Laser post-processing device for additive manufacturing parts and additive manufacturing production line
The laser post-processing device enables fully automated processing of additive manufacturing parts, solving the problems of low efficiency in part separation and support structure removal in existing technologies, improving processing efficiency and quality, and meeting the needs of automated production lines.
Patent Information
- Application Number
- CN202422933901.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing additive manufacturing technologies are inefficient and rely on skilled workers in the process of separating parts and removing support structures, making it difficult to achieve automation and high-quality post-processing.
The entire process is automated using a laser post-processing device, including substrate separation, support removal, and surface polishing. The automated processing of parts is achieved by using laser systems of different powers and a conveying mechanism.
It improves the efficiency and quality of post-processing of additively manufactured parts, reduces reliance on specialized workers, and is suitable for the needs of automated production lines.
Smart Images

Figure CN223557262U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to additive manufacturing field, more specifically, the utility model relates to a kind of laser post-processing device of additive manufacturing parts and additive manufacturing production line. BACKGROUND
[0002] Additive manufacturing technology is a kind of manufacturing technology based on discrete-accumulation principle, with the advantages of high material utilization, rapid prototyping, complex structure lightweight manufacturing etc. Among them, most of the additive manufacturing technology forming parts still need to be built on the substrate, and the complex structure still needs to add support structure. After completing the forming manufacturing, the parts need to be separated from the substrate, and the support structure is removed. However, the current main processes such as wire electrical discharge machining or saw cutting separation, support structure removal, and part polishing post-processing require the participation of professional workers, which is low in efficiency and the post-processing effect for special parts is not ideal. SUMMARY
[0003] The utility model aims to provide a kind of laser post-processing device of additive manufacturing parts and additive manufacturing production line, laser is used to carry out full-process post-processing to additive manufacturing parts, including part substrate separation, support removal, surface polishing etc., directly produce the part meeting the requirements, the whole post-processing full-process realizes automation, improve the post-processing efficiency and quality of additive manufacturing parts, and it is practical.
[0004] In order to achieve these purposes and other advantages according to the utility model, a kind of laser post-processing device of additive manufacturing parts is provided, including conveying mechanism, substrate separation processing mechanism, support removal cutting processing mechanism and surface treatment processing mechanism, the substrate separation processing mechanism, support removal cutting processing mechanism and surface treatment processing mechanism are sequentially arranged along the conveying direction of the conveying mechanism.
[0005] Further, in the laser post-processing device of additive manufacturing parts, the substrate separation processing mechanism includes a substrate separation processing bin and a first laser system, the conveying mechanism has a separation station, and the separation station is located in the substrate separation processing bin and the processing area of the first laser system.
[0006] Further, in the laser post-processing device of additive manufacturing parts, the first laser system includes a camera, a camera lens, a beam splitter, a laser, a scanning galvanometer and a field lens, the laser beam emitted by the laser converges to the separation station of the conveying mechanism through the beam splitter, the scanning galvanometer and the field lens in sequence, and the camera is located on the transmission light path of the beam splitter.
[0007] Further, the laser post-processing device for additive manufacturing parts, the support-removing cutting processing mechanism comprises a support-removing cutting processing bin and a second laser system, the conveying mechanism has a cutting station, and the cutting station is located in the support-removing cutting processing bin and in the processing range of the second laser system.
[0008] Further, the laser post-processing device for additive manufacturing parts, the support-removing cutting processing mechanism further comprises a first grabbing mechanism, and the cutting station and the cutting range of the second laser system are located on the movement track of the first grabbing mechanism.
[0009] Further, the laser post-processing device for additive manufacturing parts, the surface treatment processing mechanism comprises a surface treatment processing bin and a third laser system, the conveying mechanism has a surface treatment station, and the surface treatment station is located in the surface treatment processing bin and in the processing range of the third laser system.
[0010] Further, the laser post-processing device for additive manufacturing parts, the surface treatment processing mechanism further comprises a second grabbing mechanism, and the surface treatment station and the processing range of the third laser system are located on the movement track of the second grabbing mechanism.
[0011] Further, the laser post-processing device for additive manufacturing parts, the third laser system comprises a three-dimensional scanning mechanism for acquiring the image of the surface profile of the processed part.
[0012] Further, the laser post-processing device for additive manufacturing parts, the three-dimensional scanning mechanism is a three-dimensional laser scanner, and the three-dimensional laser scanner is arranged towards the surface treatment station.
[0013] The utility model further provides a kind of additive manufacturing production line, including printing equipment, further include as above laser post-processing device, the feeding end of the conveying mechanism is connected with the printing equipment.
[0014] The utility model has the advantages that:
[0015] The laser post-processing device for additive manufacturing parts of the utility model carries out full-process post-processing to additive manufacturing parts by laser processing mode, and the post-processing process includes part base plate separation, support structure removal and surface polishing treatment, so that processing efficiency and processing quality are higher, the dependence of current additive manufacturing on professional workers can be greatly reduced, manual work is saved, and the device is suitable for automatic production line and meets the needs of industrial development.
[0016] Other advantages, objects, and features of the present application will be apparent to those skilled in the art from the following description of the application, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 The laser post-processing device structure schematic view of the additive manufacturing part of the present application is shown in the figure.
[0018] Figure 2 The structure schematic view of the first laser system of the present application is shown in the figure.
[0019] Figure 3 The structure schematic view of the third laser system of the present application is shown in the figure.
[0020] In the figure, the signs represent:
[0021] The first laser system 1; the camera 101; the camera lens 102; the beam splitter 103; the laser 104; the scanning galvanometer 105; the field lens 106; the second laser system 2; the third laser system 3; the three-dimensional scanning mechanism 301; the conveying mechanism 4; the substrate separation processing bin 5; the support removal cutting processing bin 6; the surface treatment processing bin 7; the first grabbing mechanism 8; the second grabbing mechanism 9; the part 10; the support 11; the substrate 12. DETAILED DESCRIPTION
[0022] The present application will be further described in detail below in conjunction with the embodiments, so that those skilled in the art can implement the present application according to the description.
[0023] It should be noted that in the description of the present application, the terms "transverse", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0024] As Figure 1 shown, the embodiment of the present application provides a laser post-processing device for additive manufacturing parts 10, which comprises a conveying mechanism 4, and a substrate separation processing mechanism, a support removal cutting processing mechanism and a surface treatment processing mechanism arranged in sequence along the conveying direction thereof.
[0025] In this embodiment, after the additive manufacturing is completed, the machined part 10 together with the substrate 12 is placed on the conveying mechanism 4, and when the conveying mechanism 4 drives the part 10 together with the substrate 12 to move to below the substrate separation processing mechanism, the substrate separation processing mechanism starts to work to cut and separate the part 10 and the substrate 12; the separated part 10 and the substrate 12 are moved to below the support removal cutting processing mechanism under the conveying of the conveying mechanism 4, and the support removal cutting processing mechanism starts to work to intelligently identify and cut the support structure of the part 10 until all the supports 11 are removed; the part 10 after the supports 11 are removed is moved to below the processing position of the surface treatment processing mechanism under the conveying of the conveying mechanism 4, and the surface treatment processing mechanism starts to work to perform burr cutting, remelting polishing, and high-brightness polishing on the surface of the part 10. The part 10 after the surface treatment is conveyed to the next sorting process by the conveying mechanism 4. The substrate separation processing mechanism, the support removal cutting processing mechanism, and the surface treatment processing mechanism adopt laser systems with similar basic structures, and the main difference is that the laser systems adopt laser emitters 104 with different powers, so that the powers of the laser systems are different, and the laser systems of the substrate separation processing mechanism, the support removal cutting processing mechanism, and the surface treatment processing mechanism can be a high-power laser system, a small-medium-power laser system, and an ultrafast laser system, respectively.
[0026] Preferably, as another embodiment of the utility model, the substrate separation processing mechanism comprises a substrate separation processing bin 5, and the conveying mechanism 4 has a separation position, which is located in the substrate separation processing bin 5 and also in the processing range of the first laser system 1; the first laser system 1 is arranged in the substrate separation processing bin 5, and the first laser system 1 comprises a camera 101, a camera lens 102, a beam splitter 103, a laser emitter 104, a scanning galvanometer 105, and a field lens 106, and the laser beam emitted by the laser emitter 104 is converged to the separation position of the conveying mechanism 4 in sequence through the beam splitter 103, the scanning galvanometer 105, and the field lens 106, and the camera 101 is located on the transmission light path of the beam splitter 103.
[0027] In this embodiment, after the part 10 together with the substrate 12 on the conveying mechanism 4 moves to below the substrate separation processing bin 5, the part 10 together with the substrate 12 on the conveying mechanism 4 is monitored by the camera 101, and after the part 10 together with the substrate 12 on the conveying mechanism 4 moves to the separation position, the laser emitter 104 starts to work, and the laser beam emitted by the laser emitter 104 is converged to the joint of the part 10 and the substrate 12 on the conveying mechanism 4 in sequence through the beam splitter 103, the scanning galvanometer 105, and the field lens 106 to cut and separate the part 10 and the substrate 12.
[0028] Preferably, as another embodiment of the utility model, the support-removing cutting processing mechanism comprises a support-removing cutting processing bin 6, the second laser system 2 is arranged in the support-removing cutting processing bin 6, the conveying mechanism 4 has a cutting station, the cutting station is located in the support-removing cutting processing bin 6 and simultaneously in the processing interval of the second laser system 2; the support-removing cutting processing mechanism further comprises a first grabbing mechanism 8, the first grabbing mechanism 8 is a mechanical hand, and the cutting station and the cutting area of the second laser system 2 are all located on the moving track of the first grabbing mechanism 8.
[0029] In the embodiment, the second laser system 2 is similar to the first laser system 1 in basic structure, and the main difference is that the laser system adopts a laser 104 with different power, and the laser beam emitted by the laser of the second laser system 2 is converged to the cutting station of the conveying mechanism 4 in turn through a beam splitter, a scanning galvanometer and a field lens; the power of the second laser system 2 is less than that of the first laser system 1.
[0030] After the separated part 10 and the substrate 12 are moved below the support-removing cutting processing bin 6 under the conveying of the conveying mechanism 4, the first grabbing mechanism 8 grabs the part 10 from the cutting station on the conveying mechanism 4, and then moves the part 10 to the laser processing position of the second laser system 2; the second laser system 2 intelligently identifies the support structure of the part 10 and adjusts the cutting parameters according to the printing model of the part 10; the first grabbing mechanism 8 can rotate and adjust the processing position of the part 10 in real time according to the processing instruction of the second laser system 2, until all the supports 11 are removed; the first grabbing mechanism 8 repositions the part 10 from which the supports 11 are removed on the conveying mechanism 4, and the part 10 will continue to be conveyed to the surface treatment processing mechanism.
[0031] Preferably, as another embodiment of the utility model, the surface treatment processing mechanism comprises a surface treatment processing bin 7, the third laser system 3 is arranged in the surface treatment processing bin 7, the conveying mechanism 4 has a surface treatment station, the surface treatment station is located in the surface treatment processing bin 6 and simultaneously in the processing interval of the third laser system 3; the surface treatment processing mechanism further comprises a second grabbing mechanism 9, the second grabbing mechanism 9 is a mechanical hand, and the surface treatment station and the processing area of the third laser system 3 are all located on the moving track of the second grabbing mechanism 9.
[0032] In the embodiment, the third laser system 3 is similar to the first laser system 1 in basic structure, and the main difference is that the laser system adopts a laser 104 with different power, and the power of the third laser system 3 is less than that of the first laser system 1; the laser beam emitted by the laser of the third laser system 3 is converged to the surface treatment station of the conveying mechanism 4 in turn through a beam splitter, a scanning galvanometer and a field lens.
[0033] After the part 10 is removed from the support 11, under the transmission of the transmission mechanism 4, the part 10 is moved to the surface treatment, then the second grabbing mechanism 9 grabs the part 10 from the transmission mechanism 4, and then moves the part 10 to the laser processing position of the third laser system 3, and the surface of the part 10 is processed by the third laser system 3 for burr cutting, remelting polishing and high-brightness polishing, the second grabbing mechanism 9 can rotate and adjust the angle position of the part 10 in real time, so that the part 10 can be effectively processed by the laser on the whole surface, and the part 10 has higher size precision and surface quality. After the surface treatment is completed, the second grabbing mechanism 9 places the part 10 after the surface treatment on the transmission mechanism 4 again, and the part 10 is transmitted to the next sorting process by the transmission mechanism 4.
[0034] Preferably, as another embodiment of the utility model, the third laser system 3 includes a three-dimensional scanning mechanism for acquiring the image of the surface profile of the processed part 10. The three-dimensional scanning mechanism is a three-dimensional laser scanner, and the three-dimensional laser scanner is arranged towards the surface treatment station.
[0035] In this embodiment, the three-dimensional laser scanner is arranged in the surface treatment processing bin 7, the surface profile of the part 10 after the surface treatment is scanned by the three-dimensional laser scanner, and the surface profile detection function is performed. After the laser surface treatment of the part 10 is completed, the size and surface roughness of the processed part 10 are detected in time, and if the requirements for leaving the factory are met, the second grabbing mechanism 9 places the processed part 10 on the transmission mechanism 4, and the processed part 10 is transmitted out of the laser post-processing device for sorting; if the requirements are not met, the laser surface treatment of the part 10 is repeated until the factory standard is met.
[0036] The embodiment of the utility model also provides an additive manufacturing production line, which comprises a printing device, and also comprises the above-mentioned laser post-processing device, and the feeding end of the transmission mechanism 4 is connected with the printing device.
[0037] In this embodiment, the transmission mechanism 4 is connected with the discharging end of the equipment body of the additive manufacturing equipment. The part 10 processed on the additive manufacturing equipment enters the laser post-processing device for processing.
[0038] Although the embodiments of the utility model have been disclosed as above, they are not limited to the application and the embodiments listed in the specification, and can be fully applied to various fields suitable for the utility model, and other modifications can be easily realized by those skilled in the art, therefore, the utility model is not limited to specific details and the embodiments shown and described herein, without departing from the general concept defined by the claims and the equivalent scope.
Claims
1. A laser post-processing device for additive manufacturing of a part, characterized in that, The laser post-processing device comprises a conveying mechanism, a substrate separation processing mechanism, a support-removing cutting processing mechanism and a surface treatment processing mechanism.
2. A laser post-processing apparatus for additively manufactured parts according to claim 1, characterized in that, The substrate separation processing mechanism comprises a substrate separation processing chamber and a first laser system, and the conveying mechanism has a separation station located in the substrate separation processing chamber and in a processing area of the first laser system.
3. A device for laser post-processing of an additively manufactured part according to claim 2, characterized in that The first laser system comprises a camera, a camera lens, a beam splitter, a laser, a scanning galvanometer and a field lens, and a laser beam emitted by the laser passes through the beam splitter, the scanning galvanometer and the field lens in sequence and converges on the separation station of the conveying mechanism.
4. A laser post-processing apparatus for additively manufactured parts according to claim 1, characterized in that, The support-removing cutting processing mechanism comprises a support-removing cutting processing chamber and a second laser system, and the conveying mechanism has a cutting station located in the support-removing cutting processing chamber and in a processing area of the second laser system.
5. A device for laser post-processing of an additively manufactured part according to claim 4, characterized in that The support-removing cutting processing mechanism further comprises a first grabbing mechanism, and the cutting station and a cutting area of the second laser system are located on a moving track of the first grabbing mechanism.
6. A laser post-processing apparatus for additively manufactured parts according to claim 1, characterized in that, The surface treatment processing mechanism comprises a surface treatment processing chamber and a third laser system, and the conveying mechanism has a surface treatment station located in the surface treatment processing chamber and in a processing area of the third laser system.
7. A device for laser post-processing of an additively manufactured part according to claim 6, characterized in that The surface treatment processing mechanism further comprises a second grabbing mechanism, and the surface treatment station and the processing area of the third laser system are located on a moving track of the second grabbing mechanism.
8. A device for laser post-processing of an additively manufactured part according to claim 6, characterized in that The third laser system comprises a three-dimensional scanning mechanism for acquiring an image of a surface profile of a processed part.
9. A device for laser post-processing of an additively manufactured part according to claim 8, characterized in that The three-dimensional scanning mechanism is a three-dimensional laser scanner, and the three-dimensional laser scanner is arranged towards the surface treatment station.
10. An additive manufacturing production line comprising a printing device, characterized in that, The laser post-processing device further comprises a printing device, and an upper end of the conveying mechanism is connected to the printing device.