Heat dissipation device, mainboard and server

Abstract

The utility model discloses a heat dissipation device, a mainboard and a server, and relates to the technical field of servers, the heat dissipation device comprises a heat dissipation device and a heat insulation structure, the heat dissipation device comprises a first heat dissipation main body, a second heat dissipation main body and a heat pipe set connected between the first heat dissipation main body and the second heat dissipation main body, the heat pipe set is lower than the first heat dissipation body and the second heat dissipation body in the height direction of the radiator, the heat insulation structure is located between the first heat dissipation body and the second heat dissipation body, and the heat insulation structure is arranged on the outer side of the heat pipe set. The heat insulation structure is used for bearing a cable and forming isolation between the heat pipe set and the cable. According to the heat dissipation device in the embodiment of the invention, the cable can be prevented from being burnt out on the premise that the basic heat dissipation function on the central processing unit is ensured, and the service life of the cable can be prolonged.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a heat dissipation device, a motherboard, and a server. Background Technology

[0002] As modern servers become increasingly powerful, the number of connectors on server motherboards is constantly increasing, as is the number of components connected to these connectors (such as memory modules). This leads to a continuous increase in the number of cables within the server, further compressing the space available for cable routing. Additionally, motherboards typically have heatsinks to cool the central processing unit, which also reduces the available cable routing space.

[0003] In related technologies, in order to route cables, the cables usually need to cross the heat sink and extend from one side of the heat sink to the other side. The heat sink has a high temperature, which can easily burn out the cables, thereby affecting the normal function of the motherboard and server. Utility Model Content

[0004] This application provides a heat dissipation device, a motherboard, and a server to at least solve the problem of cables being easily burned out in related technologies.

[0005] This application provides a heat dissipation device, including:

[0006] A radiator, comprising a first heat dissipation body, a second heat dissipation body, and a heat pipe assembly connected between the first heat dissipation body and the second heat dissipation body, wherein the heat pipe assembly is lower than the first heat dissipation body and the second heat dissipation body in the height direction of the radiator.

[0007] The heat insulation structure is located between the first heat dissipation body and the second heat dissipation body, and is disposed on the outside of the heat pipe assembly. The heat insulation structure is used to support the cable and form an isolation between the heat pipe assembly and the cable.

[0008] This application also provides a motherboard, including a central processing unit and the aforementioned heat dissipation device, wherein a first heat dissipation body in the heat dissipation device is located above the central processing unit.

[0009] This application also provides a server, including the aforementioned motherboard.

[0010] According to the above-described heat dissipation device, the heat sink in the heat dissipation device can maintain basic heat dissipation function for the central processing unit, and the heat insulation structure in the heat dissipation device can support the cable and isolate the cable from the heat pipe assembly, thereby preventing the heat from the heat pipe assembly from being transferred to the cable and burning it out. The heat dissipation device in this embodiment of the application can prevent the cable from burning out while ensuring basic heat dissipation function for the central processing unit, and can extend the service life of the cable. Attached Figure Description

[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This application provides a schematic diagram of the structure of a server according to an embodiment of the present application.

[0013] Figure 2 This is a schematic diagram of a motherboard structure provided in an embodiment of this application;

[0014] Figure 3 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0016] Figure 5 This is a schematic diagram of a heat insulation structure provided in an embodiment of this application.

[0017] The above figures include the following reference numerals:

[0018] 100 - Heat sink; 110 - First heat sink body; 120 - Second heat sink body; 130 - Heat pipe assembly; 140 - Connecting base; 111 - First substrate; 112 - First heat sink assembly; 113 - First internal heat pipe; 121 - Second substrate; 122 - Second heat sink assembly; 123 - Second internal heat pipe; 141 - First connecting part; 142 - First connecting side plate; 143 - Second connecting side plate; 144 - Connecting top plate;

[0019] 200 - Thermal insulation structure; 201 - Receiving cavity; 210 - Thermal insulation horizontal plate; 220 - Thermal insulation side plate; 230 - Wire harness assembly; 221 - Second connecting part; 231 - First wire harness clamp; 232 - Second wire harness clamp; 2211 - Inclined surface; 2311 - First limiting wall; 2312 - Second limiting wall; 2321 - Third limiting wall; 2322 - Fourth limiting wall;

[0020] 10-Server Chassis;

[0021] 20-Motherboard; 20a-Board; 21-Central Processing Unit; 22-Heat Dissipation Device; 23-Connector;

[0022] 30- Fan. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] With increasing societal demands and more customized services, modern servers are facing ever-increasing requirements for data processing capacity and speed, leading to continuous improvements in server performance.

[0026] To match the high performance of modern servers, there are two main requirements: firstly, the motherboard needs more connectors to connect more components (such as memory modules); secondly, the motherboard needs better heat dissipation. To meet the former requirement, the number of connectors and components on the motherboard continues to increase, leading to a continuous increase in the number of cables, which compresses the space available for cable routing. To meet the latter requirement, the motherboard typically needs a heatsink capable of supporting the central processing unit (CPU), which further compresses the cable routing space.

[0027] In related technologies, in order to route cables, the cables usually need to cross the heat sink. The cables need to extend from one side of the heat sink to the other side. The heat sink has a high temperature, which can easily burn out the cables, thereby affecting the normal function of the motherboard and server.

[0028] Specifically, to improve the cooling effect on the central processing unit (CPU), the heatsink on the motherboard is usually an irregularly shaped heatsink. This irregularly shaped heatsink consists of two heatsink bodies and a heat pipe assembly connecting the two heatsink bodies. One heatsink body is located opposite the CPU, while the other is located near the server fan. To ensure cooling efficiency, the two heatsink bodies are usually quite large, for example, they are often quite tall and located near the top of the server. The height of the heat pipe assembly is lower than the two heatsink bodies. As a result, cables can only cross the heatsink at the heat pipe assembly. Obviously, the surface temperature of the heat pipe assembly is high, typically reaching 70 degrees Celsius. The intense heat exchange between the heat pipe assembly and the cables can burn out the cables, thus affecting the normal functioning of the motherboard and the server.

[0029] The aforementioned irregular heat sink is a commonly used heat sink in servers. Its specific structure, such as internal details, can be found in related technologies, and will not be described in detail in this application embodiment.

[0030] Based on the above-mentioned situation and problems, this application provides a heat dissipation device that can prevent the cables from burning out while ensuring that the central processing unit has basic heat dissipation functions, and can extend the service life of the cables.

[0031] To achieve the above objectives, the heat dissipation device can make full use of the structure of the heat sink configured on the motherboard. By setting a heat insulation structure between the heat sink and the cable, heat in the heat sink can be prevented from being transferred to the cable. The heat sink can maintain its heat dissipation function for the central processing unit, and the heat insulation structure can also prevent the heat sink from burning the cable due to excessive temperature.

[0032] The aforementioned heat dissipation device can be formed based on the irregularly shaped heatsink. For example, a heat insulation structure can be placed above the heat pipe assembly of the irregularly shaped heatsink. It should be noted that in other embodiments, heatsinks with other structural forms can also be used on the motherboard. To facilitate cable crossing, these heatsinks have at least one recess. In summary, regardless of whether the aforementioned irregularly shaped heatsink or other structural forms are used, the heatsinks need to have one thing in common: space needs to be left on the heatsink to allow cables to cross.

[0033] To simplify the description and facilitate understanding, the embodiments of this application will mainly be described using an irregularly shaped heat sink as an example. The embodiments of this application can form a heat dissipation device by making minor improvements to the irregularly shaped heat sink and combining it with the above-mentioned heat insulation structure.

[0034] Based on the above-mentioned heat dissipation device, this application embodiment can also provide a motherboard, in which the heat dissipation device can be used as a component of the motherboard, and the motherboard can operate stably for a long time and has high performance stability.

[0035] Furthermore, based on the aforementioned heat dissipation device or motherboard, embodiments of this application may also provide a server that may include the aforementioned heat dissipation device or motherboard, thereby enabling the server to have higher performance stability.

[0036] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] Figure 1 This is a schematic diagram of the structure of a server provided in an embodiment of this application.

[0038] In some embodiments, please refer to Figure 1 The server includes a server chassis 10 and a motherboard 20 disposed within the server chassis 10. The server chassis 10 can be constructed into a cuboid structure. Figure 1 In the example shown, the X direction is the length direction of the server chassis 10, the Y direction is the width direction of the server chassis 10, and the Z direction is the height direction of the server chassis 10. In this embodiment, the X direction defines the right side of the server chassis 10, the opposite direction defines the left side of the server chassis 10, the Y direction defines the front side of the server chassis 10, and the opposite direction defines the rear side of the server chassis 10. The orientation description in this embodiment can be correctly understood based on the above definitions of left, right, front, and rear.

[0039] In some embodiments, please refer to Figure 1The server also includes a fan 30 disposed in the server chassis 10. The fan 30 is used to dissipate heat from the relevant structures in the server chassis 10. For example, the motherboard 20 can be disposed close to the fan 30, and the fan 30 can generate airflow on the motherboard 20 to dissipate heat from the motherboard 20.

[0040] There can be multiple fans 30, and multiple fans 30 can be arranged along the X direction in the server chassis 10, while the motherboard 20 can be set behind the fans 30.

[0041] Figure 2 This is a schematic diagram of the structure of a motherboard 20 provided in an embodiment of this application.

[0042] In some embodiments, please refer to Figure 2 The motherboard 20 includes a central processing unit 21 and a heat dissipation device 22 corresponding to the central processing unit 21, which can dissipate heat from the central processing unit 21.

[0043] You can refer to the following: Figure 1 The motherboard 20 can also be constructed as a rectangular structure (or other structures). The motherboard 20 can be installed in the server chassis 10 parallel to the bottom surface of the server chassis 10. As with the aforementioned orientation definitions, the X direction is the length direction of the motherboard 20, the Y direction is the width direction of the motherboard 20, and the Z direction is the height direction of the motherboard 20. In this embodiment, the X direction defines the right side of the motherboard 20, the opposite direction defines the left side, the Y direction defines the front side, and the opposite direction defines the rear side. The orientation descriptions in this embodiment can be correctly understood based on the above definitions of left, right, front, and rear sides.

[0044] To better dissipate heat from the central processing unit 21, the heat dissipation device 22 may include a first heat dissipation body 110, a second heat dissipation body 120, and a heat pipe assembly 130. The first heat dissipation body 110 may be located above the central processing unit 21. The heat generated by the central processing unit 21 during operation can be transferred to the first heat dissipation body 110, and then transferred to the second heat dissipation body 120 through the heat pipe assembly 130. The heat dissipation by the first heat dissipation body 110 and the second heat dissipation body 120 can keep the temperature of the central processing unit 21 within the temperature range that allows the central processing unit 21 to have excellent performance.

[0045] Figure 3 This is a schematic diagram of the structure of a heat dissipation device 22 provided in an embodiment of this application.

[0046] In the embodiments of this application, please refer to Figure 2 and Figure 3The heat dissipation device 22 includes a radiator 100 and a heat insulation structure 200.

[0047] The heat sink 100 can provide basic heat dissipation for the central processing unit 21. The structure of the heat sink 100 is roughly the same as the irregular heat sink 100 mentioned above.

[0048] Specifically, please refer to Figure 3 The radiator 100 includes a first heat dissipation body 110, a second heat dissipation body 120, and a heat pipe assembly 130 connected between the first heat dissipation body 110 and the second heat dissipation body 120. The heat pipe assembly 130 is lower than the first heat dissipation body 110 and the second heat dissipation body 120 in the height direction of the radiator 100.

[0049] You can refer to the following: Figure 1 and Figure 2 The first heat sink 110 is a vertically oriented heat dissipation structure, which can be installed above the central processing unit 21. The second heat sink 120 is a horizontally oriented heat dissipation structure, which can be positioned near the fan 30. When the heat sink 100 performs its heat dissipation function, the heat generated by the motherboard 20 or the central processing unit 21 on the motherboard 20 can be transferred to the first heat sink 110, which can dissipate the heat for the first time. Then, the heat can be transferred to the second heat sink 120, which can dissipate the heat for the second time. Because the second heat sink 120 is close to the fan 30, its heat dissipation effect is improved.

[0050] Based on the orientation definitions above, for the heat pipe assembly 130, the first heat sink 110 can be located at the rear of the heat pipe assembly 130, and the second heat sink 120 can be located at the front of the heat pipe assembly 130. In designing the first and second heat sinks 110 and 120, to improve their heat dissipation performance, both are designed to fill as much of the height space of the server chassis 10 as possible, allowing them to be close to the top of the server chassis 10. Therefore, cables typically need to cross from the left side of the heatsink 100 to the right side of the heatsink 100 from the heat pipe assembly 130.

[0051] For the first heat sink unit 110, please refer to Figure 3The first heat dissipation body 110 may include a first substrate 111, a first heat sink assembly 112, and a first internal heat pipe 113. The first internal heat pipe 113 is disposed between the first heat sink assembly 112. The first substrate 111 can be closely attached to the central processing unit 21, so that the heat generated by the central processing unit 21 during operation can be transferred to the first heat sink assembly 112 through the first internal heat pipe 113. The first heat sink assembly 112 includes multiple closely arranged fin structures. The first heat sink assembly 112 can consume the heat carried out by the first internal heat pipe 113, and the excess heat can be transferred to the second heat dissipation body 120 through the heat pipe assembly 130.

[0052] For the second heat sink unit 120, please refer to... Figure 3 The second heat dissipation body 120 may include a second substrate 121, a second heat sink assembly 122, and a second internal heat pipe 123. The second internal heat pipe 123 is disposed between the second heat sink assemblies 122. The second substrate 121 may be connected to other locations on the motherboard 20, so that the excess heat can be transferred to the second heat sink assembly 122 through the second internal heat pipe 123. The second heat sink assembly 122 includes multiple closely arranged fin structures. The second heat sink assembly 122 can consume the excess heat. Because the second heat dissipation body 120 is located close to the fan 30, the second heat dissipation body 120 has high heat dissipation efficiency and can quickly remove excess heat.

[0053] Reference Figure 2 Connectors 23 are provided on both sides of the second heat dissipation body 120. The location of the connectors 23 and the heat pipe assembly 130 forms a high-quality cable routing channel, through which cables can cross from one side of the heat sink 100 to the other side.

[0054] The heat insulation structure 200 is located between the first heat dissipation body 110 and the second heat dissipation body 120, and the heat insulation structure 200 is disposed on the outside of the heat pipe assembly 130. The heat insulation structure 200 is used to support the cable and form an isolation between the cable and the heat pipe assembly 130.

[0055] As described above, the heat pipe assembly 130 is lower in height than the first heat dissipation body 110 and the second heat dissipation body 120. Therefore, the location of the heat pipe assembly 130 provides space for the installation of the heat insulation structure 200, which can be positioned between the first heat dissipation body 110 and the second heat dissipation body 120. Furthermore, the function of the heat insulation structure 200 is to prevent heat from being transferred from the heat pipe assembly 130 to the heat insulation structure 200; therefore, the heat insulation structure 200 is positioned on the outside of the heat pipe assembly 130.

[0056] Because of the installation of the heat insulation structure 200, when the cable needs to cross the heat sink 100, the cable can be arranged on the heat insulation structure 200. The cable can be separated from the heat pipe group 130 without changing its routing route, thereby protecting the cable.

[0057] In this embodiment, the heat sink 100 in the heat dissipation device 22 enables the heat dissipation device 22 to maintain basic heat dissipation function for the central processing unit 21. The heat insulation structure 200 in the heat dissipation device 22 supports the cable and isolates the cable from the heat pipe assembly 130, thereby preventing heat from the heat pipe assembly 130 from being transferred to the cable and burning it out. The heat dissipation device 22 in this embodiment, while ensuring basic heat dissipation function for the central processing unit 21, can prevent cable burnout and extend the cable's service life.

[0058] It should be noted that the heat insulation structure 200 can be connected to the heat pipe assembly 130 in at least two ways to form the aforementioned positional relationship. One way is to connect the heat insulation structure 200 to the motherboard 20. In this case, it is necessary to consider that the heat insulation structure 200 should avoid the components on the motherboard 20 as much as possible. The other way is to connect the heat insulation structure 200 to the heat sink 100. The embodiments of this application mainly use the latter as an example for illustration.

[0059] It should be understood that, for the heat sink 100, the heat pipe assembly 130 is the concentrated area of ​​heat. The main purpose of this embodiment is to isolate the heat pipe assembly 130 from the cables, thus protecting the cables. Furthermore, the first heat sink 110 and the second heat sink 120 also dissipate heat. Therefore, when arranging the heat insulation structure 200, it needs to be as far apart as possible from the heat pipe assembly 130, the first heat sink 110, and the second heat sink 120. Connecting the heat insulation structure 200 to the motherboard 20 satisfies these requirements.

[0060] Alternatively, to prevent heat transfer to the insulation structure 200, the insulation structure 200 can be made of a non-thermal-conducting material, such as a high-temperature resistant plastic material, thereby achieving a good insulation effect.

[0061] Furthermore, it should be noted that different servers have different cabling requirements, and the number of cables also varies. Therefore, to facilitate better adaptation of the heat insulation structure 200 to cabling requirements, the heat insulation structure 200 is detachably installed on the outside of the heat pipe assembly 130. Different sizes of heat insulation structures 200 can be reasonably selected according to the cabling requirements, enabling flexible server configuration. For ease of understanding and description, the following embodiments of this application will use the example of the heat insulation structure 200 being detachably connected to the heat sink 100.

[0062] Figure 4 This is a schematic diagram of the structure of a heat sink 100 provided in an embodiment of this application.

[0063] To achieve a detachable connection of the thermal insulation structure 200, in some embodiments, please refer to... Figure 3 and Figure 4 The radiator 100 also includes a connecting base 140, which is connected to at least one of the first heat dissipation body 110, the second heat dissipation body 120 and the heat pipe assembly 130. The connecting base 140 has a first connecting portion 141 extending out of the heat pipe assembly 130, and the heat insulation structure 200 has a second connecting portion 221 that can be connected to the first connecting portion 141.

[0064] It should be noted that, to enhance the connection strength of the connecting base 140, the connecting base 140 can be connected based on at least one of the first heat dissipation body 110, the second heat dissipation body 120, and the heat pipe assembly 130. For example, the connecting base 140 can be connected to the side of the first heat dissipation body 110 facing the heat pipe assembly 130, or the connecting base 140 can be connected to the side of the second heat dissipation body 120 facing the heat pipe assembly 130. Of course, to further enhance the connection strength, the connecting base 140 can be connected to both the first heat dissipation body 110 and the second heat dissipation body 120 simultaneously.

[0065] Because the first connecting part 141 on the connecting base 140 extends out of the heat pipe assembly 130, it can prevent the heat pipe assembly 130, the first heat dissipation body 110 and the second heat dissipation body 120 from being rubbed during the process of connecting the heat insulation structure 200 to the connecting base 140. The first connecting part 141 extending out of the heat pipe assembly 130 can achieve the purpose of connecting the heat insulation structure 200 to the outside of the heat pipe assembly 130, which is beneficial to the installation of the heat insulation structure 200.

[0066] It is understood that the thermal insulation structure 200 and the connecting base 140 are assembled through the connection between the first connecting part 141 and the second connecting part 221. The first connecting part 141 and the second connecting part 221 can adopt various combination forms. For example, they can adopt a flexible snap-fit ​​structure, or they can adopt a male and female connector structure. The following embodiments of this application will describe an easy-to-assemble structure. The specific structure and connection method can be referred to in the following embodiments.

[0067] In some embodiments, please refer to Figure 4 The connecting base 140 is located in the space below the heat pipe assembly 130.

[0068] The space below refers to the space between the heat pipe assembly 130 and the motherboard 20's board body 20a. The board body 20a is the main structure of the motherboard 20, and the heat sink 22 and the central processing unit 21 can be installed on the board body 20a. The connection base 140 can make full use of the space below the heat pipe assembly 130, which can avoid reducing the space for cable routing.

[0069] In some embodiments, please refer to Figure 4 The connecting base 140 includes at least a pair of connecting side plates, the pair of connecting side plates including a first connecting side plate 142 and a second connecting side plate 143. The first connecting side plate 142 is located on one side of the heat pipe assembly 130, and the second connecting side plate 143 is located on the other side of the heat pipe assembly 130. At least one first connecting part 141 is provided on the first connecting side plate 142, and at least one first connecting part 141 is provided on the second connecting side plate 143.

[0070] Taking the connection base 140 to the second heat dissipation body 120 as an example, the aforementioned pair of connecting side plates can extend from the surface of the second heat dissipation body 120 toward the heat pipe assembly 130. These pair of connecting side plates can be located in the space below the heat pipe assembly 130 and on one side of the heat pipe assembly 130. Specifically, refer to... Figure 2 The first connecting side plate 142 can be located on the left side of the heat pipe assembly 130, and the second connecting side plate 143 can be located on the right side of the heat pipe assembly 130.

[0071] In the above embodiment, by providing a pair of connecting side plates and at least one first connecting part 141 on the connecting side plates, more connection points can be formed between the connecting base 140 and the heat insulation structure 200, which is beneficial to improve the connection strength between the connecting base 140 and the heat insulation structure 200 and can prevent the heat insulation structure 200 from detaching from the connecting base 140 because it needs to support the cable.

[0072] It should be noted that the position of the first connecting part 141 can be set according to actual needs. For example, when a first connecting part 141 is provided on the first connecting side plate 142, the first connecting part 141 can be located in the middle position of the first connecting side plate 142. When a first connecting part 141 is provided on the second connecting side plate 143, the first connecting part 141 can be located in the middle position of the second connecting side plate 143.

[0073] In some embodiments, please refer to Figure 4 At least two first connecting parts 141 are connected to the first connecting side plate 142, and at least two first connecting parts 141 are connected to the second connecting side plate 143. Taking the first connecting parts 141 set on the second connecting side plate 143 as an example, the arrangement of the first connecting parts 141 can be designed in different ways.

[0074] For example, in some specific embodiments, there are two first connecting portions 141 provided on the second connecting side plate 143. The two first connecting portions 141 can be located in the same horizontal plane, that is, the distance between the two first connecting portions 141 and the plate 20a is the same. The two first connecting portions 141 can be arranged at intervals in the Y direction.

[0075] For example, in some specific embodiments, there are two first connecting parts 141 provided on the second connecting side plate 143. The two first connecting parts 141 can be located in different horizontal planes, that is, the distance between the two first connecting parts 141 and the plate 20a is different. The two first connecting parts 141 can be arranged at intervals in the Y direction.

[0076] For example, in some specific embodiments, there are three first connecting parts 141 provided on the second connecting side plate 143. Two of the three first connecting parts 141 can be located in the same horizontal plane, that is, the distance between the two first connecting parts 141 and the plate 20a is the same. The two first connecting parts 141 can be arranged at intervals in the Y direction. The third first connecting part 141 can be set at a higher position, and the third first connecting part 141 can be located between the first two first connecting parts 141 in the Y direction.

[0077] For example, in some specific embodiments, there are three first connecting parts 141 provided on the second connecting side plate 143. Two of the three first connecting parts 141 can be located in different horizontal planes, that is, the distance between the two first connecting parts 141 and the plate 20a is different. The two first connecting parts 141 can be arranged at intervals in the Y direction. The third first connecting part 141 can be set at a higher position, and the third first connecting part 141 can be located between the first two first connecting parts 141 in the Y direction.

[0078] In other specific embodiments, the number and arrangement of the first connecting portions 141 may vary, which will not be described in detail in this application.

[0079] In conjunction with the foregoing, the first connecting portion 141 and the second connecting portion 221 can adopt different structural forms. In the above embodiment where at least two first connecting portions 141 are provided, the two first connecting portions 141 can adopt different structural forms.

[0080] In some embodiments, please refer to Figure 4 The first connecting side plate 142 is inclined from top to bottom along the direction away from the heat pipe assembly 130, and the second connecting side plate 143 is inclined from top to bottom along the direction away from the heat pipe assembly 130.

[0081] Can be combined Figure 2To understand this, taking the second connecting side plate 143 as an example, the second connecting side plate 143 has a first end located at a higher position and a second end located at a lower position. The aforementioned inclined arrangement means that the first end is closer to the heat pipe assembly 130, and the second end is farther away from the heat pipe assembly 130. For the first connecting side plate 142 and the second connecting side plate 143, the distance between them gradually changes from top to bottom.

[0082] As described above, the first connecting part 141 can be located at the bottom of the first connecting side plate 142 or the second connecting side plate 143, thereby allowing the first connecting part 141 to be further away from the heat pipe assembly 130. During the process of connecting the heat insulation structure 200 to the connecting base 140, the first connecting part 141 and the second connecting part 221 can be connected smoothly.

[0083] In some embodiments, the connecting base 140 may further include a connecting top plate 144 connected between the first connecting side plate 142 and the second connecting side plate 143. The connecting top plate 144 connected between the first connecting side plate 142 and the second connecting side plate 143 can improve the overall strength of the connecting base 140.

[0084] In other embodiments, to improve the structural strength of the connecting base 140, reinforcing ribs and other structures may be provided on the first connecting side plate 142 and the second connecting side plate 143.

[0085] Furthermore, for the first connecting side plate 142 and the second connecting side plate 143 in the above embodiments, the first connecting side plate 142 and the second connecting side plate 143 can be made of a material with a certain elasticity, so that when the heat insulation structure 200 is installed, the first connecting side plate 142 and the second connecting side plate 143 can be deformed by the pressure of the heat insulation structure 200, and their elastic recovery effect can facilitate the formation of a connection between the first connecting part 141 and the second connecting part 221.

[0086] The above embodiments describe in detail the embodiment where the connecting base 140 includes a first connecting side plate 142 and a second connecting side plate 143. In other embodiments, the connecting base 140 can be constructed in other forms. For example, the connecting base 140 may include a support rod extending from the surface of the second heat dissipation body 120 toward the heat pipe assembly 130, with at least one first connecting portion 141 provided on the support rod. The support rod is located outside the heat pipe assembly 130, allowing the heat insulation structure 200 to be connected to the support rod from top to bottom. Furthermore, in some possible cases, the connecting base 140 can be provided on the outer wall surface of the second heat dissipation body 120. For example, the connecting base 140 may be a vertically arranged groove provided on the second heat dissipation body 120, allowing the heat insulation structure 200 to be slidably assembled into the groove. Correspondingly, a slide rail or similar structure capable of moving along the groove can be provided on the heat insulation structure 200.

[0087] In some specific embodiments, the connecting base 140 may be made of a high-temperature resistant material, such as metal.

[0088] In some specific embodiments, since the connecting base 140 can be used as a component of the heat sink 100, other structural designs can be made to the connecting base 140 to give it heat dissipation function. For example, the connecting base 140 can include multiple heat dissipation fins, which can be connected to the aforementioned connecting top plate 144. Of course, if space permits, the heat dissipation fins can also be connected to the aforementioned first heat dissipation side plate and second heat dissipation side plate.

[0089] Figure 5 This is a schematic diagram of a heat insulation structure 200 provided in an embodiment of this application.

[0090] In some embodiments, please refer to Figure 3 and Figure 5 The heat insulation structure 200 includes a heat insulation horizontal plate 210 and heat insulation side plates 220 disposed at both ends of the heat insulation horizontal plate 210. The heat insulation horizontal plate 210 and the heat insulation side plates 220 form a receiving cavity 201, in which at least a portion of the heat pipe assembly 130 is received. A second connecting portion 221 protrudes from the heat insulation side plate 220. The heat insulation horizontal plate 210 is located above the heat pipe assembly 130 and is used to support cables.

[0091] The heat insulation horizontal plate 210 can be located above the heat pipe assembly 130. Two heat insulation side plates 220 are connected to the heat insulation horizontal plate 210 on the left and right sides, respectively. The heat insulation structure 200 can be U-shaped. The heat insulation structure 200 houses the heat pipe assembly 130 in its housing cavity 201, thereby preventing heat from the heat pipe assembly 130 from being transferred to the cable.

[0092] The heat-insulating side plate 220 can be connected to the aforementioned first connecting side plate 142 and second connecting side plate 143. Since the heat-insulating side plate 220, the first connecting side plate 142, and the second connecting side plate 143 all adopt a plate-like structure, a smooth connection between the connecting base 140 and the heat-insulating structure 200 can be achieved. Specifically, the heat-insulating structure 200 can be connected to the connecting base 140 in a top-to-bottom manner. Taking the connection between the second connecting side plate 143 and the heat-insulating side plate 220 as an example, the inner wall surface of the second connecting side plate 143 can contact the outer wall surface of the heat-insulating side plate 220, and there is a large contact area between the two. The first connecting part 141 on the second connecting side plate 143 can gradually approach the second connecting part 221 until the two are connected, thus completing the connection between the heat-insulating structure 200 and the connecting base 140.

[0093] In the previous embodiment, both the first connecting side plate 142 and the second connecting side plate 143 can be inclined. To adapt to this design, the heat insulation side plate 220 can also be inclined from top to bottom along the direction away from the heat pipe assembly 130, so that the heat insulation structure 200 is easier to connect to the connecting base 140.

[0094] In some embodiments, please refer to Figure 5 There are at least two second connecting portions 221 provided on the same heat insulation side plate 220, and the two second connecting portions 221 have different sizes or different structures.

[0095] The arrangement of the at least two second connecting parts 221 can refer to the aforementioned first connecting part 141.

[0096] For example, in some specific embodiments, there are two second connecting portions 221 provided on the heat insulation side plate 220. The two second connecting portions 221 can be located in the same horizontal plane, that is, the distance between the two second connecting portions 221 and the plate body 20a is the same. The two second connecting portions 221 can be arranged at intervals in the Y direction.

[0097] For example, in some specific embodiments, there are two second connecting portions 221 provided on the heat insulation side plate 220. The two second connecting portions 221 can be located in different horizontal planes, that is, the distance between the two second connecting portions 221 and the plate body 20a is different. The two second connecting portions 221 can be arranged at intervals in the Y direction.

[0098] For example, in some specific embodiments, there are three second connecting parts 221 provided on the heat insulation side plate 220. Two of the three second connecting parts 221 can be located in the same horizontal plane, that is, the distance between the two second connecting parts 221 and the plate body 20a is the same. The two second connecting parts 221 can be arranged at intervals in the Y direction. The third second connecting part 221 can be set at a higher position, and the third second connecting part 221 can be located between the first two second connecting parts 221 in the Y direction.

[0099] For example, in some specific embodiments, there are three second connecting parts 221 provided on the heat insulation side plate 220. Two of the three second connecting parts 221 can be located in different horizontal planes, that is, the distance between the two second connecting parts 221 and the plate body 20a is different. The two second connecting parts 221 can be arranged at intervals in the Y direction. The third second connecting part 221 can be set at a higher position, and the third second connecting part 221 can be located between the first two second connecting parts 221 in the Y direction.

[0100] With the above arrangement, the second connecting part 221 can correspond to the aforementioned first connecting part 141, so that a reliable connection can be formed between the first connecting part 141 and the second connecting part 221. Taking the provision of two second connecting parts 221 and two first connecting parts 141 as an example, two connection points can be formed on the same heat insulation side plate 220, which can improve the connection strength between the connecting base 140 and the heat insulation structure 200.

[0101] Furthermore, since the two second connecting parts 221 have different sizes or different structures, the two second connecting parts 221 can be distinguished, which can achieve a foolproof effect and make it easy to connect the heat insulation structure 200 to the connecting base 140 in the correct posture.

[0102] In some embodiments, please refer to Figure 5 The sides of the two second connecting portions 221 away from the heat insulation side plate 220 are constructed as inclined surfaces 2211. This inclined surface 2211 design helps the second connecting portions 221 slide into the first connecting portion 141.

[0103] Taking the first connecting part 141 as a limiting hole and the second connecting part 221 as a protruding post as an example, by setting an inclined surface 2211 on the protruding post, it is beneficial for the protruding post to be inserted into the limiting hole.

[0104] In some embodiments, please refer to Figure 3 and Figure 5 The thermal insulation structure 200 also includes a cable harness assembly 230 disposed on the thermal insulation cross plate 210, the cable harness assembly 230 being used to confine cables within a predetermined range.

[0105] The cable harness assembly 230 can bind the cable, preventing it from being scattered on the heat insulation cross plate 210. By confining the cable within a predetermined range, it can prevent the cable from contacting the first heat dissipation body 110 or the second heat dissipation body 120, thus providing better protection for the cable.

[0106] In some embodiments, please refer to Figure 3 and Figure 5 The cable harness assembly 230 includes at least one first cable clamp 231 and at least one second cable clamp 232, the first cable clamp 231 and the second cable clamp 232 are disposed opposite to each other, the first cable clamp 231 can restrict at least one side of the cable, and the second cable clamp 232 can restrict at least the other side of the cable.

[0107] Combination Figure 2 In the coordinate system, the first cable clamp 231 can be restricted to the front side of the cable, and the second cable clamp 232 can be restricted to the rear side of the cable. The space between the first cable clamp 231 and the second cable clamp 232 is the aforementioned predetermined range.

[0108] In some embodiments, please refer to Figure 5 The first cable clamp 231 includes a first limiting wall 2311 and a second limiting wall 2312 connected to the first limiting wall 2311. The first limiting wall 2311 restricts one side of the cable length direction, and the second limiting wall 2312 restricts the cable above. The second cable clamp 232 includes a third limiting wall 2321 and a fourth limiting wall 2322 connected to the third limiting wall 2321. The third limiting wall 2321 restricts the cable length direction on the other side, and the second and fourth limiting walls restrict the cable above.

[0109] It should be understood that the aforementioned length direction can be the X direction, the first limiting wall 2311 restricting one side of the cable length direction can be the first limiting wall 2311 restricting the front side of the cable, and the second limiting wall 2312 restricting the other side of the cable length direction can be the second limiting wall 2312 restricting the rear side of the cable.

[0110] Thus, the first cable clamp 231 can restrict the cable from the front and top, and the second cable clamp 232 can restrict the cable from the rear and top, thereby ensuring that the cable is stably positioned within a predetermined range.

[0111] In addition to the above, the cable harness assembly 230 can also adopt the structure of an elastic clip. For example, the elastic clip can be set on the heat insulation horizontal plate 210. The elastic element can clamp and fix the cable, so that the cable is stably placed on the heat insulation horizontal plate 210.

[0112] The above provides a detailed description of a heat dissipation device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation device, characterized in that, include: A radiator, comprising a first heat dissipation body, a second heat dissipation body, and a heat pipe assembly connected between the first heat dissipation body and the second heat dissipation body, wherein the heat pipe assembly is lower than the first heat dissipation body and the second heat dissipation body in the height direction of the radiator. The heat insulation structure is located between the first heat dissipation body and the second heat dissipation body, and is disposed on the outside of the heat pipe assembly. The heat insulation structure is used to support the cable and form an isolation between the heat pipe assembly and the cable.

2. The heat dissipation device according to claim 1, characterized in that, The radiator further includes a connecting base, which is connected to at least one of the first heat dissipation body, the second heat dissipation body, and the heat pipe assembly. The connecting base has a first connecting portion extending out of the heat pipe assembly, and the heat insulation structure has a second connecting portion that can be connected to the first connecting portion.

3. The heat dissipation device according to claim 2, characterized in that, The connecting base is located in the space below the heat pipe assembly.

4. The heat dissipation device according to claim 2, characterized in that, The connecting base includes at least one pair of connecting side plates, and the pair of connecting side plates includes a first connecting side plate and a second connecting side plate. The first connecting side plate is located on one side of the heat pipe assembly, and the second connecting side plate is located on the other side of the heat pipe assembly. At least one first connecting part is provided on the first connecting side plate, and at least one first connecting part is provided on the second connecting side plate.

5. The heat dissipation device according to claim 4, characterized in that, The first connecting side plate is inclined from top to bottom along the direction away from the heat pipe assembly, and the second connecting side plate is inclined from top to bottom along the direction away from the heat pipe assembly.

6. The heat dissipation device according to any one of claims 2 to 5, characterized in that, The heat insulation structure includes a heat insulation horizontal plate and heat insulation side plates disposed at both ends of the heat insulation horizontal plate. The heat insulation horizontal plate and the heat insulation side plates form a receiving cavity, and at least part of the heat pipe assembly is housed in the receiving cavity. The second connecting part protrudes from the heat insulation side plate. The heat insulation horizontal plate is located above the heat pipe assembly and is used to support the cable. The heat-insulating side plate is inclined from top to bottom along the direction away from the heat pipe assembly.

7. The heat dissipation device according to claim 6, characterized in that, There are at least two second connecting portions disposed on the same heat insulation side plate, and the at least two second connecting portions have different sizes or different structures; At least two of the second connecting portions have their sides away from the heat-insulating side plate constructed as bevels.

8. The heat dissipation device according to claim 7, characterized in that, The heat insulation structure also includes a wire harness assembly disposed on the heat insulation cross plate, the wire harness assembly being used to confine the cable within a predetermined range; The cable harness assembly includes at least one first cable harness clip and at least one second cable harness clip, the first cable harness clip and the second cable harness clip being disposed opposite to each other, the first cable harness clip being able to restrict at least one side of the cable, and the second cable harness clip being able to restrict at least the other side of the cable; The first cable clamp includes a first limiting wall and a second limiting wall connected to the first limiting wall. The first limiting wall restricts one side of the cable along its length, and the second limiting wall restricts the cable from above. The second cable clamp includes a third limiting wall and a fourth limiting wall connected to the third limiting wall. The third limiting wall restricts the cable on the other side of its length direction, and the fourth limiting wall restricts the cable above it.

9. A motherboard, comprising a central processing unit, characterized in that, It also includes a heat dissipation device according to any one of claims 1 to 8, wherein the first heat dissipation body of the heat dissipation device is located above the central processing unit.

10. A server, characterized in that, Includes the motherboard as described in claim 9.

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