Mainboard with double heat dissipation structures

Abstract

The utility model discloses a mainboard with a double heat dissipation structure, which comprises a mainboard, a first heat dissipation assembly and a second heat dissipation assembly, the mainboard is provided with a CPU position, the periphery of the CPU position is provided with a through hole penetrating through the mainboard, the first heat dissipation assembly is arranged on the first side wall of the mainboard, the second heat dissipation assembly is arranged on the second side wall of the mainboard, and the first heat dissipation assembly is arranged on the first side wall of the mainboard. The second heat dissipation assembly is in clearance fit with the mainboard; the first heat dissipation assembly and the second heat dissipation assembly are installed on the first support and the second support respectively, and the first support and the second support are installed in the through holes through stud assemblies. Through the arrangement of the first support and the second support, the first heat dissipation assembly and the second heat dissipation assembly can be conveniently installed and fixed, meanwhile, heat dissipation of a CPU can be effectively improved through the double-face heat dissipation structure, meanwhile, heat dissipation can be conducted on the second side wall of the mainboard through clearance fit of the second heat dissipation assembly, and the heat dissipation efficiency of the mainboard is improved. The heat dissipation efficiency is improved, and the operation stability is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation equipment, and in particular to a motherboard with a dual heat dissipation structure. Background Technology

[0002] The motherboard, installed inside the computer case, is one of the most basic and important components of a computer, playing a crucial role in the entire computer system. The quality of the motherboard's manufacturing determines the stability of the hardware system. The motherboard is closely related to the CPU; every major CPU upgrade inevitably leads to a replacement motherboard.

[0003] As the CPU's operating frequency increases, its heat generation also increases accordingly. Therefore, structures such as water cooling are designed to dissipate heat from the CPU. However, in actual use, it has been found that when the water cooling reaches the predetermined temperature, the CPU still cannot increase its frequency (i.e., if the temperature exceeds the predetermined threshold, the CPU will automatically reduce its operating frequency to reduce damage to electronic components). The main reason for this is that the connection point between the CPU and the motherboard (i.e., the heat accumulation on the motherboard) still causes heat accumulation, which affects the operating frequency and thus affects the stability of operation. Utility Model Content

[0004] The main purpose of this invention is to propose a motherboard with a dual heat dissipation structure, which aims to improve the overall stability of the computer system and avoid the problem of frequency reduction by setting heat dissipation components on both sides of the motherboard frame.

[0005] To achieve the above objectives, this utility model proposes a motherboard with a dual heat dissipation structure, comprising:

[0006] A motherboard, wherein the motherboard has a CPU slot and a through hole penetrating the motherboard is provided around the outer periphery of the CPU slot;

[0007] The first heat dissipation component is disposed on the first sidewall of the motherboard;

[0008] The second heat dissipation component is disposed on the second side wall of the motherboard, and the second heat dissipation component is fitted with the motherboard with a clearance.

[0009] The first heat dissipation component and the second heat dissipation component are respectively mounted on the first bracket and the second bracket, and the first bracket and the second bracket are mounted on the through hole by stud assembly.

[0010] In the actual design, the first and second brackets facilitate the installation and fixation of the first and second heat dissipation components. Meanwhile, the stud assembly secures the first and second brackets to the through holes, effectively preventing vibrations generated by the heat dissipation components during operation and reducing their impact on the motherboard. Furthermore, the double-sided heat dissipation structure effectively improves CPU cooling, while the gap fit of the second heat dissipation component allows for heat dissipation of the second sidewall of the motherboard, thereby improving heat dissipation efficiency and operational stability. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the interaction between the motherboard and the positioning bracket.

[0012] Figure 2 Diagram showing the motherboard and dual heatsink configuration. Figure 1 ;

[0013] Figure 3 Diagram showing the motherboard and dual heatsink configuration. Figure 2 ;

[0014] Figure 4 A schematic diagram showing the assembly of the stud assembly, the first bracket, and the second bracket;

[0015] Figure 5 This is a schematic diagram of the stud assembly.

[0016] In the picture,

[0017] 1 represents the motherboard, and 10 represents a through-hole.

[0018] 2 represents the first heat dissipation component, and 20 represents the first support bracket.

[0019] 3 is the second heat dissipation component, 30 is the second bracket, 30a is the first positioning hole, 30b is the second positioning hole, and 30c is a through slot.

[0020] 4 is a double-ended screw, 41 is a nut, 42 is a screw, and 43 is a locating pin.

[0021] 5 represents the positioning bracket, and 50 represents the through hole. Detailed Implementation

[0022] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0023] It should be noted that if any directional indication (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.) is involved in the embodiments of this utility model, the directional indication is only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0025] like Figures 1 to 5 As shown, a motherboard with a dual heat dissipation structure includes,

[0026] Motherboard 1, the motherboard 1 is provided with a CPU position, and the outer periphery of the CPU position is provided with a through hole 10 penetrating the motherboard 1;

[0027] The first heat dissipation component 2 is disposed on the first side wall of the motherboard 1;

[0028] The second heat dissipation component 3 is disposed on the second side wall of the motherboard 1, and the second heat dissipation component 3 is clearance-fitted with the motherboard 1.

[0029] The first heat dissipation component 2 and the second heat dissipation component 3 are respectively mounted on the first bracket 20 and the second bracket 30, and the first bracket 20 and the second bracket 30 are mounted on the through hole 10 by stud assembly.

[0030] In the actual design, the first bracket 20 and the second bracket 30 facilitate the installation and fixation of the first heat dissipation component 2 and the second heat dissipation component 3. At the same time, the first bracket 20 and the second bracket 30 are installed in the through hole 10 by the stud assembly, which effectively avoids the vibration generated by the heat dissipation component during operation and reduces the impact on the motherboard 1. Meanwhile, the double-sided heat dissipation structure can effectively improve the heat dissipation of the CPU. At the same time, the gap fit of the second heat dissipation component 3 can dissipate heat from the second side wall of the motherboard 1, thereby improving the heat dissipation efficiency and improving the stability of operation.

[0031] Specifically, the first heat dissipation component 2 is a water cooling device, a cooling fan, or a heat dissipation fin, wherein the first heat dissipation component 2 is preferably an existing technology and is designed according to different needs.

[0032] In this embodiment of the invention, the second heat dissipation component 3 is a turbine fan, a centrifugal fan, a thermoelectric cooler, or a water-cooling device. The second heat dissipation component 3 can be easily installed using a single stud assembly. When a turbine fan is used, it can concentrate heat dissipation on the CPU area of ​​the motherboard 1 (e.g., drawing heat outwards or blowing towards hot spots). When a centrifugal fan is used, it can radiate fluid to the entire motherboard 1, thereby achieving overall heat dissipation. When a thermoelectric cooler or a water-cooling device is used, localized heat dissipation can be achieved, preferably with gaps or thermally conductive components.

[0033] Specifically, the first bracket 20 is a quick-release bracket with two spaced intervals. This structure is existing technology and will not be described in detail here.

[0034] In this embodiment of the utility model, the second bracket 30 has a frame-like structure, and the corner end of the second bracket 30 is provided with a first positioning hole 30a, wherein the first positioning hole 30a is used to cooperate with the stud structure.

[0035] Specifically, the corner end of the second bracket 30 is provided with an outwardly extending support arm, and the support arm is provided with a second positioning hole 30b, which is used to install the second heat dissipation component 3.

[0036] In this embodiment of the invention, the second bracket 30 is provided with a through groove 30c in the middle, which can form a fluid zone and avoid the problem of local heat dissipation failure.

[0037] Specifically, the stud assembly includes a double-ended screw 4, a nut 41 at one end of the double-ended screw 4, and a screw 42 at the other end;

[0038] After the double-headed screw 4 passes through the through hole 10, the first bracket 20 is fixed by a nut and the second bracket 30 is fixed by a screw 42, thereby realizing the installation and fixing of the cooling fan and the water cooling base (i.e., the first bracket 20).

[0039] In this embodiment of the utility model, one end of the double-ended screw 4 has an external thread and the other end has an internal thread. The double-ended screw 4 is also provided with a positioning post 43 at the position of the first side wall. The double-ended screw 4 passes through the positioning post 43. The function of the positioning post 43 is to raise the first bracket 20, i.e., the CPU position.

[0040] The stud assembly design avoids the need for the dual heatsink components to be directly fixed to the motherboard 1, thus preventing wear and tear on the motherboard 1.

[0041] Specifically, the motherboard 1 is mounted on the positioning bracket 5. The positioning bracket has a through hole 50 at the position of the second side wall. The through hole is used for the second heat dissipation component 3 to extend out, thereby facilitating the installation of the second heat dissipation component 3.

[0042] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A motherboard with a dual heat dissipation structure, characterized in that, include, A motherboard, wherein the motherboard has a CPU slot and a through hole penetrating the motherboard is provided around the outer periphery of the CPU slot; The first heat dissipation component is disposed on the first sidewall of the motherboard; The second heat dissipation component is disposed on the second side wall of the motherboard, and the second heat dissipation component is fitted with the motherboard with a clearance. The first heat dissipation component and the second heat dissipation component are respectively mounted on the first bracket and the second bracket, and the first bracket and the second bracket are mounted on the through hole by stud assembly.

2. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The first heat dissipation component is a water cooling device, a cooling fan, or heat dissipation fins.

3. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: Or a semiconductor cooling chip or a water-cooled heat dissipation device.

4. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The first bracket is a quick-release bracket with two spaced intervals.

5. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The second bracket has a frame-like structure, and a first positioning hole is provided at the corner end of the second bracket.

6. The motherboard with a dual heat dissipation structure as described in claim 5, characterized in that: The second bracket has an outwardly extending support arm at its corner end, and the support arm has a second positioning hole for installing a second heat dissipation component.

7. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The second bracket has a through groove in the middle.

8. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The stud assembly includes a double-ended screw, a nut at one end of the double-ended screw, and a screw at the other end; After the double-ended screw passes through the through hole, the first bracket is fixed by a nut, and the second bracket is fixed by a screw.

9. The motherboard with a dual heat dissipation structure as described in claim 8, characterized in that: The double-ended screw has an external thread at one end and an internal thread at the other end. A positioning post is also provided at the position of the double-ended screw on the first side wall, and the double-ended screw passes through the positioning post.

10. The motherboard with a dual heat dissipation structure as described in claim 1, characterized in that: The motherboard is mounted on a positioning bracket, and the positioning bracket has a through hole at the position of the second side wall, which is used for the second heat dissipation component to extend out.

Images