Wire controller

Abstract

The utility model provides a wire controller. The wire controller comprises a wire controller main body and a temperature sensor part which are detachably arranged. Wherein the wire controller main body is internally provided with a wire controller main board, the temperature sensor part is internally provided with a temperature sensor, and the wire controller main board is in communication connection with the temperature sensor; the wire controller main board is further in communication connection with a control device in the indoor unit. The wire controller body and the temperature sensor component are detachably arranged, so that when the temperature sensor breaks down, the temperature sensor component can be independently replaced, the whole wire controller does not need to be replaced, and device waste is reduced; and meanwhile, the wire controller main board is further in communication connection with the indoor unit control device, so that the indoor temperature can be determined based on relevant parameters of the indoor unit control device.

Description

Technical Field

[0001] This utility model relates to the field of temperature control, and in particular to a wired controller. Background Technology

[0002] Existing wired controllers are equipped with temperature sensors to detect indoor temperature and send the detection results to the unit so that the unit can adjust the indoor temperature based on the real-time indoor temperature; however, when the temperature sensor of the wired controller fails, the entire wired controller needs to be replaced, which is quite wasteful. Utility Model Content

[0003] The main purpose of this utility model is to propose a wired controller that aims to solve the problem that in the prior art, when the temperature sensor of the wired controller fails, the entire wired controller needs to be replaced, which is wasteful.

[0004] To achieve the above objectives, this utility model provides a wired controller, which includes a detachable controller body and a temperature sensor component; wherein, a controller motherboard is disposed within the controller body, a temperature sensor is disposed within the temperature sensor component, and the controller motherboard is communicatively connected to the temperature sensor; the controller motherboard is also communicatively connected to a control device inside the indoor unit.

[0005] Optionally, the wired controller body and the temperature sensor component are connected by a snap-fit.

[0006] Optionally, the main body of the wired controller includes a wired controller housing, a wired controller main board, and a plurality of elastic pins; wherein:

[0007] The main board of the wired controller is disposed inside the housing of the wired controller, and the elastic pin is disposed in the opening on the housing of the wired controller; the wiring terminals of the main board of the wired controller are connected to the corresponding elastic pins one by one through wires.

[0008] The temperature sensor component includes a sensor housing, the temperature sensor itself, and multiple copper plates; wherein:

[0009] The temperature sensor is disposed inside the sensor housing, and the copper sheet is disposed on the sensor housing; the terminals of the temperature sensor are connected to the copper sheet one by one via wires.

[0010] When the wired controller body is connected to the temperature sensor component, the elastic pin is connected to the copper sheet in a one-to-one correspondence.

[0011] Optionally, the opening on the wired controller housing matches the elastic pin, and the wired controller housing and the elastic pin form an internal sealed space, with the wired controller mainboard disposed within the sealed space.

[0012] Optionally, the temperature sensor component includes a sensor housing and the temperature sensor; wherein:

[0013] The sensor housing has multiple ventilation holes, and the interior of the sensor housing is connected to the external environment through the ventilation holes.

[0014] Optionally, the number of ventilation holes is two, and a ventilation channel is formed between the two ventilation holes;

[0015] The temperature sensor is located on the ventilation channel.

[0016] Optionally, the temperature sensor includes a sensor motherboard and a detection circuit, wherein the detection circuit is disposed on the sensor motherboard;

[0017] The detection circuit is located on the ventilation channel.

[0018] Optionally, the main body of the wired controller includes a wired controller housing; the temperature sensor component includes a sensor housing; wherein:

[0019] The back of the wired controller housing is provided with a groove that matches the sensor housing; the thickness of the sensor housing is less than the thickness of the wired controller housing.

[0020] Optionally, the groove is provided on the back corner of the wired controller housing; the back, first side, and second side of the sensor housing are in contact with the groove, a ventilation hole is provided on the third side of the sensor housing, and a ventilation hole is provided on the fourth side of the sensor housing.

[0021] Optionally, the wired controller further includes a gas sensor component, which is detachably mounted from the main body of the wired controller.

[0022] This utility model discloses a wired controller, comprising a detachable controller body and a temperature sensor component. The controller body houses a main board, and the temperature sensor component houses a temperature sensor. The main board is communicatively connected to the temperature sensor. The main board is also communicatively connected to a control device within the indoor unit. By making the controller body and temperature sensor component detachable, in the event of a temperature sensor failure, only the temperature sensor component can be replaced, eliminating the need to replace the entire controller and reducing component waste. Simultaneously, the main board's communicative connection to the indoor unit's control device enables the determination of the indoor temperature based on relevant parameters of the indoor unit's controller. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0026] Figure 1 This is a module structure diagram of the first embodiment of the wired controller of this utility model;

[0027] Figure 2 This is a side view of the wired controller of this utility model;

[0028] Figure 3 This is a side view of the main body of the wired controller in this utility model;

[0029] Figure 4 This is a flowchart illustrating the first embodiment of the indoor temperature detection method applied to the wired controller of this utility model.

[0030] Figure 5 This is a schematic diagram of the overall process of the indoor temperature detection method applied to the wired controller of this utility model.

[0031] Explanation of icon numbers:

[0032] label name label name 1 Wired controller body 21 Sensor housing 11 wired controller housing 22 Temperature sensor 12 Wired controller motherboard 221 Sensor motherboard 121 Wiring terminals of the wired controller motherboard 222 Detection circuit 13 Flexible ejector pin 23 copper sheet 2 Temperature sensor components 24 Ventilation holes Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0035] It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention. To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0036] This utility model provides a wired controller, as described above. Figure 1 , Figure 1 This is a module structure diagram of the first embodiment of the wired controller of this utility model. The wired controller includes a detachable wired controller body 1 and a temperature sensor component 2. The wired controller body 1 is provided with a wired controller main board 12, and the temperature sensor component 2 is provided with a temperature sensor 22. The wired controller main board 12 is communicatively connected to the temperature sensor 22. The wired controller main board 12 is also communicatively connected to the control device in the indoor unit.

[0037] The main body 1 of the wired controller is the part that performs the main functions of the wired controller; the temperature sensor component 2 is the part that performs temperature detection in the wired controller.

[0038] Temperature sensor 22 within temperature sensor component 2 detects the indoor temperature and sends the detected indoor temperature to the main board 12 of the wired controller body 1; the main board 12 of the wired controller undertakes the data processing function of the wired controller. After receiving the indoor temperature, the main board 12 of the wired controller sends the indoor temperature to the unit so that the unit can adjust the temperature based on the indoor temperature.

[0039] The main body 1 of the wired controller and the temperature sensor component 2 are detachable. Therefore, the temperature sensor component 2 can be disassembled separately to replace it.

[0040] The wired controller motherboard 12 is also connected to the indoor unit's control device. The wired controller motherboard 12 can obtain relevant parameters of the indoor unit, such as the indoor unit's return air temperature. When the temperature sensor 22 of the wired controller is abnormal, the wired controller cannot directly monitor the indoor temperature. Therefore, in order to ensure the normal operation of the unit, it is necessary to determine the indoor temperature through other means. In this embodiment, the indoor temperature is determined by the indoor unit's return air temperature associated with the wired controller.

[0041] In this embodiment, the main body 1 of the wired controller and the temperature sensor component 2 are made detachable, so that when the temperature sensor 22 fails, the temperature sensor component 2 can be replaced separately without replacing the entire wired controller, thus reducing component waste. At the same time, the main board 12 of the wired controller is also connected to the indoor unit controller, so that the indoor temperature can be determined based on the relevant parameters of the indoor unit controller.

[0042] Furthermore, the wired controller body 1 and the temperature sensor component 2 are connected by a snap-fit ​​mechanism.

[0043] The push-button latch typically consists of two parts: a fixed part and a movable part. The fixed part is usually a fixed seat or hook, while the movable part is a movable buckle or pin. The movable part and the fixed part are respectively set on the main body 1 of the wired controller and the temperature sensor component 2. The movable part is inserted into the fixed part, and then the movable part is pressed down to lock it together with the fixed part. When disassembly is required, simply press down the movable part and pull it outward to separate the main body 1 of the wired controller from the temperature sensor component 2.

[0044] It should be noted that the press-fit buckle is a feasible detachable setting method. In practical applications, other structures can also be set to achieve detachability between the main body 1 of the wired controller and the temperature sensor component 2.

[0045] Further, see Figure 1 as well as Figure 2 The wired controller body 1 includes a wired controller housing 11, a wired controller main board 12, and multiple elastic pins 13; wherein:

[0046] The main board 12 of the wired controller is disposed inside the housing 11 of the wired controller, and the elastic pin 13 is disposed in the opening on the housing 11 of the wired controller; the wiring terminals 121 of the main board 12 of the wired controller are connected to the corresponding elastic pins 13 one by one through wires.

[0047] The temperature sensor component 2 includes a sensor housing 21, the temperature sensor 22, and multiple copper plates 23; wherein:

[0048] The temperature sensor 22 is disposed inside the sensor housing 21, and the copper sheet 23 is disposed on the sensor housing 21; the terminals of the temperature sensor 22 are connected to the copper sheet 23 one by one through wires.

[0049] When the wired controller body 1 is connected to the temperature sensor component 2, the elastic pin 13 is connected to the copper sheet 23 in a one-to-one correspondence.

[0050] The wired controller housing 11 is used to protect its internal components; the wired controller motherboard 12 is used to implement data processing functions; it is understood that the wired controller motherboard 12 includes specific devices such as microprocessors, related circuits, and memory to implement data processing; the specific structure of the wired controller body 1 can be set according to actual needs and is not limited here.

[0051] The sensor housing 21 is used to protect its internal components; the temperature sensor 22 is used to detect the indoor temperature; the specific type, model and structure of the temperature sensor 22 can be set according to actual needs and are not limited here.

[0052] The flexible pin 13 contacts the copper sheet 23 to establish a communication connection between the wired controller main board 12 and the temperature sensor 22. When the wired controller body 1 is connected to the temperature sensor component 2, the flexible pin 13 contacts the copper sheet 23. At this time, the wiring terminal 121 of the wired controller main board 12 is connected to the wiring terminal of the temperature sensor 22 in sequence through the wire, the flexible pin 13, the copper sheet 23, and the wire, thus realizing the connection between the wired controller main board 12 and the temperature sensor 22.

[0053] In this embodiment, a contact connection structure is provided between the elastic pin 13 and the copper sheet 23, so that the connection can be easily achieved when the wire controller body 1 is connected to the temperature sensor component 2; the specific structure for realizing the communication connection between the wire controller body 1 and the temperature sensor component 2 can also be set according to actual needs.

[0054] Furthermore, the opening on the wired controller housing 11 matches the elastic pin 13, and the wired controller housing 11 and the elastic pin 13 form an internal sealed space, and the wired controller main board 12 is disposed in the sealed space.

[0055] Since the elastic pin 13 needs to contact the copper sheet 23, the elastic pin 13 needs to protrude from the wire controller housing 11. However, if the wire controller housing 11 is not sealed, the internal wire controller mainboard 12 is easily corroded by external materials and moisture, resulting in a shortened service life. Therefore, in order to ensure the sealing state of the wire controller housing 11, in this embodiment, the opening on the wire controller housing 11 is set to match the elastic pin 13, so that the inside of the wire controller housing 11 can still maintain a sealed state after the elastic pin 13 is set.

[0056] To further enhance the security of the wired controller motherboard 12, the wired controller housing 11 can also be further sealed and moisture-proofed. The specific treatment method can be set according to actual needs.

[0057] Furthermore, the temperature sensor component 2 includes a sensor housing 21 and the temperature sensor 22; wherein:

[0058] The sensor housing 21 has multiple ventilation holes 24, and the interior of the sensor housing 21 is connected to the external environment through the ventilation holes 24.

[0059] Temperature sensor 22 needs to detect indoor temperature, therefore, the space where temperature sensor 22 is located needs to be connected to the indoor space; therefore, ventilation holes 24 are provided on sensor housing 21 so that the inside of sensor housing 21 is connected to the external environment, and temperature sensor 22 can realize the detection of indoor temperature.

[0060] The number and location of the ventilation holes 24 can be set according to actual needs.

[0061] Furthermore, the number of ventilation holes 24 is 2, and a ventilation channel is formed between the two ventilation holes 24;

[0062] The temperature sensor 22 is disposed on the ventilation channel.

[0063] In this embodiment, two ventilation holes 24 are provided so that convection can be formed between the two ventilation holes 24; the ventilation channel is the flow path of the convection; the air in the ventilation channel is constantly exchanging with the indoor environment, so the temperature in the ventilation channel can reflect the temperature change of the indoor environment in a timely manner. The temperature sensor 22 is set in the ventilation channel so that the detection value of the temperature sensor 22 can quickly respond to the temperature change of the indoor environment, thereby improving the detection accuracy of the temperature sensor 22.

[0064] The specific location of the ventilation hole 24 can be selected based on the setting relationship between the sensor component and the main body 1 of the wired controller. For example, if the opposite sides of the sensor housing 21 do not contact the wired controller housing 11, the ventilation hole 24 can be set on the opposite sides respectively. If only two adjacent sides of the sensor housing 21 do not contact the wired controller housing 11, the ventilation hole 24 can be set on the adjacent sides respectively. If only one side of the sensor housing 21 is in contact with the wired controller housing 11, the ventilation hole 24 can be set on that side.

[0065] In other embodiments, multiple ventilation holes 24 may be provided to form more ventilation channels.

[0066] Furthermore, the temperature sensor 22 includes a sensor motherboard 221 and a detection circuit 222, the detection circuit 222 being disposed on the sensor motherboard 221;

[0067] The detection circuit 222 is disposed on the ventilation channel.

[0068] The detection circuit 222 is used to collect indoor temperature; the sensor main board 221 is used to process the signal collected by the detection circuit 222 and send it to the wired controller main board 12.

[0069] Since the detection circuit 222 is a direct detection device for indoor temperature, it is placed in the ventilation duct to improve the accuracy of indoor temperature detection.

[0070] Furthermore, the main body 1 of the wired controller includes a wired controller housing 11; the temperature sensor component 2 includes a sensor housing 21; wherein:

[0071] The back of the wired controller housing 11 is provided with a groove, which matches the sensor housing 21; the thickness of the sensor housing 21 is less than the thickness of the wired controller housing 11.

[0072] The back side of the wired controller housing 11 refers to the side facing the mounting wall. In this embodiment, a groove is provided on the back side of the wired controller housing 11, and the sensor housing 21 is installed through the groove, so that after installation, the sensor housing 21 is positioned opposite the back side of the wired controller housing 11. At the same time, since the sensor housing 21 matches the groove, and the thickness of the sensor housing 21 is less than the thickness of the wired controller housing 11, that is, the groove does not penetrate the wired controller housing 11 in the thickness direction, but is only manifested on the back side of the wired controller housing 11. Therefore, after installation, the sensor housing 21 can be seen from the back side, but cannot be seen from the front side, ensuring the integrity of the front side of the wired controller and improving the aesthetics of the wired controller.

[0073] Further, see Figure 3 The groove is provided on the back corner of the wired controller housing 11; the back, first side and second side of the sensor housing 21 are in contact with the groove, a ventilation hole 24 is provided on the third side of the sensor housing 21 and a ventilation hole 24 is provided on the fourth side of the sensor housing 21.

[0074] The groove is set on the back corner of the wire controller housing 11; after the sensor housing 21 is installed, it is also located on the back corner of the wire controller housing 11. In this installation method, the two sides of the wire controller in the same direction of the corner, namely the third side and the fourth side, will not contact the wire controller housing 11. Therefore, by setting the ventilation holes 24 on the third side and the fourth side, a good ventilation channel can be achieved.

[0075] Furthermore, the wired controller also includes a gas sensor component, which is detachably mounted from the main body 1 of the wired controller.

[0076] Understandably, based on the actual needs of the unit, other sensors can also be installed on the wired controller, such as gas sensors and humidity sensors. Gas sensors are used to detect the gas composition in the environment, such as TVOC (Total Volatile Organic Compounds) sensors. Sensors that need to detect relevant parameters of the external environment can be set up like temperature sensor component 2. Multiple sensors can be set up in one component at the same time, or they can be set up in different components.

[0077] The method for determining the indoor temperature of the wired controller in this application is described below; refer to Figure 4 The indoor temperature detection method is performed by the aforementioned wired controller body 1, and the indoor unit return air temperature is obtained by the wired controller body 1 from the control device inside the indoor unit. The method includes the following steps:

[0078] Step S10: Determine if the temperature sensor of the wired controller is malfunctioning;

[0079] The wired controller is used to collect relevant parameters during the operation of the unit, such as indoor temperature and humidity. The indoor parameters collected by the wired controller are sent to the unit so that the unit can adjust the temperature based on the indoor parameters.

[0080] Temperature sensors are used to detect indoor temperature. The specific type and model of the temperature sensor can be set based on actual needs.

[0081] When the temperature sensor malfunctions, the control components inside the wired controller, such as the controller body, will be unable to communicate with the temperature sensor. Therefore, the malfunction of the temperature sensor can be determined by checking the communication status with it. Other methods can also be used to determine if the temperature sensor is malfunctioning, such as if the indoor temperature detected by the temperature sensor is obviously incorrect. The specific error judgment method can be set based on the characteristics of the temperature sensor.

[0082] When the temperature sensor malfunctions, a fault indication will be issued to remind the user that the temperature sensor is faulty and needs to be replaced. The fault indication can be displayed on the screen of the online controller or sent to the corresponding user terminal.

[0083] Step S20: If the temperature sensor of the wired controller is abnormal, obtain the indoor unit return air temperature associated with the wired controller;

[0084] If the temperature sensor of the wired controller is normal, the temperature value monitored by the temperature sensor will be used as the indoor temperature.

[0085] When the temperature sensor of the wired controller malfunctions, the wired controller cannot directly monitor the indoor temperature. Therefore, in order to ensure the normal operation of the unit, it is necessary to determine the indoor temperature through other means. In this embodiment, the indoor temperature is determined by the return air temperature of the indoor unit associated with the wired controller.

[0086] The indoor unit return air temperature is the temperature at the indoor unit's return air vent. Temperature sensors, such as temperature sensors, are installed at the return air vent of the indoor unit to detect the indoor unit's return air temperature.

[0087] The wired controller establishes a communication connection with the indoor unit's control device to obtain the indoor unit's return air temperature.

[0088] Step S30: Obtain temperature correlation data, wherein the temperature correlation data is obtained from the historical indoor unit return air temperature and the historical indoor temperature.

[0089] Step S40: Determine the indoor temperature corresponding to the indoor unit return air temperature using the temperature correlation data.

[0090] Within the same space, the operating status of the air conditioner has a roughly similar effect on regulating the indoor temperature; therefore, there is a correlation between the indoor unit return air temperature and the indoor temperature. The indoor unit return air temperature indicates the operating status of the air conditioner. Thus, after determining the temperature correlation data, the indoor temperature corresponding to the indoor return air temperature can be obtained based on the temperature correlation data.

[0091] The historical indoor unit return air temperature is the indoor unit return air temperature previously obtained by the wired controller; the historical indoor unit return air temperature can be obtained periodically, or when the unit is turned on, turned off, or when the indoor unit return air temperature changes.

[0092] Historical indoor temperatures are the indoor temperatures previously detected by the wired controller via a temperature sensor.

[0093] Both historical indoor unit return air temperature and historical indoor temperature have a definite collection time. There is a correlation between historical indoor unit return air temperature and historical indoor temperature collected at the same time. Therefore, temperature correlation data can be obtained based on the correspondence of collection time.

[0094] It should be noted that the specific temperature may vary at different locations within the same space. For example, when the air conditioner is on, the temperature near the indoor unit's air outlet may be higher or lower depending on the air conditioner's operating mode. In cooling mode, the temperature near the indoor unit's air outlet is lower, while the temperature further away from the air outlet is higher. Therefore, the indoor temperature mentioned in this embodiment and subsequent embodiments refers to the temperature at the location of the temperature sensor on the wired controller. It can be understood that the unit regulates the temperature based on the indoor temperature at the location of the temperature sensor. When the temperature sensor malfunctions, in order to ensure the consistency of unit control, the indoor temperature determined based on the indoor unit's return air temperature also indicates the temperature at the location of the temperature sensor.

[0095] In this embodiment, when the temperature sensor of the online controller malfunctions, the indoor temperature can be determined by the return air temperature of the indoor unit. At the same time, based on the temperature correlation data obtained from the historical indoor unit return air temperature and the historical indoor temperature, the correlation between the indoor unit return air temperature and the indoor temperature can be accurately determined. Therefore, the indoor temperature can be accurately determined by the return air temperature of the indoor unit.

[0096] Furthermore, we will participate together later. Figure 5 In the second embodiment of the indoor temperature detection method of the present invention based on the first embodiment, step S30 includes the following steps:

[0097] Step S31: Determine the current operating mode of the indoor unit;

[0098] Step S32: Match the temperature-related data corresponding to the current operating mode, wherein the temperature-related data under different operating modes is obtained by the historical indoor unit return air temperature and the historical indoor temperature recorded under the corresponding operating mode.

[0099] The current operating mode is the air conditioner's real-time operating mode; operating modes include cooling mode, heating mode, and off.

[0100] Different operating modes result in varying effects on temperature control within the space, leading to different correlations between the indoor unit's return air temperature and the indoor temperature. Therefore, to adapt to different operating modes, this embodiment sets corresponding temperature correlation data for each mode: independent temperature correlation data is set for cooling mode, independent temperature correlation data is set for heating mode, and independent temperature correlation data is set for shutdown mode. Furthermore, the temperature correlation data for each mode is obtained based on the historical indoor unit return air temperature and the historical indoor temperature acquired under that mode. For example, the historical indoor unit return air temperature and the historical indoor temperature acquired in cooling mode are used to generate the temperature correlation data corresponding to the cooling mode.

[0101] When it is necessary to obtain temperature-related data, the temperature-related data under the corresponding operating mode is obtained based on the current operating mode.

[0102] Furthermore, more temperature-related data can be set to match more specific application scenarios; for example, generating corresponding temperature-related data based on outdoor ambient temperature and operating mode; for example, using the historical indoor unit return air temperature obtained when the outdoor environment is 30℃ and the operating mode is cooling, and the historical indoor temperature, to generate temperature-related data corresponding to an outdoor environment of 30℃ and cooling mode; when temperature-related data needs to be obtained when the outdoor environment is 30℃ and the operating mode is cooling mode, then the temperature-related data for that outdoor environment and cooling mode is obtained; it is understood that setting temperature-related data for more specific scenario types can improve the accuracy of the correlation between indoor unit return air temperature and indoor temperature in more specific application scenarios, but the higher the requirement for the amount of data collected in the early stage, the more appropriate the number of temperature-related data and the specific scenario type can be set based on actual needs; specific considerations for scenario types may also include humidity, wind speed, and air outlet direction.

[0103] This embodiment sets corresponding temperature correlation data for specific operating modes, so that the temperature correlation data can be matched with different application scenarios, thereby improving the accuracy of the correlation between indoor unit return air temperature and indoor temperature.

[0104] Furthermore, in the third embodiment of the indoor temperature detection method of the present invention based on the first embodiment, step S40 includes the following steps:

[0105] Step S41: Determine whether there are multiple indoor unit return air temperatures;

[0106] Step S42: If there are multiple indoor unit return air temperatures, calculate the average return air temperature of the multiple indoor unit return air temperatures;

[0107] Step S43: Determine the indoor temperature corresponding to the average return air temperature using the temperature correlation data.

[0108] Based on indoor temperature requirements, the number of indoor units installed in a space may be one or more. When there is only one indoor unit, temperature correlation data is obtained based on the historical return air temperature of that indoor unit, and the corresponding indoor temperature can be determined based on this temperature correlation data and the corresponding return air temperature of that indoor unit. When there are multiple indoor units, to facilitate calculation and improve accuracy, temperature correlation data is obtained based on the historical return air temperature of each indoor unit, and the corresponding indoor temperature can be determined based on this temperature correlation data and the average return air temperature of that indoor unit. The average return air temperature is the average of the return air temperatures of all indoor units.

[0109] Furthermore, when calculating the average return air temperature, a weighted average method can be used; the distance between the air outlet of each indoor unit and the temperature sensor is obtained in advance. The closer the indoor unit is, the greater its influence on the temperature at the location of the temperature sensor. Therefore, the closer the indoor unit is, the higher its weight.

[0110] In other embodiments, temperature correlation data can be jointly constructed based on the historical return air temperature of each indoor unit, and the indoor temperature corresponding to the return air temperature of each indoor unit can be determined based on the temperature correlation data.

[0111] Furthermore, in the fourth embodiment of the indoor temperature detection method of the present invention based on the first embodiment, the method further includes the following steps:

[0112] Step S50: Obtain the historical indoor temperature and the historical indoor unit return air temperature detected by the temperature sensor;

[0113] Step S60: Fit the historical indoor temperature and the historical indoor unit return air temperature to obtain a temperature relationship curve;

[0114] Step S70: Use the temperature relationship curve as the temperature correlation data.

[0115] In this embodiment, the correlation between the indoor unit return air temperature and the indoor temperature is characterized by fitting a temperature relationship curve. The fitting method of the temperature relationship curve can be set according to actual needs, such as the least squares method. Specifically, the indoor unit return air temperature is taken as the independent variable x, and the indoor temperature detected by the temperature sensor of the wired controller is taken as the dependent variable y. The indoor temperature and the indoor unit return air temperature satisfy the temperature relationship curve y = ax + b. The coefficients a and b are calculated from the historical indoor unit return air temperature and the historical indoor temperature. Where:

[0116]

[0117] Where n is the number of data points; x i Let y be the return air temperature of the i-th indoor unit. i Let be the i-th indoor temperature.

[0118] Once coefficients a and b are determined, the other can be determined based on either the indoor unit return air temperature or the indoor temperature. For example, the temperature relationship curve in heating mode is y = 0.997x - 1.842; the temperature relationship curve in cooling mode is y = 1.017x - 1.273; and the temperature relationship curve in shutdown mode is y = 1.034x - 0.98.

[0119] In this embodiment, the relationship between the indoor unit return air temperature and the indoor temperature can be clearly characterized by setting a temperature relationship curve.

[0120] Furthermore, in the fifth embodiment of the indoor temperature detection method of the present invention based on the first embodiment, the method further includes the following steps:

[0121] Step S80: At preset collection intervals, acquire the real-time indoor temperature and real-time indoor unit return air temperature detected by the temperature sensor.

[0122] Step S90: Determine the current operating mode of the indoor unit and match the temperature-related data corresponding to the current operating mode;

[0123] Step S100: Update the temperature correlation data using the real-time indoor temperature and the real-time indoor unit return air temperature.

[0124] The preset collection time is used to indicate the period for acquiring new data; the specific value of the preset collection time can be set according to actual needs, such as 10 minutes.

[0125] When the temperature sensor of the online controller is operating normally, it acquires the real-time indoor temperature and the real-time indoor unit return air temperature at preset acquisition intervals; and recalculates coefficients a and b based on the newly acquired real-time indoor temperature and the real-time indoor unit return air temperature, as well as the previously acquired historical indoor temperature and historical indoor unit return air temperature, to update the temperature relationship curve.

[0126] In the event of a malfunction in the temperature sensor of the online controller, the actual detected real-time indoor temperature cannot be directly obtained, therefore, the temperature-related data will no longer be updated.

[0127] It is understandable that real-time data collected in specific application scenarios is used to update the corresponding temperature-related data for that application scenario; for example, real-time indoor temperature and real-time indoor unit return air temperature collected in cooling mode are used to update the temperature-related data corresponding to the cooling mode.

[0128] In this embodiment, the temperature correlation data is updated by periodically acquiring real-time data, thereby improving the accuracy of the temperature correlation data.

[0129] Furthermore, in the sixth embodiment of the indoor temperature detection method of the present invention based on the first embodiment, step S20 includes the following steps:

[0130] Step S21: If the temperature sensor of the wired controller is abnormal, then obtain the return air operation status of the return air temperature sensor of the indoor unit associated with the wired controller.

[0131] Step S22: Determine whether the return air operation status is abnormal;

[0132] Step S23: If the return air operation status is abnormal, an alarm operation is performed;

[0133] Step S24: If the return air operation status is normal, then obtain the return air temperature of the indoor unit detected by the return air temperature sensor.

[0134] If the return air operation status is abnormal, an alarm operation will be executed.

[0135] The return air operation status indicates the effectiveness of the indoor unit's return air temperature detection. When the return air inlet temperature sensor of the indoor unit malfunctions or the communication between the wired controller and the indoor unit is interrupted, the wired controller cannot obtain an accurate return air temperature of the indoor unit. In this case, the indoor temperature cannot be determined from the return air temperature of the indoor unit. Therefore, in this situation, an alarm operation is performed to remind the user to replace the temperature sensor in time and troubleshoot related abnormalities.

[0136] When the return air operation is normal, the wired controller can obtain the accurate return air temperature of the indoor unit and determine the indoor temperature based on the return air temperature of the indoor unit.

[0137] Specifically, after the wired controller is powered on, if an abnormality is detected in the temperature sensor, it will remain in the state and wait for the air conditioner to start. After the air conditioner is started, if the return air operation is normal, it will issue a temperature sensor abnormality reminder, and after the user chooses to ignore it, it will determine the indoor temperature through the indoor unit's return air temperature. If the return air operation is abnormal, it will maintain the abnormality reminder and will not determine the indoor temperature through the indoor unit's return air temperature.

[0138] This embodiment ensures that the indoor temperature can be determined when the return air temperature of the indoor unit is obtained.

[0139] In this utility model, the terms "first", "second", "third", "fourth" and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0140] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0141] Although embodiments of the present invention have been shown and described above, the scope of protection of the present invention is not limited thereto. It is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, and substitutions to the above embodiments within the scope of the present invention, and such changes, modifications, and substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the claims.

Claims

1. A wired controller, characterized in that, The wired controller includes a detachable main body and a temperature sensor component; wherein, the main body houses the main board of the wired controller, the temperature sensor component houses the temperature sensor, and the main board of the wired controller is communicatively connected to the temperature sensor; the main board of the wired controller is also communicatively connected to the control device inside the indoor unit.

2. The wired controller as described in claim 1, characterized in that, The wired controller body and the temperature sensor component are connected by a snap-fit ​​mechanism.

3. The wired controller as described in claim 1, characterized in that, The main body of the wired controller includes a wired controller housing, a wired controller main board, and multiple elastic pins; wherein: The main board of the wired controller is disposed inside the housing of the wired controller, and the elastic pin is disposed in the opening on the housing of the wired controller; the wiring terminals of the main board of the wired controller are connected to the corresponding elastic pins one by one through wires. The temperature sensor component includes a sensor housing, the temperature sensor itself, and multiple copper plates; wherein: The temperature sensor is disposed inside the sensor housing, and the copper sheet is disposed on the sensor housing; the terminals of the temperature sensor are connected to the copper sheet one by one via wires. When the wired controller body is connected to the temperature sensor component, the elastic pin is connected to the copper sheet in a one-to-one correspondence.

4. The wired controller as described in claim 3, characterized in that, The opening on the wired controller housing matches the elastic pin, and the wired controller housing and the elastic pin form an internal sealed space, in which the wired controller mainboard is located.

5. The wired controller as described in claim 1, characterized in that, The temperature sensor component includes a sensor housing and the temperature sensor; wherein: The sensor housing has multiple ventilation holes, and the interior of the sensor housing is connected to the external environment through the ventilation holes.

6. The wired controller as described in claim 5, characterized in that, The number of ventilation holes is 2, and a ventilation channel is formed between the two ventilation holes; The temperature sensor is located on the ventilation channel.

7. The wired controller as described in claim 6, characterized in that, The temperature sensor includes a sensor motherboard and a detection circuit, with the detection circuit disposed on the sensor motherboard; The detection circuit is located on the ventilation channel.

8. The wired controller as described in claim 1, characterized in that, The wired controller body includes a wired controller housing; the temperature sensor component includes a sensor housing; wherein: The back of the wired controller housing is provided with a groove that matches the sensor housing; the thickness of the sensor housing is less than the thickness of the wired controller housing.

9. The wired controller as described in claim 8, characterized in that, The groove is provided on the back corner of the wired controller housing; the back, first side, and second side of the sensor housing are in contact with the groove, a ventilation hole is provided on the third side of the sensor housing, and a ventilation hole is provided on the fourth side of the sensor housing.

10. The wired controller as claimed in claim 1, characterized in that, The wired controller also includes a gas sensor component, which is detachably mounted from the main body of the wired controller.

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