Bus filtering device of electric drive assembly and electric drive assembly

By designing a bus filter device in the electric drive assembly and using a combination of magnetic rings and capacitors of different capacitance values ​​to form an LCLC two-stage filter structure, the problem of excessive conducted emission test of the piezoelectric drive assembly controller in the three-in-one system was solved, and effective electromagnetic noise filtering and volume optimization were achieved.

CN223553172UActive Publication Date: 2025-11-14ZHEJIANG LEAPPOWER TECH CO LTD +1
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Patent Information

Application Number
CN202423060549.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-11-14
Estimated Expiration
2034-12-10

AI Technical Summary

Technical Problem

The conducted emission test results of the three-in-one piezoelectric drive assembly controller under load mode exceeded the standard. Existing technologies usually use shielding, grounding and filtering methods to rectify the problem, but the effect is not good.

Method used

Design a busbar filter device, in which a busbar passes through a magnetic ring and a support, and is connected to Y and X capacitors of different capacitance values ​​to form a first-stage and second-stage LC filter structure. The device includes racetrack-shaped and UI-shaped magnetic rings, as well as combinations of capacitors of different capacitance values, forming an LCLC two-stage filter structure.

Benefits of technology

It effectively solved the problem of exceeding the limit of the high voltage method test verification results in the conducted emission test of the electric drive assembly controller, reduced the overall volume of the bus filter device, and optimized the filtering effect of electromagnetic noise.

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Abstract

The utility model discloses a bus filtering device of an electric drive assembly and the electric drive assembly. The bus filtering device comprises: a support member; the first magnetic ring, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor, the second X capacitor, the second magnetic ring, the third group of Y capacitors, the third X capacitor, the fourth X capacitor and the fifth X capacitor are sequentially arranged on the supporting piece from the output end to the input end of the bus; wherein the bus penetrates through the first magnetic ring, the second magnetic ring and the supporting piece, and the first group of Y capacitors, the second group of Y capacitors, the first X capacitor, the second X capacitor, the third group of Y capacitors, the third X capacitor, the fourth X capacitor and the fifth X capacitor are connected with the bus. In this way, the problem that the conducted emission test of a controller product exceeds the standard is solved.
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Description

Technical Field

[0001] This application relates to the field of electric drive assembly technology, and in particular to bus filter devices and electric drive assemblies. Background Technology

[0002] In related electromagnetic compatibility (EMC) technologies, when conducting conducted emission tests on three-in-one piezoelectric drive assembly controller products, EMC standards are generally referenced for testing. In particular, when the conducted emission test results exceed the standard under load mode, the common practice is to gradually try to rectify the problem by using shielding, grounding, and filtering methods based on past project theoretical experience, in order to specifically solve the problem of the controller product exceeding the conducted emission test standard. Utility Model Content

[0003] This application provides a bus filter device and an electric drive assembly, which can solve the problem of excessive conducted emission tests in controller products.

[0004] In a first aspect, this application provides a bus filter device for an electric drive assembly, the bus filter device comprising: a support member; and a first magnetic ring, a first group of Y capacitors, a second group of Y capacitors, a first X capacitor, a second X capacitor, a second magnetic ring, a third group of Y capacitors, a third X capacitor, a fourth X capacitor, and a fifth X capacitor sequentially disposed on the support member from the output end to the input end of the bus.

[0005] The busbar runs through the first magnetic ring, the second magnetic ring, and the support member. The first group of Y capacitors, the second group of Y capacitors, the first X capacitor, the second X capacitor, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor are connected to the busbar.

[0006] The busbars include a first busbar and a second busbar; the first group of Y capacitors includes a first Y capacitor and a second Y capacitor; the first end of the first Y capacitor is connected to the first busbar, the second end of the first Y capacitor is connected to the first end of the second Y capacitor, the second end of the second Y capacitor is connected to the second busbar, and the first end of the second Y capacitor is grounded.

[0007] The busbars include a first busbar and a second busbar; the second group of Y capacitors includes a third Y capacitor and a fourth Y capacitor; the first end of the third Y capacitor is connected to the first busbar, the second end of the third Y capacitor is connected to the first end of the fourth Y capacitor, the second end of the fourth Y capacitor is connected to the second busbar, and the first end of the fourth Y capacitor is grounded.

[0008] The volumes of the first and second Y capacitors are smaller than those of the third and fourth Y capacitors.

[0009] The busbar includes a first busbar and a second busbar. A first X capacitor is disposed on the upper surface of the support member and connects the first busbar and the second busbar. A second X capacitor is disposed on the lower surface of the support member and connects the first busbar and the second busbar.

[0010] The busbars include the first busbar and the second busbar; the third group of Y capacitors includes the fifth Y capacitor and the sixth Y capacitor; the first end of the fifth Y capacitor is connected to the first busbar, the second end of the fifth Y capacitor is connected to the first end of the sixth Y capacitor, the second end of the sixth Y capacitor is connected to the second busbar, and the first end of the sixth Y capacitor is grounded.

[0011] The first magnetic ring is a racetrack-shaped magnetic ring, and the second magnetic ring is a UI-shaped magnetic ring.

[0012] Among them, the capacitance of each capacitor in the first group of Y capacitors is 1nF, the capacitance of each capacitor in the second group of Y capacitors is 330nF, the capacitance of each capacitor in the first X capacitor is 68nF, the capacitance of the second X capacitor is 3.3uF, the capacitance of each capacitor in the third group of Y capacitors is 22nF, and the capacitance of the third X capacitor, the fourth X capacitor and the fifth X capacitor is 2.2nF.

[0013] The support component is provided with several accommodating cavities for accommodating the first group of Y capacitors, the second group of Y capacitors, the second group of X capacitors, the third group of Y capacitors, the third group of X capacitors, the fourth group of X capacitors, and the fifth group of X capacitors.

[0014] In a second aspect, this application provides an electric drive assembly that includes a bus filter as provided in the first aspect.

[0015] The beneficial effects of this application are as follows: Unlike the prior art, the bus filter device and electric drive assembly provided in this application have the busbar passing through the first magnetic ring, the second magnetic ring, and the support member. The first group of Y capacitors, the second group of Y capacitors, the first X capacitor, the second X capacitor, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor are connected to the busbar. The first magnetic ring, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor, and the second X capacitor constitute a first-stage LC filter, and the second magnetic ring, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor constitute a second-stage LC filter. This ultimately solves the problem of exceeding the limit of the high-voltage method test verification result during the conducted emission test of the electric drive assembly controller. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the bus filter device provided in this application;

[0018] Figure 2 yes Figure 1 The corresponding front view;

[0019] Figure 3 yes Figure 1 The corresponding top view;

[0020] Figure 4 yes Figure 1 The corresponding left view;

[0021] Figure 5 yes Figure 1 The corresponding bottom view;

[0022] Figure 6 This is a schematic diagram of the equivalent circuit structure of the bus filter device provided in this application;

[0023] Figure 7 This is a schematic diagram of an embodiment of the electric drive assembly provided in this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] In related electromagnetic compatibility (EMC) technologies, when conducting conducted emission tests on three-in-one piezoelectric drive assembly controller products, EMC standards are generally referenced for testing. In particular, when the conducted emission test results exceed the standard under load mode, the common practice is to gradually try to rectify the problem by using shielding, grounding, and filtering methods based on past project theoretical experience, in order to specifically solve the problem of the controller product exceeding the conducted emission test standard.

[0027] Based on this, this application proposes a busbar filtering device. The busbar passes through a first magnetic ring, a second magnetic ring, and a support member. A first group of Y capacitors, a second group of Y capacitors, a first X capacitor, a second X capacitor, a third group of Y capacitors, a third X capacitor, a fourth X capacitor, and a fifth X capacitor are connected to the busbar. A first-stage LC filter is formed by the first magnetic ring, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor, and the second X capacitor, and a second-stage LC filter is formed by the second magnetic ring, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor. This ultimately solves the problem of exceeding the limit of the high-voltage method test verification results during the conducted emission test of the electric drive assembly controller. See the following embodiments for details.

[0028] See Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The bus filter device includes: a support member 30, and a first magnetic ring L1, a first group of Y capacitors, a second group of Y capacitors, a first X capacitor X1, a second X capacitor X2, a second magnetic ring L2, a third group of Y capacitors, a third X capacitor X3, a fourth X capacitor X4, and a fifth X capacitor X5, which are sequentially arranged along the output end to the input end of the bus 100 on the support member 30.

[0029] In some embodiments, the busbar 100 passes through the first magnetic ring L1, the second magnetic ring L2, and the support member 30. The first group of Y capacitors, the second group of Y capacitors, the first X capacitor X1, the second X capacitor X2, the third group of Y capacitors, the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 are connected to the busbar 100. For example, through holes can be formed at corresponding positions on the support member 30 to facilitate connection between the capacitors and the busbar 100.

[0030] In some embodiments, bus 100 includes a first bus 10 and a second bus 20. The first group of Y capacitors includes a first Y capacitor Y1 and a second Y capacitor Y2; the first end of the first Y capacitor Y1 is connected to the first bus 10, the second end of the first Y capacitor Y1 is connected to the first end of the second Y capacitor Y2, the second end of the second Y capacitor Y2 is connected to the second bus 20, and the first end of the second Y capacitor Y2 is grounded.

[0031] The second group of Y capacitors includes a third Y capacitor Y3 and a fourth Y capacitor Y4. The first terminal of the third Y capacitor Y3 is connected to the first bus 10, the second terminal of the third Y capacitor Y3 is connected to the first terminal of the fourth Y capacitor Y4, the second terminal of the fourth Y capacitor Y4 is connected to the second bus 20, and the first terminal of the fourth Y capacitor Y4 is grounded.

[0032] In some embodiments, the volume of the first Y capacitor Y1 and the second Y capacitor Y2 is smaller than the volume of the third Y capacitor Y3 and the fourth Y capacitor Y4. In some embodiments, the first Y capacitor Y1 and the second Y capacitor Y2 may have the same volume. The third Y capacitor Y3 and the fourth Y capacitor Y4 may have the same volume. The larger the volume of the capacitor, the larger its capacitance value.

[0033] In some embodiments, a first X-capacitor X1 is disposed on the upper surface of the support member 30 and connected to the first busbar 10 and the second busbar 20, and a second X-capacitor X2 is disposed on the lower surface of the support member 30 and connected to the first busbar 10 and the second busbar 20. By disposing of the first X-capacitor X1 on the upper surface of the support member 30, the number of horizontally arranged capacitors is reduced, thereby reducing the overall volume of the busbar filter device. The volume of the first X-capacitor X1 is smaller than the volume of the second X-capacitor X2.

[0034] In some embodiments, the third group of Y capacitors includes a fifth Y capacitor Y5 and a sixth Y capacitor Y6. The first terminal of the fifth Y capacitor Y5 is connected to the first bus 10, the second terminal of the fifth Y capacitor Y5 is connected to the first terminal of the sixth Y capacitor Y6, the second terminal of the sixth Y capacitor Y6 is connected to the second bus 20, and the first terminal of the sixth Y capacitor Y6 is grounded.

[0035] In some embodiments, the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 are disposed on the lower surface of the support member 30. In some embodiments, the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 can be connected to the input terminal of the busbar. That is, the input terminal of the busbar can be disposed on the upper surface of the support member 30. In this case, the input terminal of the busbar and the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 can be disposed on the upper and lower surfaces of the support member 30, thereby reducing the number of horizontally arranged capacitors and thus reducing the overall size of the busbar filter device.

[0036] In some embodiments, the first magnetic ring L1 is a racetrack-shaped magnetic ring. Exemplarily, the first magnetic ring L1 can be an amorphous nanocrystalline racetrack-shaped magnetic ring. Its height is 25mm and its thickness is 8mm. Its performance parameters require an initial permeability greater than 30000 at 10kHz, a low-frequency series inductance greater than 180uH at 10kHz, greater than 65uH at 100kHz, greater than 30uH at 250kHz, and greater than 15uH at 500kHz; a high-frequency series impedance greater than 300Ω at 25MHz, and no performance degradation within a temperature range of -55℃ to +150℃. It is then installed into an injection-molded housing using adhesive dispensing and finally fixed to the DC bus port with screws. Its purpose is to attenuate the mid-to-high frequency electromagnetic noise harmonic components on the power supply line.

[0037] In some embodiments, the second magnetic ring L2 is a UI-type magnetic ring. For example, the second magnetic ring L2 can be a manganese-zinc rectangular UI magnetic ring made of ferrite material. Its height is 30mm and its thickness is 8mm. Firstly, the magnetic ring material is required to have high attenuation characteristics in the low-frequency range. Secondly, the ferrite magnetic ring performance parameters require an initial permeability of 10000 at 10kHz, a low-frequency series inductance greater than 25uH at 100kHz, a mid-frequency series impedance greater than 10Ω at 1MHz, greater than 30Ω at 2MHz, greater than 60Ω at 5MHz, and greater than 80Ω at 10MHz, and no performance degradation within a temperature range of -55℃ to +150℃. Then, it is encapsulated in an injection-molded housing using potting compound, and finally fixed to the bus capacitor output port with screws. Its purpose is to attenuate the mid-to-low frequency electromagnetic noise harmonic components on the line.

[0038] The capacitance of the first group of Y capacitors is 1nF, the capacitance of the second group of Y capacitors is 330nF, the capacitance of the first X capacitor X1 is 68nF, the capacitance of the second X capacitor X2 is 3.3uF, the capacitance of the third group of Y capacitors is 22nF, and the capacitance of the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 is 2.2nF.

[0039] In some embodiments, the support member 30 is provided with a plurality of accommodating cavities for accommodating a first group of Y capacitors, a second group of Y capacitors, a second X capacitor X2, a third group of Y capacitors, a third X capacitor X3, a fourth X capacitor X4, and a fifth X capacitor X5. Exemplarily, the number of accommodating cavities corresponds to the number of capacitors. For example, the first Y capacitor Y1 and the second Y capacitor Y2 each have corresponding accommodating cavities, and the accommodating cavities are located on both sides of the busbar, that is, the first Y capacitor Y1 and the second Y capacitor Y2 are also located on both sides of the busbar. The third Y capacitor Y3 and the fourth Y capacitor Y4 each have corresponding accommodating cavities, and the accommodating cavities are located on both sides of the busbar, that is, the third Y capacitor Y3 and the fourth Y capacitor Y4 are also located on both sides of the busbar. The fifth Y capacitor Y5 and the sixth Y capacitor Y6 each have corresponding accommodating cavities, and the accommodating cavities are located on both sides of the busbar, that is, the fifth Y capacitor Y5 and the sixth Y capacitor Y6 are also located on both sides of the busbar. From the output end to the input end of the busbar, the following components are arranged sequentially: a first magnetic ring L1, a first group of Y capacitors, a second group of Y capacitors, a first X capacitor X1, a second X capacitor X2, a second magnetic ring L2, a third group of Y capacitors, a third X capacitor X3, a fourth X capacitor X4, and a fifth X capacitor X5. Specifically, along the direction from the output end to the input end of the busbar, the first Y capacitor Y1 and the second Y capacitor Y2 are positioned between the first magnetic ring L1 and the third Y capacitor Y3 and the fourth Y capacitor Y4. The third Y capacitor Y3 and the fourth Y capacitor Y4 are positioned between the first Y capacitor Y1 and the second Y capacitor Y2, and between the first X capacitor X1 and the second X capacitor X2. The second magnetic ring L2 is positioned between the second X capacitor X2, the fifth Y capacitor Y5, and the sixth Y capacitor Y6. The third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 are located at the input end of the busbar.

[0040] In the above embodiments, the bus filter device is an overall LCLC two-stage filter structure. The first magnetic ring L1, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor X1, and the second X capacitor X2 constitute a first-stage LC filter structure. The second magnetic ring L2, the third group of Y capacitors, the third X capacitor X3, the fourth X capacitor X4, and the fifth X capacitor X5 constitute a second-stage LC filter structure.

[0041] For example, in the selection of capacitors for the first-stage LC filter structure, a differential-common-mode separator is first used to separate the original noise of the test data. Then, the characteristics of the differential-common-mode noise exceeding the limit are analyzed. One 3.3uF and one 68nF X filter capacitor with matching frequency impedance characteristics are selected, as well as two 330nF and two 1nF Y filter capacitors. Next, the one 3.3uF and one 68nF X filter capacitor are soldered to the positive and negative bus copper busbars via the power-taking copper plate structure. Finally, the two 330nF and two 1nF Y filter capacitors are soldered to the bus copper busbar power-taking structure and the grounding connection piece, respectively. In order to achieve a better filtering effect, the parasitic inductance of the capacitor leads should be minimized as much as possible to filter out the differential-common-mode harmonic components of the first-stage electromagnetic noise on the power line.

[0042] For example, in the selection of capacitors for a two-stage LC filter structure, a differential-common-mode separator is first used to separate the original noise of the test data. Then, the characteristics of the differential-common-mode noise exceeding the limit are analyzed. Three 2.2nF X filter capacitors and two 22nF Y filter capacitors with matching frequency impedance characteristics are selected. Next, the three 2.2nF X filter capacitors are soldered between the positive and negative bus copper busbars via a copper strip structure. Finally, the two 22nF Y filter capacitors are soldered to the bus copper busbar and the grounding connection piece, respectively. In order to achieve a better filtering effect, the parasitic inductance of the capacitor leads should be minimized as much as possible to filter out the differential-common-mode harmonic components of the second-stage electromagnetic noise on the power supply line.

[0043] In the above embodiments, a first-stage LC filter is formed by the first magnetic ring, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor, and the second X capacitor, and a second-stage LC filter is formed by the second magnetic ring, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor. This ultimately solves the problem of exceeding the limit of the high-voltage method test verification result during the conducted emission test of the electric drive assembly controller.

[0044] See Figure 7 , Figure 7 This is a schematic diagram of an embodiment of the electric drive assembly provided in this application. The electric drive assembly 1000 includes a bus filter device 200. The bus filter device 200 can be any of the bus filter devices described in the above embodiments.

[0045] In some embodiments, the electric drive assembly 1000 can be a three-in-one electric drive assembly. This mainly refers to a highly integrated system combining a motor, reducer, and controller.

[0046] In some embodiments, the optimization scheme in the above-described bus filter device can be as follows:

[0047] The performance parameters of the first-order LC loop L (the aforementioned first magnetic ring L1) in the bus filter device are analyzed to determine if they meet the design requirements. The performance parameters of L in the first-order LC loop are mainly considered from several aspects, including frequency impedance characteristics, series inductance, and the material of the amorphous magnetic ring. If they do not meet the design requirements, the performance parameters of L in the first-order LC loop are optimized. This optimization primarily involves implementing a magnetic ring with better high-frequency impedance characteristics, a larger series inductance, and a nanocrystalline material.

[0048] The performance parameters of the second-order LC coil (L2) in the bus filter device are analyzed to determine if they meet the design requirements. The performance parameters of L in the second-order LC coil are mainly considered from several aspects, including frequency impedance characteristics, series impedance, and the material of the ferrite core. If they do not meet the design requirements, the performance parameters of L in the second-order LC coil are optimized. This optimization primarily involves implementing better high-frequency impedance characteristics, a larger series impedance, and using a manganese-zinc ferrite core.

[0049] This analysis examines whether the performance parameters of capacitors (C) in the first-order and second-order LC circuits of the bus filter meet the design requirements. The matching parameters of C are primarily considered from the perspectives of the frequency impedance characteristics of capacitors X and Y with different capacitance values, as well as lead inductance. If they do not meet the design requirements, the matching parameters are optimized. This optimization mainly involves minimizing the parasitic inductance of the line connection leads and using capacitor combinations with good frequency impedance characteristics for different capacitance values.

[0050] In summary, the bus filter device 200 and electric drive assembly 1000 provided in this application have the busbar passing through the first magnetic ring L1, the second magnetic ring L2 and the support member 30. The first group of Y capacitors, the second group of Y capacitors, the first X capacitor X1, the second X capacitor X2, the third group of Y capacitors, the third X capacitor X3, the fourth X capacitor X4 and the fifth X capacitor X5 are connected to the busbar 100. The first magnetic ring L1, the first group of Y capacitors, the second group of Y capacitors, the first X capacitor X1 and the second X capacitor X2 form a first-stage LC filter, and the second magnetic ring L2, the third group of Y capacitors, the third X capacitor X3, the fourth X capacitor X4 and the fifth X capacitor X5 form a second-stage LC filter, which ultimately solves the problem of the high voltage method test verification result exceeding the limit during the conducted emission test of the electric drive assembly controller.

[0051] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0052] If the integrated units in the other embodiments described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor 10 to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0053] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A busbar filter for an electric drive assembly, characterized in that, The bus filter device includes: a support member; and a first magnetic ring, a first group of Y capacitors, a second group of Y capacitors, a first X capacitor, a second X capacitor, a second magnetic ring, a third group of Y capacitors, a third X capacitor, a fourth X capacitor, and a fifth X capacitor, which are sequentially arranged on the support member from the output end to the input end of the bus. The busbar passes through the first magnetic ring, the second magnetic ring, and the support member. The first group of Y capacitors, the second group of Y capacitors, the first X capacitor, the second X capacitor, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor are connected to the busbar.

2. The bus filter device according to claim 1, characterized in that, The busbar includes a first busbar and a second busbar; the first group of Y capacitors includes a first Y capacitor and a second Y capacitor; the first end of the first Y capacitor is connected to the first busbar, the second end of the first Y capacitor is connected to the first end of the second Y capacitor, the second end of the second Y capacitor is connected to the second busbar, and the first end of the second Y capacitor is grounded.

3. The bus filter device according to claim 2, characterized in that, The busbar includes a first busbar and a second busbar; the second group of Y capacitors includes a third Y capacitor and a fourth Y capacitor; the first end of the third Y capacitor is connected to the first busbar, the second end of the third Y capacitor is connected to the first end of the fourth Y capacitor, the second end of the fourth Y capacitor is connected to the second busbar, and the first end of the fourth Y capacitor is grounded.

4. The bus filter device according to claim 3, characterized in that, The volume of the first Y capacitor and the second Y capacitor is smaller than the volume of the third Y capacitor and the fourth Y capacitor.

5. The bus filter device according to claim 1, characterized in that, The busbar includes a first busbar and a second busbar. The first X capacitor is disposed on the upper surface of the support member and connects the first busbar and the second busbar. The second X capacitor is disposed on the lower surface of the support member and connects the first busbar and the second busbar.

6. The bus filter device according to claim 1, characterized in that, The busbar includes a first busbar and a second busbar; the third group of Y capacitors includes a fifth Y capacitor and a sixth Y capacitor; the first end of the fifth Y capacitor is connected to the first busbar, the second end of the fifth Y capacitor is connected to the first end of the sixth Y capacitor, the second end of the sixth Y capacitor is connected to the second busbar, and the first end of the sixth Y capacitor is grounded.

7. The bus filter device according to claim 1, characterized in that, The first magnetic ring is a racetrack-shaped magnetic ring, and the second magnetic ring is a UI-shaped magnetic ring.

8. The bus filter device according to claim 1, characterized in that, The capacitance of each capacitor in the first group of Y capacitors is 1nF, the capacitance of each capacitor in the second group of Y capacitors is 330nF, the capacitance of the first X capacitor is 68nF, the capacitance of the second X capacitor is 3.3uF, the capacitance of the capacitor in the third group of Y capacitors is 22nF, and the capacitance of the third X capacitor, the fourth X capacitor and the fifth X capacitor is 2.2nF.

9. The bus filter device according to claim 1, characterized in that, The support member is provided with a plurality of accommodating cavities for accommodating the first group of Y capacitors, the second group of Y capacitors, the second X capacitor, the third group of Y capacitors, the third X capacitor, the fourth X capacitor, and the fifth X capacitor.

10. An electric drive assembly, characterized in that, The electric drive assembly includes a bus filter as described in any one of claims 1-9.