Wafer lifting device

Abstract

The utility model relates to a wafer lifting device, and belongs to the technical field of wafer cleaning equipment. According to the wafer lifting device, the fixed teeth are used for bearing the uncleaned wafer, before a mechanical arm grabs the wafer and places the wafer on the fixed teeth, the lifting teeth with the corresponding height firstly descend to be lower than the fixed teeth with the corresponding height, the fixed teeth support the wafer firstly, then the vertical moving seat drives the wafer to enter the cleaning equipment for air injection cleaning, and after cleaning is completed, the lifting teeth with the corresponding height descend to be lower than the fixed teeth with the corresponding height. When the wafer is cleaned, the lifting teeth ascend to jack up the wafer, so that the wafer is separated from the fixed teeth, the wafer can be blown again after the wafer is separated from the fixed teeth, namely, the lifting teeth are used for bearing the cleaned wafer, then the vertical moving seat descends, and the cleaned wafer is moved to the next station through the horizontal displacement mechanism. Therefore, the wafer lifting device provided by the utility model can prevent dirt from polluting the cleaned wafer through the teeth of the support before and after cleaning through the support respectively, thereby improving the cleanliness of the wafer.

Description

Technical Field

[0001] This application belongs to the technical field of wafer cleaning equipment, and in particular relates to a wafer lifting device. Background Technology

[0002] Korean utility model patent document KR1020240115066A discloses a dryer with a lifting device for uniformly drying wafers. The dryer dries the wafers by blowing air. Before blowing air, the wafers need to be placed on a support base. The wafers are sent into the drying tank by lifting the support base. By blowing air, the wafers are dried and the air can also blow away particles, thus cleaning the wafers.

[0003] However, in existing drying lifting devices, a set of support bases always supports the wafers, and the contact position remains unchanged. If the wafers are not cleaned before they come into contact with the support bases, they will contaminate the support bases. If the support bases continue to support the cleaned wafers, they will contaminate the wafers, resulting in incomplete wafer cleaning. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer lifting device that improves the cleanliness of wafers in order to overcome the shortcomings of the prior art.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A wafer lifting device, comprising:

[0007] Vertical displacement mechanism;

[0008] The vertical moving seat is mounted on the vertical displacement mechanism and can be vertically displaced by the action of the vertical displacement mechanism;

[0009] A rotating base is mounted on a vertically movable base;

[0010] A rotating mechanism, mounted on a vertically movable base, is used to drive the rotating base to rotate.

[0011] The fixing tooth is located at the top of the rotating seat;

[0012] Rising gear;

[0013] The lifting mechanism, mounted on the rotating base, is used to drive the lifting teeth to move between positions higher than and lower than the fixed teeth.

[0014] Preferably, in the wafer lifting device of this utility model, the fixing teeth include a first fixing tooth, a second fixing tooth, and a third fixing tooth that provide three-point support for the wafer with successively decreasing heights; the lifting teeth include a first lifting tooth, a second lifting tooth, and a third lifting tooth that provide three-point support for the wafer with successively decreasing heights; and the first lifting tooth, the second fixing tooth, the third lifting tooth, the third lifting tooth, the third fixing tooth, the second lifting tooth, and the first fixing tooth are arranged from one side of the rotating seat to the other.

[0015] Preferably, the wafer lifting device of this utility model includes a rotating mechanism comprising a motor, a drive wheel mounted on the output shaft of the motor, a driven wheel connected to the drive wheel via a belt, and the driven wheel connected to the rotating shaft of the rotating seat. When the motor is working, it drives the rotating seat to rotate.

[0016] Preferably, in the wafer lifting device of this utility model, the rotating seat includes a base plate, a guide rod, and a lifting seat. The lifting seat is slidably mounted on the guide rod, and the lifting teeth are mounted on the lifting seat. The lifting mechanism can drive the lifting seat to move up and down along the guide rod.

[0017] Preferably, in the wafer lifting device of this utility model, the rotating seat is mounted on the vertical moving seat via bearings, the rotating shaft of the rotating seat is a hollow structure, and the driven wheel is also a hollow structure;

[0018] The lifting mechanism includes a cylinder and an air supply pipe for supplying air to the cylinder, the air supply pipe extending downward through the hollow of the rotating shaft and the driven wheel.

[0019] Preferably, in the wafer lifting device of this utility model, the cylinder is mounted on the base plate and located between the base plate and the lifting seat.

[0020] Preferably, in the wafer lifting device of this utility model, the first fixing tooth, the second fixing tooth, and the third fixing tooth are disposed on the fixing tooth seat.

[0021] Preferably, in the wafer lifting device of this utility model, the fixed tooth base has a hollowed-out section, and the second lifting tooth and the third lifting tooth pass through the hollowed-out section and are connected to the lifting base.

[0022] The beneficial effects of this utility model are:

[0023] This invention relates to a wafer lifting device. The fixed teeth are used to receive uncleaned wafers. Before the robotic arm picks up the wafer and places it on the fixed teeth, the lifting teeth at the corresponding height first descend to a position lower than the fixed teeth. The fixed teeth then support the wafer. Next, the vertically moving seat drives the wafer into the cleaning equipment for air-jet cleaning. After cleaning, the lifting teeth rise, lifting the wafer and detaching it from the fixed teeth. After detachment, the wafer can be sprayed again. In other words, the lifting teeth are used to receive cleaned wafers. Then, the vertically moving seat descends, and a horizontal displacement mechanism moves the cleaned wafer to the next station. Therefore, this wafer lifting device can improve wafer cleanliness by supporting the wafers before and after cleaning, preventing contaminants from polluting the cleaned wafers through the supporting teeth. Attached Figure Description

[0024] The technical solution of this application will be further described below with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a schematic diagram of the structure of the wafer lifting device according to an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the rotary seat according to an embodiment of this application;

[0027] Figure 3 This is a cross-sectional view of the rotary seat in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of the fixed tooth and the lifting tooth in an embodiment of this application;

[0029] The attached figures are labeled as follows:

[0030] 1. Horizontal displacement mechanism;

[0031] 2. Vertical displacement mechanism;

[0032] 3. Vertically movable seat;

[0033] 4. Rotary seat;

[0034] 5. Rotating mechanism;

[0035] 6. Fixed teeth;

[0036] 7. Rising gear;

[0037] 8. Lifting mechanism;

[0038] 41. Base plate;

[0039] 42 guide rods;

[0040] 43. Adjustable seat;

[0041] 51 motor

[0042] 52 Drive wheel

[0043] 53 Drive wheel

[0044] 61 First fixed tooth

[0045] 62 Second fixed tooth;

[0046] 63 Third fixed tooth;

[0047] 64. Fixed gear seat;

[0048] 71 First rising and falling teeth;

[0049] 72 Second rising gear;

[0050] 73 Third rising gear;

[0051] 81 cylinders;

[0052] 82 Gas supply pipeline. Detailed Implementation

[0053] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0054] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0055] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0056] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0057] Example

[0058] This embodiment provides a wafer lifting device, such as... Figure 1 As shown, it includes:

[0059] Horizontal displacement mechanism 1;

[0060] The vertical displacement mechanism 2 is mounted on the horizontal displacement mechanism 1 and can perform horizontal displacement by the action of the horizontal displacement mechanism 1.

[0061] The vertical moving seat 3 is mounted on the vertical displacement mechanism 2 and can be vertically displaced by the action of the vertical displacement mechanism 2;

[0062] Rotary seat 4 is mounted on vertical movable seat 3;

[0063] The rotating mechanism 5 is mounted on the vertical moving seat 3 and is used to drive the rotating seat 4 to rotate.

[0064] Fixed tooth 6 is located at the top of rotating seat 4;

[0065] 7. Lifting gear;

[0066] The lifting mechanism 8 is mounted on the rotating seat 4 and is used to drive the lifting gear 7 to move between a position higher than the fixed gear 6 and a position lower than the fixed gear 6.

[0067] In this embodiment of the wafer lifting device, the fixed teeth 6 are used to receive uncleaned wafers. Before the robot arm picks up the wafer and places it on the fixed teeth 6, the lifting teeth 7 at the corresponding height first descend to a height lower than the fixed teeth 6. The fixed teeth 6 support the wafer first, and then the vertical moving seat 3 drives the wafer into the cleaning equipment for air jet cleaning. After cleaning, the lifting teeth 7 rise, lifting the wafer and detaching it from the contact with the fixed teeth 6. After detachment, it can be sprayed again. In other words, the lifting teeth 7 are used to receive the cleaned wafer. Then the vertical moving seat 3 descends, and the horizontal displacement mechanism 1 moves the cleaned wafer to the next station. Therefore, the wafer lifting device of this embodiment can improve the cleanliness of the wafer by supporting the wafer before and after cleaning, preventing dirt from contaminating the cleaned wafer through the supporting teeth. At the same time, changing the contact position with the wafer can also prevent incomplete cleaning caused by the contact position of the fixed teeth 6 when contacting the wafer.

[0068] Furthermore, the fixing teeth 6 include a first fixing tooth 61, a second fixing tooth 62, and a third fixing tooth 63 that provide three-point support for the wafer, with their heights decreasing sequentially; the lifting teeth 7 include a first lifting tooth 71, a second lifting tooth 72, and a third lifting tooth 73 that provide three-point support for the wafer, with their heights decreasing sequentially; wherein, from one side of the rotating base 4 to the other side, the arrangement is as follows: first lifting tooth 71, second fixing tooth 62, third lifting tooth 73, third lifting tooth 73, third fixing tooth 63, second lifting tooth 72, and first fixing tooth 61. The staggered arrangement of the fixing teeth 6 and lifting teeth 7 can stably provide three-point support for the wafer.

[0069] Furthermore, such as Figure 3 As shown, the rotating mechanism 5 includes a motor 51, a drive wheel 52 mounted on the output shaft of the motor 51, and a driven wheel 53 connected to the drive wheel 52 via a belt. The driven wheel 53 is connected to the rotating shaft of the rotating seat 4. When the motor 51 is working, it drives the rotating seat 4 to rotate.

[0070] Furthermore, such as Figure 2 The rotating seat 4 includes a base plate 41, a guide rod 42, and a lifting seat 43. The lifting seat 43 is slidably mounted on the guide rod 42, and the lifting teeth 7 are mounted on the lifting seat 43. The lifting mechanism 8 can drive the lifting seat 43 to move up and down along the guide rod 42.

[0071] Furthermore, the rotating seat 4 is mounted on the vertically moving seat 3 via bearings. The rotating shaft of the rotating seat 4 is a hollow structure, and the driven wheel 53 is also a hollow structure, such as... Figure 3 As shown, the lifting mechanism 8 includes a cylinder 81 and an air supply pipe 82 for supplying air to the cylinder 81. The air supply pipe 82 extends downward through the hollow of the rotating shaft and the driven wheel 53 to facilitate the connection of the air supply pipe.

[0072] Furthermore, the cylinder 81 is mounted on the base plate 41, located between the base plate 41 and the lifting seat 43.

[0073] Furthermore, the first fixing tooth 61, the second fixing tooth 62, and the third fixing tooth 63 are disposed on the fixing tooth seat 64; the fixing tooth seat 64 has a hollowed-out section, through which the second lifting tooth 72 and the third lifting tooth 73 pass and connect to the lifting seat 43.

[0074] Based on the above-described preferred embodiments according to this application, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer lifting device, characterized in that, include: Vertical displacement mechanism (2); The vertical moving seat (3) is set on the vertical displacement mechanism (2) and can be vertically displaced by the action of the vertical displacement mechanism (2); A rotating seat (4) is mounted on a vertically movable seat (3); A rotating mechanism (5) is mounted on a vertical moving seat (3) and is used to drive the rotating seat (4) to rotate. The fixed tooth (6) is set at the top of the rotating seat (4); Lifting gear (7); The lifting mechanism (8) is mounted on the rotating seat (4) and is used to drive the lifting tooth (7) to move between a position higher than the fixed tooth (6) and a position lower than the fixed tooth (6).

2. The wafer lifting device according to claim 1, characterized in that, The fixed teeth (6) include a first fixed tooth (61), a second fixed tooth (62), and a third fixed tooth (63) that provide three-point support for the wafer with progressively decreasing heights; the lifting teeth (7) include a first lifting tooth (71), a second lifting tooth (72), and a third lifting tooth (73) that provide three-point support for the wafer with progressively decreasing heights; the first lifting tooth (71), the second fixed tooth (62), the third lifting tooth (73), the third fixed tooth (63), the second lifting tooth (72), and the first fixed tooth (61) are arranged from one side of the rotating seat (4) to the other side.

3. The wafer lifting device according to claim 1, characterized in that, The rotating mechanism (5) includes a motor (51), a drive wheel (52) set on the output shaft of the motor (51), a driven wheel (53) connected to the drive wheel (52) by a belt, and the driven wheel (53) connected to the rotating shaft of the rotating seat (4). When the motor (51) is working, it drives the rotating seat (4) to rotate.

4. The wafer lifting device according to claim 2, characterized in that, The rotating seat (4) includes a base plate (41), a guide rod (42) and a lifting seat (43). The lifting seat (43) is slidably mounted on the guide rod (42), and the lifting teeth (7) are mounted on the lifting seat (43). The lifting mechanism (8) can drive the lifting seat (43) to move up and down along the guide rod (42).

5. The wafer lifting device according to claim 4, characterized in that, The rotating seat (4) is mounted on the vertical moving seat (3) by bearings. The rotating shaft of the rotating seat (4) is hollow, and the driven wheel (53) is also hollow. The lifting mechanism (8) includes a cylinder (81) and an air supply pipe (82) for supplying air to the cylinder (81), the air supply pipe (82) extending downward through the hollow of the rotating shaft and the driven wheel (53).

6. The wafer lifting device according to claim 5, characterized in that, The cylinder (81) is mounted on the base plate (41) and located between the base plate (41) and the lifting seat (43).

7. The wafer lifting device according to claim 4, characterized in that, The first fixing tooth (61), the second fixing tooth (62) and the third fixing tooth (63) are disposed on the fixing tooth seat (64).

8. The wafer lifting device according to claim 7, characterized in that, The fixed tooth base (64) has a hollowed-out section, through which the second lifting tooth (72) and the third lifting tooth (73) pass and connect to the lifting base (43).

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