Carrier device for simultaneously baking front and back solder resist ink films of FPC (Flexible Printed Circuit)

Abstract

The utility model discloses a carrier device for simultaneously baking front and back solder resist ink films of an FPC (Flexible Printed Circuit), and relates to the field of FPC board processing. The carrier device for simultaneously baking the FPC front and back solder resist ink films comprises a supporting piece and a baking carrier installed on the supporting piece, a full-transparent window is formed in the middle of the supporting piece, the baking carrier is arranged on the full-transparent window in an overhead mode, and a bottom baking window is formed in the baking carrier. According to the carrier device for simultaneously baking the solder resist ink films on the front and back sides of the FPC, after the two sides of the FPC are coated with the solder resist ink films respectively, the FPC is placed on the baking carrier, the solder resist ink film coating at the bottom of the FPC is located in the bottom baking window, the baking carrier is placed on the full-transparent window and pushed into the baking box to be baked, and the baking carrier is placed on the full-transparent window. Therefore, baking forming of the solder resist ink films on the two sides of the FPC is completed at a time, procedures and time are reduced, baking cost is saved, and damage to the FPC and the solder resist ink films cured for the first time in the secondary baking process is avoided.

Description

Technical Field

[0001] This utility model relates to the field of FPC board processing technology, specifically to a device for simultaneously baking the solder resist ink film on both sides of an FPC carrier. Background Technology

[0002] Nowadays, flexible printed circuit board (FPC) products are becoming increasingly diverse and complex. For small pad openings on components, solder resist ink film solder resist technology is required, and both sides of the FPC need to be treated with solder resist ink film solder resist technology. For FPC solder joints, solder resist ink is usually applied and then cured, which has the advantage of precise installation. For circuit parts, film bonding is usually used, which has the advantage of not cracking when repeatedly bent during subsequent use.

[0003] The current process requires first covering one side with a solder resist film, then baking and curing it, and then covering the other side and curing it again. This process is cumbersome and requires two baking and curing cycles, which consumes more time and costs. In addition, the FPC is subjected to two baking cycles, and the second baking process can easily damage the FPC itself and the solder resist film cured in the first cycle. Therefore, a carrier device for simultaneously baking solder resist films on both sides of an FPC is provided to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a device for simultaneously baking solder resist ink films on both sides of an FPC onto a carrier. This solves the problem that in the current process, one side needs to be covered with a solder resist ink film first, then baked and cured, and then the other side is covered and cured again. This process is cumbersome, requires two baking and curing cycles, consumes more time and costs, and the FPC is subjected to two baking cycles, which can easily damage the FPC itself and the solder resist ink film cured in the first baking.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a device for simultaneously baking FPC front and back solder resist ink films, including a support member and a baking carrier installed on the support member. The support member has a fully transparent window in the middle, and the baking carrier is suspended on the fully transparent window. The baking carrier is a metal mesh, and the outer surface of the metal mesh has a bottom baking window.

[0006] Preferably, the support member includes a rectangular metal carrier plate and arched overhead bars integrally formed on both sides of the rectangular metal carrier plate.

[0007] Preferably, the fully transparent window is located at the center of the rectangular metal carrier plate, and a positioning baffle is provided on the top surface of the rectangular metal carrier plate.

[0008] Preferably, the number of positioning bars is multiple sets, and the multiple sets of positioning bars are arranged on the four sides of the fully transparent window.

[0009] Preferably, the outer side of the metal mesh is integrally formed with a frame, and the outer side of the frame contacts the inner side of the positioning strip.

[0010] Preferably, a reinforcing rib is provided at the connection between the rectangular metal carrier plate and the arched overhead bar.

[0011] This utility model discloses a device for simultaneously baking solder resist ink films on both sides of an FPC onto a carrier, which has the following beneficial effects:

[0012] This device for simultaneously baking solder resist ink films on both sides of an FPC utilizes a support component adapted to the baking oven. A fully transparent window is located in the center of the support component, and positioning strips are installed on all four sides of the window. In use, a baking carrier suitable for the corresponding FPC is selected. After coating both sides of the FPC with solder resist ink, the FPC is placed on the baking carrier, ensuring that the solder resist ink coating on the bottom of the FPC is within the bottom baking window to avoid contact with the bottom solder resist ink film. The baking carrier is then placed on the fully transparent window, and the support component is placed inside the baking oven for baking. This process completes the baking and forming of the solder resist ink films on both sides of the FPC in one step, reducing processes and time, saving baking costs, and preventing damage to the FPC itself and the first-cured solder resist ink film during secondary baking. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall outer surface structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall bottom structure of this utility model;

[0016] Figure 3 This is an exploded view of the overall structure of this utility model.

[0017] In the diagram: 1. Support component; 11. Rectangular metal carrier plate; 12. Arched overhead bar; 13. Reinforcing rib; 14. Fully transparent window; 15. Positioning baffle; 2. Baking carrier; 21. Metal mesh; 22. Frame; 23. Bottom baking window. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0019] This application provides a device for simultaneously baking solder resist ink films on both sides of an FPC onto a carrier. This solves the problem that in the current process, one side needs to be covered with a solder resist ink film first, then baked and cured, and then the other side is covered and cured again. This process is cumbersome, requires two baking and curing cycles, consumes more time and costs, and the FPC is subjected to two baking cycles, which can easily damage the FPC itself and the solder resist ink film cured in the first baking.

[0020] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0021] This utility model discloses a device for simultaneously baking the front and back solder resist ink films of FPC onto a carrier.

[0022] According to the appendix Figure 1-3 As shown, it includes a support member 1 and a baking carrier 2 installed on the support member 1. A fully transparent window 14 is provided in the middle of the support member 1. The baking carrier 2 is suspended on the fully transparent window 14. The baking carrier 2 is a metal mesh 21. A bottom baking window 23 is provided on the outer surface of the metal mesh 21.

[0023] By placing the FPC on the baking carrier 2, ensuring that the solder resist film coating portion on the bottom of the FPC is within the bottom baking window 23 to avoid contact with the solder resist film on the bottom, and then placing the baking carrier 2 on the fully transparent window 14, the support 1 is placed inside the baking oven for baking. This completes the baking and forming of the solder resist film on both sides of the FPC in one go. At the same time, the support 1 and the baking carrier 2 adopt a separate installation structure. When baking the solder resist film for different types of FPCs, only different baking carriers 2 need to be replaced, reducing the overall manufacturing cost.

[0024] The support member 1 includes a rectangular metal carrier plate 11 and arched overhead bars 12 integrally formed on both sides of the rectangular metal carrier plate 11.

[0025] The fully transparent window 14 is located at the center of the rectangular metal carrier plate 11, and the top surface of the rectangular metal carrier plate 11 is provided with positioning baffles 15. There are multiple sets of positioning baffles 15, and multiple sets of positioning baffles 15 are provided on the four sides of the fully transparent window 14. The outer side of the metal mesh 21 is integrally formed with a frame 22. The outer side of the frame 22 contacts the inner side of the positioning baffles 15, thereby determining that the position of the metal mesh 21 is in the fully transparent window 14, avoiding contact with the solder resist ink film on the bottom of the FPC, and ensuring the overall quality effect of the solder resist ink film after baking.

[0026] A reinforcing rib 13 is provided at the connection between the rectangular metal carrier plate 11 and the arched overhead strip 12. The reinforcing rib 13 enables the arched overhead strip 12 and the rectangular metal carrier plate 11 to maintain a pre-bending angle, thereby enabling the rectangular metal carrier plate 11 to effectively support the FPC and avoid overall deformation.

[0027] By using a support member 1 adapted to the baking oven, a fully transparent window 14 is provided in the middle of the support member 1, and positioning baffles 15 are provided on the four sides of the fully transparent window 14. In use, a baking carrier 2 adapted to the corresponding FPC is selected. After the solder resist ink film is coated on both sides of the FPC, the FPC is placed on the baking carrier 2, so that the solder resist ink film coated on the bottom of the FPC is in the bottom baking window 23 to avoid contact with the bottom solder resist ink film. Then the baking carrier 2 is placed on the fully transparent window 14. At this time, the support member 1 is placed inside the baking oven for baking, thereby completing the baking and forming of the solder resist ink film on both sides of the FPC in one go, reducing the process and time, saving baking costs, and avoiding damage to the FPC itself and the first cured solder resist ink film during the secondary baking process.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A device for simultaneously baking solder resist ink films on both sides of an FPC, comprising a support (1) and a baking carrier (2) mounted on the support (1), characterized in that... ； The support member (1) has a fully transparent window (14) in the middle, and the baking carrier (2) is suspended on the fully transparent window (14); The baking carrier (2) is a metal mesh (21), and the outer surface of the metal mesh (21) is provided with a bottom baking window (23); The four sides of the fully transparent window (14) are provided with positioning bars (15).

2. The device for simultaneously baking solder resist ink films on both sides of an FPC carrier according to claim 1, characterized in that, The support member (1) includes a rectangular metal carrier plate (11) and arched overhead bars (12) integrally formed on both sides of the rectangular metal carrier plate (11).

3. The device for simultaneously baking the front and back solder resist ink films of an FPC carrier according to claim 2, characterized in that, The fully transparent window (14) is located at the center of the rectangular metal plate (11).

4. The device for simultaneously baking the front and back solder resist ink films of an FPC carrier according to claim 3, characterized in that, The number of positioning bars (15) is multiple sets, and multiple sets of positioning bars (15) are set on the four sides of the fully transparent window (14).

5. The device for simultaneously baking solder resist ink films on both sides of an FPC carrier according to claim 4, characterized in that, The outer side of the metal mesh (21) is integrally formed with a frame (22), and the outer side of the frame (22) is in contact with the inner side of the positioning baffle (15).

6. The device for simultaneously baking the front and back solder resist ink films of an FPC carrier according to claim 2, characterized in that, A reinforcing rib (13) is provided at the connection between the rectangular metal carrier plate (11) and the arched overhead bar (12).

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