Semiconductor chip packaging structure

Abstract

The utility model is suitable for the technical field of semiconductor packaging, and provides a semiconductor chip packaging structure, which comprises a lower template, an adsorption mechanism, an upper template arranged above the lower template in parallel, a plurality of electric push rods distributed on the top wall of the lower template in an array manner, and a plurality of LED chips arranged on the adsorption mechanism, and the output end of each electric push rod is fixedly connected with the bottom wall of the upper template. The first adsorption assembly is arranged in the lower mold plate, the second adsorption assembly is arranged in the upper mold plate, in the first adsorption assembly, a first adsorption head can be detachably connected with a first air nozzle in a first through hole, and in the second adsorption assembly, a second adsorption head can be detachably connected with a second air nozzle in a second through hole. When a certain first adsorption head (second adsorption head) is damaged, the first adsorption head (second adsorption head) can be manually taken down from the first air nozzle (second air nozzle) in a quick release mode, so that quick replacement is carried out, and normal operation of the whole device is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, and in particular relates to a semiconductor chip packaging structure. Background Technology

[0002] Semiconductor chip: A semiconductor device that performs a specific function, manufactured by etching and wiring on a semiconductor wafer. To meet the demands of mass production, the electrical properties of semiconductors must be predictable and stable; therefore, strict requirements must be placed on the purity of dopants and the quality of the semiconductor lattice structure. To ensure that the transportation of semiconductor chips does not affect subsequent assembly processes, the chips need to be packaged in a cleanroom environment.

[0003] Chinese utility model patent CN213304068U discloses a semiconductor chip packaging structure, including a lower mold groove and an upper cover plate. The lower mold groove has integrally formed assembly grooves at its four corners, each containing a hydraulic rod. A support wall is integrally formed in the center of the assembly groove. The upper ends of the hydraulic rods are fixedly installed at the four corners of the upper cover plate. Heating strips are embedded in the upper surface of the support wall, and the support wall has a main adsorption hole and a secondary adsorption hole fixedly installed in the center of the lower mold groove. This packaging process does not apply pressure to the chip body. The heat-formed packaging contains dust-free air, avoiding the possibility of chip deformation due to vacuum negative pressure. It also avoids the problem of the packaging leaking and drawing in a large amount of outside air, which would inevitably contaminate the chip. Furthermore, the packaging allows for short-term gas leakage after rupture, thus slowing down the rate at which dust enters the packaging and providing workers with more time to handle the ruptured chip.

[0004] However, the above-mentioned device has the following technical problems in actual use:

[0005] The above-mentioned device uses negative pressure adsorption to adsorb two diaphragms between the cover plate and the support arm respectively. The extension and retraction of multiple hydraulic rods drives the two diaphragms to fit tightly together and encapsulate the semiconductor chip between them. However, the above-mentioned device lacks an alignment device for the two diaphragms, which requires manual alignment when placing the diaphragms. This method not only consumes a lot of manual labor, but also has too low accuracy and cannot guarantee the stable adhesion of the corners of the two diaphragms.

[0006] Second, since the adsorption holes in the above-mentioned device are fixedly installed on the upper cover plate and the lower mold groove, they cannot be disassembled and replaced. Therefore, when one of the adsorption holes in the above-mentioned device is damaged and cannot work, it will affect the adsorption effect on the membrane and affect the overall use of the above-mentioned device. Utility Model Content

[0007] This utility model provides a semiconductor chip packaging structure, which aims to solve the problem mentioned in the background art that the above-mentioned device lacks an alignment device for the film, thus requiring manual placement to ensure that the two films are aligned. This method not only consumes a lot of manual labor, but also has low accuracy and cannot guarantee stable adhesion between the two. In addition, the adsorption device in the above-mentioned device cannot be disassembled and replaced. When one of the adsorption devices is damaged, it will not only affect the overall operation of the device, but also reduce the adsorption quality.

[0008] This utility model is implemented as follows: a semiconductor chip packaging structure includes: a lower template with an upper template arranged parallel above it; multiple electric push rods are arrayed on the top wall of the lower template, the output end of each electric push rod is fixedly connected to the bottom wall of the upper template; a first support base is fixedly installed on the bottom wall of the upper template, and an electric heating strip is arranged around the bottom wall of the first support base; a second support base is fixedly installed on the top wall of the lower template, and a receiving groove for accommodating the electric heating strip is formed around the top wall of the second support base; an adsorption mechanism, comprising: a first adsorption component disposed within the lower template and a second adsorption component disposed within the upper template; the first adsorption component adsorbs a film placed on the lower template, and the second adsorption component adsorbs a film placed on the bottom wall of the upper template; and a correction mechanism disposed on the top of the lower template. The first adsorption component is located on the bottom wall of the upper template and on the outside of the first support and the second support, to drive the upper and lower membranes to align. In this scheme, the first adsorption component is located inside the lower template. The negative pressure generated by the first adsorption component can adsorb the membrane placed on the lower template. At the same time, the second adsorption component is located inside the upper template. The negative pressure generated by the second adsorption component can adsorb the membrane at the bottom of the upper template. In the first adsorption component, the first adsorption head can be detachably connected to the first air nozzle in the first through hole. In the second adsorption component, the second adsorption head can be detachably connected to the second air nozzle in the second through hole. When a first adsorption head (second adsorption head) is damaged, it can be quickly removed from the first air nozzle (second air nozzle) by manual means for quick replacement, so as to ensure the normal operation of the whole device.

[0009] In addition, this device is equipped with a correction mechanism, which is located at the bottom of the upper template and the bottom of the lower template. The two correction mechanisms can align the two films set at the top and bottom, so that the corners of the films are aligned and the problem of improper sealing is avoided.

[0010] Preferably, the first adsorption component includes: a first placement groove formed on the bottom wall of the lower template, a first air storage box fixedly installed in the first placement groove, the inner cavity of the first air storage box being connected to an external negative pressure device through a first delivery pipe, and a plurality of first through holes connected to the first placement groove distributed on the top wall of the lower template, and a first air nozzle fixedly installed on the top wall of the first air storage box corresponding to the plurality of first through holes, one end of the first air nozzle being connected to the inner cavity of the first air storage box, and the other end extending into the first through hole, and a first adsorption head being accommodated in each first through hole, and the first adsorption head and the first air nozzle being detachably connected; in this scheme, when the external negative pressure device extracts the air inside the first air storage box through the first delivery pipe, a negative pressure is generated at the end of each first air nozzle, thereby using the first adsorption head connected to the first air nozzle to perform negative pressure adsorption on the membrane, ensuring the stability of the membrane before sealing.

[0011] Preferably, the second adsorption component includes: a second placement groove formed on the top wall of the upper template, a second air storage box fixedly installed in the second placement groove, the inner cavity of the second air storage box being connected to an external negative pressure device through a second delivery pipe, and a plurality of second through holes connected to the second placement groove distributed on the bottom wall of the upper template, each of the second through holes being provided with a second adsorption head, and a plurality of second air nozzles corresponding one-to-one with the second through holes being connected to the bottom wall of the second air storage box, one end of the second air nozzle extending into the second through hole and detachably connected to the second adsorption head; in this scheme, when the external negative pressure device extracts the air inside the second air storage box through the second delivery pipe, a negative pressure is generated at the end of each second air nozzle, thereby using the second adsorption head connected to the second air nozzle to perform negative pressure adsorption on the membrane, ensuring the stability of the membrane before sealing.

[0012] Preferably, the correction mechanism includes: a first recessed groove formed on the top wall of the lower template and located on one side of the second support, a first limiting block movably disposed in the first recessed groove, a first spring disposed between the bottom wall of the first limiting block and the inner bottom wall of the first recessed groove; and a second recessed groove formed on the bottom wall of the upper template and located on one side of the first support, a second limiting block movably installed inside the second recessed groove, a second spring disposed between the second limiting block and the second recessed groove; in this scheme, when the upper template and the lower template are separated, the first spring and the second spring are in an extended state, thereby pushing the first limiting block and the second limiting block to extend out of the first recessed groove and the second recessed groove, using the first limiting block to correct the deviation of the membrane placed on the lower template, and using the second limiting block to correct the deviation of the membrane placed under the upper template, so that the two membranes set on the upper and lower templates are symmetrically distributed and the edges and corners are aligned with each other, ensuring that there will be no leakage or uneven edge pressing during the subsequent hot pressing process.

[0013] Preferably, the first limiting block and the second limiting block are symmetrically arranged and staggered. In this scheme, in order to facilitate the alignment of the two films arranged above and below, both the first limiting block and the second limiting block can be set to L-shape. The L-shaped limiting block can simultaneously limit the two sides of the film. Since the two limiting blocks are staggered, when the film size is the same, the four corners of the upper and lower films can be aligned by the two sets of limiting blocks, thereby ensuring the accuracy of subsequent hot-pressing encapsulation.

[0014] Preferably, a first guide groove is longitudinally formed on both inner walls of the first settling tank, and a first guide block is fixedly installed on both inner walls of the first limiting block. The first guide block is slidably disposed in the first guide groove. A second guide groove is longitudinally formed on both inner walls of the second settling tank, and a second guide block is fixedly installed on both inner walls of the second limiting block. The second guide block is slidably disposed in the second guide groove. In this scheme, by setting guide blocks and guide grooves, the lifting distance of the first limiting block and the second limiting block can be controlled to prevent them from falling out of the settling tank, thereby ensuring the normal operation of the device and making the lifting of the first limiting block and the second limiting block more stable.

[0015] Compared with the prior art, the beneficial effects of this utility model are: A semiconductor chip packaging structure of this utility model:

[0016] 1. In the first adsorption assembly, the first adsorption head can be detachably connected to the first air nozzle in the first through hole, and in the second adsorption assembly, the second adsorption head can be detachably connected to the second air nozzle in the second through hole. When a first adsorption head (second adsorption head) is damaged, it can be quickly removed from the first air nozzle (second air nozzle) by manual means for quick replacement, so as to ensure the normal operation of the whole device.

[0017] 2. In addition, this device is equipped with a correction mechanism, which is located at the bottom of the upper template and the bottom of the lower template. The two correction mechanisms can align the two films set at the top and bottom, so that the corners of the films are aligned, thus avoiding the problem of improper sealing. Attached Figure Description

[0018] Figure 1 This is a front view of the present invention;

[0019] Figure 2 This is a cross-sectional view of the upper template in this utility model;

[0020] Figure 3 This is a cross-sectional view of the lower template in this utility model;

[0021] Figure 4 This is a bottom view of the upper template in this utility model;

[0022] In the picture:

[0023] 1. Lower template; 11. Electric push rod; 12. Second support base;

[0024] 2. Upper template; 21. First support base; 211. Heating strip;

[0025] 3. Adsorption mechanism; 31. First adsorption assembly; 311. First placement slot; 312. First gas storage box; 313. First delivery pipe; 314. First through hole; 315. First air nozzle; 316. First adsorption head; 32. Second adsorption assembly; 321. Second placement slot; 322. Second gas storage box; 323. Second delivery pipe; 324. Second through hole; 325. Second adsorption head; 326. Second air nozzle;

[0026] 4. Correction mechanism; 41. First sink groove; 411. First guide groove; 412. First guide block; 42. First limit block; 43. First spring; 44. Second sink groove; 441. Second guide groove; 442. Second guide block; 45. Second limit block; 46. Second spring. Detailed Implementation

[0027] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0028] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0029] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Please see Figure 1-4 This utility model provides a technical solution: a semiconductor chip packaging structure, comprising: a lower template 1, with an upper template 2 arranged parallel above it; multiple electric push rods 11 arranged in an array on the top wall of the lower template 1, the output end of each electric push rod 11 being fixedly connected to the bottom wall of the upper template 2; a first support base 21 fixedly installed on the bottom wall of the upper template 2, and an electric heating strip 211 arranged around the bottom wall of the first support base 21; and a second support base 12 fixedly installed on the top wall of the lower template 1, with an electric heating strip 211 arranged around the top wall of the second support base 12. The device has a receiving groove for accommodating the heating strip 211. The adsorption mechanism 3 has a first adsorption component 31 disposed in the lower template 1 and a second adsorption component 32 disposed in the upper template 2. The first adsorption component 31 is used to adsorb the membrane placed on the lower template 1, and the second adsorption component 32 is used to adsorb the membrane placed on the bottom wall of the upper template 2. The alignment mechanism 4 is disposed on the top wall of the lower template 1 and the bottom wall of the upper template 2, and is located outside the first support 21 and the second support 12, for driving the upper and lower membranes to align.

[0033] Specifically, in this device, the heating strip 211 is electrically connected to an external power supply. When the power supply is provided, it generates heat to heat the two diaphragms, thereby pressing the two diaphragms together.

[0034] Furthermore, the first adsorption component 31 includes: a first placement groove 311 opened on the bottom wall of the lower template 1, a first air storage box 312 fixedly installed in the first placement groove 311, the inner cavity of the first air storage box 312 being connected to an external negative pressure device through a first delivery pipe 313, and a plurality of first through holes 314 connected to the first placement groove 311 distributed on the top wall of the lower template 1, and a first air nozzle 315 fixedly installed on the top wall of the first air storage box 312 corresponding to the plurality of first through holes 314, one end of the first air nozzle 315 being connected to the inner cavity of the first air storage box 312, and the other end extending into the first through hole 314, and a first adsorption head 316 being accommodated in each first through hole 314, and the first adsorption head 316 and the first air nozzle 315 being detachably connected.

[0035] Specifically, in this device, to facilitate a stable connection between the first adsorption head 316 and the first air nozzle 315, an external thread is provided on the outer wall of the end of the first air nozzle 315, and an internal thread is provided on the inner wall of the air duct inside the first adsorption head 316. The screw connection between the external and internal threads ensures a stable connection between the first adsorption head 316 and the first air nozzle 315. At the same time, the screw connection method also facilitates quick manual disassembly and assembly of a new first adsorption head 316.

[0036] Furthermore, the second adsorption component 32 includes: a second placement groove 321 opened on the top wall of the upper template 2, a second air storage box 322 fixedly installed in the second placement groove 321, the inner cavity of the second air storage box 322 being connected to an external negative pressure device through a second delivery pipe 323, and a plurality of second through holes 324 connected to the second placement groove 321 distributed on the bottom wall of the upper template 2, each second through hole 324 being provided with a second adsorption head 325, and a plurality of second air nozzles 326 corresponding one-to-one with the second through holes 324 being connected to the bottom wall of the second air storage box 322, one end of the second air nozzle 326 extending into the second through hole 324 and being detachably connected to the second adsorption head 325.

[0037] Specifically, in this device, to facilitate a stable connection between the second adsorption head 325 and the second air nozzle 326, an external thread is provided on the outer wall of the end of the second air nozzle 326, and an internal thread is provided on the inner wall of the air duct inside the second adsorption head 325. The screw connection between the external and internal threads ensures a stable connection between the second adsorption head 325 and the second air nozzle 326. At the same time, the screw connection method also facilitates quick manual disassembly and assembly of a new second adsorption head 325.

[0038] Furthermore, the correction mechanism 4 includes: a first sinkhole 41 opened on the top wall of the lower template 1 and located on one side of the second support 12, a first limiting block 42 movably disposed in the first sinkhole 41, a first spring 43 disposed between the bottom wall of the first limiting block 42 and the inner bottom wall of the first sinkhole 41; and a second sinkhole 44 opened on the bottom wall of the upper template 2 and located on one side of the first support 21, a second limiting block 45 movably installed inside the second sinkhole 44, and a second spring 46 disposed between the second limiting block 45 and the second sinkhole 44.

[0039] Specifically, the heights of the first support base 21 and the second support base 12 in this device are the same as the heights of the first limiting block 42 and the second limiting block 45, thereby ensuring that the membrane can be stably adsorbed and placed while also allowing for precise hot pressing of the membrane.

[0040] Furthermore, the first limiting block 42 and the second limiting block 45 are symmetrically arranged and staggered.

[0041] Furthermore, the inner walls of both sides of the first settling tank 41 are provided with a first guide groove 411 in the longitudinal direction, and the inner walls of both sides of the first limiting block 42 are provided with a first guide block 412 fixedly installed. The first guide block 412 is slidably disposed in the first guide groove 411. The inner walls of both sides of the second settling tank 44 are provided with a second guide groove 441 in the longitudinal direction, and the inner walls of both sides of the second limiting block 45 are provided with a second guide block 442 fixedly installed. The second guide block 442 is slidably disposed in the second guide groove 441.

[0042] Working principle and usage process of this utility model:

[0043] In this device, two membranes are placed on the top of the lower template 1 and the bottom of the upper template 2 respectively. Then, the first limiting block 42 and the second limiting block 45 in the correction mechanism 4 are used to limit the two membranes. Then, the first adsorption component 31 is used to adsorb the lower membrane, and the second adsorption component 32 is used to adsorb the upper membrane. Finally, the semiconductor chip to be packaged is placed between the two membranes.

[0044] Subsequently, the output end of the electric push rod 11 retracts, driving the upper template 2 to sink and approach the lower template 1, so that the two diaphragms fit together. Then, the electric heating strip 211 is energized and heats the two diaphragms to perform heat-press sealing.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip packaging structure, characterized in that: include: A lower template (1) is provided with an upper template (2) arranged parallel to it. Multiple electric push rods (11) are arranged in an array on the top wall of the lower template (1). The output end of each electric push rod (11) is fixedly connected to the bottom wall of the upper template (2). A first support base (21) is fixedly installed on the bottom wall of the upper template (2), and an electric heating strip (211) is arranged around the bottom wall of the first support base (21). A second support base (12) is fixedly installed on the top wall of the lower template (1), and an accommodating groove for accommodating the electric heating strip (211) is opened around the top wall of the second support base (12). The adsorption mechanism (3) has the following features: A first adsorption component (31) is disposed in the lower template (1), and a second adsorption component (32) is disposed in the upper template (2). The first adsorption component (31) is used to adsorb the membrane placed on the lower template (1), and the second adsorption component (32) is used to adsorb the membrane placed on the bottom wall of the upper template (2). The alignment mechanism (4) is located on the top wall of the lower template (1) and the bottom wall of the upper template (2), and is located outside the first support (21) and the second support (12) to drive the upper and lower diaphragms to align.

2. The semiconductor chip packaging structure as described in claim 1, characterized in that: The first adsorption component (31) includes: A first placement groove (311) is opened on the bottom wall of the lower template (1), and a first air storage box (312) is fixedly installed in the first placement groove (311). The inner cavity of the first air storage box (312) is connected to an external negative pressure device through a first delivery pipe (313). The top wall of the lower template (1) is also provided with a plurality of first through holes (314) that connect to the first placement groove (311). The top wall of the first air storage box (312) is fixedly installed with a first air nozzle (315) corresponding to the plurality of first through holes (314). One end of the first air nozzle (315) connects to the inner cavity of the first air storage box (312), and the other end extends into the first through hole (314). Each of the first through holes (314) contains a first adsorption head (316), and the first adsorption head (316) and the first air nozzle (315) are detachably connected.

3. The semiconductor chip packaging structure as described in claim 1, characterized in that: The second adsorption component (32) includes: A second placement groove (321) is opened on the top wall of the upper template (2), and a second air storage box (322) is fixedly installed in the second placement groove (321). The inner cavity of the second air storage box (322) is connected to an external negative pressure device through a second delivery pipe (323). The bottom wall of the upper template (2) is also provided with a plurality of second through holes (324) that connect to the second placement groove (321), and a second adsorption head (325) is provided in each second through hole (324); The bottom wall of the second air storage box (322) is connected to a plurality of second air nozzles (326) that correspond one-to-one with the second through hole (324). One end of the second air nozzle (326) extends into the second through hole (324) and is detachably connected to the second adsorption head (325).

4. A semiconductor chip packaging structure as described in claim 3, characterized in that: The correction mechanism (4) includes: A first sinkhole (41) is opened on the top wall of the lower template (1) and located on one side of the second support seat (12). A first limiting block (42) is movably arranged in the first sinkhole (41). A first spring (43) is arranged between the bottom wall of the first limiting block (42) and the inner bottom wall of the first sinkhole (41). And a second sinkhole (44) is opened on the bottom wall of the upper template (2) and located on one side of the first support (21). A second limiting block (45) is movably installed inside the second sinkhole (44), and a second spring (46) is provided between the second limiting block (45) and the second sinkhole (44).

5. A semiconductor chip packaging structure as described in claim 4, characterized in that: The first limiting block (42) and the second limiting block (45) are symmetrically arranged and staggered.

6. A semiconductor chip packaging structure as described in claim 4, characterized in that: The first guide groove (411) is longitudinally provided on both inner walls of the first sink (41), and the first guide block (412) is fixedly installed on both inner walls of the first limiting block (42). The first guide block (412) is slidably disposed in the first guide groove (411). The inner walls of the second sink (44) are provided with a second guide groove (441) along the longitudinal direction. The inner walls of the second limiting block (45) are fixedly installed with a second guide block (442). The second guide block (442) is slidably disposed in the second guide groove (441).

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