Satellite-borne vertical interconnection structure based on fuzz buttons
By using a button-like vertical interconnect structure, utilizing aluminum plates and radiation-resistant coatings, and combining reflow soldering technology, the integration, miniaturization, and reliability issues of spaceborne phased array antennas were solved, enabling stable operation in strong radiation environments.
Patent Information
- Application Number
- CN202423148549.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing technologies are insufficient to meet the requirements of high integration, miniaturization, and high reliability of spaceborne phased array antennas, and the welding yield of traditional radio frequency glass bead interconnection methods is low, which cannot meet the requirements of spaceborne radiation resistance.
A vertical interconnect structure based on fuzzy buttons is adopted, using aluminum plates and polytetrafluoroethylene dielectric blocks, combined with fluffy gold wire fuzzy buttons and radiation-resistant coatings. The substrate is fixed by reflow soldering to enhance radiation resistance and structural reliability.
It effectively reduces the damage of radiation to devices, improves the stability and reliability of the system in strong radiation environments, expands the range of device selection, and ensures the normal operation of equipment under complex working conditions.
Smart Images
Figure CN223553521U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vertical interconnection technology, specifically to a spaceborne vertical interconnection structure based on a hair button. Background Technology
[0002] With the continuous development of aerospace technology, spaceborne phased array antennas have been widely used in satellite communication, remote sensing, navigation and other fields. Spaceborne phased array antennas need to have the characteristics of high integration, miniaturization, lightweight and high reliability in order to meet the strict requirements of satellite platforms for payloads.
[0003] Currently, according to the requirements for radiation resistance in spaceborne applications, phased array antennas need to meet a total dose capability greater than 3.42 × 10³ krad (Si), which places high demands on the radiation resistance of the components used. Conventional SOI germanium-silicon cannot meet this requirement, which greatly limits the selection of components. The traditional method of interconnecting RF glass beads is to pass the inner conductor through a via on the substrate and solder it to the via. However, for highly integrated phased arrays, this method is impractical due to the large number of components designed on the substrate. If the inner conductor of the glass bead is contacted and soldered to the substrate, the lack of elasticity of the inner conductor and the inherent processing errors of the structural components result in a low yield rate during the soldering process. Therefore, in order to meet the requirements of spaceborne phased array equipment for integration, miniaturization, and radiation resistance, a vertical interconnection structure based on a burr button for spaceborne KA phased array antennas is proposed. Utility Model Content
[0004] The purpose of this invention is to provide a spaceborne vertical interconnection structure based on a button to address the aforementioned shortcomings in the technology.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a spaceborne vertical interconnect structure based on a hair button, comprising an RF adapter board, wherein the RF adapter board is a metal aluminum plate, the properties of which can attenuate the effects of irradiation, and the RF adapter board has multiple slots, each slot containing a hair button component, the hair button component comprising a dielectric block and a hair button, the dielectric block being embedded in the slot, one end of the dielectric block having an insert groove, the hair button being embedded in the insert groove, a first substrate and a second substrate, the first substrate and the second substrate being disposed on both sides of the RF adapter board, the RF adapter board... With a thickness of three millimeters, the total radiation dose of the device can be reduced to 10 krad(Si), a significant reduction that greatly increases the range of device options. The dielectric block is made of polytetrafluoroethylene, the fuzzy button is a ball of fluffy gold wire, and the surface of the RF adapter board is coated with an anti-radiation coating (not shown in the figure). The anti-radiation coating is made of a boron- or lead-containing organic polymer material, which can further absorb and scatter radiation particles, enhancing the overall radiation resistance. The first substrate has a first pad connected to the side wall near the RF adapter board, and the second substrate has a second pad connected to the side wall near the RF adapter board.
[0006] Through the above technical solution:
[0007] Using a metal structure as the mounting medium fully leverages the radiation resistance of metal, effectively reducing the damage of radiation to devices and ensuring the stable operation of the system in a strong onboard radiation environment. It also provides strong support for the system's integrated and miniaturized design.
[0008] Preferably, the side of the first substrate facing the RF adapter board is provided with a first solder paste layer, and the side of the second substrate facing the RF adapter board is provided with a second solder paste layer.
[0009] Through the above technical solution:
[0010] By using reflow soldering to weld the hair button between two substrates, the hair button is ensured to be tightly and stably connected between the substrates, which greatly enhances the reliability and stability of the overall structure in a strong mechanical environment, effectively resists external interference such as vibration and impact, and ensures the normal operation of the equipment under complex working conditions.
[0011] Specifically, firstly, the dielectric block is placed in the slot opened in the RF adapter board. Then, the fuzzy button is placed in the slot (at this time, both ends of the fuzzy button protrude). Next, the first substrate and the RF adapter board are fixed by the first solder paste layer and reflow soldering, so that the first pad contacts one end of the fuzzy button. Finally, the second pad on the second substrate is fixed to the other end of the fuzzy button by the second solder paste layer, and a second reflow soldering is performed (after assembly and soldering, both ends of the fuzzy button are flattened).
[0012] The technical effects and advantages provided by this utility model in the above technical solution are as follows:
[0013] 1. By setting up a metal aluminum plate and two substrates, and using a metal structure as the mounting and fixing medium, the radiation resistance characteristics of metal are fully utilized. This not only effectively reduces the damage of radiation to the devices and ensures the stable operation of the system in the strong radiation environment of space, but also provides strong support for the system integration and miniaturization design. This allows for more flexible selection of various high-performance devices while meeting the radiation resistance requirements, further improving the overall performance and reliability of the spaceborne phased array antenna.
[0014] 2. By setting a first solder paste layer and a second solder paste layer, the fuzzy button can be soldered between two substrates using reflow soldering. Reflow soldering can firmly fix the fuzzy button, effectively controlling its elasticity under specific application requirements. The presence of solder ensures that the fuzzy button is tightly and stably connected between the substrates, greatly enhancing the reliability and stability of the overall structure in a strong mechanical environment, effectively resisting external interference such as vibration and impact, and ensuring the normal operation of the equipment under complex working conditions. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model after assembly;
[0017] Figure 2 This is one of the schematic diagrams of the overall structure of this utility model before assembly;
[0018] Figure 3 This is the second schematic diagram of the overall structure of this utility model before assembly;
[0019] Figure 4 This is a cross-sectional view of the radio frequency adapter board of this utility model;
[0020] Figure 5 This is an enlarged schematic diagram of the connection between the medium block and the button of this utility model.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1. RF adapter board; 2. First substrate; 3. Second substrate; 4. Hole; 5. Dielectric block; 6. Insertion groove; 7. Hair button; 8. First solder paste layer; 9. Second solder paste layer; 10. First pad; 11. Second pad. Detailed Implementation
[0023] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0024] This utility model provides, for example Figures 1-4 The illustrated spaceborne vertical interconnect structure based on a small button includes:
[0025] The RF adapter board 1 is made of aluminum, and the properties of metal can attenuate the effects of radiation. The RF adapter board 1 has multiple slots 4, each containing a small button. The button includes a dielectric block 5 and a small button 7. The dielectric block 5 is embedded in the slot 4, and one end of the dielectric block 5 has a recess 6 into which the small button 7 is embedded. A first substrate 2 and a second substrate 3 are located on opposite sides of the RF adapter board 1. The RF adapter board 1 is three millimeters thick, which can reduce the total radiation dose tolerable by the device to 1. The 0krad(Si) has a huge reduction, which can greatly increase the range of device selection. The dielectric block 5 is made of polytetrafluoroethylene. The fuzzy button 7 is a gold-plated tuft of beryllium bronze wire. The surface of the RF adapter board 1 is coated with an anti-radiation coating (not shown in the figure). The anti-radiation coating is made of boron- or lead-containing organic polymer materials, which can further absorb and scatter radiation particles and enhance the overall anti-radiation capability. The first substrate 2 is connected to the first pad 10 near the side wall of the RF adapter board 1, and the second substrate 3 is connected to the second pad 11 near the side wall of the RF adapter board 1.
[0026] Through the above technical solution:
[0027] Using a metal structure as the mounting medium fully leverages the radiation resistance of metal, effectively reducing the damage of radiation to devices and ensuring the stable operation of the system in a strong onboard radiation environment. It also provides strong support for the system's integrated and miniaturized design.
[0028] This utility model provides, for example Figure 1 and Figure 2The above describes a spaceborne vertical interconnect structure based on a hair button. The first substrate 2 has a first solder paste layer 8 on the side facing the radio frequency adapter board 1, and the second substrate 3 has a second solder paste layer 9 on the side facing the radio frequency adapter board 1.
[0029] Through the above technical solution:
[0030] By using reflow soldering to weld the button 7 between the two substrates, the button 7 is ensured to be tightly and stably connected between the substrates, which greatly enhances the reliability and stability of the overall structure in a strong mechanical environment, effectively resists external interference such as vibration and impact, and ensures the normal operation of the equipment under complex working conditions.
[0031] Specifically, firstly, the dielectric block 5 is placed in the slot 4 of the RF adapter board 1. Then, the button 7 is placed in the groove 6 (at this time, both ends of the button 7 protrude). Next, the first substrate 2 is fixed to the RF adapter board 1 by the first solder paste layer 8 and reflow soldering, so that the first pad 10 contacts one end of the button 7. Finally, the second pad 11 on the second substrate 3 is fixed to the other end of the button 7 by the second solder paste layer 9, and a second reflow soldering is performed (after assembly and soldering, both ends of the button 7 are flattened).
[0032] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A spaceborne vertical interconnection structure based on a small button, characterized in that, include: Radio frequency adapter board (1), the radio frequency adapter board (1) is a metal aluminum plate, and the radio frequency adapter board (1) has multiple holes and slots (4), and each hole and slot (4) is provided with a bobby button; A first substrate (2) and a second substrate (3) are disposed on both sides of an RF adapter board (1). The first substrate (2) is connected to a first pad (10) near the side wall of the RF adapter board (1), and the second substrate (3) is connected to a second pad (11) near the side wall of the RF adapter board (1).
2. The spaceborne vertical interconnection structure based on a button as described in claim 1, characterized in that: The bobby button includes a medium block (5) and a bobby button (7). The medium block (5) is embedded in the hole groove (4). One end of the medium block (5) has an insert groove (6), and the bobby button (7) is embedded in the insert groove (6).
3. The spaceborne vertical interconnection structure based on a small button as described in claim 1, characterized in that: The first substrate (2) has a first solder paste layer (8) on the side facing the radio frequency adapter board (1).
4. The spaceborne vertical interconnection structure based on a button as described in claim 3, characterized in that: The second substrate (3) has a second solder paste layer (9) on the side facing the radio frequency adapter board (1).
5. A spaceborne vertical interconnection structure based on a small button as described in claim 1, characterized in that: The thickness of the radio frequency adapter board (1) is three millimeters.
6. A spaceborne vertical interconnection structure based on a small button as described in claim 2, characterized in that: The medium block (5) is made of polytetrafluoroethylene, and the fuzzy button (7) is a velvety gold wire column.