Image acquisition device for three-dimensional mining seepage simulation experiment

Abstract

The utility model relates to the technical field of image acquisition equipment for a three-dimensional mining seepage simulation experiment, and discloses an image acquisition device for a three-dimensional mining seepage simulation experiment. Comprising a supporting base, the top surface of the supporting base is fixedly connected with a laser through a supporting rod, the device further comprises a moving plate arranged on the top surface of the supporting base, the bottom surface of the moving plate is fixedly connected with a clamping and embedding block, and the top surface of the moving plate is movably connected with a rotating rod through a bearing; the outer side surface of the rotating rod is fixedly connected with a limiting mechanism through a connecting rod, and the top end of the rotating rod is fixedly connected with a CCD camera. The cold air cover is arranged on the surface of the bottom of the CCD camera, a heat dissipation cover is arranged below the cold air cover, the CCD camera for image acquisition can move left and right and rotate through the arrangement of the moving plate, the clamping and embedding block, the rotating rod and the limiting mechanism, and the CCD camera can be adjusted in a humanized mode.

Description

Technical Field

[0001] This utility model relates to the technical field of image acquisition equipment for three-dimensional mining-induced seepage simulation experiments, specifically an image acquisition device for three-dimensional mining-induced seepage simulation experiments. Background Technology

[0002] The flow of water in fractured rock masses differs greatly from its flow in porous soil. This is manifested in the high dispersion of seepage in rock masses, significant anisotropy, major influence of stress environment, and actual flow velocity that is several orders of magnitude larger than Darcy's velocity.

[0003] To better understand the flow characteristics of water in fractured rock masses, simulation experiments are usually used. In three-dimensional mining-induced seepage simulation experiments, image acquisition equipment is required. The most common image acquisition equipment is a CCD camera. The CCD camera records speckle images under laser irradiation before and after deformation, as well as the dynamic laser surface formed by the seepage field to be measured marked with tracers. However, the existing CCD cameras used for image acquisition are inconvenient to adjust the left and right position and rotation angle during use. Moreover, the heat dissipation effect of the CCD camera is generally not good. The maintenance and replacement of the semiconductor cooling chip used for heat dissipation is not user-friendly and is not conducive to its widespread use. Utility Model Content

[0004] The purpose of this invention is to provide an image acquisition device for a three-dimensional mining and seepage simulation experiment, so as to solve the problems of inconvenient adjustment of the position and rotation angle of the CCD camera and the lack of user-friendly maintenance and replacement of the semiconductor cooling chip used for heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an image acquisition device for a three-dimensional mining-induced seepage simulation experiment, comprising a support base, wherein a laser is fixedly connected to the top surface of the support base via a support rod, and further comprising:

[0006] A motion plate is set on the top surface of the support base. A snap-fit ​​block is fixedly connected to the bottom surface of the motion plate. A rotating rod is movably connected to the top surface of the motion plate through a bearing. A limit mechanism is fixedly connected to the outer surface of the rotating rod through a connecting rod. A CCD camera is fixedly connected to the top of the rotating rod.

[0007] A cooling shroud is installed on the bottom surface of the CCD camera. A heat dissipation shroud is located below the cooling shroud. A cooling mechanism is provided between the heat dissipation shroud and the cooling shroud. The cooling mechanism includes a clip box fixedly connected to the opposite side surfaces of the cooling shroud and the heat dissipation shroud. A guide rail box is provided on one side surface of the clip box. A lead screw is provided inside the guide rail box. A motion frame is slidably connected to the opposite side surfaces of the guide rail box and the clip box. A semiconductor cooling chip is movably connected inside the motion frame.

[0008] Preferably, the top surface of the motion plate is threaded with a set screw, the top surface of the support base is provided with a threaded hole that matches the size of the set screw, and the top surface of the support base is provided with a slot that matches the size of the insert block.

[0009] Preferably, the limiting mechanism includes a limiting box fixedly connected to the outer surface of the rotating rod via a connecting rod, a square plate being slidably connected to the inner cavity of the limiting box, a limiting post being fixedly connected through the top surface of the square plate, and a limiting spring being fixedly connected to the top surface of the square plate.

[0010] Preferably, the top and bottom ends of the limiting post are movably connected to the limiting box, and the top surface of the moving plate is provided with a limiting hole that matches the structural size of the limiting post.

[0011] Preferably, an exhaust motor is fixedly connected to the opposite side surface of the inner cavity of the cold air cover and the heat sink cover, and an exhaust fan blade is fixedly connected to the output end of the exhaust motor.

[0012] Preferably, the front end of the lead screw is movably connected to the guide rail box through a bearing, the front end of the lead screw has a square groove, and the rear end of the lead screw is movably connected to the guide rail box through a bearing.

[0013] Preferably, a first sliding block is fixedly connected to one side surface of the motion frame, and a groove matching the structural size of the first sliding block is opened on the side surface of the card box near the guide rail box. A second sliding block is fixedly connected to the side surface of the motion frame away from the first sliding block. The second sliding block is threadedly connected to the outer surface of the lead screw body, and a groove matching the structural size of the second sliding block is opened on the side surface of the guide rail box near the motion frame.

[0014] Preferably, open slots are provided on both sides of the inner cavity of the motion frame, and upper and lower rods are slidably connected to the inner cavity of the open slots. A tensioning spring is fixedly connected to the top surface of the upper and lower rods, and a tensioning plate is fixedly connected to the bottom surface of the upper and lower rods. The bottom surface of the tensioning plate is slidably connected to the cooling surface of the semiconductor refrigeration chip.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This invention, by incorporating a motion plate, a locking block, a rotating rod, and a limiting mechanism, allows for left-right and rotational movement of the CCD camera used for image acquisition, enabling user-friendly adjustment of the CCD camera. Furthermore, by including a cooling shroud, a heat dissipation shroud, and a cooling mechanism, it can better dissipate heat from the CCD camera, extending its service life and facilitating the inspection and replacement of the semiconductor cooling chip. Attached Figure Description

[0017] Figure 1 A schematic diagram of a preferred embodiment of the image acquisition device for three-dimensional mining seepage simulation experiment provided by this utility model;

[0018] Figure 2 A schematic diagram showing the details of the limiting mechanism provided by this utility model;

[0019] Figure 3 A structural schematic diagram showing the disassembly details of the cold air cover, heat dissipation cover, and refrigeration mechanism provided by this utility model;

[0020] Figure 4 A schematic diagram of the structure of the refrigeration mechanism provided by this utility model, in which the semiconductor refrigeration chip is removed.

[0021] In the diagram: 1. Support base; 2. Laser; 3. Motion plate; 4. Insert block; 5. Rotating rod; 6. Limiting mechanism; 61. Limiting box; 62. Square plate; 63. Limiting post; 64. Limiting spring; 7. CCD camera; 8. Cooling shroud; 9. Heat sink; 10. Cooling mechanism; 101. Insert box; 102. Guide rail box; 103. Lead screw body; 104. Motion frame; 105. Semiconductor cooling chip; 11. Top screw; 12. Exhaust motor; 13. Exhaust fan blade; 14. First sliding block; 15. Second sliding block; 16. Open slot; 17. Upper and lower rods; 18. Tightening spring; 19. Tightening plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4As shown, an image acquisition device for a three-dimensional mining-induced seepage simulation experiment includes a support base 1. A laser 2 is fixedly connected to the top surface of the support base 1 via a support rod. A moving plate 3 is disposed on the top surface of the support base 1. A set screw 11 is threadedly connected to the top surface of the moving plate 3. A threaded hole matching the structural dimensions of the set screw 11 is opened on the top surface of the support base 1. A locking block 4 is fixedly connected to the bottom surface of the moving plate 3. A slot matching the structural dimensions of the locking block 4 is opened on the top surface of the support base 1. The moving plate 3 slides on the support base 1 via the locking block 4 and is inserted into the corresponding threaded hole via the set screw 11 to limit the position of the moving plate 3. A rotating rod 5 is movably connected to the top surface of the moving plate 3 via a bearing. A limit mechanism 6 is fixedly connected to the outer surface of the rotating rod 5 via a connecting rod. A CCD camera 7 is fixedly connected to the top of the rotating rod 5.

[0024] like Figure 2 As shown, the limiting mechanism 6 includes a limiting box 61 fixedly connected to the outer surface of the rotating rod 5 via a connecting rod. A square plate 62 is slidably connected to the inner cavity of the limiting box 61. A limiting post 63 is fixedly connected through the top surface of the square plate 62. A limiting spring 64 is fixedly connected through the top surface of the square plate 62. The top and bottom ends of the limiting post 63 are movably connected through the limiting box 61. A limiting hole matching the structural size of the limiting post 63 is opened on the top surface of the moving plate 3. The limiting post 63 is inserted into the corresponding limiting hole to limit the position of the combination of the limiting box 61 and the rotating rod 5.

[0025] like Figure 3 and Figure 4As shown, a cooling shroud 8 is disposed on the bottom surface of the CCD camera 7, and a heat dissipation shroud 9 is disposed below the cooling shroud 8. Exhaust motors 12 are fixedly connected to the opposite sides of the inner cavities of both the cooling shroud 8 and the heat dissipation shroud 9. Exhaust fan blades 13 are fixedly connected to the output end of the exhaust motors 12. The exhaust motors 12 in the cooling shroud 8 drive the exhaust fan blades 13 to rotate, drawing out the cold air generated by the semiconductor cooling chip 105, forming cold air to perform cold air cooling operation on the CCD camera 7. The exhaust motors 12 in the heat dissipation shroud 9 drive the exhaust fan blades 13 to rotate, drawing out the heat generated by the heating surface of the semiconductor cooling chip 105, which is beneficial to the normal operation of the semiconductor cooling chip 105. A cooling mechanism 10 is disposed between the heat dissipation shroud 9 and the cooling shroud 8. The cooling mechanism 10 includes components fixedly connected to the opposite sides of the cooling shroud 8 and the heat dissipation shroud 9. The surface of the card holder 101 has a guide rail box 102 on one side. The top and bottom surfaces of the guide rail box 102 are fixedly connected to the cold air cover 8 and the heat dissipation cover 9, respectively. A baffle is fixedly connected to the opposite side surface of the guide rail box 102 and the card holder 101. The width of the baffle is the same as the width of the motion frame 104. The height of the baffle, the height of the card holder 101 and the height of the guide rail box 102 are the same. A lead screw 103 is provided in the inner cavity of the guide rail box 102. The motion frame 104 is slidably connected to the opposite side surface of the guide rail box 102 and the card holder 101. A semiconductor cooling chip 105 is movably connected to the inner cavity of the motion frame 104. The cooling surface of the semiconductor cooling chip 105 faces the cold air cover 8 and the heat generating surface of the semiconductor cooling chip 105 faces the heat dissipation cover 9.

[0026] like Figure 4As shown, the front end of the lead screw 103 is movably connected to the guide rail box 102 via a bearing. A square groove is formed at the front end of the lead screw 103. The rear end of the lead screw 103 is movably connected to the guide rail box 102 via a bearing. A first sliding block 14 is fixedly connected to one side surface of the motion frame 104. A groove matching the structural dimensions of the first sliding block 14 is formed on the surface of the locking box 101 near the guide rail box 102. A second sliding block 15 is fixedly connected to the surface of the motion frame 104 away from the first sliding block 14. The second sliding block 15 is threadedly connected to the outer surface of the lead screw 103. A groove matching the structural dimensions of the second sliding block 15 is formed on the surface of the guide rail box 102 near the motion frame 104. A flathead screwdriver is inserted into the square groove at the front end of the lead screw 103. In the slot, the lead screw 103 is rotated. At this time, with the rotation of the lead screw 103, the second sliding block 15, the first sliding block 14 and the motion frame 104 move in the direction of the guide box 102, which is conducive to the maintenance and replacement of the semiconductor refrigeration chip 105. Open slots 16 are opened on both sides of the inner cavity of the motion frame 104. The upper and lower rods 17 are slidably connected in the inner cavity of the open slots 16. The top surface of the upper and lower rods 17 is fixedly connected to the top spring 18, and the bottom surface of the upper and lower rods 17 is fixedly connected to the bottom plate 19. The bottom surface of the bottom plate 19 is slidably connected to the cooling surface of the semiconductor refrigeration chip 105. Under the action of the top spring 18, the bottom surface of the bottom plate 19 presses against the cooling surface of the semiconductor refrigeration chip 105 to ensure the stability of the semiconductor refrigeration chip 105 during operation.

[0027] It is worth noting that an image system is required in the three-dimensional mining-induced seepage simulation experiment. The particle image velocimetry system is manufactured by LaVision GmbH in Germany and includes a laser 2, a CCD camera 7, a PTU synchronous control system and a computer. The CCD camera 7 records speckle images under laser irradiation before and after deformation, as well as the dynamic laser surface formed by the test seepage field, which is marked by bright fluorescence under natural indoor light conditions after laser excitation by the tracer Nile Red fluorescent tracer. The computer processes each frame of image obtained by the CCD camera 7 to obtain the mining-induced fracture field and seepage field on the same slice, establishes a three-dimensional model, and realizes non-embedded visualization observation inside the model.

[0028] Working principle: In use, place the support base 1 in a suitable position, then start the laser 2 and CCD camera 7 to acquire images. Before using the CCD camera 7, the set screw 11 can be removed as needed. The moving plate 3 slides on the support base 1 via the locking block 4, and then the set screw 11 is inserted into the corresponding threaded hole to change the left and right positions of the moving plate 3 and CCD camera 7. Further, pull out the limiting post 63 protruding from the top of the limiting box 61, driving the square plate 62 to move. At this time, the limiting spring 64 deforms, and the limiting post 63 leaves the limiting hole on the surface of the moving plate 3, causing the rotating rod 5 and CCD camera 7 assembly to rotate. Then, release the limiting post 63, at which point the limiting spring 64 deforms. 4. Restore the original state and drive the movement of the combination of square plate 62 and limiting post 63. Insert the limiting post 63 into the corresponding limiting hole to adjust the rotation angle of CCD camera 7. Further, start the semiconductor cooling chip 105 and the two exhaust motors 12 to cool the CCD camera 7 with cold air. If it is necessary to repair or replace the semiconductor cooling chip 105, insert a flathead screwdriver into the square groove at the front end of the lead screw 103 and rotate the lead screw 103. At this time, as the lead screw 103 rotates, the second sliding block 15, the first sliding block 14 and the moving frame 104 move forward. The moving frame 104 gradually extends. At this time, the top plate 19 can be pulled up to repair or replace the semiconductor cooling chip 105.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An image acquisition device for a three-dimensional mining-induced seepage simulation experiment, comprising a support base (1), wherein a laser (2) is fixedly connected to the top surface of the support base (1) via a support rod, characterized in that, Also includes: A motion plate (3) is set on the top surface of the support base (1). A snap-fit ​​block (4) is fixedly connected to the bottom surface of the motion plate (3). A rotating rod (5) is movably connected to the top surface of the motion plate (3) through a bearing. A limit mechanism (6) is fixedly connected to the outer surface of the rotating rod (5) through a connecting rod. A CCD camera (7) is fixedly connected to the top of the rotating rod (5). A cooling shroud (8) is disposed on the bottom surface of the CCD camera (7). A heat sink (9) is disposed below the cooling shroud (8). A cooling mechanism (10) is disposed between the heat sink (9) and the cooling shroud (8). The cooling mechanism (10) includes a clip box (101) fixedly connected to the opposite side surfaces of the cooling shroud (8) and the heat sink (9). A guide box (102) is disposed on one side surface of the clip box (101). A lead screw (103) is disposed inside the guide box (102). A motion frame (104) is slidably connected to the opposite side surfaces of the guide box (102) and the clip box (101). A semiconductor cooling chip (105) is movably connected to the inner cavity of the motion frame (104).

2. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: The top surface of the motion plate (3) is threaded with a set screw (11), the top surface of the support base (1) is provided with a threaded hole that matches the structural size of the set screw (11), and the top surface of the support base (1) is provided with a slot that matches the structural size of the insert block (4).

3. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: The limiting mechanism (6) includes a limiting box (61) fixedly connected to the outer surface of the rotating rod (5) via a connecting rod. A square plate (62) is slidably connected to the inner cavity of the limiting box (61). A limiting post (63) is fixedly connected through the top surface of the square plate (62). A limiting spring (64) is fixedly connected to the top surface of the square plate (62).

4. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 3, characterized in that: The top and bottom ends of the limiting post (63) are movably connected to the limiting box (61), and the top surface of the moving plate (3) is provided with a limiting hole that matches the structural size of the limiting post (63).

5. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: The inner surfaces of the cold air cover (8) and the heat dissipation cover (9) are both fixedly connected to exhaust motors (12), and the output end of the exhaust motors (12) is fixedly connected to exhaust fan blades (13).

6. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: The front end of the lead screw (103) is movably connected to the guide rail box (102) through a bearing. The front end of the lead screw (103) is provided with a square groove. The rear end of the lead screw (103) is movably connected to the guide rail box (102) through a bearing.

7. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: A first sliding block (14) is fixedly connected to one side surface of the motion frame (104). The card holder (101) has a groove on the side surface near the guide rail box (102) that matches the structural size of the first sliding block (14). A second sliding block (15) is fixedly connected to the side surface of the motion frame (104) away from the first sliding block (14). The second sliding block (15) is threadedly connected to the outer surface of the lead screw body (103). The guide rail box (102) has a groove on the side surface near the motion frame (104) that matches the structural size of the second sliding block (15).

8. The image acquisition device for a three-dimensional mining-induced seepage simulation experiment according to claim 1, characterized in that: The inner cavity of the motion frame (104) is provided with open slots (16) on both sides. The upper and lower rods (17) are slidably connected to the inner cavity of the open slots (16). The top surface of the upper and lower rods (17) is fixedly connected with a top spring (18). The bottom surface of the upper and lower rods (17) is fixedly connected with a top plate (19). The bottom surface of the top plate (19) is slidably connected to the cooling surface of the semiconductor cooling chip (105).

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