Mainboard structure and electronic device

Abstract

The utility model discloses a mainboard structure and an electronic device. The mainboard structure comprises a circuit substrate, a processor, at least one adapter, at least one external card and a heat dissipation module. The processor is arranged on the circuit substrate. The adapter is arranged on the circuit substrate and comprises a slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate jointly define an opening facing the processor. The heat dissipation module is arranged on the processor and comprises a notch opposite to the opening, and the heat dissipation module is suitable for generating airflow flowing to the opening through the notch.

Description

Technical Field

[0001] This utility model relates to a motherboard and an electronic device, and more particularly to a motherboard structure with better heat dissipation performance and an electronic device having a motherboard structure. Background Technology

[0002] In electronic devices, such as computers, there is usually a host and a motherboard inside the host. The motherboard has a lot of components, such as processors, memory cards, graphics cards, resistors, capacitors, etc. Some of these components generate a lot of heat when they are in operation. In order to dissipate the heat quickly to the outside, a heat dissipation module is usually installed. For example, a heat dissipation module including a fan is installed on the central processing unit (CPU) for heat dissipation.

[0003] However, due to the limitations of the Intel platform design guide, the components on the motherboard usually have a fixed placement orientation and are not adjusted to match the heat dissipation module. Even with the addition of a heat dissipation module to assist in heat dissipation, some components still have the problem of overheating. Utility Model Content

[0004] The purpose of this invention is to provide a motherboard structure and electronic device that can have better heat dissipation performance.

[0005] To achieve the above objectives, a motherboard structure according to this utility model includes a circuit board, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is disposed on the circuit board. The adapter is disposed on the circuit board and includes a slot facing the processor. The external card is inserted into the slot and, together with the circuit board, defines an opening facing the processor. The heat dissipation module is disposed on the processor and includes a notch opposite the opening; the heat dissipation module is adapted to generate airflow through the notch to the opening.

[0006] According to one embodiment of the present invention, the external card is located between the adapter and the heat dissipation module.

[0007] According to one embodiment of the present invention, the external card includes an upper surface, a lower surface, and a plurality of memories, wherein the plurality of memories are respectively disposed on the upper surface and the lower surface, and each of the memories includes a fifth-generation double data rate synchronous dynamic random access memory.

[0008] According to one embodiment of the present invention, the number of adapters is two, and multiple adapters are arranged side by side on the circuit board.

[0009] According to one embodiment of the present invention, the heat dissipation module includes a fan and a heat dissipation fin assembly. The heat dissipation fin assembly includes a plurality of heat dissipation fins, which are disposed on the periphery of the fan from two opposite sides of the notch.

[0010] According to one embodiment of the present invention, the width of the notch is smaller than the width of the opening.

[0011] According to one embodiment of the present invention, it further includes: a heat dissipation film disposed on the external card.

[0012] To achieve the above objectives, an electronic device according to this utility model includes a main body and a motherboard structure. The motherboard structure is disposed within the main body and includes a circuit board, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is disposed on the circuit board. The adapter is disposed on the circuit board and includes a slot facing the processor. The external card is inserted into the slot and, together with the circuit board, defines an opening facing the processor. The heat dissipation module is disposed on the processor and includes a notch opposite the opening; the heat dissipation module is adapted to generate airflow through the notch to the opening.

[0013] As described above, in the motherboard structure and electronic device of this utility model, an adapter is disposed on the circuit board and includes a slot facing the processor; an external card is inserted into the slot and together with the circuit board defines an opening facing the processor; and a heat dissipation module is disposed on the processor and includes a notch opposite to the opening, and the heat dissipation module is adapted to generate airflow through the notch to the opening, so that the motherboard structure and electronic device of this utility model can have better heat dissipation performance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present invention.

[0015] Figure 2 and Figure 3 They are respectively Figure 1 A three-dimensional diagram and a top view of the mainboard structure of the electronic device.

[0016] Figure 4 for Figure 2 A cross-sectional view of the motherboard structure.

[0017] Figure 5 This is a cross-sectional view of an existing motherboard structure.

[0018] Figure 6 This is a cross-sectional schematic diagram of the motherboard structure according to another embodiment of the present invention.

[0019] The attached figures are labeled as follows:

[0020] 1: Electronic devices

[0021] 11: Main Unit

[0022] 12, 12a: Motherboard Structure

[0023] 121, 921: Circuit board

[0024] 122, 922: Processors

[0025] 123a, 123b, 923a, 923b: Adapters

[0026] 124a, 124b, 924a, 924b: External cards

[0027] 125, 925: Heat dissipation module

[0028] 1251, 9251: Fan

[0029] 1252, 9252: Heatsink fin assembly (heatsink fins)

[0030] 1253: Bottom

[0031] 126: Heat dissipation film

[0032] 13: Display screen

[0033] 14: Keyboard

[0034] 15: Mouse

[0035] M: Memory

[0036] O: Opening

[0037] Oa, Ob: Secondary opening

[0038] Sa, Sb: Slots

[0039] U: Gap Detailed Implementation

[0040] The motherboard structure and electronic device according to embodiments of the present invention will be described below with reference to the accompanying drawings, wherein the same components will be described with the same reference numerals. The components, units or modules appearing in the following embodiments are only used to illustrate their relative relationships and do not represent the actual proportions or dimensions of the components, units or modules.

[0041] The electronic device mentioned in this article may be a desktop computer or a server. The following examples use a desktop computer as an example.

[0042] Figure 1 This is a schematic diagram of an electronic device 1 according to an embodiment of the present invention. Figure 2 and Figure 3 They are respectively Figure 1 A three-dimensional schematic diagram and a top view of the motherboard structure 12 of the electronic device 1, and Figure 4 for Figure 2 A cross-sectional view of the motherboard structure 12.

[0043] Please refer to this first. Figure 1 The electronic device 1 of this embodiment includes a main body 11 and a motherboard structure 12. Additionally, the electronic device 1 of this embodiment may also include a display screen 13, a keyboard 14, and a mouse 15. The motherboard structure 12 is disposed within the main body 11, and the display screen 13, keyboard 14, and mouse 15 are electrically connected to the motherboard structure 12. The display screen 13, keyboard 14, and mouse 15 are devices well known to those skilled in the art and will not be described further here.

[0044] like Figures 2 to 4 As shown, the motherboard structure 12 includes a circuit board 121, a processor 122, at least one adapter (two adapters 123a and 123b are shown in the figure), at least one external card (two external cards 124a and 124b are shown in the figure), and a heat dissipation module 125.

[0045] The circuit board 121 may be a printed circuit board (PCB), and the processor 122 is disposed on the circuit board 121 and electrically connected to the circuit board 121. Here, the processor 122 may be the core control component of the electronic device 1, used to control the operation of the electronic device 1, such as including a central processing unit (CPU) or a graphics processing unit (GPU).

[0046] At least one adapter is disposed on the circuit board 121 and includes a slot facing the processor 122. At least one external card is inserted into the slot of the at least one adapter and, together with the circuit board 121, defines an opening facing the processor 122. Here, "opening" refers to the space jointly defined by the external card and the circuit board. However, if there are two or more external cards, the "opening" jointly defined by one external card and the circuit board 121 can be divided in two by another external card to form two secondary openings. In this embodiment, there are two adapters and two external cards: adapters 123a and 123b, and external cards 124a and 124b respectively corresponding to adapters 123a and 123b. Adapters 123a and 123b are electrically connected to external cards 124a and 124b respectively. Adapters 123a and 123b are disposed side-by-side (standing) on ​​the circuit board 121. The adapter 123a includes a slot Sa facing the processor 122. Figure 4 The external card 124a is inserted into slot Sa of adapter 123a. Additionally, adapter 123b includes slot Sb facing processor 122. Figure 4 The external card 124b is inserted into slot Sb of adapter 123b. Since slots Sa and Sb of adapters 123a and 123b face the processor 122, external cards 124a and 124b can be inserted into slots Sa and Sb of adapters 123a and 123b at an angle, so that external cards 124a and 124b are arranged in a vertically overlapping manner.

[0047] Additionally, external card 124a and circuit board 121 together define an opening O facing processor 122, while external card 124b divides this opening O in two to form two secondary openings Oa and Ob. Figure 2 or Figure 3 Furthermore, it should be emphasized that the corresponding slot Sa of the adapter 123a, which is farther from the processor 122, is also farther from the circuit board 121. Therefore, when the external cards 124a and 124b are inserted into the slots Sa and Sb of the adapters 123a and 123b, they will not interfere with each other, and the external cards 124a and 124b and the circuit board 121 can cooperate to define the secondary openings Oa and Ob facing the processor 122. In one embodiment, the external cards 124a and 124b each have gold fingers corresponding to the slots Sa and Sb, and the gold fingers of the external cards 124a and 124b are inserted into the slots Sa and Sb respectively to electrically connect with the adapters 123a and 123b (and the processor 122).

[0048] In this embodiment, external cards 124a and 124b are memory cards, including, but not limited to, fifth-generation Double Data Rate Synchronous Dynamic Random Access Memory (DDR5). External card 124a is located between adapter 123a and heat dissipation module 125, and external card 124b is located between adapter 123b and heat dissipation module 125. External cards 124a and 124b in this embodiment each include an upper surface, a lower surface, and multiple memory modules M (e.g., each including 16 memory modules M). The multiple memory modules M are configured on the upper and lower surfaces of external cards 124a and 124b. Specifically, the upper and lower surfaces of external card 124a each have two rows of memory modules M, with four memory modules M in each row. That is, the upper surface of external card 124a has eight memory modules M, and the lower surface also has eight memory modules M. In addition, the upper and lower surfaces of the external card 124b are also provided with two rows of memory M, with four memory M in each row. That is to say, the upper surface of the external card 124b is provided with eight memory M, and the lower surface is also provided with eight memory M.

[0049] A heat dissipation module 125 is disposed on the processor 122 to remove the heat generated by the processor 122 and reduce the temperature of the processor 122. Here, the heat dissipation module 125 includes a notch U opposite to the secondary openings Oa and Ob, and the heat dissipation module 125 is adapted to generate airflow through the notch U to the secondary openings Oa and Ob. Specifically, the heat dissipation module 125 of this embodiment includes a fan 1251 and a heat sink assembly 1252, with the bottom 1253 of the heat sink assembly 1252 (…). Figure 4 The fan 1251 can be connected to the processor 122 via, for example, thermally conductive adhesive (not shown). Additionally, the heat sink assembly 1252 includes multiple heat sink fins (1252) disposed around the periphery of the fan 1251, with the multiple heat sink fins (1252) positioned on opposite sides of the notch U around the periphery of the fan 1251. Figure 3 As shown, the width of the notch U is smaller than the widths of the secondary openings Oa and Ob.

[0050] Therefore, the heat generated by the processor 122 can be conducted to the heat sink fin assembly 1252. In addition to blowing air onto the heat sink fin assembly 1252 to dissipate the heat generated by the processor 122 to the outside, the airflow generated by the fan 1251 can also blow through the notch U onto the secondary openings Oa and Ob to dissipate heat from the memory M of the external cards 124a and 124b, thereby reducing the temperature of the memory M. Therefore, in addition to dissipating heat from the processor 122, the heat dissipation module 125 can also reduce the temperature of the memory M of the external cards 124a and 124b. Thus, the motherboard structure 12 of this embodiment can have better heat dissipation performance.

[0051] Those skilled in the art will understand that the motherboard structure 12 may also include other components, units or modules, such as capacitors, resistors, graphics cards, hard disk drives and / or power supplies, etc. These components, units or modules are well known and are not the focus of this case, so they will not be described in detail here.

[0052] Figure 5 This is a cross-sectional view of a current motherboard structure. Figure 5As shown, in the existing method of placing adapters 923a and 923b on the circuit board 921, the slots Sa and Sb of adapters 923a and 923b are respectively facing away from the processor 922. Therefore, when external cards 924a and 924b are inserted into the slots Sa and Sb of adapters 923a and 923b respectively, adapters 923a and 923b are located between the heat dissipation module 925 and the external cards 924a and 924b. Even if the airflow generated by the heat dissipation module 925 flows to the external cards 924a and 924b through the notch U, the airflow will be blocked by adapters 923a and 923b and cannot flow through the secondary openings Oa and Ob to dissipate heat from the memory M. Therefore, as shown in Table 1 below, the surface temperatures of memory M located at positions #1 to #4 on the lower surface of adapter 923a and memory M located at positions #5 to #8 on the lower surface of adapter 923b are both relatively high, with a minimum of 54.2°C and a maximum of 69°C.

[0053]

[0054] Table 1

[0055] However, please refer to the following: Figure 4 In this embodiment, the adapters 123a and 123b are rotated so that their slots Sa and Sb face the processor 122. When external cards 124a and 124b are inserted into slots Sa and Sb of the adapters 123a and 123b respectively, the airflow generated by the heat dissipation module 125 can dissipate heat from the memory M through the notch U and secondary openings Oa and Ob. Therefore, as shown in Table 2 below, the surface temperatures of the memory M at positions #1 to #4 on the lower surface of the adapter 123a and positions #5 to #8 on the lower surface of the adapter 123b are all lower than those in Table 1, and none exceed 50°C, with the lowest reaching 42°C. Clearly, Figure 4 The implementation of this embodiment also enables the memory M of the external cards 124a and 124b to achieve better heat dissipation.

[0056]

[0057] Table 2

[0058] In addition, please refer to Figure 6This is a cross-sectional schematic diagram of a motherboard structure 12a according to another embodiment of the present invention. The motherboard structure 12a of this embodiment is substantially the same as the motherboard structure 12 of the aforementioned embodiment. The main difference from the motherboard structure 12 is that the motherboard structure 12a of this embodiment may further include at least one heat dissipation film, which is disposed on the external card. Here, it is taken as an example that one heat dissipation film 126 is attached to the memory M on the upper surface of the external card 124a, and another heat dissipation film 126 is attached to the memory M on the upper surface of the external card 124b.

[0059] The heat dissipation film 126 may include a highly thermally conductive material, such as, but not limited to, graphene, graphite, carbon nanotubes, alumina, zinc oxide, titanium oxide, or boron nitride (BN), or combinations thereof, or other suitable highly thermally conductive materials, thereby further improving the heat dissipation performance of the memory M of the external cards 124a and 124b. In one embodiment, the heat generated by the memory M of the external cards 124a and 124b during operation can be directly conducted to the housing of the main unit 11 via the heat dissipation film.

[0060] In summary, in the motherboard structure and electronic device of this utility model, an adapter is disposed on the circuit board and includes a slot facing the processor; an external card is inserted into the slot and together with the circuit board defines an opening facing the processor; and a heat dissipation module is disposed on the processor and includes a notch opposite the opening. The heat dissipation module is adapted to generate airflow through the notch to the opening, so that the motherboard structure and electronic device of this utility model can have better heat dissipation performance.

[0061] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this utility model should be included in the appended claims.

Claims

1. A motherboard structure, characterized in that, include: A circuit board; A processor is disposed on the circuit board; At least one adapter is disposed on the circuit board and includes a slot facing the processor; At least one external card is inserted into the slot and, together with the circuit board, defines an opening facing the processor; as well as A heat dissipation module is disposed on the processor and includes a notch opposite the opening, the heat dissipation module being adapted to generate airflow through the notch to the opening.

2. The motherboard structure as described in claim 1, characterized in that, The external card is located between the adapter and the heat dissipation module.

3. The motherboard structure as described in claim 1, characterized in that, The external card includes an upper surface, a lower surface, and multiple memories, with the multiple memories respectively disposed on the upper surface and the lower surface, wherein each memory includes a fifth-generation double data rate synchronous dynamic random access memory.

4. The motherboard structure as described in claim 1, characterized in that, There are two adapters, and multiple adapters are arranged side by side on the circuit board.

5. The motherboard structure as described in claim 1, characterized in that, The heat dissipation module includes a fan and a heat dissipation fin assembly. The heat dissipation fin assembly includes multiple heat dissipation fins, which are disposed on the periphery of the fan from two opposite sides of the notch.

6. The motherboard structure as described in claim 1, characterized in that, The width of the notch is smaller than the width of the opening.

7. The motherboard structure as described in claim 1, characterized in that, Also includes: A heat dissipation film is installed on the external card.

8. An electronic device, characterized in that, include: One main body; as well as A motherboard structure, disposed within the host body, includes: A circuit board; A processor is disposed on the circuit board; At least one adapter is disposed on the circuit board and includes a slot facing the processor; At least one external card is inserted into the slot and, together with the circuit board, defines an opening facing the processor; and A heat dissipation module is disposed on the processor and includes a notch opposite the opening, the heat dissipation module being adapted to generate airflow through the notch to the opening.

9. The electronic device as claimed in claim 8, characterized in that, The external card is located between the adapter and the heat dissipation module.

10. The electronic device as claimed in claim 8, characterized in that, The external card includes an upper surface, a lower surface, and multiple memories, with the multiple memories respectively disposed on the upper surface and the lower surface, wherein each memory includes a fifth-generation double data rate synchronous dynamic random access memory.

11. The electronic device as claimed in claim 8, characterized in that, There are two adapters, and multiple adapters are arranged side by side on the circuit board.

12. The electronic device as claimed in claim 8, characterized in that, The heat dissipation module includes a fan and a heat dissipation fin assembly. The heat dissipation fin assembly includes multiple heat dissipation fins, which are disposed on the periphery of the fan from two opposite sides of the notch.

13. The electronic device as claimed in claim 8, characterized in that, The width of the notch is smaller than the width of the opening.

14. The electronic device as claimed in claim 8, characterized in that, The motherboard structure also includes a heat dissipation film, which is disposed on the external card.

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