Fast-cooling integrated combined type assembled rectifier bridge device

Abstract

The utility model discloses a quick-cooling integrated combined type assembled rectifier bridge device, relates to the technical field of water cooling plates, and aims to solve the problem that a single-face heat dissipation and cooling effect of a single-plate type water cooling plate is poorer. The quick-cooling integrated combined type assembled rectifier bridge device comprises an integrated water collecting tank and two heat dissipation plates, the two heat dissipation plates and the water collecting tank are arranged in a U shape, and the water collecting tank and the two heat dissipation plates are arranged in a U shape. A water inlet cavity and a water outlet cavity are formed in the water collecting tank, a water inlet is formed in the top of the water inlet cavity, a water outlet is formed in the top of the water outlet cavity, a water inlet runner and a water outlet runner are arranged in the heat dissipation plate, and the ends, away from the water collecting tank, of the water inlet runner and the water outlet runner are communicated. The water inlet flow channel is communicated with the water inlet cavity, and the water outlet flow channel is communicated with the water outlet cavity.

Description

Technical Field

[0001] This utility model relates to the technical field of water-cooled plates, specifically to a fast-cooling integrated modular rectifier bridge device. Background Technology

[0002] Semiconductor water-cooled plates are a core component for heat dissipation in modern high-power-density electronic devices, especially widely used in CPUs, GPUs, AI accelerator cards, power semiconductors, lasers, high-power LEDs, and data center equipment. Their core function is to utilize the efficient heat exchange capabilities of water or water-based coolants to remove the enormous heat generated during semiconductor device operation, ensuring the devices operate within a safe temperature range and maintaining their performance, stability, and lifespan.

[0003] Currently, most water-cooled plates are single-plate types. To improve cooling performance, the only solution is to increase the number of plates, which requires a large space and limits applications, as they can only cool one side and have poor cooling efficiency. Furthermore, the existing rectifier bridge is welded to the base plate before being mounted on the water-cooled plate, increasing the base plate's thermal resistance and further contributing to poor cooling performance. Utility Model Content

[0004] To address the aforementioned problem of poor cooling performance due to single-sided heat dissipation in single-plate water-cooled plates, this invention proposes a fast-cooling integrated modular rectifier bridge device. This device includes a water-cooling body comprising an integrated water collection tank and two heat dissipation plates arranged in a U-shape with the water collection tank. Rectifiers are welded to the outer surfaces of the two heat dissipation plates. The water collection tank contains an inlet chamber and an outlet chamber. The inlet chamber has an inlet port (1111) at its top, and the outlet chamber has an outlet port at its top. The heat dissipation plates contain inlet and outlet channels, connected at the ends opposite to the water collection tank. The inlet channel communicates with the inlet chamber, and the outlet channel communicates with the outlet chamber.

[0005] A further feature of this invention is that four inlet channels and four outlet channels are provided, with the four inlet channels and the four outlet channels arranged symmetrically about the center line of the wide side of the heat sink.

[0006] A further feature of this invention is that an intermediate plate is connected to the middle position of the bottom of the water collection tank, and an inlet channel and an outlet channel are provided in the intermediate plate; a water supply port is opened at the bottom of the inlet cavity corresponding to the intermediate plate, and a water return port is opened at the bottom of the outlet cavity corresponding to the intermediate plate; the inlet channel in the intermediate plate is connected to the water supply port, and the outlet channel in the intermediate plate is connected to the water return port.

[0007] A further feature of this invention is that a splicing circuit is detachably connected to the intermediate board.

[0008] A further feature of this invention is that splicing circuits are provided on both sides of the intermediate plate.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. By directly welding the rectifier to the heat sink, the need for a mounting base plate can be eliminated, further reducing the thermal resistance caused by the base plate and further improving the cooling effect.

[0011] 2. By arranging the two heat sinks and the water collection tank in a U-shape, the semiconductor device can be cooled simultaneously from both sides, thereby improving its cooling effect. Since the two heat sinks are integrated, installation is more convenient, eliminating the need to install individual heat sinks separately. Furthermore, installing an intermediate plate further enhances the cooling effect and increases the heat dissipation capacity. Attached Figure Description

[0012] Figure 1 A schematic diagram of the structure of this utility model is shown.

[0013] Figure 2 A schematic diagram of the water-cooled body is shown.

[0014] Figure 3 A schematic diagram of the internal structure of the heat sink is shown. Figure 1 .

[0015] Figure 4 A schematic diagram of the internal structure of the heat sink is shown. Figure 2 .

[0016] Figure 5 It shows Figure 2 A cross-sectional view along the AA direction.

[0017] Figure 6 It shows Figure 2 A cross-sectional view along the BB direction.

[0018] Figure 7 A schematic diagram of the structure without the intermediate plate installed is shown.

[0019] Reference numerals in the attached diagram: 1. Water-cooled body; 11. Water collection tank; 111. Water inlet chamber; 1111. Water inlet; 1112. Water supply port; 112. Water outlet chamber; 1121. Water outlet; 1122. Water return port; 12. Heat sink; 13. Intermediate plate; 2. Water inlet channel; 3. Water outlet channel; 4. Rectifier; 5. Connecting circuit. Detailed Implementation

[0020] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0021] refer to Figure 1 This utility model proposes a fast-cooling integrated modular rectifier bridge device, including a water-cooled body 1. The water-cooled body 1 includes an integrated water collection tank 11 and two heat dissipation plates 12. The two heat dissipation plates 12 and the water collection tank 11 are arranged in a U-shape. The water collection tank 11 is provided with an inlet chamber 111 and an outlet chamber 112. The inlet chamber 111 and the outlet chamber 112 are not connected to each other.

[0022] A rectifier 4 is welded to the outer surface of each of the two heat sinks 12. That is, the rectifier 4 is directly welded to the heat sink 12. Compared with the prior art, it eliminates the need to use a base plate to connect the rectifier 4 to the heat sink 12, further reducing the thermal resistance caused by the base plate.

[0023] refer to Figure 2 , 3 The top of the water inlet chamber 111 is provided with a water inlet 1111, which is connected to a water inlet pipe for injecting cooling water into the water inlet chamber 111. The top of the water outlet chamber 112 is provided with a water outlet 1121, which is connected to a water outlet pipe for discharging the cooled water from the water collection tank 11.

[0024] The heat sink 12 is provided with four water inlet channels 2 and four water outlet channels 3. The four water inlet channels 2 and four water outlet channels 3 are symmetrically arranged about the center line of the wide side of the heat sink 12, and the ends of the four water inlet channels 2 and four water outlet channels 3 that are away from the water collection tank 11 are interconnected.

[0025] The top ends of the four inlet channels 2 are connected to the inlet chamber 111, allowing cooling water in the inlet chamber 111 to flow into the four inlet channels 2. The top ends of the four outlet channels 3 are connected to the outlet chamber 112, allowing cooling water in the inlet channels 2 to flow from the bottom of the device into the inlet and outlet channels 3, then along the outlet channels 3 into the inlet and outlet chamber 112, and finally discharged from the outlet 1121 on the outlet chamber 112. This facilitates the flow of cooling water within the heat dissipation plate 12, further allowing the cooling water to carry away heat from the areas it passes through, thus achieving a cooling effect.

[0026] The semiconductor device is mounted between two heat sinks 12, which can simultaneously dissipate heat from the semiconductor device, further improving the cooling effect.

[0027] A middle plate 13 is bolted to the middle position of the bottom of the water collection tank 11. The middle plate 13 is also provided with three water inlet channels 2 and three water outlet channels 3. The three water inlet channels 2 and three water outlet channels 3 are symmetrically arranged about the center line of the wide side of the middle plate 13.

[0028] refer to Figure 4 , 5 The bottom of the water inlet chamber 111 is provided with a water supply port 1112 corresponding to the middle plate 13, and the bottom of the water outlet chamber 112 is provided with a water return port 1122 corresponding to the middle plate 13. The water inlet channel 2 in the middle plate 13 is connected to the water supply port 1112, and the water outlet channel 3 in the middle plate 13 is connected to the water return port 1122, so that the coolant can also flow in the middle plate 13.

[0029] Threaded holes are provided on both sides of the intermediate plate 13. The threaded holes do not penetrate the intermediate plate 13. The splicing circuit 5 is detachably connected to the intermediate plate 13 through the threaded holes. The splicing circuit 5 does not have an RC protection circuit or an electromagnetic interference protection circuit. Since the splicing circuit 5 is detachably connected to the threaded holes by bolts, different splicing circuits 5 can be replaced on the intermediate plate 13, that is, replaced according to the use needs. The water flow in the intermediate plate 13 can achieve the cooling effect of the splicing circuit 5. Furthermore, it can not only replace different splicing circuits 5, but also achieve the purpose of cooling the splicing circuit 5.

[0030] refer to Figure 6 It should be noted that the intermediate plate 13 should be installed according to the usage requirements. If the intermediate plate 13 is not required, the water supply port 1112 and the water return port 1122 can be sealed with rubber plugs.

[0031] In summary, this invention, by arranging the two heat sinks 12 and the water collection tank 11 in a U-shape, achieves simultaneous heat dissipation from both sides of the semiconductor device, thereby improving its cooling effect. Furthermore, since the two heat sinks 12 are integrated, installation is more convenient, eliminating the need to install each individual heat sink 12 separately. Simultaneously, the installation of the intermediate plate 13 further enhances the cooling effect and increases the heat dissipation capacity.

[0032] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0033] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0036] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A fast-cooling integrated modular rectifier bridge device, characterized in that: The system includes a water-cooled body (1), which includes an integrated water collection tank (11) and two heat dissipation plates (12). The two heat dissipation plates (12) are arranged in a U-shape with the water collection tank (11). Rectifiers (4) are welded to the outer surfaces of the two heat dissipation plates (12). The water collection tank (11) is provided with an inlet chamber (111) and an outlet chamber (112). The top of the inlet chamber (111) is provided with an inlet (1111), and the top of the outlet chamber (112) is provided with an outlet (1121). The heat dissipation plates (12) are provided with an inlet channel (2) and an outlet channel (3). The inlet channel (2) and the outlet channel (3) are connected at one end away from the water collection tank (11). The inlet channel (2) is connected to the inlet chamber (111), and the outlet channel (3) is connected to the outlet chamber (112).

2. The fast-cooling integrated modular rectifier bridge device according to claim 1, characterized in that: The water inlet channel (2) is provided with four channels, and the water outlet channel (3) is also provided with four channels. The four water inlet channels (2) and the four water outlet channels (3) are symmetrically arranged about the center line of the wide side of the heat sink (12).

3. The fast-cooling integrated modular rectifier bridge device according to claim 1, characterized in that: The middle position of the bottom of the water collection tank (11) is also connected to an intermediate plate (13). The intermediate plate (13) is provided with an inlet channel (2) and an outlet channel (3). The bottom of the inlet chamber (111) is provided with a water supply port (1112) corresponding to the intermediate plate (13). The bottom of the outlet chamber (112) is provided with a return water port (1122) corresponding to the intermediate plate (13). The inlet channel (2) in the intermediate plate (13) is connected to the water supply port (1112). The outlet channel (3) in the intermediate plate (13) is connected to the return water port (1122).

4. The fast-cooling integrated modular rectifier bridge device according to claim 3, characterized in that: The intermediate board (13) is detachably connected to a splicing circuit (5).

5. The fast-cooling integrated modular rectifier bridge device according to claim 4, characterized in that: Splicing circuits (5) are provided on both sides of the intermediate plate (13).

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