All-in-one machine with mainboard heat dissipation function

Abstract

The utility model relates to the technical field of computers, and discloses an all-in-one machine with a mainboard heat dissipation function, a plurality of heating elements are integrated on a mainboard, a heat conducting sheet is attached to the upper surface of each heating element, at least one heat conducting pipe is connected between every two adjacent heat conducting sheets, an air inlet and an air outlet are formed in the two sides of a shell respectively, and the air inlet and the air outlet are communicated with each other. According to the all-in-one machine with the mainboard heat dissipation function, through heat exchange between the heat conduction pieces and the heating elements, heat generated when the heating elements work can be rapidly taken away and conducted to the heat conduction pipes which are in lap joint with the heat conduction pieces. External cold air can be introduced into the shell through the air inlet device, and hot air in the shell is discharged out of the shell through the air outlet device, so that air circulation is formed, and heat in the shell is reduced. Therefore, the high-performance operation state of the host module can be maintained for a long time, and the service life of the host module can be effectively prolonged.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to an all-in-one machine with motherboard heat dissipation function. Background Technology

[0002] With the rapid development of computer technology, all-in-one computers are increasingly favored by users due to their convenience, aesthetics, and high integration. For example, invention application CN113721709A discloses a similar all-in-one computer.

[0003] The aforementioned all-in-one PC mainly consists of a display module and a host module installed at the bottom of the display module. The host module primarily comprises a housing and a motherboard housed within the housing. The motherboard integrates numerous heat-generating components, such as the CPU, GPU, memory, and chipset. These components release a significant amount of heat during operation, and due to the limited space within the housing, poor heat dissipation is a common problem. Over time, this can lead to a decline in the host module's performance, and even system crashes, impacting work efficiency and shortening the device's lifespan. Therefore, improvements are needed. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing an all-in-one machine with motherboard heat dissipation function, which can quickly remove and expel the heat generated by the heat-generating components on the motherboard from the casing, thereby increasing the stability and service life of the equipment.

[0005] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:

[0006] An all-in-one computer with motherboard heat dissipation function includes a display module and a host module disposed at the bottom of the display module. The host module includes a housing and a motherboard horizontally disposed within the housing. Several heat-generating elements are integrated on the motherboard. A heat-conducting fin is attached to the upper surface of each heat-conducting element. At least one heat-conducting pipe is connected between adjacent heat-conducting fins. An air inlet and an air outlet are respectively provided on both sides of the housing. An air inlet device is installed at the air inlet to introduce cold air from the outside into the housing, and an air outlet device is installed at the air outlet to exhaust hot air from the housing.

[0007] By employing the above solution, heat generated during the operation of the heating element can be rapidly dissipated and conducted to the overlapping heat pipes through heat exchange between the heat-conducting plate and the heating element. An air intake device introduces cool outside air into the housing, while an exhaust device expels hot air from inside the housing, creating air circulation to reduce the heat inside the housing. The increased contact area between the heat pipes and the circulating airflow within the housing results in better heat exchange, further enhancing the cooling effect of the heating element. This not only maintains the high-performance operation of the main module for extended periods but also effectively extends its service life.

[0008] Preferably, a thermally conductive silicone pad is provided between the heat-conducting sheet and the heating element.

[0009] By adopting the above solution, the thermally conductive silicone pad can fill the tiny gaps between the thermally conductive sheet and the heating element, thereby improving the heat exchange efficiency between the two and further enhancing the cooling effect of the heating element.

[0010] Preferably, the upper surface of the heat-conducting sheet is provided with a slot for the heat-conducting pipe to be engaged and is covered with a cap to prevent the heat-conducting pipe from falling out of the slot.

[0011] Using the above solution, the slot allows for pre-positioning of the heat pipe on the heat-conducting plate, thereby improving the installation efficiency and convenience of the heat pipe. The cap locks the heat pipe onto the heat-conducting plate, ensuring the stability of the heat pipe installation.

[0012] Preferably, the upper surface of the motherboard is provided with first positioning posts on both sides of the heating element, and the heat-conducting plate is provided with first ears on both sides. Each of the two first ears has a positioning hole through which the two first positioning posts are inserted. Each of the two sides of the cover is provided with a second ear that covers the two first ears respectively. The second ear is provided with a first screw threaded to the end of the first positioning post to lock the first ear onto the motherboard and lock the second ear onto the first ear.

[0013] Using the above scheme, the insertion and engagement between the first positioning post and the positioning hole enables pre-positioning of the heat-conducting plate during installation, thereby improving its installation efficiency and accuracy. The first screw sequentially locks the second lug onto the motherboard, thus completing the simultaneous locking of the cover and the heat-conducting plate, further improving installation efficiency and convenience.

[0014] Preferably, the lower surface of the second ear is provided with a second positioning post for the first screw to pass through and be inserted into the upper port of the positioning hole.

[0015] By adopting the above scheme, the second positioning post can not only achieve the pre-positioning of the cover on the heat-conducting plate, thereby improving the installation efficiency and accuracy of the cover, but also achieve the limiting by abutting the end of the first positioning post, preventing the first lug from being excessively squeezed by the first screw and causing the heat-conducting plate to excessively compress the heating element, thereby avoiding damage to the heating element.

[0016] Preferably, the lower end of the first positioning post is fixed to the motherboard by a second screw.

[0017] By adopting the above solution, the first positioning post can be securely installed on the motherboard, further improving the installation stability of the heat-conducting plate.

[0018] Preferably, the two opposite side walls inside the housing are provided with support plates for supporting the motherboard, and the motherboard is fixed to the support plates by a third screw.

[0019] The above solution allows the motherboard to be securely installed inside the casing.

[0020] Preferably, the air intake device is a cooling fan, which is installed at the air intake by a fourth screw.

[0021] Using the above solution, the cooling fan has a simple structure, is easy to install, and has low cost. It can be securely installed at the air inlet using the fourth screw.

[0022] Preferably, the air outlet device is a cooling fan, which is installed at the air outlet by the fifth screw.

[0023] Using the above solution, the cooling fan has a simple structure, is easy to install, and has a low cost. It can be securely installed at the air outlet using the fifth screw.

[0024] Preferably, the upper part of the housing is covered with a support cover plate fixed to the bottom of the display module and used to close the upper opening of the housing. The support cover plate is installed in the upper opening of the housing by a sixth screw.

[0025] Using the above solution, the support cover can both provide stable support for the display module and protect the motherboard inside the housing. The sixth screw enables quick installation and removal of the support cover and ensures the stability of the cover after installation.

[0026] This invention, by employing the above technical solutions, achieves significant technical effects: Through heat exchange between the heat-conducting plate and the heating element, the heat generated during operation of the heating element can be quickly carried away and conducted to the overlapping heat-conducting pipes. The air inlet device introduces cool outside air into the housing, while the air outlet device exhausts hot air from inside the housing, thus forming air circulation and reducing the heat inside the housing. Because the contact area between the heat-conducting pipes and the circulating airflow inside the housing is increased, the heat exchange effect is improved, further enhancing the cooling effect of the heating element. This not only maintains the high-performance operation of the main module for extended periods but also effectively extends its service life. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of this embodiment. Figure 1 ;

[0028] Figure 2 For the explosion in this embodiment Figure 1 ;

[0029] Figure 3 For the explosion in this embodiment Figure 2 ;

[0030] Figure 4 For the explosion in this embodiment Figure 3 ;

[0031] Figure 5 This is a schematic diagram of the structure of this embodiment. Figure 2 .

[0032] The parts referred to by the numbers in the above attached diagrams are as follows: 1. Display module; 2. Main unit module; 3. Housing; 4. Motherboard; 5. Heating element; 6. Heat-conducting plate; 7. Heat-conducting pipe; 8. Air inlet; 9. Air outlet; 10. Air intake device; 11. Air outlet device; 12. Thermal conductive silicone pad; 13. Slot; 14. Cover; 15. First positioning post; 16. First support ear; 17. Positioning hole; 18. Second support ear; 19. First screw; 20. Second positioning post; 21. Second screw; 22. Support plate; 23. Third screw; 24. Fourth screw; 25. Fifth screw; 26. Support cover plate; 27. Sixth screw. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0034] like Figures 1 to 5As shown, this embodiment discloses an all-in-one computer with motherboard heat dissipation function, including a display module 1 and a host module 2 disposed at the bottom of the display module 1, wherein the display module 1 is a monitor. The host module 2 includes a housing 3 and a motherboard 4 horizontally disposed within the housing 3. Specifically, two opposing side walls inside the housing 3 are provided with support plates 22 for supporting the motherboard 4, and the motherboard 4 is fixed to the support plates 22 by several third screws 23. Several heat-generating elements 5 are integrated on the motherboard 4, including but not limited to CPU, GPU, memory, and chipset. A copper heat-conducting plate 6 is attached to the upper surface of each heat-conducting element 5, and three copper heat-conducting pipes 7 are connected between adjacent heat-conducting plates 6. Air inlets 8 and air outlets 9 are respectively opened on both sides of the housing 3. An air inlet device 10 for introducing cold air from the outside into the housing 3 is installed at the air inlet 8, and an air outlet device 11 for expelling hot air from the housing 3 is installed at the air outlet 9. In this embodiment, the air intake device 10 is a cooling fan, and its four corners are all installed at the air intake 8 by the fourth screw 24. The air outlet device 11 is also a cooling fan, and its four corners are all installed at the air outlet 9 by the fifth screw 25. A thermally conductive silicone pad 12 is provided between the heat-conducting plate 6 and the heating element 5, thereby improving the heat exchange efficiency between the heat-conducting plate 6 and the heating element 5.

[0035] In order to improve the installation efficiency and stability of the heat pipe 7, the upper surface of the heat-conducting plate 6 is provided with a slot 13 for the heat pipe 7 to be snapped in, and a cover 14 is provided to prevent the heat pipe 7 from falling out of the slot 13. The cover 14 is also made of copper material, so it has better thermal conductivity and stability.

[0036] To improve the installation accuracy and efficiency of the heat-conducting plate 6, first positioning posts 15 are vertically arranged on the upper surface of the motherboard 4 and on both sides of the heating element 5. The lower end of the first positioning post 15 is fixed to the motherboard 4 by a second screw 21. First ears 16 are integrally provided on both sides of the heat-conducting plate 6. Positioning holes 17 are passed through each of the two first ears 16 for inserting the two first positioning posts 15. Second ears 18 are integrally provided on both sides of the cover 14, respectively covering the top of the two first ears 16. First screws 19, threaded onto the ends of the first positioning posts 15, are threaded through the second ears 18 to lock the first ears 16 onto the motherboard 4, and simultaneously lock the second ears 18 onto the first ears 16.

[0037] In order to improve the installation efficiency and accuracy of the cover 14 and prevent the heating element 5 from being excessively squeezed, the lower surface of the second ear 18 is provided with a second positioning post 20 for the first screw 19 to pass through and be inserted into the upper port of the positioning hole 17.

[0038] To facilitate the opening of the housing 3 for maintenance of the motherboard 4 inside, a support cover 26 is fixed to the bottom of the display module 1 and used to close the opening on the top of the housing 3. The support cover 26 is installed on the top opening of the housing 3 by a sixth screw 27.

[0039] The specific principle of this utility model is as follows:

[0040] When installing the heat dissipation module on the motherboard 4, first attach the thermally conductive silicone pad 12 to the upper surface of the heat-generating element 5, and then cover the thermally conductive sheet 6 on top of the thermally conductive silicone pad 12. During the covering process, align the positioning holes 17 on the first lugs 16 on both sides of the thermally conductive sheet 6 with the first positioning posts 15 on both sides of the heat-generating element 5 until the thermally conductive sheet 6 is completely attached to the upper surface of the thermally conductive silicone pad 12. Then, cover the upper surface of the thermally conductive sheet 6 with the cover 14 and pre-position it using the second positioning post 20. After the cover 14 is closed, lock the second lug 18 and the first lug 16 simultaneously onto the first positioning post 15 using the first screw 19, thereby completing the synchronous locking of the cover 14 and the thermally conductive sheet 6, and simultaneously completing the complete fixation of the heat pipe 7.

[0041] After the heat pipe 7 is installed, the main board 4 is fixed to the support plates 22 on both sides of the inner cavity of the housing 3 using the third screw 23. Then, the air inlet device 10 is installed at the air inlet 8 using the fourth screw 24, and the air outlet device 11 is installed at the air outlet 9 using the fifth screw 25. Finally, the display module 1 is re-erected on top of the housing 3 so that the support cover 26 covers the top of the housing 3, and the support cover 26 is locked using the sixth screw 27.

[0042] When the main unit module 2 is running, the heat-conducting plate 6 can exchange heat with the heating element 5 through the thermally conductive silicone pad 12 and conduct the heat to the heat-conducting pipe 7. At this time, the air intake device 10 can introduce cold outside air into the housing 3 and exchange heat with the heat-conducting pipe 7 and the heat-conducting plate 6, while the air exhaust device 11 can exhaust the heated air inside the housing 3, thus forming an air circulation. In this way, the main unit module 2 can not only maintain a high-performance operating state for a long time, but also extend its service life.

[0043] When disassembling motherboard 4, simply reverse the installation steps described above.

Claims

1. An all-in-one computer with motherboard heat dissipation function, comprising a display module (1) and a host module (2) disposed at the bottom of the display module (1), characterized in that: The main unit module (2) includes a housing (3) and a motherboard (4) horizontally arranged inside the housing (3). Several heating elements (5) are integrated on the motherboard (4). Each heating element (5) has a heat-conducting plate (6) attached to its upper surface. At least one heat-conducting pipe (7) is connected between adjacent heat-conducting plates (6). An air inlet (8) and an air outlet (9) are respectively opened on both sides of the housing (3). An air inlet device (10) for introducing cold air from the outside into the housing (3) is installed at the air inlet (8). An air outlet device (11) for discharging hot air from the housing (3) is installed at the air outlet (9).

2. The all-in-one PC with motherboard heat dissipation function according to claim 1, characterized in that: A thermally conductive silicone pad (12) is provided between the thermally conductive sheet (6) and the heating element (5).

3. An all-in-one computer with motherboard heat dissipation function according to claim 1 or 2, characterized in that: The upper surface of the heat-conducting plate (6) is provided with a slot (13) for the heat-conducting pipe (7) to be engaged, and a cover (14) is provided to prevent the heat-conducting pipe (7) from falling out of the slot (13).

4. An all-in-one computer with motherboard heat dissipation function according to claim 3, characterized in that: The upper surface of the main board (4) and both sides of the heating element (5) are provided with first positioning posts (15), and both sides of the heat-conducting plate (6) are provided with first ears (16). Both first ears (16) have positioning holes (17) for inserting the two first positioning posts (15). Both sides of the cover (14) are provided with second ears (18) that cover the two first ears (16). The second ears (18) are provided with first screws (19) threaded to the end of the first positioning posts (15) to lock the first ears (16) onto the main board (4) and at the same time lock the second ears (18) onto the first ears (16).

5. An all-in-one computer with motherboard heat dissipation function according to claim 4, characterized in that: The lower surface of the second ear (18) is provided with a second positioning post (20) through which the first screw (19) passes and is inserted into the upper port of the positioning hole (17).

6. An all-in-one computer with motherboard heat dissipation function according to claim 4, characterized in that: The lower end of the first positioning post (15) is fixed to the main board (4) by the second screw (21).

7. An all-in-one computer with motherboard heat dissipation function according to claim 1 or 2, characterized in that: The two opposite side walls inside the housing (3) are provided with support plates (22) for supporting the main board (4), and the main board (4) is fixed to the support plates (22) by a third screw (23).

8. An all-in-one computer with motherboard heat dissipation function according to claim 1 or 2, characterized in that: The air intake device (10) is a cooling fan, which is installed at the air inlet (8) by the fourth screw (24).

9. An all-in-one computer with motherboard heat dissipation function according to claim 1 or 2, characterized in that: The air outlet device (11) is a cooling fan, which is installed at the air outlet (9) by the fifth screw (25).

10. An all-in-one computer with motherboard heat dissipation function according to claim 1 or 2, characterized in that: The top of the housing (3) is covered by a support cover plate (26) which is fixed to the bottom of the display module (1) and is used to close the opening on the housing (3). The support cover plate (26) is installed on the opening on the housing (3) by a sixth screw (27).

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