Silicon wafer guiding device and silicon wafer sorting machine

Abstract

The utility model relates to the technical field of silicon wafer conveying and guiding, in particular to a silicon wafer guiding device and a silicon wafer sorting machine, which comprise a silicon wafer conveying mechanism, the silicon wafer conveying mechanism is used for conveying silicon wafers in the y direction, and the head end and the tail end of the silicon wafer conveying mechanism are respectively a first end and a second end. The device further comprises a bottom plate, a belt guide structure and a height adjusting mechanism. The silicon wafer conveying mechanism is arranged on the bottom plate, the belt guide mechanisms are symmetrically arranged on the two sides of the silicon wafer conveying mechanism, the belt guide mechanisms are arranged on the bottom plate through height adjusting mechanisms, and the belt guide mechanisms on the two sides are jointly used for guiding silicon wafers conveyed between the belt guide mechanisms. According to the silicon wafer guiding device, after the guiding belt part is abraded and damaged, the unabraded intact part can be used for many times, so that the service life of the guiding belt is prolonged, and the cost of consumables is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a silicon wafer transmission and guiding technology field, and particularly to a silicon wafer guiding device and a silicon wafer sorting machine. BACKGROUND

[0002] Prior art:

[0003] The traditional sorting machine of the photovoltaic slicing industry mainly adopts a motor-driven belt guiding mode and a rubber wheel clamping mode to guide the silicon wafer.

[0004] The motor-driven belt mode: the guiding mode is that a servo motor drives a belt to guide, and the main components include a guide wheel, a Teflon belt, a servo motor, a shaft rod, etc. In operation, the motor is fixed with the guide wheel, the guide wheel drives the belt to keep rotating, the two belts are kept horizontal, the shaft rod keeps the position of the belt so that the center of the silicon wafer and the belt are in contact, and the silicon wafer is naturally guided to flow to the next detection process due to the action of the belt.

[0005] The rubber wheel clamping mode: the guiding mode is that a servo motor reverses a lead screw to drive a guide wheel to clamp and guide, and the main components include a small guide wheel, a lead screw, a servo motor, a fixing piece, etc. In operation, when the silicon wafer passes through an inductor, the inductor transmits the model to the servo motor, the servo motor reverses the small guide wheel to clamp when the silicon wafer enters the guiding mechanism, the silicon wafer is guided to keep 1 millisecond, the servo motor reverses the small guide wheel to release, and the silicon wafer flows to the next detection process.

[0006] Disadvantages of the prior art:

[0007] When the motor-driven belt mode is used to guide the silicon wafer, the belt consumption is large, the cost is high, the belt friction fixed part is penetrated in 1-2 months, and the belt cannot be used again.

[0008] When the rubber wheel clamping mode is used to guide the silicon wafer, it is easy to be damaged and not wear-resistant, the use cycle is short, the clamping action is not continuous, the production capacity is very limited, the requirement for the operator is relatively high, and the operator time is wasted to reduce the overall efficiency. Utility model content

[0009] The utility model aims at providing a silicon wafer guiding device, which can use the un-worn intact part multiple times after the guiding belt part is worn out and damaged, so as to prolong the service life of the guiding belt and reduce the cost of consumables.

[0010] Another purpose of the utility model is to provide a silicon wafer sorting machine, which can use the un-worn intact part multiple times after the guiding belt part is worn out and damaged through the silicon wafer guiding device, so as to prolong the service life of the guiding belt and reduce the cost of consumables.

[0011] The technical scheme of the utility model is implemented as follows:

[0012] A silicon wafer guiding device, comprising a silicon wafer conveying mechanism for conveying silicon wafers in a y direction, a first end and a second end at a head end and a tail end of the silicon wafer conveying mechanism respectively, a base plate, a belt guiding structure and an adjusting mechanism;

[0013] The silicon wafer conveying mechanism is arranged on the base plate, the belt guiding structure is symmetrically arranged on both sides of the silicon wafer conveying mechanism, and the belt guiding structure is arranged on the base plate through the adjusting mechanism, and the belt guiding structures on both sides are used for guiding the silicon wafers conveyed therebetween.

[0014] Further, the belt guiding structure comprises a mounting plate, a guiding guide wheel, a flared guide wheel, a tensioning guide wheel and a belt.

[0015] The flared guide wheel, the tensioning guide wheel and the guiding guide wheel are respectively installed on the mounting plate through an axle, and the flared guide wheel is closer to the first end than the guiding guide wheel.

[0016] The guiding guide wheel, the flared guide wheel and the tensioning guide wheel are collectively covered with the belt, and the tensioning guide wheel is located between the guiding guide wheel and the flared guide wheel for tensioning the belt.

[0017] The distance between the guiding guide wheels on both sides of the silicon wafer conveying mechanism is L1, the distance between the tensioning guide wheels on both sides of the silicon wafer conveying mechanism is L2, and the distance between the flared guide wheels on both sides of the silicon wafer conveying mechanism is L3, satisfying L1=L2<L3.

[0018] Further, the mounting plate is parallel to the silicon wafers on the silicon wafer conveying mechanism, and the axles of the guiding guide wheel, the flared guide wheel and the tensioning guide wheel are respectively perpendicular to the mounting plate.

[0019] Further, the silicon wafer conveying mechanism is horizontally arranged for moving the silicon wafers in the y direction on a horizontal plane.

[0020] The mounting plate is horizontally arranged, and the length direction of the mounting plate is the y direction.

[0021] Further, the belt has a guiding segment and a flared segment, the two ends of the guiding segment are respectively in contact with the tensioning guide wheel and the guiding guide wheel, the two ends of the flared segment are respectively in contact with the flared guide wheel and the tensioning guide wheel, the guiding segments on both sides of the silicon wafer conveying mechanism are parallel to each other with a distance L4, the width of the silicon wafer in the x direction is L5, and 0≤L4-L5≤5mm is satisfied.

[0022] Further, at least two height adjusting mechanisms are arranged below the belt guiding structure.

[0023] The height adjusting mechanism comprises a support rod and an axial limiting structure, the lower part of the support rod is a round rod part, and the upper part of the support rod is a screw rod part.

[0024] A plurality of threaded holes are formed in the mounting plate, the threaded holes are arranged in one-to-one correspondence with the support rods, and the screw rod parts of the support rods are threadedly connected with the threaded holes.

[0025] A plurality of through holes are formed in the bottom plate, the round rod parts of the support rods are arranged in the through holes, and the axial limiting structure is arranged at the corner of the round rod part and the bottom plate, so as to axially limit the support rod.

[0026] Further, the axial limiting structure is an axial limiting clamp, the axial limiting clamp has a notch and is in the shape of a lunula, and the central hole of the axial limiting clamp is used for penetrating the support rod.

[0027] The axial limiting clamp is provided with a fastening threaded hole and a through hole penetratingly formed in the horizontal direction, the fastening threaded hole is coaxially arranged with the through hole, a fastening bolt is arranged in the through hole, the screw rod of the fastening bolt penetrates the through hole, the notch and is threadedly connected with the fastening threaded hole in sequence, and the support rod is locked by deforming the axial limiting clamp by tightening the fastening bolt.

[0028] A plurality of bolt holes are formed in the axial limiting clamp in the z direction, and a connecting bolt is arranged in the bolt holes to be bolted with the bottom plate.

[0029] Further, a bearing is arranged in the through hole, and the round rod part is rotatably connected with the bottom plate through the bearing.

[0030] Further, the through hole is a counter-sunk hole, the upper part and the lower part of the counter-sunk hole are thick-diameter holes and thin-diameter holes respectively, and the bearing is correspondingly arranged in the thick-diameter hole.

[0031] A silicon wafer sorting machine comprises the silicon wafer guiding device.

[0032] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0033] The silicon wafer is conveyed along the y direction between two symmetrical silicon wafer guiding structures, and the silicon wafer is limited in the width direction (x direction) and guided by the joint action of the belts of the belt guiding mechanisms on the two sides. When the belt of the belt guiding mechanism is worn, a worn part and an intact part are formed, the height of the belt can be changed by the height adjusting mechanism so that the silicon wafer corresponds to the intact part of the belt, and thus the belt can be used for multiple times after being worn, the service life of the belt is prolonged, and the cost of consumables is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0035] Figure 1 It is a perspective view of the silicon wafer guiding device of the present application;

[0036] Figure 2 It is a top view of the silicon wafer guiding device of the present application;

[0037] Figure 3 It is a side view of the silicon wafer guiding device of the present application;

[0038] Figure 4 It is a rear view of the silicon wafer guiding device of the present application;

[0039] Figure 5 It is a perspective view of the axial limiting clamp of the present application;

[0040] Figure 6 It is a top view of the axial limiting clamp of the present application.

[0041] In the drawings:

[0042] 1-silicon wafer conveying mechanism; 101-first end; 102-second end;

[0043] 2-belt guiding mechanism; 201-mounting plate; 202-guiding guide wheel; 203-tensioning guide wheel; 204-flared guide wheel; 205-belt; 2051-guiding section; 2052-flared section;

[0044] 3-height adjusting mechanism; 301-supporting rod; 3011-screw part; 3012-round rod part;

[0045] 302-axial limiting clamp; 3021-notch; 3022-fastening bolt; 3023-bolt hole;

[0046] 4 - base plate; 5 - silicon wafer. DETAILED DESCRIPTION

[0047] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0049] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0050] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0051] In addition, the terms "horizontal", "vertical", "overhang" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0052] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0053] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0054] Example 1

[0055] Reference Figures 1-6 This embodiment provides a silicon wafer alignment device, including a silicon wafer conveying mechanism 1. The silicon wafer conveying mechanism 1 is used to convey silicon wafers 5 in the y-direction. The first end and the second end of the silicon wafer conveying mechanism 1 are a first end 101 and a second end 102, respectively. The specific structure of the silicon wafer conveying mechanism 1 is as follows: Figure 1 As shown, this belongs to the prior art and will not be described in detail here. The silicon wafer conveying mechanism 1 can convey wafers at an angle or at a horizontal angle. The angle conveying method includes two types: angled upward and angled downward. Regardless of which conveying method the silicon wafer conveying mechanism 1 adopts, the conveying direction of the silicon wafer 5 is defined as the y-direction, and the dimension of the silicon wafer 5 in the y-direction is defined as its length, and the dimension in the width direction is defined as the x-direction, and the dimension in the thickness direction is defined as the z-direction, so as to propose a spatial rectangular coordinate line oxyz.

[0056] The silicon wafer alignment device also includes a base plate 4, a belt alignment mechanism 2, and a height adjustment mechanism 3;

[0057] A silicon wafer conveying mechanism 1 is provided on the base plate 4. Belt guiding mechanisms 2 are symmetrically arranged on both sides of the silicon wafer conveying mechanism 1. The belt guiding mechanisms 2 are set on the base plate 4 through the height adjustment mechanism 3. The belt guiding mechanisms 2 on both sides are used together to guide the silicon wafers 5 conveyed between them.

[0058] Specifically, the belt guiding mechanism 2 in this embodiment includes a mounting plate 201, a guiding wheel 202, a flared guiding wheel 204, a tensioning guiding wheel 203, and a belt 205;

[0059] The flared guide wheel 204, the tension guide wheel 203, and the straightening guide wheel 202 are respectively mounted on the mounting plate 201 via wheel axles, and the flared guide wheel 204 is closer to the first end 101 than the straightening guide wheel 202;

[0060] The common belt 205 is wrapped on the guide straightening wheel 202, the flared guide wheel 204 and the tensioning guide wheel 203, and the tensioning guide wheel 203 is located between the guide straightening wheel 202 and the flared guide wheel 204, and is used for tensioning the belt 205;

[0061] The distance between the guide straightening wheels 202 on both sides of the silicon wafer conveying mechanism 1 is L1, the distance between the tensioning guide wheels 203 on both sides of the silicon wafer conveying mechanism 1 is L2, and the distance between the flared guide wheels 204 on both sides of the silicon wafer conveying mechanism 1 is L3, and L1=L2<L3 is met.

[0062] The guide straightening wheel 202, the flared guide wheel 204 and the tensioning guide wheel 203 are the same in structure and model, as shown in Figure 1 and Figure 2 The guide straightening wheel 202, the flared guide wheel 204 and the tensioning guide wheel 203 are the same in structure and model, as shown in

[0063] The guide straightening wheel 202, the flared guide wheel 204 and the tensioning guide wheel 203 can not be driven by a driving mechanism, but can be self-rotated by the contact friction between the silicon wafer 5 and the belt 205, or a driving mechanism can be arranged, and the driving mechanism includes a driving motor and a transmission belt (this way of driving the belt 205 by the motor belongs to the prior art, and is not shown in the figure), and the driving motor is in transmission connection with the rotating shaft of the guide straightening wheel 202 or the flared guide wheel 204 through the transmission belt. Under normal conditions, the driving mechanism is arranged on each of the belt straightening mechanisms 2 on both sides, and the driving motors on both sides are synchronously operated to drive the belt 205 to rotate counterclockwise (as shown in Figure 2 ); preferably, the rotating speed of the belt 205 is less than the conveying speed of the silicon wafer conveying mechanism 1, so as to facilitate the silicon wafer 5 to slowly enter and protect the silicon wafer 5, and more facilitate the silicon wafer 5 to be straightened.

[0064] There are two design ways between the mounting plate 201 and the silicon wafer 5 on the silicon wafer conveying mechanism 1, which are parallel and non-parallel. Preferably, the mounting plate 201 is parallel to the silicon wafer 5 on the silicon wafer conveying mechanism 1, and the wheel shafts of the guide straightening wheel 202, the flared guide wheel 204 and the tensioning guide wheel 203 are perpendicular to the mounting plate 201. Such design makes the surface where the belt 205 of the silicon wafer guide straightening structure is located parallel to the silicon wafer 5, so that when the belt 205 contacts the silicon wafer 5, the belt 205 does not exert an inclined upward or downward force on the silicon wafer 5, but only exerts a horizontal backward force on the silicon wafer 5, which is beneficial to the stability of the silicon wafer 5 conveying and does not cause the silicon wafer 5 to be lifted or damaged.

[0065] In the embodiment, the silicon wafer conveying mechanism 1 is horizontally arranged to drive the silicon wafer 5 to move in the y direction in the horizontal plane; and the mounting plate 201 is also horizontally arranged, and the length direction of the mounting plate 201 is the y direction. The bottom plate 4 is also horizontally arranged.

[0066] The belt 205 has a guide straightening section 2051 and a flared section 2052, the two ends of the guide straightening section 2051 contact the tensioning guide wheel 203 and the guide straightening wheel 202 respectively, and the two ends of the flared section 2052 contact the flared guide wheel 204 and the tensioning guide wheel 203 respectively. The guide straightening sections 2051 on the two sides of the silicon wafer conveying mechanism 1 are parallel to each other and the distance therebetween is L4, the width of the silicon wafer 5 in the x direction is L5, and the following condition is satisfied: 0≤L4-L5≤5mm. Preferably, L4-L5=1mm, that is, the gap between L4 and L5 is designed to be 1mm. The region between the guide straightening sections 2051 on the two sides is a guide straightening region, and the region between the flared sections 2052 on the two sides is a flared region, which is used to facilitate the silicon wafer 5 to enter the guide straightening region, and the silicon wafer 5 is guided after entering the guide straightening region through the guide straightening sections 2051 on the two sides.

[0067] The belt 205 can be a Teflon belt 205.

[0068] At least two height adjusting mechanisms 3 are arranged below the belt guide straightening mechanism 2, and in the embodiment, the bottom of each mounting plate 201 is provided with a height adjusting mechanism 3, as shown in Figure 1 .

[0069] The height adjusting mechanism 3 comprises a support rod 301 and an axial limiting structure, the lower part of the support rod 301 is a round rod part 3012, and the upper part of the support rod 301 is a screw rod part 3011.

[0070] A plurality of threaded holes are formed in the mounting plate 201, and the threaded holes are arranged one by one corresponding to the support rods 301, and the screw rod part 3011 of the support rod 301 is threadedly connected with the threaded hole.

[0071] The bottom plate 4 is provided with a plurality of through holes, the round rod part 3012 of the support rod 301 is arranged in the through hole, and an axial limiting structure is arranged at the corner of the bottom plate 4 and the round rod part 3012, which is used for limiting the axial position of the support rod 301.

[0072] Specifically, the axial limiting structure is an axial limiting clamp 302, which is provided with a notch 3021 and is in the shape of a ring. The center hole of the axial limiting clamp 302 is used for passing through the support rod 301.

[0073] The axial limiting clamp 302 is provided with a fastening threaded hole and a through hole along the horizontal direction. The fastening threaded hole and the through hole are coaxially arranged. A fastening bolt 3022 is arranged in the through hole. The screw rod of the fastening bolt 3022 passes through the through hole, the notch 3021 and is screwed with the fastening threaded hole in sequence. The axial limiting clamp 302 has good toughness and can be deformed. By tightening the fastening bolt 3022, the axial limiting clamp 302 is deformed, the size of the notch 3021 is reduced, and the support rod 301 is locked.

[0074] A plurality of bolt holes 3023 are arranged on the axial limiting clamp 302 along the z direction. After the support rod 301 is locked, a connecting bolt is arranged in each bolt hole 3023 to be screwed with the bottom plate 4.

[0075] The through hole is a counter-sunk hole. The upper part and the lower part of the counter-sunk hole are thick-diameter holes and thin-diameter holes, respectively. Bearings are arranged in the thick-diameter holes. The structure of the bottom plate 4 below the thick-diameter holes can support the bearings.

[0076] In normal use, the size of the belt 205 in the z direction is greater than the thickness of the silicon wafer 5, and the belt 205 in the z direction can be divided into multiple layers from bottom to top, such as the first layer, the second layer, the third layer, the fourth layer, etc. of the belt 205 from bottom to top, each layer has the same thickness as the belt 205. First, the lowermost part of the belt 205 (i.e. the first layer) is arranged correspondingly with the silicon wafer 5, that is, when the silicon wafer 5 passes through the guide area, it is in contact with the lowermost part (i.e. the first layer) of the belt 205. When the first layer of the belt 205 is worn or damaged, a worn part and an intact part are formed on the belt 205. The worn first layer is the worn part, and the other parts that are not worn are the intact part. When the first layer of the belt 205 is worn, the height of the belt 205 is adjusted downward by the height adjustment mechanism 3, so that the second layer of the belt 205 is correspondingly arranged with the silicon wafer 5. When the second layer of the belt 205 is worn, the height of the belt 205 is adjusted so that the third layer of the belt 205 is correspondingly arranged with the silicon wafer 5. In this way, the belt 205 can be used multiple times, the intact part of the belt 205 is fully utilized, the service life of the belt 205 is prolonged, and the cost of consumables is reduced. When the height of the belt 205 needs to be adjusted, the fastening bolt 3022 on the axial limiting clamp 302 is loosened, and then the screw rod part 3011 of the support rod 301 is screwed to change the height of the belt 205. After adjusting the height of the belt 205, the fastening bolt 3022 on the axial limiting clamp 302 is tightened to position the axis of the support rod 301. During the height adjustment process, the silicon wafer 5 does not need to be stopped, and personnel do not need to stop and disassemble and replace consumables, which does not affect the conveying process of the silicon wafer 5.

[0077] Embodiment 2

[0078] The embodiment provides a silicon wafer guiding device, which is different from the embodiment 1 in that the height adjustment mechanism 3 has a different structure. The height adjustment mechanism 3 is a lifting mechanism, which is not limited to a scissor lifting mechanism (electric scissors), a hydraulic lifting mechanism (hydraulic cylinder), a screw lifting mechanism (such as a ball screw mechanism or a linear module), a rope lifting mechanism (lifting hoist) and other lifting mechanisms that can change the vertical lifting of an object.

[0079] Embodiment 3

[0080] The embodiment provides a silicon wafer sorting machine, which comprises the silicon wafer guiding device. The silicon wafer sorting machine is a device specially used for detecting and sorting silicon wafers 5, and is mainly used in the semiconductor manufacturing industry.

[0081] The technical scheme of the utility model has the advantages of:

[0082] 1. Cost saving

[0083] The traditional method causes about 150-200 belts 205 to be damaged per month, while the new guide wheel mechanism and the belt 205 specification reduce the belt 205 damage to 50 belts within 6 months. The stress points of the belt 205 are changed, the belt 205 becomes more durable, and the belt 205 can be reused after wearing, which greatly reduces the cost.

[0084] 2. Product quality is improved:

[0085] The belt 205 damage frequency is reduced, the production of defective products is reduced, and the product quality is improved.

[0086] 3. Personnel efficiency is improved:

[0087] The belt 205 does not need to be frequently replaced, and the overall production efficiency is improved.

[0088] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0089] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A silicon wafer guiding device, comprising a silicon wafer conveying mechanism (1) for conveying a silicon wafer (5) in a y direction, a first end (101) and a second end (102) at a leading end and a trailing end of the silicon wafer conveying mechanism (1) respectively, characterized in that, It also includes a bottom plate (4), a belt guiding mechanism (2) and an adjusting mechanism (3); The silicon wafer conveying mechanism (1) is arranged on the bottom plate (4), the belt guiding mechanisms (2) are symmetrically arranged on both sides of the silicon wafer conveying mechanism (1), and the belt guiding mechanisms (2) are arranged on the bottom plate (4) through the adjusting mechanisms (3), and the belt guiding mechanisms (2) on both sides are used for guiding the silicon wafer (5) conveyed therebetween.

2. The silicon wafer guiding device according to claim 1, characterized in that The belt guiding mechanism (2) comprises a mounting plate (201), a guiding guide wheel (202), an expanding guide wheel (204), a tensioning guide wheel (203) and a belt (205); The expanding guide wheel (204), the tensioning guide wheel (203) and the guiding guide wheel (202) are respectively arranged on the mounting plate (201) through shafts, and the expanding guide wheel (204) is closer to the first end (101) than the guiding guide wheel (202); The guiding guide wheel (202), the expanding guide wheel (204) and the tensioning guide wheel (203) are collectively covered by the belt (205), and the tensioning guide wheel (203) is located between the guiding guide wheel (202) and the expanding guide wheel (204) and is used for tensioning the belt (205); The distance between the guiding guide wheels (202) on both sides of the silicon wafer conveying mechanism (1) is L1, the distance between the tensioning guide wheels (203) on both sides of the silicon wafer conveying mechanism (1) is L2, and the distance between the expanding guide wheels (204) on both sides of the silicon wafer conveying mechanism (1) is L3, and L1=L2 3. The silicon wafer guiding device according to claim 2, characterized in that The mounting plate (201) is parallel to the silicon wafer (5) on the silicon wafer conveying mechanism (1), and the shafts of the guiding guide wheel (202), the expanding guide wheel (204) and the tensioning guide wheel (203) are perpendicular to the mounting plate (201).

4. The silicon wafer guiding device according to claim 3, wherein The silicon wafer conveying mechanism (1) is horizontally arranged and used for driving the silicon wafer (5) to move in the y direction of the horizontal plane; The mounting plate (201) is horizontally arranged, and the length direction of the mounting plate (201) is the y direction.

5. The silicon wafer guiding device according to claim 2, wherein The belt (205) has a guiding section (2051) and an expanding section (2052), the two ends of the guiding section (2051) are respectively in contact with the tensioning guide wheel (203) and the guiding guide wheel (202), the two ends of the expanding section (2052) are respectively in contact with the expanding guide wheel (204) and the tensioning guide wheel (203), the guiding sections (2051) on both sides of the silicon wafer conveying mechanism (1) are parallel to each other and the distance therebetween is L4, the width of the silicon wafer (5) in the x direction is L5, and 0≤L4-L5≤5mm is satisfied.

6. The silicon wafer guiding device according to claim 2, wherein At least two adjusting mechanisms (3) are arranged below the belt guiding mechanism (2); The adjusting mechanism (3) comprises a supporting rod (301) and an axial limiting structure, the lower part of the supporting rod (301) is a round rod part (3012), and the upper part of the supporting rod (301) is a screw rod part (3011). A plurality of threaded holes are formed on the mounting plate (201), and the threaded holes are arranged one-to-one with the support rods (301). Screw portions (3011) of the support rods (301) are threadedly connected with the threaded holes. A plurality of through holes are formed on the bottom plate (4), and round rod portions (3012) of the support rods (301) are arranged in the through holes. The round rod portions (3012) and corners of the bottom plate (4) are provided with axial limiting structures for axially limiting the support rods (301).

7. The silicon wafer guiding device according to claim 6, characterized in that The axial limiting structure is an axial limiting clamp (302) having a notch (3021) and being in the shape of a discoid. A central hole of the axial limiting clamp (302) is used for passing through the support rod (301). The axial limiting clamp (302) is provided with a fastening threaded hole and a through hole along the horizontal direction. The fastening threaded hole is coaxially arranged with the through hole. A fastening bolt (3022) is arranged in the through hole. A screw rod of the fastening bolt (3022) passes through the through hole, the notch (3021) and the fastening threaded hole in sequence and is threadedly connected with the fastening threaded hole. The axial limiting clamp (302) is deformed by tightening the fastening bolt (3022) to lock the support rod (301). A plurality of bolt holes (3023) are formed on the axial limiting clamp (302) along the z direction. The bolt holes (3023) are used for arranging connecting bolts to be bolted with the bottom plate (4).

8. The silicon wafer guiding device according to claim 6, wherein Bearings are arranged in the through holes. The round rod portions (3012) are rotatably connected with the bottom plate (4) through the bearings.

9. The silicon wafer guiding device according to claim 8, characterized in that The through holes are counter-sunk holes. Upper and lower portions of the counter-sunk holes are thick-diameter holes and thin-diameter holes respectively. The bearings are arranged in the thick-diameter holes.

10. A silicon wafer handler characterized by, The silicon wafer guiding device of any one of claims 1-9 is included.

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