Infrared receiving module and electronic equipment
By setting a groove structure on the substrate of the infrared receiving module, the decoding chip and the photosensitive chip are stacked vertically, which solves the problem of excessive module size and achieves miniaturization of the module and signal shielding effect.
Patent Information
- Application Number
- CN202422847688.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Existing infrared receiving modules have a large substrate area due to the spacing between the photosensitive chip and the decoding chip, making it difficult to reduce the module size and affecting its application in micro devices.
A groove structure is set on the substrate, and the decoding chip is placed inside the groove. The photosensitive chip and the decoding chip are arranged in an overlapping manner. The groove structure is used to shield the signal of the decoding chip from the photosensitive chip, eliminating the need for an additional shielding structure.
It saves space in the infrared receiving module, reduces the module size, and at the same time achieves signal shielding of the decoding chip, eliminating the need for additional shielding structures.
Smart Images
Figure CN223553565U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of infrared communication technology, and in particular to an infrared receiving module and electronic device. Background Technology
[0002] Infrared receiver modules are commonly used in appliances such as televisions and air conditioners to receive commands and control the appliances. Existing infrared receiver modules typically consist of a metal frame, a photosensitive chip, a decoding chip, and a shielding cover. The photosensitive chip and decoding chip are mounted on the metal frame and electrically connected via wiring on the frame. The shielding cover is positioned opposite the decoding chip to provide shielding. However, in existing infrared receiver modules, to ensure the photosensitive function of the photosensitive chip and avoid interference with the decoding chip, the photosensitive chip and decoding chip are spaced apart on the substrate. This results in a larger substrate area, making it difficult to reduce the overall size of the infrared receiver module and hindering its application in micro-devices. Utility Model Content
[0003] This utility model provides an infrared receiving module and electronic device to solve the problem of excessive size of existing infrared receiving modules.
[0004] This utility model provides an infrared receiving module, including a substrate, a photosensitive wafer, and a decoding chip;
[0005] The substrate has a groove structure along a first direction, and the groove structure includes a groove bottom and a groove shoulder;
[0006] The decoding chip is connected to the bottom of the groove, and the photosensitive wafer is connected to the shoulder of the groove;
[0007] The projection of the photosensitive wafer in the first direction completely covers the projection of the decoding chip in the first direction.
[0008] Preferably, the substrate includes a first PCB board and a second PCB board disposed on the first PCB board;
[0009] Through holes are provided on the second PCB board;
[0010] The first PCB board is positioned opposite to the through hole to form the bottom of the groove, and the second PCB board forms the shoulder of the groove, which is located around the through hole.
[0011] Preferably, the substrate includes a first PCB board and two second PCB boards spaced apart on the first PCB board;
[0012] The gap between the first PCB board and the two second PCB boards is arranged opposite to each other to form the bottom of the groove, and the side of the two second PCB boards away from the first PCB board cooperates with each other to form the shoulder of the groove.
[0013] Preferably, both the first PCB board and the second PCB board are provided with connection holes;
[0014] The connection holes of the first PCB board are positioned opposite to the connection holes of the second PCB board;
[0015] A metal layer is provided on the inner wall of the connection hole.
[0016] Preferably, the substrate is provided with connection lines;
[0017] The connection line is connected to the photosensitive wafer and the decoding chip.
[0018] Preferably, the decoding chip is fixedly mounted on the substrate using conductive adhesive or insulating adhesive, and the decoding chip is electrically connected to the connection line via bonding wires.
[0019] Preferably, the photosensitive wafer is fixedly mounted on the substrate using conductive adhesive and is electrically connected to the connection lines via the conductive adhesive.
[0020] Alternatively, the photosensitive chip is fixedly mounted on the substrate using solder paste and electrically connected to the connection lines via the solder paste.
[0021] Preferably, it further includes a protective encapsulation layer that covers the photosensitive wafer and the decoding chip.
[0022] Preferably, the substrate is an opaque substrate.
[0023] This utility model embodiment also provides an electronic device, including the infrared receiving module described in any of the above claims.
[0024] This utility model provides an infrared receiving module and an electronic device. In this infrared receiving module, a substrate with a grooved structure is used, and a decoding chip is placed inside the grooved structure, so that the photosensitive chip and the decoding chip are arranged in an overlapping manner. This saves layout space and reduces the size of the infrared receiving module. Simultaneously, the photosensitive chip also acts as a shield against interference signals from the decoding chip, eliminating the need for an additional shielding structure and further reducing the size of the infrared receiving module. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of an infrared receiving module in one embodiment of the present invention;
[0027] Figure 2 This is another structural schematic diagram of the infrared receiving module in one embodiment of this utility model.
[0028] In the figure: 1. Substrate; 11. First PCB board; 12. Second PCB board; 2. Photosensitive chip; 3. Decoding chip; 4. Groove structure; 41. Bottom of the groove; 42. Shoulder of the groove; 5. Connecting hole; 6. Bonding wire; 7. Encapsulation protective layer. Detailed Implementation
[0029] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0030] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] This utility model provides an infrared receiving module, including a substrate 1, a photosensitive chip 2, and a decoding chip 3; the substrate 1 has a groove structure 4 along a first direction, the groove structure 4 including a groove bottom 41 and a groove shoulder 42; the decoding chip 3 is disposed on the groove bottom 41, and the photosensitive chip 2 is disposed on the groove shoulder 42; the projection of the photosensitive chip 2 in the first direction completely covers the projection of the decoding chip 3 in the first direction.
[0033] As an example, the infrared receiving module includes a substrate 1, a photosensitive wafer 2, and a decoding chip 3. The substrate 1 has a recessed structure 4 along a first direction, which can be perpendicular to the surface of the substrate 1. The recessed structure 4 is concave relative to the surface of the substrate 1, including a bottom 41 and a shoulder 42. The bottom 41 is located below the surface of the substrate 1, forming the bottom of the recessed structure 4. The shoulder 42 is located on the substrate 1 surface surrounding the opening of the recessed structure 4, and is located above the bottom 41. The decoding chip 3 is connected to the bottom 41, and the photosensitive wafer 2 is connected to the shoulder 42. Therefore, the photosensitive wafer 2 is located above the decoding chip 3 and is used to receive infrared light. The projection of the photosensitive wafer 2 in the first direction completely covers the projection of the decoding chip 3 in the first direction. Therefore, the photosensitive wafer 2 can completely block the decoding chip 3 in a direction perpendicular to the surface of the substrate 1, saving layout space while also shielding the decoding chip 3 from interference signals.
[0034] In this example, by setting a substrate 1 with a groove structure 4 and placing the decoding chip 3 inside the groove structure 4, the photosensitive chip 2 and the decoding chip 3 are arranged in an overlapping manner, which can save layout space and reduce the size of the infrared receiving module. At the same time, the photosensitive chip 2 can also shield the interference signal of the decoding chip 3, eliminating the need for an additional shielding structure and further reducing the size of the infrared receiving module.
[0035] In one embodiment, the substrate 1 includes a first PCB board 11 and a second PCB board 12 disposed on the first PCB board 11; a through hole is formed on the second PCB board 12; a groove bottom 41 is formed on the first PCB board 11 opposite to the through hole, and a groove shoulder 42 is formed on the second PCB board 12, which is disposed around the through hole.
[0036] As an example, the substrate 1 can be formed by laminating a first PCB board 11 and a second PCB board 12 stacked vertically, with the second PCB board 12 positioned above the first PCB board 11. The second PCB board 12 has through holes to allow a groove structure 4 to be formed on the stacked substrate 1. The area of the first PCB board 11 opposite to the through hole is the bottom 41 of the groove, and the area of the second PCB board 12 surrounding the through hole is the shoulder 42 of the groove. The photosensitive wafer 2 is attached to the through hole and connected to the shoulder 42 of the groove.
[0037] In another embodiment, the substrate 1 includes a first PCB board 11 and two second PCB boards 12 spaced apart on the first PCB board 11; the spaced area between the first PCB board 11 and the two second PCB boards 12 is disposed opposite to each other to form a groove bottom 41, and the side of the two second PCB boards 12 away from the first PCB board 11 cooperates with each other to form a groove shoulder 42.
[0038] As another example, substrate 1 can be formed by laminating a first PCB board 11 and two second PCB boards 12 stacked vertically, with the two second PCB boards 12 spaced apart on the first PCB board 11. The position of the board surface on the first PCB board 11 opposite to the spaced area between the two second PCB boards 12 is the bottom of the groove 41. The side of one second PCB board 12 away from the first PCB board 11 and the side of the other second PCB board 12 away from the first PCB board 11 cooperate with each other to form the shoulder of the groove 42. The photosensitive chip 2 is attached to the two second PCB boards 12, and both ends of the photosensitive chip 2 are connected to the two second PCB boards 12 respectively.
[0039] In one embodiment, both the first PCB board 11 and the second PCB board 12 are provided with connection holes 5; the connection holes 5 of the first PCB board 11 and the connection holes 5 of the second PCB board 12 are arranged opposite to each other; a metal layer is provided on the inner wall of the connection hole 5.
[0040] As an example, both the first PCB board 11 and the second PCB board 12 are provided with connection holes 5. The connection holes 5 of the first PCB board 11 and the connection holes 5 of the second PCB board 12 are arranged opposite to each other, and can cooperate to form a through-hole connecting the first PCB board 11 and the second PCB board 12. Metal layers are evenly distributed on the inner walls of the two connection holes 5, and these metal layers are used to form an electrical connection between the first PCB board 11 and the second PCB board 12. Figure 1As shown, the connecting hole 5 can be located at the edge corner of the first PCB board 11 and the second PCB board 12, forming an inwardly recessed arc-shaped chamfer at the edge corner of the first PCB board 11 and the second PCB board 12. Alternatively, the connecting hole 5 can also be located within the surface of the first PCB board 11 and the second PCB board 12. When the connecting hole 5 is located at the edge corner of the first PCB board 11 and the second PCB board 12, the size of the connecting hole 5 can reach 0.3mm or more, facilitating the processing and forming of the connecting hole 5.
[0041] In one embodiment, a connection line is provided on the substrate 1; the connection line is connected to the photosensitive chip 2 and the decoding chip 3.
[0042] As an example, the substrate 1 is provided with connection lines, including a first connection line for connecting the decoding chip 3 and the photosensitive wafer 2, so that the decoding chip 3 and the photosensitive wafer 2 are electrically connected through the connection line. The connection line may also include a second connection line for connecting the decoding chip 3 and an external device, so that the decoding chip 3 can output the sensing signal to the external device. The connection line may also include a third connection line for connecting the power supply to the decoding chip 3, so as to supply power to the decoding chip 3. During the operation of the infrared receiving module, the photosensitive wafer 2 can convert the received infrared light signal into an electrical signal and transmit it to the decoding chip 3 through the connection line, so that the decoding chip 3 processes the electrical signal to form a sensing signal, and transmits it to the external device through the connection line.
[0043] In one embodiment, the decoding chip 3 is fixedly mounted on the substrate 1 with conductive adhesive or insulating adhesive, and the decoding chip 3 is electrically connected to the connection line through the bonding wire 6.
[0044] As an example, the connection circuit includes metal leads disposed in the substrate 1 and metal pins disposed on the surface of the substrate 1 and connected to the metal leads. The decoding chip 3 is fixedly connected to the bottom of the groove 41 by conductive adhesive or insulating adhesive, and is connected to the metal pins by bonding wire 6 to form an electrical connection with the metal pins, and is connected to the photosensitive chip 2 or external device or power supply by the metal leads.
[0045] In one embodiment, the photosensitive chip 2 is fixedly mounted on the substrate 1 with conductive adhesive and electrically connected to the connection lines through the conductive adhesive; or, the photosensitive chip 2 is fixedly mounted on the substrate 1 with solder paste and electrically connected to the connection lines through the solder paste.
[0046] As an example, the photosensitive chip 2 can be disposed on the shoulder of the groove 42 by flip-chip bonding, fixedly connected to the substrate 1 by conductive adhesive, and electrically connected to the metal pins by conductive adhesive, and connected to the decoding chip 3 by metal leads. Alternatively, the photosensitive chip 2 can be fixedly connected to the substrate 1 by solder paste, and electrically connected to the metal pins by solder paste.
[0047] In one embodiment, the infrared receiving module further includes a protective encapsulation layer 7, which covers the photosensitive chip 2 and the decoding chip 3.
[0048] As an example, the infrared receiving module also includes a protective encapsulation layer 7, which can be made of silicone, silicone resin, epoxy resin, etc. This protective encapsulation layer 7 is disposed together with the photosensitive chip 2 and the decoding chip 3 on one side of the substrate 1, and covers the photosensitive chip 2 and the decoding chip 3, thus providing encapsulation and protection for them.
[0049] In one embodiment, substrate 1 is an opaque substrate.
[0050] As an example, substrate 1 is an opaque substrate used to isolate external light and prevent external light from interfering with the signal of decoding chip 3.
[0051] This utility model provides an electronic device, including the infrared receiving module described in the above embodiments.
[0052] As an example, the electronic device includes the infrared receiving module described in the example above. This infrared receiving module employs a substrate 1 with a groove structure 4, and a decoding chip 3 is disposed at the bottom 41 of the groove, so that the photosensitive chip 2 and the decoding chip 3 are arranged vertically overlapping each other. This saves layout space and reduces the size of the infrared receiving module. Simultaneously, the photosensitive chip 2 also serves to shield the decoding chip 3 from interference signals, eliminating the need for an additional shielding structure and further reducing the size of the infrared receiving module.
[0053] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.
Claims
1. An infrared receiving module, characterized in that, Includes substrate, photosensitive chip, and decoding chip; The substrate has a groove structure along a first direction, and the groove structure includes a groove bottom and a groove shoulder; The decoding chip is connected to the bottom of the groove, and the photosensitive wafer is connected to the shoulder of the groove; The projection of the photosensitive wafer in the first direction completely covers the projection of the decoding chip in the first direction.
2. The infrared receiving module according to claim 1, characterized in that, The substrate includes a first PCB board and a second PCB board disposed on the first PCB board; Through holes are provided on the second PCB board; The first PCB board is positioned opposite to the through hole to form the bottom of the groove, and the second PCB board forms the shoulder of the groove, which is located around the through hole.
3. The infrared receiving module according to claim 1, characterized in that, The substrate includes a first PCB board and two second PCB boards spaced apart on the first PCB board; The gap between the first PCB board and the two second PCB boards is arranged opposite to each other to form the bottom of the groove, and the side of the two second PCB boards away from the first PCB board cooperates with each other to form the shoulder of the groove.
4. The infrared receiving module according to claim 2 or 3, characterized in that, Both the first PCB board and the second PCB board are provided with connection holes; The connection holes of the first PCB board are positioned opposite to the connection holes of the second PCB board; A metal layer is provided on the inner wall of the connection hole.
5. The infrared receiving module according to claim 1, characterized in that, The substrate is provided with connection lines; The connection line is connected to the photosensitive wafer and the decoding chip.
6. The infrared receiving module according to claim 5, characterized in that, The decoding chip is fixedly mounted on the substrate using conductive or insulating adhesive, and the decoding chip is electrically connected to the connection circuit via bonding wires.
7. The infrared receiving module according to claim 5, characterized in that, The photosensitive chip is fixedly mounted on the substrate by conductive adhesive and electrically connected to the connection line through the conductive adhesive. Alternatively, the photosensitive chip is fixedly mounted on the substrate using solder paste and electrically connected to the connection lines via the solder paste.
8. The infrared receiving module according to claim 1, characterized in that, It also includes a protective encapsulation layer that covers the photosensitive wafer and the decoding chip.
9. The infrared receiving module according to claim 1, characterized in that, The substrate is an opaque substrate.
10. An electronic device, characterized in that, Includes the infrared receiving module as described in any one of claims 1-9.