Support-free packaging carrier boat for chips
By designing a chip supportless packaging carrier, the problems of increased packaging thickness and insufficient functional utilization in existing technologies are solved, achieving precise positioning and efficient packaging of chips without support.
Patent Information
- Application Number
- CN202423097287.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-13
AI Technical Summary
In existing semiconductor packaging technologies, chips require supporting structures, which increases the packaging thickness, prevents the utilization of functions on the back of the chip such as photosensitive elements, and results in insufficient heat dissipation.
A chip supportless packaging carrier is adopted. Through the combination of carrier base, bottom adhesive tape and carrier pressure plate, the chip is fixed on the PCB board without support. Combined with the positioning structure of magnets and steel plates, the precise positioning of chip and PCB board and supportless packaging are ensured.
This achieves a chip-free packaging structure, with the chip's lower surface flush with or protruding from the PCB board, enhancing chip functionality and heat dissipation, and improving packaging efficiency.
Smart Images
Figure CN223552504U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of semiconductor chip packaging equipment, and more specifically to a supportless chip packaging carrier. Background Technology
[0002] Currently, the semiconductor packaging industry includes COB packaging (Chip on Board), plastic packaging, and ceramic packaging. All three types of packaging products require support when mounting bare chips. The so-called support means that the frame has a base island or the substrate has support.
[0003] COB packaging, such as Figure 1 As shown, the chip is first fixed onto the circuit board (substrate). The diagram includes PCB board 101, chip 102, mounting adhesive 103, bonding wire 104, and potting compound 105. Plastic encapsulation is then performed, as shown... Figure 2 As shown, the chip is first fixed onto the base island of the frame. The diagram includes frame 106, base island (support) 107, chip 108, die adhesive 109, bonding wire 110, and encapsulation area 111. Ceramic encapsulation, as shown... Figure 3 As shown, the chip is first fixed inside the base of the housing. The figure includes a ceramic housing 112, a chip 113, a die adhesive 114, a bonding wire 115, and a cap 116. The inner cavity of the ceramic housing 112 provides support for the chip 113.
[0004] The above three packaging methods have some problems, such as: (1) increasing the packaging thickness, which is not applicable to some products with very small packaging thickness requirements; (2) the back of the chip is attached, which makes it impossible to utilize the functions of the back of the chip, such as photosensitive, and it cannot pass through air or liquid, resulting in a small heat dissipation function.
[0005] However, the development of current semiconductor packaging products requires utilizing functions on the back of the chip, such as photosensitive elements, necessitating the chip's ability to breathe and pass through liquids. Therefore, there is an urgent need for a chip-supportless packaging technology to meet the requirements of chip-supportless (without base islands or substrates) packaging. Utility Model Content
[0006] To address the aforementioned issues, this invention provides a supportless chip packaging carrier. The PCB board is first fixed in the carrier, and then the chip is placed in a relative position on the PCB board. The chip is not supported on the PCB board but is only temporarily fixed on the carrier, thus achieving chip packaging without a base island or substrate support.
[0007] According to one aspect of the present invention, a supportless chip packaging carrier is provided, comprising a carrier base, a bottom adhesive tape, and a carrier upper pressure plate;
[0008] The front of the carrier base is provided with several grooves for placing PCB boards. The grooves have a through slot portion that penetrates the carrier base and a slot bottom portion that supports the PCB board. The through slot portion can accommodate the chip to be mounted.
[0009] The adhesive tape is attached to the bottom of the carrier base to support the chip to be mounted;
[0010] The upper pressure plate of the carrier boat is provided with a number of mounting holes, the number of mounting holes being the same as the number of grooves on the carrier boat base. The mounting holes are used for mounting and packaging operations. The mounting holes correspond to the through slots of the carrier boat base. The back of the upper pressure plate of the carrier boat has a protruding pressure block. The mounting holes are located at the pressure block. When the upper pressure plate of the carrier boat is assembled above the carrier boat base, the pressure block is embedded in the groove of the carrier boat base and presses the PCB board.
[0011] Therefore, the bottom adhesive tape is applied to the bottom of the carrier base, covering the through slot. The PCB board is placed in the groove of the carrier base, and the upper pressure plate is placed on the carrier base. At this time, the pressure block on the back of the upper pressure plate is embedded in the groove on the front of the carrier base, and the pressure plate of the upper pressure plate presses down on the PCB board. The mounting hole is located directly above the through slot of the carrier base, exposing the bottom adhesive tape. After the carrier installs the PCB board in place, the PCB board follows the carrier to perform processes such as mounting, bonding, encapsulation (potting), and baking. After the encapsulation glue (potting glue) has hardened after baking, the chip does not need to be supported. First, peel off the bottom adhesive tape on the back of the carrier, and then remove the upper pressure plate of the carrier to take out all the finished products.
[0012] In some embodiments, a plurality of magnets 1 are embedded in the base of the boat, and a plurality of magnets 2 are embedded in the upper pressure plate of the boat. Magnets 1 and magnets 2 are one-to-one corresponding magnets with opposite poles attracting each other. Thus, the base of the boat and the upper pressure plate of the boat attract each other through the upper and lower magnets, and the upper pressure plate of the boat can effectively press the PCB board firmly.
[0013] In some embodiments, the carrier boat also includes a steel plate with a plurality of chip through holes. The chip through holes can accommodate the chips to be mounted. The chip through holes correspond to the through slot portion of the carrier boat base. The back of the carrier boat base is provided with a receiving groove that can be embedded in the steel plate. The receiving groove covers the edge of the through slot portion. The depth of the receiving groove is equal to the height of the lower surface of the chip protruding from the lower surface of the PCB board. After the bottom adhesive tape is attached to the bottom of the carrier boat base, it covers the steel plate and the chip through holes. Therefore, when designing a packaged product, the height of the chip's lower surface protruding above the PCB board's lower surface needs to be considered. If the height is 0, the carrier does not need the steel plate, and correspondingly, the back of the carrier base does not need a receiving groove. If the height is greater than 0, a receiving groove of the same depth must be provided. For this type of packaged product, the steel plate needs to be embedded into the receiving groove on the back of the carrier base first, then adhesive tape is applied, and the PCB board is placed in the groove of the carrier base. After assembling the carrier's upper pressure plate, subsequent die mounting and other processes are performed. This carrier can be used to package products where the chip has no support and the chip's lower surface protrudes above the PCB board.
[0014] In some embodiments, the steel plate is a magnetic steel plate, which is embedded in the receiving groove of the carrier base and then adsorbed into the receiving groove. Thus, by using a magnetic steel plate, and with a magnet on the carrier base, when the magnetic steel plate is embedded in the receiving groove, it can be adsorbed into the receiving groove at the bottom of the carrier base, making the magnetic steel plate stable in position after placement and achieving high positioning accuracy.
[0015] In some embodiments, the bottom of the groove is provided with a product positioning pin, the PCB board is provided with a product positioning hole that matches the product positioning pin, and the upper pressure plate of the carrier is provided with a product positioning pin clearance hole. Thus, the PCB board can be positioned by assembling its product positioning hole with the product positioning pin in the groove. After the upper pressure plate of the carrier is placed, the clearance hole of the product positioning pin is aligned vertically with the product positioning pin, which does not affect the placement of the upper pressure plate of the carrier and can also play a positioning role.
[0016] In some embodiments, the back of the upper pressure plate of the carrier boat is provided with a plate positioning pin, and the carrier boat base is provided with a plate positioning hole that matches the plate positioning pin. Thus, when the upper pressure plate of the carrier boat is placed, aligning the plate positioning hole of the upper pressure plate of the carrier boat with the plate positioning hole of the carrier boat base allows the upper pressure plate of the carrier boat to be aligned and assembled with the carrier boat base.
[0017] In some embodiments, the steel plate has a foolproof chamfer, and the receiving groove has a large rounded corner that matches the foolproof chamfer. This ensures the correct placement of the steel plate and improves work efficiency.
[0018] In some embodiments, the carrier is equipped with a support base, the back of which is a flat surface, and the front of which is attached to the bottom adhesive tape to support the bottom adhesive tape during bonding. Therefore, during the bonding process, to prevent the bottom adhesive tape from failing to withstand the bonding pressure, a support base is added to support the bottom adhesive tape during bonding.
[0019] Compared with the prior art, the beneficial effects of this utility model are: This utility model provides a novel and ingeniously designed carrier boat for chip unsupported packaging. The carrier boat can realize a chip unsupported packaging structure. In the chip unsupported packaging structure, the lower surface of the chip is flush with the lower surface of the PCB board, and the lower surface of the chip can also protrude downward relative to the lower surface of the PCB board.
[0020] When the height of the lower surface of the chip protruding from the lower surface of the PCB board in the packaging structure is greater than 0, the carrier is equipped with a steel plate and the back of the carrier base has a receiving groove. First, the steel plate is embedded into the receiving groove on the back of the carrier base and a bottom adhesive tape is attached. The bottom adhesive tape can cover the chip through hole of the steel plate. Then, the PCB board is placed in the groove of the carrier base. Finally, the carrier upper pressure plate is assembled. The next step is for the PCB board to follow the carrier for die mounting, bonding, encapsulation (potting), baking and other processes. During bonding, the carrier can be placed on the support base to support the bottom adhesive tape and resist the pressure during bonding.
[0021] When the height of the chip's lower surface protruding from the PCB board's lower surface in the packaging structure is equal to 0, the carrier is not equipped with a steel plate and the back of the carrier base has no receiving groove. First, the bottom adhesive tape is directly attached to the bottom of the carrier base and the bottom adhesive tape covers the through groove. The PCB board is placed in the groove of the carrier base. Finally, the carrier upper pressure plate is assembled. The next step is for the PCB board to follow the carrier for processes such as die mounting, bonding, encapsulation (potting), and baking. During bonding, the carrier is placed on the support base.
[0022] This carrier enables chip packaging without support (without a base island or a base). The steel plate in the carrier is precisely positioned relative to the carrier base, and the carrier base is precisely positioned relative to the upper pressure plate, ensuring accurate positioning of the PCB board and the chip. Furthermore, it can package multiple chips, greatly improving work efficiency. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of a COB packaged product in the prior art, wherein, Figure 1 A is the front view. Figure 1 B is the top view;
[0024] Figure 2 This is a schematic diagram of the structure of a plastic-sealed product in the prior art, wherein, Figure 2 B is the top view. Figure 2 A is Figure 2Sectional view of AA in B;
[0025] Figure 3 This is a structural diagram of a ceramic sealing product in the prior art, in which, Figure 3 A is the front view. Figure 3 B is the top view, and 3C is the bottom view;
[0026] Figure 4 This is a schematic diagram of the structure of a chip unsupported packaged product, in which... Figure 4 A is the front view. Figure 4 B is the top view. Figure 4 C is Figure 4 Enlarged view of part I in A;
[0027] Figure 5 This is a schematic diagram of a chip unsupported packaging product. The diagram does not include the encapsulating adhesive. Figure 5 B is the top view. Figure 5 A is Figure 5 A sectional view of BB in B;
[0028] Figure 6 This is a schematic diagram of one embodiment of the present invention for a supportless chip packaging carrier, wherein, Figure 6 A is the top view. Figure 6 B is Figure 6 Sectional view of CC in A Figure 6 C is a sectional view of DD in 6A. Figure 6 D is Figure 6 Enlarged view of section II in C;
[0029] Figure 7 This is an exploded diagram of the boat, excluding the support base;
[0030] Figure 8 This is a schematic diagram of the structure of the pressure plate on the boat, in which, Figure 8 A is the top view. Figure 8 B is Figure 8 Sectional view of FF in A Figure 8 C is Figure 8 Sectional view of EE in A Figure 8 D is the bottom view;
[0031] Figure 9 This is a schematic diagram of the structure of the boat-carrying base, in which, Figure 9 A is the top view. Figure 9 B is Figure 9 A cross-sectional view of NN in A Figure 9 C is Figure 9 Cross-sectional view of MM in A Figure 9 D is the bottom view;
[0032] Figure 10This is a structural diagram of the steel plate;
[0033] Figure 11 This is a structural diagram of the support base, in which, Figure 11 A is the top view. Figure 11 B is Figure 11 A sectional view of GG in section A;
[0034] Figure 12 This is a schematic diagram of another embodiment of the present invention for a supportless chip packaging carrier, without a steel plate. Detailed Implementation
[0035] The present invention will be further described below with reference to specific embodiments.
[0036] like Figure 4 and 5 As shown, the carrier provided in this application is for packaging products with a chip-unsupported structure. "Chip-unsupported" means that the chip 202 is packaged without a base island or substrate support, and the height H of the lower surface of the chip 202 protruding from the lower surface of the PCB board 201 in the packaged product is ≥0. A simplified structure of this package is shown below. Figure 4 and 5 As shown, the packaging structure includes a PCB board 201, a chip 202, a chip vent hole 2021, a bonding wire 203, an encapsulation 204, and a product positioning hole 205.
[0037] Example 1
[0038] like Figure 6 and 7 As shown, one embodiment of this utility model provides a supportless chip packaging carrier, specifically for a packaging product where the lower surface of chip 202 protrudes from the lower surface of PCB board 201 at a height greater than 0.
[0039] The carrier includes a carrier base 1, a steel plate 4, a bottom adhesive tape 2, and a carrier pressure plate 3.
[0040] like Figure 9 As shown, the front of the carrier base 1 has several grooves 12 for placing the PCB board 201. Each groove 12 has a through-slot portion 121 penetrating the carrier base 1 and a bottom portion 122 supporting the PCB board 201. The through-slot portion 121 can accommodate the chip 202 to be mounted. The back of the carrier base 1 has a receiving groove 14 for embedding a steel plate 4, covering the edge of the through-slot portion 121. The thickness t of the steel plate 4 and the depth of the receiving groove 14 are both equal to the height H of the lower surface of the chip 202 protruding from the lower surface of the PCB board 201.
[0041] like Figure 10As shown, the steel plate 4 has several chip through holes 41, which can accommodate the chips 202 to be mounted. The number of chip through holes 41 is the same as the number of grooves 12, and the chip through holes 41 correspond to the through slots 121 of the carrier base 1. The steel plate 4 is provided with a foolproof chamfer 42, and the receiving groove 14 is provided with a large rounded corner 141 that matches the foolproof chamfer 42, which can ensure that the steel plate 4 is placed quickly and correctly.
[0042] The steel plate 4 is assembled into the receiving groove 14 on the back of the carrier base 1, and the bottom adhesive tape 2 is attached. After the bottom adhesive tape 2 is attached to the bottom of the carrier base 1, the bottom adhesive tape 2 can cover the steel plate 4 and the chip through hole 41 so that the bottom adhesive can support the chip 202 to be mounted during subsequent assembly.
[0043] like Figure 8 As shown, the upper pressure plate 3 of the carrier has a number of mounting holes 31, the number of which is the same as the number of grooves 12 on the carrier base 1. The mounting holes 31 are used for mounting and encapsulation operations, and correspond to the through slots 121 of the carrier base 1. The back of the upper pressure plate 3 has a protruding pressure block 32, and the mounting holes 31 are formed at the pressure block 32. When the upper pressure plate 3 is assembled above the carrier base 1, the pressure block 32 is embedded in the grooves 12 of the carrier base 1 and presses the PCB board 201.
[0044] To achieve precise product positioning, the bottom portion 122 of the groove 12 has a product positioning pin 123. Figure 9 As shown), the PCB board 201 has product positioning holes 205 that match the product positioning pins 123. Figure 4 As shown), correspondingly, the pressure plate 3 on the carrier boat has a product positioning pin clearance hole 35 (as shown). Figure 8 (As shown). In this way, the PCB board 201 is assembled with the product positioning pin 123 of the groove 12 through its product positioning hole 205, which can position the PCB board 201. After the pressure plate 3 on the carrier is placed, the product positioning pin clearance hole 35 is aligned with the product positioning pin 123 vertically, which does not affect the placement of the pressure plate 3 on the carrier and can also play a positioning role.
[0045] like Figure 8 and 9 As shown, to ensure accurate positioning of the upper pressure plate 3 and the base 1 of the boat, the back of the upper pressure plate 3 has a plate positioning pin 34, and the base 1 of the boat has a plate positioning hole 15 that matches the plate positioning pin 34. When the upper pressure plate 3 is placed, aligning the plate positioning hole 15 of the upper pressure plate 3 with the plate positioning hole 15 of the base 1 of the boat allows the upper pressure plate 3 and the base 1 of the boat to be aligned and assembled.
[0046] The carrier base 1 has holes, and several magnets 13 are embedded in the holes. The carrier upper pressure plate 3 has holes, and several magnets 33 are embedded in the holes. Magnets 13 and 33 are one-to-one corresponding magnets that attract each other. Magnets 13 and 33 are high-temperature resistant magnets, and after assembly, they do not protrude from their respective carrier base 1 or carrier upper pressure plate 3. In this embodiment, 10 packaging stations are designed, with 17 magnets 13 and 33 respectively. There are two magnets between every two packaging stations, and 5 magnets are evenly distributed on one side of each of the 10 packaging stations. In this way, the carrier base 1 and the carrier upper pressure plate 3 attract each other through the upper and lower magnets, and the carrier upper pressure plate 3 can effectively press the PCB board 201.
[0047] Correspondingly, the steel plate 4 is a magnetic steel plate. After being embedded in the receiving groove 14 of the carrier base 1, the steel plate 4 is attracted to the receiving groove 14. The use of a magnetic steel plate, coupled with a magnet 13 on the carrier base 1, allows the magnetic steel plate to be attracted to the receiving groove 14 at the bottom of the carrier base 1 after being embedded in the receiving groove 14, ensuring stable positioning and high accuracy after placement.
[0048] The support base 5 is configured during bonding using a carrier boat. Figure 6 and Figure 11 As shown in the diagram, during actual operation, the support base 5 is installed in its working position using screws. The back of the support base 5 is a flat surface, and the front of the support base 5 is in contact with the bottom adhesive tape 2 to support the bottom adhesive tape 2 during bonding. During the bonding process, to prevent the bottom adhesive tape 2 from failing to support the pressure during bonding, the support base 5 is added to support the bottom adhesive tape 2 during bonding.
[0049] The process of using this carrier boat for chip packaging:
[0050] Combination Figure 6The process involves inverting the carrier base 1 and embedding the steel plate 4 into the receiving groove 14 on the back of the carrier base 1; applying a base adhesive tape 2, which covers the steel plate 4, including the chip through-hole 41, with the edge of the base adhesive tape 2 attached to the bottom of the carrier base 1; flipping the carrier base 1 so that the front faces forward, placing the PCB board 201 in the groove 12 of the carrier base 1, and positioning it with the product positioning pin 123; then, assembling the carrier upper pressure plate 3, with the pressure block 32 on the back of the carrier upper pressure plate 3 embedded in the groove 12 on the front of the carrier base 1, the pressure plate of the carrier upper pressure plate 3 pressing down on the PCB board 201, and the mounting hole 31 located directly above the through-groove portion 121 of the carrier base 1, exposing the base adhesive tape 2. Next, the PCB board 201 follows the carrier boat through processes such as die loading, bonding, encapsulation (potting), and baking. During bonding, the carrier boat can be placed on the support base 5 to support the bottom adhesive tape 2 and withstand the pressure during bonding. After the encapsulation glue (potting glue) has hardened after baking, the chip 202 no longer needs support. First, peel off the bottom adhesive tape 2 on the back of the carrier boat, then remove the upper pressure plate 3 of the carrier boat to remove all the finished products.
[0051] Example 2
[0052] The main difference between Embodiment 2 and Embodiment 1 is that, in this embodiment of the present invention, a supportless chip packaging carrier is specifically used for a packaging product where the height H of the lower surface of the chip 202 protruding from the lower surface of the PCB board 201 is equal to 0. Figure 4 and 5 As shown. Therefore, as Figure 12 As shown, the carrier includes a carrier base 1, a bottom adhesive tape 2, and a carrier upper pressure plate 3. It does not require a steel plate 4, and the back of the carrier base 1 does not have a receiving groove 14. The remaining structure of the carrier base 1 and the structure of the carrier upper pressure plate 3 are the same as in Embodiment 1.
[0053] The process of using this carrier boat for chip packaging:
[0054] Invert the carrier base 1 and attach the bottom adhesive tape 2 to the bottom of the carrier base 1, covering the through slot portion 121. Flip the carrier base 1 so that the front side faces up, place the PCB board 201 in the groove 12 of the carrier base 1, and position it using the product positioning pin 123. Then, assemble the carrier upper pressure plate 3. The pressure block 32 on the back of the carrier upper pressure plate 3 is embedded in the groove 12 on the front side of the carrier base 1, and the pressure plate of the carrier upper pressure plate 3 presses down on the PCB board 201, with the mounting hole 31 located directly above the through slot portion 121 of the carrier base 1, exposing the bottom adhesive tape 2. Next, the PCB board 201 follows the carrier for processes such as mounting, bonding, encapsulation (potting), and baking. During bonding, the carrier can be placed on the support base 5 to support the bottom adhesive tape 2 and withstand the pressure during bonding. After the encapsulating glue (potting compound) has hardened after baking, the chip 202 no longer needs support. First, peel off the bottom adhesive tape 2 on the back of the carrier, then remove the upper pressure plate 3 of the carrier, and all the finished products can be taken out.
[0055] The product obtained by packaging the carrier provided in this embodiment is such that the lower surface of the chip 202 is flush with the lower surface of the PCB board 201.
[0056] This utility model provides a novel and ingeniously designed carrier boat for chip unsupported packaging. The carrier boat enables chip unsupported packaging structure. In the chip unsupported packaging structure, the lower surface of chip 202 is flush with the lower surface of PCB board 201, and the lower surface of chip 202 can also protrude downward relative to the lower surface of PCB board 201.
[0057] This carrier enables chip packaging without support (without a base island or a base). The steel plate 4 in the carrier is precisely positioned with the carrier base 1, and the carrier base 1 is precisely positioned with the carrier upper pressure plate 3, ensuring the accurate positioning of the PCB board 201 and the chip 202. Moreover, multiple chips can be packaged at this time, which greatly improves work efficiency.
[0058] The above descriptions are merely some embodiments of this utility model. It should be noted that those skilled in the art can make other modifications and improvements without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.
Claims
1. A carrier boat for unsupported chip packaging, characterized in that, include: The boat base (1) has several grooves (12) on its front side for placing PCB boards. The grooves (12) have a through slot (121) that penetrates the boat base (1) and a bottom slot (122) that supports the PCB board. The through slot (121) can accommodate the chip to be mounted. A bottom adhesive tape (2) is attached to the bottom of the carrier base (1) to support the chip to be mounted; The upper pressure plate (3) of the carrier is provided with a number of mounting holes (31). The number of mounting holes (31) is the same as the number of grooves (12) on the carrier base (1). The mounting holes (31) are used for mounting and packaging operations. The mounting holes (31) correspond to the through slots (121) of the carrier base (1). The back of the upper pressure plate (3) of the carrier has a protruding pressure block (32). The mounting holes (31) are located at the pressure block (32). When the upper pressure plate (3) of the carrier is assembled above the carrier base (1), the pressure block (32) is embedded in the groove (12) of the carrier base (1) and presses the PCB board.
2. The supportless chip packaging carrier according to claim 1, characterized in that, The base (1) of the boat is inlaid with a number of magnets (13), and the pressure plate (3) of the boat is inlaid with a number of magnets (33). The magnets (13) and magnets (33) are magnets of opposite polarity that attract each other.
3. The supportless chip packaging carrier according to claim 2, characterized in that, The carrier boat also includes a steel plate (4), which has a plurality of chip through holes (41). The chip through holes (41) can accommodate the chip to be mounted. The chip through holes (41) correspond to the through slot (121) of the carrier boat base (1). The back of the carrier boat base (1) is provided with a receiving groove (14) that can be embedded in the steel plate (4). The receiving groove (14) covers the edge of the through slot (121). The depth of the receiving groove (14) is equal to the height (H) of the lower surface of the chip protruding from the lower surface of the PCB board. The bottom adhesive tape (2) is attached to the bottom of the carrier boat base (1) and covers the steel plate (4) and the chip through holes (41).
4. The supportless chip packaging carrier according to claim 3, characterized in that, The steel plate (4) is a magnetic steel plate. After the steel plate (4) is embedded in the receiving groove (14) of the carrier base (1), it is adsorbed into the receiving groove (14).
5. The supportless chip packaging carrier according to claim 1, characterized in that, The groove bottom portion (122) of the groove (12) is provided with a product positioning pin (123), the PCB board is provided with a product positioning hole that matches the product positioning pin (123), and the upper pressure plate (3) of the carrier boat is provided with a product positioning pin clearance hole (35).
6. The supportless chip packaging carrier according to claim 1, characterized in that, The back of the pressure plate (3) on the boat is provided with a plate positioning pin (34), and the boat base (1) is provided with a plate positioning hole (15) that matches the plate positioning pin (34).
7. The supportless chip packaging carrier according to claim 3, characterized in that, The steel plate (4) is provided with a foolproof chamfer (42), and the receiving groove (14) is provided with a large rounded corner (141) that matches the foolproof chamfer (42).
8. The supportless chip packaging carrier according to any one of claims 1 to 7, characterized in that, The carrier is equipped with a support base (5), the back of the support base (5) is a flat surface, and the front of the support base (5) is attached to the bottom adhesive tape (2) so as to support the bottom adhesive tape (2) during bonding.