Power supply module grounding device and power supply module
By separating the multiple voltage outputs of the power module and connecting them to the board ground via ferrite beads, and combining this with filter capacitors to handle ripple, the problem of severe ground bounce in the power module was solved, resulting in a more stable power output.
Patent Information
- Application Number
- CN202423111043.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-17
AI Technical Summary
The existing power supply module has multiple power outputs sharing a return plane, which causes severe ground bounce, especially when the integrated circuit is large-scale and the switching frequency is high, resulting in glitches at the input of logic devices.
The ground planes of the multiple voltage outputs of the power module are separated and connected to the board-level ground through ferrite beads to limit the return signal of each power supply unit. Combined with filter capacitors, the ripple is converted into heat energy, reducing ground bounce noise.
It effectively reduces ground bounce noise, protects the input terminals of logic devices, reduces ground plane interference, and improves the stability of the power module.
Smart Images
Figure CN223553222U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic circuits, and more specifically, relates to a power module grounding device and a power module. Background Technology
[0002] In some scenarios, the power modules used in applications have multiple voltage output terminals. During power conversion, the voltage output pins switch frequently, converting electrical energy from the input to the output. The voltage at these pins changes continuously during this switching process, generating rapidly varying voltage and current. This causes constant changes in the return current to the adjacent ground plane, creating ground bounce. Multiple power return currents converge and share a common return ground plane, leading to greater ground plane interference and a larger ground bounce. As integrated circuits become increasingly larger and switching frequencies increase, ground bounce noise can cause glitches at the inputs of logic devices. Utility Model Content
[0003] In view of the shortcomings of the prior art, the purpose of this application is to provide a power module grounding device and a power module, which aims to solve the problem of severe ground bounce caused by multiple power outputs sharing a return plane in existing power modules.
[0004] To achieve the above objectives, in a first aspect, this application provides a power module grounding device, wherein the power module includes: N power supply units, where N is an integer greater than 1; and includes: N+1 grounding terminals and multiple ferrite beads, each grounding terminal being connected to a different ground plane;
[0005] Each power supply unit includes: a voltage input terminal, a voltage input ground terminal, a voltage output terminal, and a voltage output ground terminal;
[0006] All N voltage input grounding terminals of the N-way power supply unit are connected to the first grounding terminal among the N+1 grounding terminals;
[0007] The voltage output grounding terminal of the N-way power supply unit is connected to the second to the N+1th grounding terminals, respectively.
[0008] Each of the second to the (N+1)th grounding terminals is connected to the first grounding terminal by at least one magnetic bead.
[0009] In one possible implementation, there are N magnetic beads, and each of the second to N+1 grounding terminals is connected to the first grounding terminal with a magnetic bead.
[0010] In one possible implementation, the N+1 grounding terminals are connected to different ground planes at different heights and / or at different locations at the same height.
[0011] In one possible implementation, the first grounding terminal is connected to the board-level ground.
[0012] In one possible implementation, the grounding device further includes: multiple filter capacitors;
[0013] At least one filter capacitor is connected between the voltage input terminal of each power supply unit and the first ground terminal;
[0014] At least one filter capacitor is connected between the voltage output terminal of each power supply unit and one of the ground terminals from the second to the (N+1)th ground terminal.
[0015] In one possible implementation, multiple filter capacitors are connected between the voltage input terminal of each power supply unit and the first ground terminal; and / or
[0016] Multiple filter capacitors are connected between the voltage output terminal of each power supply unit and one of the ground terminals from the second to the (N+1)th ground terminal.
[0017] In one possible implementation, N is 2 or N is 3.
[0018] Secondly, this application provides a power module including the grounding device described in the first aspect or any possible implementation thereof.
[0019] Overall, the technical solutions conceived in this application have the following beneficial effects compared with the prior art:
[0020] This application provides a power module grounding device and a power module. In the grounding device, the ground planes of the multiple voltage outputs of the power module are separated and then connected to the board-level ground via ferrite beads. This limits the return current of the voltage output of each power supply unit to a different ground plane, effectively reducing ground bounce by limiting the number of return signals on the return plane. Furthermore, this application connects ferrite beads between the ground planes connected to the multiple voltage output terminals and the board-level ground to convert ripple into heat energy and dissipate it, further reducing ground bounce. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the connection between the power module and the grounding device provided in the embodiments of this application;
[0022] Figure 2 This is a schematic diagram of the grounding method connection of the grounding device provided in the embodiments of this application;
[0023] In all the figures, the same reference numerals are used to indicate the same elements or structures, wherein: 10 is the first ground terminal; 20 is the second ground terminal; 21 is the third ground terminal; 30 is a ferrite bead; and 40 is a filter capacitor. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0025] The embodiments of this application are described below with reference to the accompanying drawings.
[0026] This application applies to the design of various printed circuit boards (PCBs), primarily addressing the ground bounce problem caused by multiple voltage outputs sharing a common return plane in a power module. This application reduces ground bounce by limiting the number of signals sharing a single return path. The implementation principle is that each output signal has an independent return path and is connected to the input ground via a ferrite bead.
[0027] Figure 1 This is a schematic diagram showing the connection between the power module and the grounding device provided in an embodiment of this application; as shown. Figure 1 As shown, the power supply module includes: N power supply units, where N is an integer greater than 1.
[0028] The grounding device includes N+1 grounding terminals and multiple magnetic beads 30, with each grounding terminal connected to a different ground plane.
[0029] Each power supply unit includes: voltage input terminal VIN, voltage input ground terminal, voltage output terminals VOUT1, VOUT2, etc., and voltage output ground terminal;
[0030] All N voltage input grounding terminals of the N-way power supply unit are connected to the first grounding terminal GND 10 among the N+1 grounding terminals;
[0031] The voltage output grounding terminal of the N-way power supply unit is connected to the second grounding terminal GND1 20 to the N+1 grounding terminals (GND1 GND2... etc.) one by one;
[0032] At least one magnetic bead 30 is connected between each of the second to the (N+1)th grounding terminals and the first grounding terminal.
[0033] More preferably, there are N magnetic beads 30, and each of the second to N+1 grounding terminals is connected to the first grounding terminal with one magnetic bead 30.
[0034] More preferably, the N+1 grounding terminals are connected to different ground planes at different heights and / or at different locations at the same height.
[0035] More preferably, the first grounding terminal is connected to the plate ground.
[0036] More preferably, at least one filter capacitor 40 is connected between the voltage input terminal of each power supply unit and the first grounding terminal; at least one filter capacitor 40 is connected between the voltage output terminal of each power supply unit and one of the grounding terminals from the second grounding terminal to the (N+1)th grounding terminal.
[0037] More preferably, a plurality of filter capacitors 40 are connected between the voltage input terminal of each power supply unit and the first ground terminal; and / or a plurality of filter capacitors 40 are connected between the voltage output terminal of each power supply unit and one of the ground terminals from the second ground terminal to the (N+1)th ground terminal.
[0038] More preferably, N is 2 or N is 3. Figure 1 The example shown only illustrates the case where N is 2. When N is 2, the third grounding terminal is... Figure 1 GND2 21 in.
[0039] It should be noted that, as Figure 1 As shown, the internal circuitry of the power module mainly includes a power field-effect transistor (FET), a freewheeling diode, a filter inductor, and a filter capacitor. When the power module is operating, its power FET is constantly switching. When the power FET is on, current is converted into magnetic energy through the core magnetic field of the inductor and stored in the inductor, while the freewheeling diode is off. When the switch is off, due to the inductor's self-inductance, the magnetic energy generates a voltage, converting the magnetic energy into electrical energy, which is then supplied to the load through the output terminal. The output terminal VOUT is filtered by the filter capacitor to remove ripple before supplying power to the load. From a filtering perspective, the high switching frequency and large current cause ground plane current fluctuations when the current reaches the ground plane through the filter capacitor. The ferrite bead 30 converts the ripple into heat energy, reducing ground plane bounce.
[0040] Furthermore, in Figure 1 Based on this, the present application can also protect a power module including the above-mentioned grounding device, so as to provide a power module with smaller ground bounce.
[0041] Figure 2This is a schematic diagram of the grounding method connection of the grounding device provided in the embodiment of this application; taking the power module including: 2 power supply units as an example, the two voltage input grounding terminals of the 2 power supply units are both connected to the first grounding terminal GND 10; the voltage output grounding terminals of the 2 power supply units are respectively connected to the second grounding terminal GND1 20 and the third grounding terminal GND2 21; a ferrite bead 30 is connected between the second grounding terminal GND1 20 and the third grounding terminal GND2 21 and the first grounding terminal GND 10.
[0042] In summary, unlike previous designs, this application separates the ground planes of multiple VOUT channels and connects them to the board-level ground via ferrite beads. This limits the return current of VOUT1 to GND1, the return current of VOUT2 to GND2, and so on. Therefore, this application effectively reduces ground bounce by limiting the number of return signals on the return plane (only one signal returns to a ground plane). Furthermore, connecting ferrite beads between the ground planes connected to multiple voltage output terminals and the board-level ground converts ripple into heat, further reducing ground bounce.
[0043] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.
[0044] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.
[0045] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. "Sliding connection" refers to a connection where the components can slide relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," "outer," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0046] Furthermore, the mathematical concepts mentioned in the embodiments of this application, such as symmetry, equality, parallelism, and perpendicularity, are limitations specific to the current technological level, rather than absolute and strict mathematical definitions. Slight deviations are permissible; approximations of symmetry, equality, parallelism, and perpendicularity are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.
[0047] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A power module grounding device, the power module comprising: The N-channel power supply unit, where N is an integer greater than 1, is characterized by comprising: N+1 grounding terminals and multiple ferrite beads, with each grounding terminal connected to a different ground plane. Each power supply unit includes: a voltage input terminal, a voltage input ground terminal, a voltage output terminal, and a voltage output ground terminal; All N voltage input grounding terminals of the N-way power supply unit are connected to the first grounding terminal among the N+1 grounding terminals; The voltage output grounding terminal of the N-way power supply unit is connected to the second to the N+1th grounding terminals, respectively. Each of the second to the (N+1)th grounding terminals is connected to the first grounding terminal by at least one magnetic bead.
2. The grounding device according to claim 1, characterized in that, There are N magnetic beads, and each of the second to N+1 grounding terminals is connected to the first grounding terminal with a magnetic bead.
3. The grounding device according to claim 1, characterized in that, The N+1 grounding terminals are connected to different ground planes at different heights and / or at different locations at the same height.
4. The grounding device according to any one of claims 1 to 3, characterized in that, The first grounding terminal is connected to the board ground.
5. The grounding device according to any one of claims 1 to 3, characterized in that, Also includes: Multiple filter capacitors; At least one filter capacitor is connected between the voltage input terminal of each power supply unit and the first ground terminal; At least one filter capacitor is connected between the voltage output terminal of each power supply unit and one of the ground terminals from the second to the (N+1)th ground terminal.
6. The grounding device according to claim 5, characterized in that, Multiple filter capacitors are connected between the voltage input terminal of each power supply unit and the first ground terminal; and / or Multiple filter capacitors are connected between the voltage output terminal of each power supply unit and one of the ground terminals from the second to the (N+1)th ground terminal.
7. The grounding device according to claim 5, characterized in that, N is 2 or N is 3.
8. A power supply module, characterized in that, Includes the grounding device described in any one of claims 1 to 7.