Semiconductor device processing equipment and transfer manipulator

Abstract

The utility model discloses a semiconductor device processing device and a transfer manipulator, the semiconductor device processing device comprises a wafer bearing table and a transfer manipulator used for absorbing and transferring a workpiece on the wafer bearing table to a preset position, and the transfer manipulator comprises a vacuum chuck. The vacuum suction cup is characterized in that the vacuum suction cup is arranged on the back face of an annular assembly, a medium channel is formed in the annular assembly, the lower portion of the medium channel is communicated with a circle of through holes formed in the periphery of the vacuum suction cup in a surrounding mode, and the medium channel is further communicated with a connector on the annular assembly. According to the transferring manipulator, when the workpiece is adsorbed, an air curtain or a water curtain can be formed around the workpiece, and water mist in a processing box and a space below the workpiece can be isolated to the greatest extent, so that the problem that the water mist below the workpiece is blown to the back surface of the workpiece to cause pollution to the back surface of the workpiece when a wafer bearing table blows air reversely is avoided.

Description

Technical Field

[0001] This utility model relates to semiconductor device processing equipment, and in particular to semiconductor device processing equipment and transfer robot. Background Technology

[0002] In the processing of semiconductor devices such as wafers and substrates, it is often necessary to use a transfer robot to move workpieces from the wafer stage to other locations. For example, the utility model patent with authorization announcement number CN218182183U describes the use of a transfer robot to move workpieces from the wafer stage to the cleaning module.

[0003] The workpiece mounting platform usually uses vacuum adsorption to fix the workpiece. When the transfer robot adsorbs the workpiece, the mounting platform blows air towards the back of the workpiece to make it easier for the workpiece to detach from the mounting platform and thus make adsorption safer. However, when the mounting platform blows air towards the back of the workpiece, it will blow water mist in the processing chamber onto the back of the workpiece, causing the back of the workpiece to be contaminated. Utility Model Content

[0004] The purpose of this invention is to solve the above-mentioned problems in the prior art and to provide a semiconductor device processing equipment and a transfer robot.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] Semiconductor device processing equipment includes a wafer stage and a transfer robot for adsorbing and transferring workpieces on the wafer stage to a predetermined position. The transfer robot includes a vacuum suction cup. The vacuum suction cup is disposed on the back of an annular assembly. A medium channel is formed inside the annular assembly. The lower part of the medium channel communicates with a through hole surrounding the outer periphery of the vacuum suction cup. The medium channel also communicates with a connector on the annular assembly.

[0007] Preferably, in the semiconductor device processing equipment, the connector is connected to a gas supply system and / or a liquid supply system.

[0008] Preferably, in the semiconductor device processing equipment, the medium ejected from the through hole forms an air curtain or water curtain around the vacuum suction cup.

[0009] Preferably, in the semiconductor device processing equipment, the diameter of the through hole is between 0.5 mm and 1 mm.

[0010] Preferably, in the semiconductor device processing equipment, the top of the annular assembly is connected to a connecting disk via a set of connecting rods. The connecting rods can move up and down relative to the connecting disk and are limited on the connecting disk by a limiting block located above the connecting disk. An elastic element is also provided between the annular assembly and the connecting disk.

[0011] Preferably, in the semiconductor device processing equipment, the transfer robot can move the workpiece to the top cleaning mechanism.

[0012] Preferably, in the semiconductor device processing equipment, the top cleaning mechanism includes a tank, the top of which is provided with a cover that can be automatically opened and closed relative to it, and an ion fan is provided on the cover.

[0013] Preferably, in the semiconductor device processing equipment, the cover is provided with a swing mechanism, which is connected to the cleaning assembly inside the cover and drives the cleaning assembly to swing horizontally.

[0014] Preferably, in the semiconductor device processing equipment, the swing mechanism uses a rotary cylinder as its power source.

[0015] A transfer robot includes a vacuum suction cup disposed on the back of an annular assembly. A medium channel is formed inside the annular assembly. The lower part of the medium channel communicates with a through hole surrounding the outer periphery of the vacuum suction cup. The medium channel also communicates with a connector on the annular assembly.

[0016] The advantages of this utility model's technical solution are mainly reflected in:

[0017] The transfer robot of this invention can form an air curtain or water curtain around the workpiece when adsorbing it, which can isolate the water mist in the processing box from the space below the workpiece to the greatest extent. This avoids the problem of water mist below the workpiece being blown to the back of the workpiece and causing contamination of the back of the workpiece when the support table blows air back.

[0018] This invention forms an air curtain around the workpiece, which can effectively avoid the influence of the water curtain on the adsorption holes of the support platform and prevent water splashing, thus making the equipment more stable to use. Attached Figure Description

[0019] Figure 1 This is a partial perspective view of the semiconductor device processing equipment of this utility model;

[0020] Figure 2 This is a partial perspective view of the transfer robot of this utility model;

[0021] Figure 3 This is a partial exploded view of the transfer robot of this utility model;

[0022] Figure 4 This is a partial exploded perspective view of the top cleaning mechanism of this utility model. Detailed Implementation

[0023] The purpose, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this utility model, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0024] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] The semiconductor device processing equipment disclosed in this utility model will be described below with reference to the accompanying drawings. The semiconductor processing equipment can be a dicing machine, a thinning machine, etc. In this embodiment, a thinning machine is used as an example. It can be the structure disclosed in invention patent applications with publication numbers CN116652767A and CN115338717A, or authorized publication number CN218639240U, as shown in the attached drawings. Figure 1 As shown, it includes a support stage 100 and a transfer robot 200 for adsorbing and transferring the workpiece on the support stage 100 to a predetermined position.

[0026] As attached Figure 2 Appendix Figure 3 As shown, the transfer manipulator 200 includes a vacuum suction cup 210, which is disposed on the back of an annular assembly 220. A medium channel 221 is formed inside the annular assembly 220. The lower part of the medium channel 221 communicates with a through hole 222 surrounding the outer periphery of the vacuum suction cup 210. The medium channel 221 also communicates with a connector 223 on the annular assembly 220.

[0027] Specifically, the transfer manipulator 200 includes a swing mechanism 340. The specific structure of the swing mechanism 340 is known technology, for example, the structure disclosed in the utility model patent with authorization announcement number CN217766703U. The swing mechanism 340 includes a swing arm 230 that rotates about a vertical axis. The distal end of the swing arm 230 (the end away from the vertical axis) is connected to the annular assembly 220. The annular assembly 220 includes an upper ring 224 and a lower ring 225 that are concentrically arranged and fixedly connected. The upper ring 224 is provided with a connector 223, which is connected to an air supply system and / or a liquid supply system. Preferably, the connector 223 is connected to a parallel air supply system and a liquid supply system. The lower ring 225 is provided with a medium channel 221, which is an annular groove concentric with the vacuum suction cup 210.

[0028] The diameter of the through holes 222 is between 0.5 mm and 1 mm. The number and spacing of the through holes 222 can be designed as needed to ensure that the medium sprayed from the through holes 222 forms an air curtain or water curtain around the vacuum suction cup 210. When the vacuum suction cup 210 needs to adsorb the workpiece on the support platform 100, it is first moved to a position coaxial and close to the workpiece on the support platform 100. At this time, the medium sprayed through the through holes 222 forms an air curtain on the workpiece, which can effectively prevent water from the water curtain from entering the holes of the support platform 100. Then, the support platform 100 stops vacuum adsorption and backflushs. At the same time, the vacuum suction cup 210 starts to evacuate the vacuum to adsorb and fix the workpiece on the support platform 100, and then removes the workpiece.

[0029] As attached Figure 3 As shown, the annular assembly 220 can float up and down relative to the swing arm 230. Specifically, the top of the upper ring 224 of the annular assembly 220 is connected to a connecting plate 250 via a set of connecting rods 240. The connecting plate 250 is connected to the far end of the swing arm 230. The set of connecting rods 240 are evenly distributed around the axis of the upper ring 224. The connecting rods 240 can move up and down relative to the connecting plate 250 and are limited on the connecting plate 250 by a limiting block 260 located above the connecting plate 250. An elastic element 270 is also provided between the annular assembly 220 and the connecting plate 250. The elastic element 270 is preferably a spring fitted around the outer periphery of each connecting rod 240.

[0030] The predetermined position can be designed as needed; preferably, as shown in the attached figure. Figure 1 As shown, the transfer robot 200 can transfer the processed workpiece to the top cleaning mechanism 300, which can be the structure disclosed in patent application publication number CN115338717A.

[0031] In this embodiment, as shown in the appendix Figure 4 As shown, the top cleaning mechanism 300 includes a tank 310, and the top of the tank 310 is provided with a cover 320 that can be automatically switched relative to it. The structure of the cover 320 with automatic switch is known technology and is not an innovation of this utility model, so it will not be described in detail here.

[0032] The main improvements of this utility model to the top cleaning mechanism 300 are:

[0033] An ion fan 330 is provided on the cover 320. The ion fan 330 can send ion wind into the tank 310, thereby realizing static electricity elimination and dust removal.

[0034] Furthermore, the top cleaning mechanism 300 can be equipped with a swing-type cleaning mechanism on the side of the adsorption table 360, just like in the prior art, to clean the workpiece on the adsorption table 360.

[0035] A further improvement of the top cleaning mechanism 300 in this invention is that a swing mechanism 340 is provided on the cover 320. The swing mechanism 340 is connected to the cleaning assembly 350 inside the cover 320 and drives the cleaning assembly 350 to swing horizontally. The swing mechanism 340 includes a rotary cylinder whose rotating disk extends to the inside of the cover 320 and is connected to a swing rod whose length direction is perpendicular to the axial direction of the rotating disk. The swing rod is connected to the cleaning assembly 350, and the rotary cylinder drives the swing rod to swing above the adsorption stage 360, thereby driving the cleaning assembly 350 to clean the top surface of the wafer on the adsorption stage 360. The cleaning assembly includes an air nozzle and a water nozzle connected to the end of the swing rod away from the rotating disk. The air nozzle is connected to an air supply system, and the water nozzle is connected to a water supply system. This effectively simplifies the cleaning structure and makes the equipment more compact.

[0036] When the workpiece needs to be cleaned, the cover 320 is opened, and the transfer robot 200 places the wafer it grips onto the adsorption stage 360. After the transfer robot 200 moves out of the top cleaning mechanism 300, the cover 320 is closed, and the adsorption stage 360 ​​drives the workpiece on it to rotate. At the same time, the swing mechanism 340 drives the cleaning assembly 350 to spray water, air, etc. on the top of the workpiece to achieve cleaning.

[0037] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A semiconductor device processing apparatus, comprising a wafer stage and a transfer robot for adsorbing and transferring a workpiece on the wafer stage to a predetermined position, the transfer robot including a vacuum suction cup, characterized in that: The vacuum suction cup is disposed on the back of a ring assembly. A medium channel is formed inside the ring assembly. The lower part of the medium channel communicates with a through hole surrounding the outer periphery of the vacuum suction cup. The medium channel also communicates with a connector on the ring assembly. The top of the ring assembly is connected to a connecting plate via a set of connecting rods. The connecting rods can move up and down relative to the connecting plate and are limited on the connecting plate by a limiting block located above the connecting plate. An elastic element is also provided between the ring assembly and the connecting plate.

2. The semiconductor device processing equipment according to claim 1, characterized in that: The connector is connected to the gas supply system and / or the liquid supply system.

3. The semiconductor device processing equipment according to claim 1, characterized in that: The medium ejected from the through-hole forms an air curtain or water curtain around the vacuum suction cup.

4. The semiconductor device processing equipment according to claim 1, characterized in that: The diameter of the through hole is between 0.5 mm and 1 mm.

5. The semiconductor device processing equipment according to any one of claims 1-4, characterized in that: The transfer robot can move the workpiece to the top cleaning mechanism.

6. The semiconductor device processing equipment according to claim 5, characterized in that: The top cleaning mechanism includes a tank, and the top of the tank is provided with a cover that can be automatically opened and closed relative to it. An ion fan is provided on the cover.

7. The semiconductor device processing equipment according to claim 6, characterized in that: The cover is provided with a swing mechanism, which is connected to the cleaning component inside the cover and drives the cleaning component to swing horizontally.

8. The semiconductor device processing equipment according to claim 7, characterized in that: The swing mechanism uses a rotary cylinder as its power source.

9. A transfer robot, including a vacuum suction cup, characterized in that: The vacuum suction cup is disposed on the back of a ring assembly. A medium channel is formed inside the ring assembly. The lower part of the medium channel communicates with a through hole surrounding the outer periphery of the vacuum suction cup. The medium channel also communicates with a connector on the ring assembly. The top of the ring assembly is connected to a connecting plate via a set of connecting rods. The connecting rods can move up and down relative to the connecting plate and are limited on the connecting plate by a limiting block located above the connecting plate. An elastic element is also provided between the ring assembly and the connecting plate.

Images