveyor 304 is completed, it is loaded via a wafer assembly mechanism or a loading mechanism before proceeding to the next round of transfer. In this case, the length of the transition conveyor 303 can be relatively small, reducing the space occupied in the coating chamber. Multiple substrate holders 401 can also exist simultaneously on the transition conveyor 303, with no limit on their spacing. The advantage of this method is that it reduces the number of chamber openings, but the disadvantage is that it increases the overall length and the space occupied in the coating chamber.

[0061] The substrate transport mechanism 304 is located at the core of the process coating chamber 104, responsible for moving the substrate holder 401 at a specific speed, so that the substrate 501 passes through the coating area of ​​the vacuum coating device 107 for coating operation. Figure 1 The image shown is a top view of the system in one embodiment. The wafer conveying mechanism 304 operates at a relatively slow speed to ensure sufficient dwell time for material to be fully deposited on the surface of the substrate 501.

[0062] The vacuum coating apparatus 107 is fixedly mounted on one side of the wafer transfer mechanism 304, with the two positioned opposite each other. When the substrate 501 passes through the wafer transfer mechanism 304, the vacuum coating apparatus 107 releases material molecules, which are then deposited directly onto the surface of the substrate 501 in a vacuum environment to form a thin film. It can be understood that within the process coating chamber 104, the transition transfer mechanism 303 and the wafer transfer mechanism 304 are connected end-to-end; the former efficiently feeds the substrate holder 401 into the latter, while the latter ensures that the substrate 501 receives uniform coating treatment in the appropriate position. This layout not only improves work efficiency but also ensures the consistency and stability of the coating quality.

[0063] Furthermore, based on the above structural description of the vacuum coating system, the working principle of the vacuum coating system of this utility model is as follows:

[0064] On the one hand, to achieve a small spacing between adjacent substrates 501, this system features an innovative design in the structure of the substrate holder 401. It should be noted that traditional substrate holders 401, due to their perimeter frame structure, limit the minimum spacing between substrates 501. However, in this invention, the newly designed substrate holder 401 has open, frameless sides. This structure allows the substrates 501 to be arranged almost adjacent to each other during the wafer fabrication process, reducing the spacing between substrates 501 to an extremely small value (e.g., 2mm). Therefore, the substrate holder 401 structure of this invention significantly improves material utilization, reduces material waste, and, due to the extremely short distance between substrates 501, significantly increases production cycle time while ensuring that component stability is not affected.

[0065] On the other hand, to ensure the close proximity of the substrate holders 401 during the wafer running process, this system employs multiple transfer mechanisms with different speeds (including a transition transfer mechanism 303 and a wafer running transfer mechanism 304). Thus, in actual operation, before the substrate holders 401 are fed into the process coating chamber 104, they first pass through the transition transfer mechanism 303, which quickly transfers them onto the wafer running transfer mechanism 304 within the process coating chamber 104. At this time, due to the speed difference design between the multiple guide rails, the spacing between the substrate holders 401 entering the wafer running transfer mechanism 304 can be maintained at a relatively small value (e.g., 2mm), allowing multiple substrate holders 401 to be closely adjacent during the wafer running process. This improves the coating cycle time, enabling the system to produce more component products per unit time.

[0066] In related technologies, continuous coating of substrates cannot be achieved in vacuum coating equipment, mainly due to the following two aspects: First, the design of the substrate holder. The existing substrate holder design has borders on all four sides, and in order to ensure the strength of the substrate holder, the borders are generally designed to be relatively wide, which determines that there must be gaps when the substrate is placed in the substrate holder; Second, the existing technology cannot make the gaps between substrate holders extremely small, which also leads to a greater distance between substrates.

[0067] The large spacing between substrates will lead to the following three defects: First, the material utilization rate is low. During vacuum coating, the substrate process coating area will be coated with the target film layer. In the gaps between substrates, material is still being released, but it is all ineffective release. Some of it is coated on the edge of the substrate holder, and others are directly or indirectly coated on the anti-adhesion plate, which reduces the cleanliness of the substrate holder or chamber. A small amount may occur around the substrate, which will have an adverse effect on the back side of the substrate. Second, the coating cycle is slow. The large spacing between substrates will waste this gap. If this gap is utilized, the coating cycle will be faster, which can further increase the output. Third, the stability of the module will be worse. The gap between substrates means that the concentration and pressure of the coating material on the front of the substrate (facing the coating equipment) cannot be kept constant.

[0068] Therefore, in order to solve the technical defects in the above-mentioned related problems, this utility model provides a vacuum coating system. The system, through the design of a multi-segment conveying mechanism and combined with a novel structure of the substrate holder 401, enables the substrate holders 401 to be in an adjacent state during the process of running the substrate, and the gap between adjacent substrate holders 401 is greatly reduced, thereby improving the material utilization rate, production cycle and component stability in the coating process.

[0069] Furthermore, compared with systems in related technologies, the vacuum coating system of this utility model has at least the following advantages:

[0070] (1) Improved material utilization: By designing a substrate holder 401 with open front and rear sides and a multi-segment guide rail system, this invention achieves an adjacent state of the substrate holder 401 during the wafer running process, minimizing the spacing between substrates 501. Simultaneously, the minimal spacing between substrates 501 reduces ineffective material deposition in non-target areas such as the substrate holder 401 and the chamber anti-stick plate, thereby improving material utilization. In contrast, in traditional technologies, the substrate holder is restricted by a border, resulting in a larger spacing between substrates, leading to material deposition or waste in ineffective areas (such as the border).

[0071] (2) Accelerating Production Cycle: The speed of the transition conveyor 303 is greater than that of the wafer conveyor 304, ensuring that the interval between the substrate holders 401 on the wafer conveyor 304 is minimized. This minimized interval means that coating operations can be performed more continuously, avoiding the "window period" caused by longer intervals between substrates 501, thus further accelerating the production cycle. In addition, the speed difference design also makes the entire system operate more smoothly, reduces waiting time, and improves overall production efficiency.

[0072] (3) Improved component stability: The smaller substrate 501 spacing helps maintain a constant concentration of coating material and gas pressure in front of the substrate 501 (facing the coating equipment) during the coating process. For example, for coating equipment that requires the introduction of process gases, this system can ensure the stability of environmental conditions, thereby improving coating quality.

[0073] Furthermore, the large substrate spacing in traditional technologies leads to changes in environmental conditions at the beginning and end of each coating process. In contrast, the close arrangement of the substrate holders 401 in this invention reduces the frequency of such occurrences, lowers the risk of component performance fluctuations, and improves product quality consistency.

[0074] like Figure 1 As shown, according to some embodiments of the present invention, the vacuum coating system further includes a wafer storage chamber 102 and a wafer assembly chamber 103.

[0075] The storage chamber 102 is equipped with several storage devices 301 for storing substrate holders 401 and a feeding conveyor 311; the assembly chamber 103 is equipped with an assembly conveyor 302, and the feeding conveyor 311 is used to transport the substrate holders 401 on the storage devices 301 to the assembly conveyor 302 in sequence.

[0076] In the transport direction of the substrate holder 401, the wafer storage chamber 102, the wafer assembly chamber 103, and the process coating chamber 104 are arranged sequentially and can be selectively connected front to back. The feeding conveyor 311, the wafer assembly conveyor 302, and the transition conveyor 303 are arranged sequentially and are all arranged end to end. The conveying speed of the wafer assembly conveyor 302 is greater than the conveying speed of the transition conveyor 303. The wafer splitting conveyor 305 is used to separate the coated substrate holder 401 from the wafer running conveyor 304.

[0077] In this embodiment, the wafer storage chamber 102 and the wafer assembly chamber 103 can respectively realize the pre-storage of multiple substrate holders 401 and the sequential arrangement of the pre-stored multiple substrate holders 401. Specifically, the wafer storage chamber 102 is used to temporarily store substrate holders 401 to be processed, ensuring that a sufficient number of substrate holders 401 can continuously enter the subsequent process flow. Inside the wafer storage chamber 102, several wafer storage devices 301 are distributed in the chamber, each device can accommodate at least one substrate holder 401, ensuring sufficient storage capacity. The feeding conveyor mechanism 311 is responsible for transporting the substrate holders 401 on the wafer storage devices 301 to the wafer assembly chamber 103, ensuring that the substrate holders 401 can enter the next processing stage in a predetermined order.

[0078] The wafer assembly chamber 103 is used to complete the merging operation of the substrate holders 401, ensuring that the substrate holders 401 remain adjacent to each other during the process run, achieving an ultra-short interval arrangement. The wafer assembly conveyor mechanism 302 within the wafer assembly chamber 103 has a higher conveying speed than the transition conveyor mechanism 303 within the process coating chamber 104. This allows the wafer assembly conveyor mechanism 302 to quickly and tightly arrange the substrate holders 401 from the storage chamber 102, preparing them for delivery into the process coating chamber 104. It can be understood that this high-speed design is to ensure that the substrate holders 401 can be arranged compactly without affecting the overall production cycle.

[0079] In this way, on the one hand, the speed difference design between the various conveying mechanisms (e.g., wafer assembly conveying mechanism 302 > transition conveying mechanism 303 > wafer running conveying mechanism 304) ensures that the substrate holder 401 can move quickly and orderly from one chamber to another, reducing waiting time and improving the overall system's production efficiency. On the other hand, the highly automated conveying mechanisms and chamber design make the transfer of the substrate holder 401 smoother, reducing the possibility of manual intervention and improving operational safety and reliability.

[0080] Meanwhile, the presence of the storage chamber 102 allows the system to store substrate holders 401 without interruption, avoiding downtime due to material shortages, and also facilitates the management of different batches of substrate holders 401.

[0081] like Figure 1As shown, the wafer storage chamber 102 is further provided with a translational conveying mechanism 312, which is located between the wafer storage device 301 and the feeding conveying mechanism 311, and is used to transport the substrate holder 401 on the wafer storage device 301 to the feeding conveying mechanism 311.

[0082] like Figure 1 As shown, according to some embodiments of the present invention, the vacuum coating system further includes a segmented chamber 105.

[0083] The slicing chamber 105 is equipped with a slicing conveying mechanism 305. The slicing chamber 105 is located downstream of the process coating chamber 104 and can be selectively connected to the process coating chamber 104. The head of the slicing conveying mechanism 305 is arranged opposite to the tail of the running conveying mechanism 304, and the conveying speed of the slicing conveying mechanism 305 is greater than the conveying speed of the running conveying mechanism 304.

[0084] It is understandable that, since the substrate holders 401 are arranged in a compact manner during the coating process, in order to achieve safe separation between the substrate holders 401, the system in this embodiment is provided with a partitioning chamber 105. The main function of the partitioning chamber 105 is to separate the tightly arranged substrate holders 401 after the coating process is completed, so as to facilitate subsequent processing or unloading.

[0085] Specifically, the wafer transfer mechanism 305 is located within the wafer transfer chamber 105 and is responsible for receiving the substrate holder 401 from the wafer transfer mechanism 304 and removing it from the process coating chamber 104 at a relatively high speed. The speed of the wafer transfer mechanism 305 is greater than that of the wafer transfer mechanism 304, thus ensuring that the substrate holder 401 can quickly leave the tightly packed state, while avoiding blockage or accumulation problems caused by excessively slow speed.

[0086] In summary, the speed design of the slab transfer mechanism 305 enables it to quickly remove the coated substrate holder 401 from the wafer transport mechanism 304, thereby improving the separation efficiency of the entire system. Simultaneously, by employing a high-speed slab transfer mechanism 305, the substrate holder 401 can be separated quickly and gently without affecting the quality of the substrate 501, reducing the risk of damage to the substrate 501 due to mechanical contact or improper operation.

[0087] Furthermore, the automated wafer transfer mechanism 305 simplifies the operation process, reduces the need for manual intervention, lowers the operational difficulty and error rate, and also improves safety. Moreover, the wafer separation chamber 105 provides a complete closed-loop process for the entire vacuum coating system, with each step—from wafer storage, wafer assembly, coating, to wafer separation—closely linked, ensuring high production efficiency and stability.

[0088] like Figure 1As shown, according to some embodiments of the present invention, the wafer storage chamber 102, the wafer assembly chamber 103, the process coating chamber 104, and the wafer splitting chamber 105 are all vacuum chambers and each of them is equipped with a switchable ventilation device (not shown in the figure).

[0089] It is understandable that each chamber acts as an independent vacuum environment, ensuring that an appropriate vacuum level is maintained during different processing stages (such as storage, merging, coating, and separation), thereby guaranteeing coating quality. Simultaneously, each chamber is equipped with an on / off venting device that allows for rapid adjustment of the chamber's pressure when needed, such as restoring from vacuum to atmospheric pressure, or introducing a specific gas (such as argon) to optimize the coating environment. This enhances operational flexibility and adapts to different process requirements.

[0090] like Figure 1 As shown, according to some embodiments of the present invention, the vacuum coating system further includes a loading chamber 101. The loading chamber 101 is provided with a loading conveying mechanism 300. The loading chamber 101 is located upstream of the wafer storage chamber 102 and is selectively connected to it. The loading conveying mechanism 300 is used to transport the substrate holder 401 to the wafer storage device 301.

[0091] It is understood that the loading chamber 101 is located at the very top of the entire system and is the first link in the process of the substrate carrier 401 entering the system. It is responsible for receiving the substrate carrier 401 loaded with substrates 501 to be coated and safely transferring them to the storage chamber 102. The loading chamber 101 can switch from an atmospheric state to a vacuum state, ensuring that the substrate carrier 401 is in a vacuum environment before entering the subsequent vacuum processing steps. When the substrate carrier 401 continues to be transferred, it can reduce the vacuum interference between adjacent chambers and reduce the impact on the vacuum environment of the process chamber and the coating chamber.

[0092] Specifically, inside the loading chamber 101, the loading conveyor 300 is used to transport the substrate holder 401 to the storage device 301, ensuring that the substrate holder 401 can enter the storage chamber 102 smoothly and accurately.

[0093] like Figure 1 As shown, according to some embodiments of the present invention, the vacuum coating system further includes a discharge chamber 106, which is provided with a discharge conveying mechanism 306. The discharge chamber 106 is located downstream of the segmentation chamber 105 and is selectively connected to it. The head of the discharge conveying mechanism 306 is arranged opposite to the tail of the segmentation conveying mechanism 305.

[0094] As can be understood, the discharge chamber 106 is located at the very bottom of the entire system and is the last link in the process of the coated substrate holder 401 leaving the system. Its main task is to receive the separated substrate holders 401 from the separation chamber 105 and send them to the outside for further processing or packaging. The discharge chamber 106 also has the ability to return from a vacuum state to an atmospheric state, ensuring that the substrate holders 401 can be safely removed in a normal atmospheric environment, while avoiding the influence of outside air on the internal vacuum environment.

[0095] Specifically, inside the discharge chamber 106, the head of the discharge conveying mechanism 306 is positioned opposite to the tail of the slicing conveying mechanism 305, and is responsible for receiving the substrate holder 401 from the slicing chamber 105 and transmitting it out.

[0096] In summary, from feeding to discharging, the entire system achieves a high degree of automation, reduces manual intervention, and improves production efficiency and safety.

[0097] like Figure 1 As shown, according to some embodiments of the present invention, in the feeding chamber 101, the storage chamber 102, the assembly chamber 103, the process coating chamber 104, the separation chamber 105, and the discharge chamber 106, each pair of adjacent chambers is provided with an openable door to allow selective front-to-back communication between the chambers.

[0098] Furthermore, the feeding port of the feeding chamber 101 and the discharge port of the discharge chamber 106 are also provided with openable and closable doors.

[0099] For example Figure 1 As shown, a first door 201 is provided at the loading port of the loading chamber 101. The first door 201 can be opened and closed to cooperate with the loading operation of the substrate holder 401. The first door 201 is opened after the vacuum in the loading chamber 101 is broken, and is closed after the substrate holder 401 is completely entered into the loading chamber 101.

[0100] A second door 202 is provided between the loading chamber 101 and the storage chamber 102. The second door 202 can be opened and closed, opening when the substrate holder 401 enters the storage chamber 102 from the loading chamber 101, and closing after the substrate holder 401 has completely entered the storage chamber 102.

[0101] A third door 203 is provided between the film storage chamber 102 and the film assembly chamber 103. The third door 203 can be opened and closed, opening when the substrate holder 401 enters the film assembly chamber 103 from the film storage chamber 102, and closing after the substrate holder 401 has fully entered the film assembly chamber 103.

[0102] A fourth door 204 is provided between the lamination chamber 103 and the process coating chamber 104. The fourth door 204 can be opened and closed, opening when the substrate holder 401 enters the process coating chamber 104 from the lamination chamber 103, and closing after the substrate holder 401 has completely entered the process coating chamber 104.

[0103] A fifth door 205 is provided between the process coating chamber 104 and the slitting chamber 105. The fifth door 205 can be opened and closed, opening when the substrate holder 401 enters the slitting chamber 105 from the process coating chamber 104, and closing after the substrate holder 401 has completely entered the slitting chamber 105.

[0104] A sixth door 206 is provided between the slicing chamber 105 and the discharge chamber 106. The sixth door 206 can be opened and closed, opening when the substrate holder 401 enters the discharge chamber 106 from the slicing chamber 105 and closing after the substrate holder 401 has fully entered the discharge chamber 106.

[0105] A seventh chamber door 207 is provided at the discharge port of the discharge chamber 106. The seventh chamber door 207 can be opened and closed to facilitate the unloading operation of the substrate holder 401. Specifically, the seventh chamber door 207 opens after the vacuum in the discharge chamber 106 is broken and closes after the substrate holder 401 has been completely discharged. Subsequently, the discharge chamber 106 is evacuated, changing from an atmospheric state to a vacuum state.

[0106] In summary, on the one hand, the switchable chamber doors allow for flexible control of the connectivity between chambers according to the needs of the actual production process, enabling the system to effectively manage the flow path of the substrate holder 401, preventing unnecessary air ingress, and supporting multi-step continuous operation. On the other hand, the chamber doors between each chamber can be closed when needed to prevent gas exchange between different processing stages, ensuring that each chamber can independently maintain the required vacuum or pressure conditions and reducing the risk of cross-contamination. Furthermore, the chamber door design not only improves system safety but also simplifies the operation process, allowing for maintenance or adjustment of individual chambers without affecting other parts.

[0107] like Figure 1 As shown, according to some embodiments of this utility model, the transition conveying mechanism 303, the sheet conveying mechanism 304, the feeding conveying mechanism 311, the sheet assembly conveying mechanism 302, the sheet splitting conveying mechanism 305, the loading conveying mechanism 300, and the unloading conveying mechanism 306 are all conveying guides, and their conveying directions all coincide. The conveying guides are belt conveying mechanisms, roller conveying mechanisms, etc.

[0108] For example, the feeding conveyor 311 is a wafer storage guide rail. Its first function is to connect the substrate holder 401 of the loading chamber 101 into the wafer storage chamber 102; its second function is to move the substrate holder 401 to the reserved substrate holder 401 position in the wafer storage chamber 102, and then return to the initial position for the next wafer storage operation; its third function is to connect the wafer assembly guide rail so that the substrate holder 401 can smoothly enter the wafer assembly chamber 103.

[0109] The wafer transfer mechanism 302 is a wafer transfer guide. Its first function is to connect with the wafer storage guide to move the substrate holder 401 in the wafer storage chamber 102 to the wafer transfer chamber 103. Its second function is to connect with the transition guide to send the substrate holder 401 into the process coating chamber 104.

[0110] The transition conveyor 303 is a transition guide rail. Its speed is less than that of the lamination guide rail but greater than that of the process running guide rail. It ensures that the substrate holder 401 is always maintained on the transition guide rail so that it can stay in contact with the substrate 501 on the process running guide rail and maintain high-speed operation. It connects the lamination guide rail and the process running guide rail to complete the lamination operation.

[0111] The wafer conveying mechanism 304 is a process wafer guide rail that runs at the process speed. Its first function is to move multiple adjacent substrate holders 401 to the point where the coating operation is completed at the process coating speed. Its second function is to transport the substrate holders 401 to the wafer separation chamber 105.

[0112] The slab conveying mechanism 305 is a slab guide rail that operates at a speed higher than the process coating speed. When the substrate 501 in the process coating chamber completes the coating and is moved to the fifth chamber door 205, the fifth chamber door 205 opens, and the substrate 501 is transferred to the slab guide rail. Due to its high speed, it can quickly move the substrate 501 into the slab chamber 105. After the substrate 501 has completely moved into the slab chamber 105, the fifth chamber door 205 closes.

[0113] The first function of the slicing guide rail is to carry the previous substrate holder 401 away and move it completely into the slicing chamber 105 to realize the slicing operation; the second function is to transport the substrate holder 401 to the discharge chamber 106.

[0114] In summary, the design of the transfer guide rail ensures that the substrate holder 401 can smoothly pass through each processing stage along a fixed direction, avoiding unnecessary turning or complex mechanical movements, thereby improving the continuity and smoothness of the entire system.

[0115] Furthermore, since the conveying directions of all the conveying rails coincide, the movement path of the substrate holder 401 between the various chambers from loading to unloading is linear. This not only simplifies the system layout but also reduces the operational difficulty and risk of failure caused by complex paths. In addition, although the conveying directions are consistent, the speeds of different conveying rails can be adjusted according to specific needs (e.g., lamination conveyor 302 > transition conveyor 303 > wafer running conveyor 304 < wafer splitting conveyor 305) to achieve optimal production cycle time and process efficiency.

[0116] The above text provides a detailed description of each chamber and its internal structure within the vacuum coating system. To ensure the integrity of this system, the substrate holder 401 within this system will be described in detail below.

[0117] like Figures 2 to 5 As shown, according to some embodiments of the present invention, the substrate holder 401 includes a stabilizing frame 402 and two clamping plates 403. The two clamping plates 403 are respectively disposed on the left and right sides of the stabilizing frame 402, and a clamping space for clamping the substrate 501 is defined between the two clamping plates 403.

[0118] Thus, through the combined design of the stabilizer 402 and the clamping plate 403, this embodiment can achieve a frameless design of the substrate holder 401 in the front-to-back direction, so that the substrates 501 can be in a close adjacent state during the process, reducing the gap between the substrates 501 to a minimum (e.g., 2mm), which greatly improves material utilization and improves the stability of the component; on the other hand, it ensures the stability of the substrates 501 during the transfer and coating process, reducing coating defects caused by mechanical vibration or instability.

[0119] like Figures 2 to 5 As shown, in some specific embodiments, a deflection adjustment mechanism 405 is provided between each of the two clamping plates 403 and the stabilizer 402. The deflection adjustment mechanism 405 is used to adjust the distance between the clamping plates 403 and the stabilizer 402 to adjust the tilt angle of the substrate 501. One end of the deflection adjustment mechanism 405 is connected to the clamping plate 403 by a rotating joint.

[0120] The main function of the deflection adjustment mechanism 405 is to change the distance between the clamping plate 403 and the stabilizer 402, thereby adjusting the tilt angle of the substrate 501. In this way, by adjusting the angle of the substrate 501, the system can optimize the material deposition effect and adapt to different types of vacuum coating equipment and process requirements, such as magnetron sputtering and near-space sublimation. For ease of understanding, some specific embodiments of the deflection adjustment mechanism 405 are given below.

[0121] For example Figure 3 and Figure 4As shown, the deflection adjustment mechanism 405 can consist of one or more screws. The screws pass through the clamping plate 403 via threaded joints and are movably mounted on the stabilizer 402 via ball joints, shafts, or other rotating joints, ensuring that the clamping plate 403 can be deflected and adjusted relative to the stabilizer 402. By rotating the screws, the distance between the clamping plate 403 and the stabilizer 402 can be changed. Furthermore, to prevent loosening during conveying and coating processes, the screw adjustment mechanism is equipped with a locking device, such as a lock nut or spring washer, to ensure that the adjusted angle remains constant.

[0122] At this point, the operation is manual adjustment. The operator can use a wrench or other tools to manually rotate the screws to precisely adjust the tilt angle of the substrate 501 according to process requirements. For ease of adjustment and repeated settings, the screws may have graduations indicating different tilt angles.

[0123] For example, the deflection adjustment mechanism 405 can also be a hydraulic cylinder or a pneumatic cylinder, using hydraulic oil or compressed air as a power source to push the piston rod to extend or retract, thereby changing the distance between the clamping plate 403 and the stabilizer 402. In this case, the operation mode is electric or automatic adjustment, which is suitable for production lines that require frequent angle adjustments or have a high degree of automation.

[0124] According to some embodiments of this utility model, the stabilizer 402 in the substrate holder 401 can adopt different structural forms, such as scissor structure, telescopic mechanism, clamping mechanism, etc. This utility model does not make any special limitation, as long as the stabilizer 402 can realize the installation of the clamping plate 403 and ensure the stability of the substrate holder 401.

[0125] like Figures 2 to 5 As shown, in some specific embodiments, the stabilizer 402 is a scissor structure, including a first scissor bar 4021 and a second scissor bar 4022. The center of the first scissor bar 4021 is rotatably connected to the center of the second scissor bar 4022. One end of the first scissor bar 4021 is hinged to a clamping plate 403, and the other end is slidably connected to another clamping plate 403 along the length of the plate. One end of the second scissor bar 4022 is hinged to the other clamping plate 403, and the other end is slidably connected to a clamping plate 403 along the length of the plate. The fixed ends of the first scissor bar 4021 and the second scissor bar 4022 are respectively located on the two clamping plates. In this method, the clamping plate 403 replaces the crossbar of the scissor structure. Alternatively, a slider-type scissor mechanism with crossbeams can be directly used, with the clamping plate 403 directly fixed on the two crossbeams.

[0126] In this embodiment, the center of the first scissor bar 4021 and the center of the second scissor bar 4022 are connected by a rotatable connection point (such as a hinge or bearing), so that the two bars can rotate relative to each other in the middle position.

[0127] It is understandable that by adjusting the degree of deployment of the scissor lift structure, the angle between the first scissor lift 4021 and the second scissor lift 4022 can be changed, thereby adjusting the distance between the two clamping plates 403. This width adjustment mechanism allows the substrate holder 401 to accommodate substrates 501 of different sizes, enhancing the system's flexibility. Furthermore, due to the inherent mechanical strength and stability of the scissor lift structure, it ensures that the clamping plates 403 will not loosen or deform during transport and coating processes, improving operational safety and reliability.

[0128] In this way, the scissor structure allows for flexible adjustment of the distance between the clamping plates 403 within a wide range, accommodating substrates 501 of different sizes and enhancing the system's versatility and adaptability. Furthermore, due to the inherent mechanical strength and stability of the scissor structure, it ensures that the clamping plates 403 will not loosen or deform during transport and coating processes, improving operational safety and reliability.

[0129] In addition, compared to other width adjustment mechanisms, the scissor mechanism occupies less space, which helps to simplify the overall design of the substrate holder 401 and reduce the size and weight of the equipment.

[0130] Furthermore, the first scissor bar 4021 and the second scissor bar 4022 can be made of materials such as SUS304 and SUS316, and their shape can be a cuboid, a cylinder or other constructible shape, and their thickness is more than 10mm.

[0131] In other implementations, the stabilizer 402 may also be a telescopic mechanism or a clamping mechanism. When it is a telescopic mechanism or a clamping mechanism, two clamping plates 403 are respectively disposed at its two ends, and the two clamping plates 403 are kept parallel.

[0132] like Figure 5 As shown, in some specific embodiments, the substrate holder 401 is provided with shock-absorbing pads 404 on both the front and rear sides in the transmission direction. Specifically, the clamping plate 403 is provided with shock-absorbing pads 404 on both the front and rear sides.

[0133] It is understandable that the main function of the shock-absorbing pad 404 is to absorb mechanical vibration and reduce the damage to the substrate 501 caused by collision or vibration during the transfer and coating process.

[0134] The 404 shock-absorbing pad is made of polyester fiber, acrylic fiber and other chemical fibers through a glue-free composite technology, and the front is treated with a waterproof coating. The combination of these materials provides good cushioning and durability, while the waterproof coating increases its moisture resistance and ease of cleaning.

[0135] Furthermore, the thickness of the damping pad 404 is at least 1 mm and at most 2.5 mm. It should be explained that if the thickness of the damping pad 404 is less than 1 mm, it cannot provide sufficient damping effect, which may affect the long-term use of the substrate holder 401; while if the thickness exceeds 2.5 mm, it will increase the spacing between the substrates 501, resulting in an increased idle period and affecting process stability.

[0136] In this way, the damping pad 404 effectively reduces the risk of mechanical damage to the substrate 501 during transport and coating processes, improving product yield. Simultaneously, by precisely controlling the thickness of the damping pad 404, the spacing between the substrates 501 can be maintained within an ideal range (e.g., 2mm), ensuring the stability of the process environment and the uniformity of material deposition. Furthermore, the thickness of the damping pad 404 can be adjusted within a certain range to adapt to different substrate 501 sizes and process requirements, enhancing the system's flexibility.

[0137] A specific embodiment of the vacuum coating system of this utility model is given below with reference to the accompanying drawings.

[0138] (1) Material feeding stage:

[0139] like Figure 1 As shown, after the substrate 501 to be coated is loaded onto the substrate holder 401, it first enters the loading chamber 101. The loading chamber 101 is located at the upstream end of the entire system and is equipped with a loading conveyor rail inside. The ventilation device in the loading chamber 101 evacuates the chamber to a vacuum state, ensuring that the substrate holder 401 is in a vacuum environment before entering the subsequent processing steps. The loading conveyor rail smoothly transports the substrate holder 401 to the storage chamber 102. At this time, the second door 202 between the loading chamber 101 and the storage chamber 102 opens, allowing the substrate holder 401 to smoothly enter the storage chamber 102.

[0140] (2) Film storage and assembling stage:

[0141] like Figure 1 As shown, when coating is required, the substrate holders 401 in the storage chamber 102 are fed into the assembly chamber 103 via the feeding conveyor rail. Here, multiple substrate holders 401 are arranged in a spaced-out manner, ready to enter the process coating chamber 104. Both the storage chamber 102 and the assembly chamber 103 are equipped with ventilation devices, through which gas such as argon is introduced to maintain stable gas pressure.

[0142] (3) Coating stage:

[0143] like Figure 1As shown, the laminated substrate holder 401 is rapidly transferred to the process coating chamber 104 via a transition transfer rail. The transition transfer rail operates faster than the wafer transfer rail, pushing the substrate holder 401 onto the wafer transfer rail, ensuring a rapid connection between the substrate holder 401 and the wafer transfer rail. Inside the process coating chamber 104, the substrate holder 401 moves along the slower wafer transfer rail and undergoes uniform coating treatment via the vacuum coating device 107 above. Due to the extremely small spacing between the substrate holders 401 (e.g., 2mm), material utilization is greatly improved, and component stability is enhanced. The process coating chamber 104 is equipped with a ventilation device to maintain a stable coating environment and ensure consistent coating conditions for each application.

[0144] (4) Fragmentation stage:

[0145] like Figure 1 As shown, the substrate holder 401, after coating, enters the slitting chamber 105. The slitting chamber 105 is equipped with a high-speed slitting conveyor rail to quickly separate adjacent substrate holders 401, ensuring that each substrate holder 401 can move independently without interfering with each other. After separation, the chamber doors are quickly closed to reduce gas exchange between adjacent chambers. The slitting chamber 105 is also equipped with a ventilation device to introduce gas such as argon to maintain stable gas pressure and prevent environmental changes from affecting the quality of the coated substrate 501.

[0146] (5) Discharge stage:

[0147] Finally, the slitting substrate holder 401 enters the discharge chamber 106. The discharge chamber 106 is located at the downstream end of the entire system and is equipped with a discharge conveyor rail to safely transport the substrate holder 401 out. A ventilation device within the discharge chamber 106 regulates the air pressure inside, restoring it from a vacuum to an atmospheric environment, so that the coated substrate 501 can be safely removed.

[0148] At this point, the operator can remove the processed substrate holder 401 from the discharge port, ready for the next process or packaging.

[0149] In summary, the vacuum coating system of this utility model, through the multi-segment guide rail design, allows the substrate holders 401 to be in an adjacent state during the process running. At the same time, the novel structure of the substrate holders 401 reduces the spacing of the substrate holders 401 during the process running to 2mm, which is of great significance to the material utilization rate, production cycle and component stability of the vacuum coating equipment.

[0150] Meanwhile, by using the wafer storage chamber 102 and the wafer assembly chamber 103, multiple substrate holders 401 can be stored in the chambers to meet the demand for substrates 501 during the wafer running process; at the same time, by setting ventilation devices in the wafer assembly chamber 103 and the wafer separation chamber 105, the air pressure stability of the chamber doors during the wafer running process can be further maintained.

[0151] Furthermore, by adopting a substrate holder 401 without side frames and a substrate holder 401 with shock-absorbing pads 404 and a clamping plate 403, the ultra-short interval between substrates 501 has a hardware foundation. At the same time, by adopting a structure that allows for adjustable tilt angles of substrates 501, it can be adapted to vacuum coating equipment and process requirements with different tilt angles, and the angle adjustment operation is simple and fast.

[0152] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A vacuum coating system, characterized in that, include: A substrate holder (401) is used to place a substrate (501) to be coated, and the substrate holder (401) is open on both the front and rear sides in the transport direction; The process coating chamber (104) is provided with a transition transfer mechanism (303) and a wafer transfer mechanism (304) inside. The process coating chamber (104) is also provided with a vacuum coating device (107), which is located on one side of the wafer transfer mechanism (304) and is arranged opposite to it. In the transport direction of the substrate holder (401), the tail of the transition conveyor (303) docks with the head of the running conveyor (304); wherein the conveying speed of the transition conveyor (303) is greater than the conveying speed of the running conveyor (304); the transition conveyor (303) pushes the substrate holder (401) onto the running conveyor (304), and such that the next substrate holder (401) is adjacent to the previous substrate holder (401) on the running conveyor (304).

2. The vacuum coating system according to claim 1, characterized in that, Also includes: The wafer storage chamber (102) is provided with several wafer storage devices (301) for storing substrate holders (401) and a feeding conveyor mechanism (311); The wafer assembly chamber (103) is provided with a wafer assembly conveying mechanism (302) inside. The feeding conveying mechanism (311) is used to transport the substrate holder (401) on the wafer storage device (301) to the wafer assembly conveying mechanism (302) in sequence. In the transport direction of the substrate holder (401), the wafer storage chamber (102), the wafer assembly chamber (103), and the process coating chamber (104) are arranged in sequence and can be selectively connected front to back. The feeding conveyor (311), the wafer assembly conveyor (302), and the transition conveyor (303) are arranged in sequence and are all connected end to end. The conveying speed of the wafer assembly conveyor (302) is greater than the conveying speed of the transition conveyor (303).

3. The vacuum coating system according to claim 2, characterized in that, Also includes: A slab-splitting chamber (105) is provided inside which a slab-splitting conveyor mechanism (305) is provided. The slab-splitting chamber (105) is located downstream of the process coating chamber (104) and is selectively connected to the process coating chamber (104). The head of the slab-splitting conveyor mechanism (305) is arranged opposite to the tail of the wafer-running conveyor mechanism (304), and the conveying speed of the slab-splitting conveyor mechanism (305) is greater than the conveying speed of the wafer-running conveyor mechanism (304). The slab-splitting conveyor mechanism (305) is used to detach the coated substrate holder (401) from the wafer-running conveyor mechanism (304).

4. The vacuum coating system according to claim 3, characterized in that, The wafer storage chamber (102), the wafer assembly chamber (103), the process coating chamber (104), and the wafer splitting chamber (105) are all vacuum chambers and each of them is equipped with a switchable ventilation device. And / or, in the wafer storage chamber (102), the wafer assembly chamber (103), the process coating chamber (104), and the wafer splitting chamber (105), each pair of adjacent chambers is provided with an openable door to allow selective front-to-back communication between the chambers.

5. The vacuum coating system according to claim 2, characterized in that, Also includes: The loading chamber (101) is provided with a loading conveyor mechanism (300) inside. The loading chamber (101) is located upstream of the wafer storage chamber (102) and is selectively connected to it. The loading conveyor mechanism (300) is used to transport the substrate holder (401) to the wafer storage device (301).

6. The vacuum coating system according to any one of claims 1 to 5, characterized in that, The transition conveyor (303), the running conveyor (304), the feeding conveyor, the combining conveyor, the splitting conveyor (305), the loading conveyor (300), and the unloading conveyor (306) are all conveying guides and their conveying directions coincide with each other.

7. The vacuum coating system according to any one of claims 1 to 5, characterized in that, The substrate holder (401) includes a stabilizing frame (402) and two clamping plates (403). The two clamping plates (403) are respectively disposed on opposite sides of the stabilizing frame (402), and a clamping space for clamping the substrate (501) is defined between the two clamping plates (403).

8. The vacuum coating system according to claim 7, characterized in that, A deflection adjustment mechanism (405) is provided between each of the two clamping plates (403) and the stabilizer (402). The deflection adjustment mechanism (405) is used to adjust the distance between the clamping plates (403) and the stabilizer (402) to adjust the tilt angle of the substrate (501).

9. The vacuum coating system according to claim 7, characterized in that, The stabilizer (402) can be any one of a scissor lift structure, a telescopic mechanism, or a clamping mechanism.

10. The vacuum coating system according to claim 1, characterized in that, The substrate holder (401) is provided with shock-absorbing pads (404) on both the front and rear sides in the transmission direction.

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