Laser mold opening machine with multiple groups of light paths

Abstract

The utility model discloses a laser mould opening machine with multiple groups of light paths, which comprises a doping unit comprising a first laser output mechanism and a doping output mechanism, the first laser output mechanism can output laser beams to a processing position of a workpiece to be processed, and the doping output mechanism is used for conveying a doping medium to the processing position of the workpiece; the doping output mechanism and the first laser output mechanism jointly act on a doping process of the workpiece; the second laser output mechanism is adjacent to the first laser output mechanism, and the second laser output mechanism can output laser beams to the machining position of the workpiece to be machined; the jig is arranged at the laser output ends of the first laser output mechanism and the second laser output mechanism, and the jig is used for fixing a workpiece; and the laser beam output by the first laser output mechanism and the laser beam output by the second laser output mechanism have energy difference.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser mold opening machine technical field, especially a kind of laser mold opening machine with multiple optical paths. BACKGROUND

[0002] In order to improve the conversion efficiency of battery piece, the contact resistance between silicon wafer and electrode needs to be reduced, and the ohmic contact between silicon wafer and electrode needs to be increased. The current common practice is to laser groove on the contact position of silicon wafer and electrode.

[0003] However, in the prior art, the existing mold opening machine only uses one optical path to open the mold, which results in poor mold opening effect. The reason is that some coating materials on the silicon wafer, such as BSG material, require a high-power laser to remove. The mold opening machine with a single optical path can only remove the BSG material by stacking the power of the laser. However, due to the defects of fast attenuation and inconsistent beam quality of high-power lasers, the spot shaping effect is unstable, and the beam needs to be adjusted frequently, which results in high cost of production capacity improvement and single process improvement method. Therefore, the present application proposes a technical solution to solve the above problems. SUMMARY

[0004] The utility model aims at at least one of the technical problems existing in the prior art. To this end, the utility model provides a laser mold opening machine with multiple optical paths, which realizes the processing procedures of doping and grooving by two lasers with different powers, meets the processing requirements of workpieces, effectively improves production efficiency, and integrates laser light sources on the same machine, effectively reducing equipment cost.

[0005] In the first aspect, according to the utility model embodiment, a laser mold opening machine with multiple optical paths comprises:

[0006] The doping unit comprises a first laser output mechanism and a doping output mechanism. The first laser output mechanism can output a laser beam to the processing position of the workpiece to be processed. The doping output mechanism is used to deliver doping medium to the processing position of the workpiece. The doping output mechanism and the first laser output mechanism jointly act on the doping process of the workpiece.

[0007] The second laser output mechanism is adjacent to the first laser output mechanism. The second laser output mechanism can output a laser beam to the processing position of the workpiece to be processed.

[0008] The jig is arranged at the laser output end of the first laser output mechanism and the second laser output mechanism. The jig is used to fix the workpiece.

[0009] The laser beam output by the first laser output mechanism and the laser beam output by the second laser output mechanism have energy difference.

[0010] The laser mold opening machine with multiple groups of light paths has at least the following beneficial effects: the device integration doping and double laser processing are adopted to realize that the doping process and the slotting process of the workpiece surface treatment can be completed on the same device, the production efficiency is effectively improved, and the cost of the device is effectively reduced through the integrated design of the machining mechanism. In addition, the doping process is added before the slotting process of the workpiece, the doping medium is added to the machining position of the workpiece, the first laser output mechanism outputs a high-energy laser beam to the machining position where the doping medium has been added, the surface of the workpiece is pretreated before the slotting process, so that the material at the machining position of the workpiece can be better removed in the slotting process, the machining precision of the workpiece is ensured, and the machining quality of the workpiece is ensured.

[0011] It should be noted that after the doping output mechanism outputs the doping medium to the machining position of the workpiece, the first laser output mechanism simultaneously outputs a laser beam to the position and simultaneously performs surface treatment on the position.

[0012] The laser mold opening machine with multiple groups of light paths has at least the following beneficial effects: the device integration doping and double laser processing are adopted to realize that the doping process and the slotting process of the workpiece surface treatment can be completed on the same device, the production efficiency is effectively improved, and the cost of the device is effectively reduced through the integrated design of the machining mechanism. In addition, the doping process is added before the slotting process of the workpiece, the doping medium is added to the machining position of the workpiece, the first laser output mechanism outputs a high-energy laser beam to the machining position where the doping medium has been added, the surface of the workpiece is pretreated before the slotting process, so that the material at the machining position of the workpiece can be better removed in the slotting process, the machining precision of the workpiece is ensured, and the machining quality of the workpiece is ensured.

[0013] The laser mold opening machine with multiple groups of light paths has at least the following beneficial effects: the device integration doping and double laser processing are adopted to realize that the doping process and the slotting process of the workpiece surface treatment can be completed on the same device, the production efficiency is effectively improved, and the cost of the device is effectively reduced through the integrated design of the machining mechanism. In addition, the doping process is added before the slotting process of the workpiece, the doping medium is added to the machining position of the workpiece, the first laser output mechanism outputs a high-energy laser beam to the machining position where the doping medium has been added, the surface of the workpiece is pretreated before the slotting process, so that the material at the machining position of the workpiece can be better removed in the slotting process, the machining precision of the workpiece is ensured, and the machining quality of the workpiece is ensured.

[0014] The laser mold opening machine with multiple groups of light paths has at least the following beneficial effects: the device integration doping and double laser processing are adopted to realize that the doping process and the slotting process of the workpiece surface treatment can be completed on the same device, the production efficiency is effectively improved, and the cost of the device is effectively reduced through the integrated design of the machining mechanism. In addition, the doping process is added before the slotting process of the workpiece, the doping medium is added to the machining position of the workpiece, the first laser output mechanism outputs a high-energy laser beam to the machining position where the doping medium has been added, the surface of the workpiece is pretreated before the slotting process, so that the material at the machining position of the workpiece can be better removed in the slotting process, the machining precision of the workpiece is ensured, and the machining quality of the workpiece is ensured.

[0015] The laser mold opening machine with multiple groups of light paths has at least the following beneficial effects: the device integration doping and double laser processing are adopted to realize that the doping process and the slotting process of the workpiece surface treatment can be completed on the same device, the production efficiency is effectively improved, and the cost of the device is effectively reduced through the integrated design of the machining mechanism. In addition, the doping process is added before the slotting process of the workpiece, the doping medium is added to the machining position of the workpiece, the first laser output mechanism outputs a high-energy laser beam to the machining position where the doping medium has been added, the surface of the workpiece is pretreated before the slotting process, so that the material at the machining position of the workpiece can be better removed in the slotting process, the machining precision of the workpiece is ensured, and the machining quality of the workpiece is ensured.

[0016] According to the laser mold opening machine with multiple groups of light paths provided in the embodiment of the present application, the light propagation circuit comprises a second light reflecting member, the second light reflecting member conducts the light beam of the first light source to the laser output unit, and the light path switching unit can be located between the second light reflecting member and the laser output unit.

[0017] According to the laser mold opening machine with multiple groups of light paths provided in the embodiment of the present application, the first light source and the second light source are located on two sides of the line connecting the second light reflecting member and the laser output unit.

[0018] According to the laser mold opening machine with multiple groups of light paths provided in the embodiment of the present application, the second light reflecting member, the light path switching unit and the laser output unit are arranged along the horizontal direction.

[0019] According to the laser mold opening machine with multiple groups of light paths provided in the embodiment of the present application, the first laser output mechanism comprises a first box body, the first box body comprises a first box part and a second box part arranged in an L shape, the first box part is provided with the first light source, the second box part is provided with the light path switching unit and the laser output unit, and the second light reflecting member is located at the junction of the first box part and the second box part.

[0020] According to the laser mold opening machine with multiple groups of light paths provided in the embodiment of the present application, the second laser output mechanism comprises a second box body, the second light source is arranged in the second box body, the second box body is provided with a light outlet, and the second box part is provided with a light inlet corresponding to the light outlet.

[0021] The additional aspects and advantages of the present application will be partially given in the following description, some will become obvious from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0023] Fig. 1 FIG. 1 is a structural diagram of a laser mold opening machine with multiple groups of light paths according to an embodiment of the present application;

[0024] Fig. 2 FIG. 2 is a light path diagram of the laser of the laser mold opening machine according to the embodiment of the present application;

[0025] Fig. 3 FIG. 3 is a working structure diagram of the laser mold opening machine with multiple groups of light paths according to the embodiment of the present application.

[0026] FIG. 4 is a schematic diagram of the laser mold opening machine with multiple groups of light paths according to the embodiment of the present application.

[0027] The first light source 100;

[0028] The laser output unit 200;

[0029] Second light source 300;

[0030] Optical path switching unit 400;First light-reflecting piece 410;First sliding seat 420;

[0031] Jig 500;

[0032] Second light-reflecting piece 600;

[0033] First box body 700;First box part 710;Second box part 720;

[0034] Visual positioning unit 800;

[0035] Doped output mechanism 900. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, and are used to explain the present application, and cannot be understood as a limitation of the present application.

[0037] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by the upper, lower, front, rear, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0038] In the description of the present application, the meaning of several is one or more, and the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, and above, below, etc. are understood as including the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0039] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0040] Reference Figs. 1-3The utility model embodiment provides a kind of laser mold opening machine with multiple groups of light path, including doping unit, including first laser output mechanism and doping output mechanism 900, first laser output mechanism can output laser beam to the processing position of workpiece to be processed, doping output mechanism 900 is used to transport doping medium to the processing position of workpiece, and doping output mechanism 900 and first laser output mechanism are jointly used in the doping procedure of workpiece;Second laser output mechanism is adjacent to first laser output mechanism, and second laser output mechanism can output laser beam to the processing position of workpiece to be processed;Jig 500 is arranged at the laser output end of first laser output mechanism and second laser output mechanism, and jig 500 is used to fix workpiece;

[0041] Wherein, the laser beam output by first laser output mechanism and the laser beam output by second laser output mechanism have energy difference.

[0042] Specifically, the laser light source of the application is mainly used for doping and opening mold of silicon wafer.

[0043] The application realizes that doping procedure and slotting procedure of workpiece surface treatment can be completed on the same equipment by equipment integrated doping and double laser processing, effectively improves production efficiency, and effectively reduces the cost of equipment by integrated design of processing mechanism.In addition, doping procedure is added before the slotting procedure of workpiece, doping medium is added to the processing position of workpiece, first laser output mechanism outputs high-energy laser beam to the processing position where doping medium has been added, to pre-treat the surface of workpiece for slotting procedure, so that slotting procedure can better remove the material of processing position of workpiece, ensure the processing accuracy of workpiece and guarantee the processing quality of workpiece.

[0044] Wherein, it should be noted that, after doping output mechanism 900 outputs doping medium on the processing position of workpiece, first laser output mechanism simultaneously outputs laser beam to the position, and simultaneously performs surface treatment on the position.

[0045] Specifically, the doping medium output by doping output mechanism 900 is mainly medium containing boron element.It can be understood that, when the laser beam of first light source 100 is conducted to the processing position of workpiece, doping output mechanism 900 simultaneously transports the processing medium containing boron element to the processing position of workpiece, and after the controllable doping of boron element by the laser beam of first light source 100, the workpiece, since boron atom has only three valence electrons, will form a hole in silicon wafer, so that the workpiece surface is more easily processed by surface slotting under the laser beam of second light source 300, effectively improving production efficiency.

[0046] Optionally, the doping output mechanism 900 can be spray or spot or coating, and the user can select the output mechanism suitable for the current workpiece processing requirements according to the actual situation. Further, since the laser mold opening machine of the present application is provided with two laser light sources, i.e. the first light source 100 and the second light source 300 with output energy, and the first light source 100 and the second light source 300 are respectively used for different processing procedures of the workpiece, after completing the first processing procedure of the workpiece, the second procedure is carried out by switching the laser light source. It can be understood that the user can select to install two lasers on the equipment and switch according to the process flow, but the installation of too many lasers on the equipment can easily lead to complex equipment structure and high equipment cost.

[0047] Therefore, the present application further proposes an optional preferred solution.

[0048] Specifically, the present application can realize the switching use of the two laser light sources through the optical path switching unit 400. By integrating the two laser light sources on the same machine, the two laser light sources are switched in turn to realize that the workpiece can complete the processing procedures in sequence in the same processing station or the same processing equipment, the user does not need to repeatedly switch different equipment according to different processing procedures of the workpiece, effectively improving the production efficiency, and effectively reducing the equipment cost and improving the functional integration of the equipment.

[0049] Optionally, the laser beam energy output by the first light source 100 is higher than the laser beam energy output by the second light source 300. The laser beam of the first light source 100 is used for the doping procedure of the silicon wafer. It can be understood that the first light source 100 outputs high-energy laser beam to the processing position of the workpiece to dope and modify the silicon element and the silicon wafer on the processing position. After the first procedure is completed, the optical path switching unit 400 switches the first light source 100 and the second light source 300, cuts off the first light source 100, and makes the laser beam of the second light source 300 conduct to the processing position of the workpiece which has completed the doping of the silicon element, and processes the silicon wafer, i.e. removes the surface layer material of the silicon wafer at the position which has completed the doping by using the laser beam of the second light source 300, so as to form a large number of micro cracks and grooves on the surface of the silicon wafer, increase the contact area between the silicon wafer and the back plate, and be beneficial to the collection and transmission of the current, so as to expose the area of the silicon wafer which converts solar energy into electric energy to the air as much as possible, and improve the battery conversion efficiency.

[0050] It should be noted that the specific output energy of the laser beams of the first light source 100 and the second light source 300 is set by the user according to the actual demand.

[0051] According to some embodiments of the present application, the optical path switching unit 400 includes a movable first reflecting piece 410. When the first reflecting piece 410 moves to the light propagation line, the first reflecting piece 410 conducts the light beam of the second light source 300 to the laser output unit 200.

[0052] Specifically, the light path switching unit 400 comprises a first sliding seat 420 and a first reflecting piece 410 arranged on the first sliding seat 420. When the first sliding seat 420 moves to the light propagation line, the first reflecting piece 410 conducts the light beam of the second light source 300 to the laser output unit 200.

[0053] It can be understood that when the workpiece completes the first machining process, before the second machining process starts, by moving the first sliding seat 420 to a preset position on the light propagation line, one side of the first reflecting piece 410 intercepts the light beam of the first light source 100, while the light beam of the second light source 300 can be refracted to the laser output unit 200 through the first reflecting piece 410, and then output to the workpiece to be machined, and the second machining process of the workpiece is started.

[0054] Conversely, by moving the first sliding seat 420 out of the range of the light propagation line, the light beam of the first light source 100 can be directly conducted along the light propagation line, while the light beam of the second light source 300 is refracted to other positions by the first reflecting piece 410 and cannot be refracted to the workpiece, or the second light source 300 is turned off, and when the second machining process needs to be started, the first sliding seat 420 is moved to a preset position on the light propagation line, and then the second light source 300 is started again and is refracted to the laser output unit 200 and then output to the workpiece.

[0055] According to some embodiments of the present application, the light path switching unit 400 has a second embodiment, specifically, the light path switching unit 400 comprises a first sliding seat 420 and a first reflecting piece 410 rotatably arranged on the first sliding seat 420. By rotating the first reflecting piece 410, the irradiation angle of the light beam of the second light source 300 is adjusted to ensure that the light beam of the second light source 300 can be accurately conducted to the workpiece. When the first sliding seat 420 moves to the light propagation line, the first reflecting piece 410 conducts the light beam of the second light source 300 to the laser output unit 200.

[0056] According to some embodiments of the present application, the propagation line comprises a second reflecting piece 600, the second reflecting piece 600 conducts the light beam of the first light source 100 to the laser output unit 200, and the light path switching unit 400 can be located between the second reflecting piece 600 and the laser output unit 200.

[0057] It can be understood that when the first light source 100 and the laser output unit 200 are not on the same axis, the second reflecting piece 600 can be used to refract the light beam of the first light source 100 to the laser output unit 200.

[0058] As Fig. 1As shown, according to the embodiments of the laser light source layout provided in the present application, the first light source 100 and the second light source 300 are located on both sides of the line connecting the second reflecting member 600 and the laser output unit 200.

[0059] Specifically, as shown, Fig. 1 The first laser output mechanism includes a first box 700, the first box 700 includes a first box part 710 and a second box part 720 arranged in an L shape, the first box part 710 is provided with the first light source 100, the second box part 720 is provided with the light path switching unit 400 and the laser output unit 200, and the second reflecting member 600 is located at the junction of the first box part 710 and the second box part 720. In addition, the second laser output mechanism includes a second box, the second box is provided with the second light source 300, the second box is provided with a light outlet, and the second box part 720 is provided with a light inlet corresponding to the light outlet. The design of the L-shaped box and the cooperative distribution of the two laser light sources make the structure of the device more compact, effectively reducing the overall space occupied by the device.

[0060] It should be noted that the second reflecting member 600 can be increased in number according to the specific layout of the light source position.

[0061] According to some embodiments of the present application, the laser mold opening machine of the present application is also provided with a visual positioning unit, the visual positioning unit 800 is arranged above the jig 500, and the visual positioning unit 800 is used to determine the machining light beam at the machining position of the workpiece, so as to ensure the machining precision.

[0062] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A laser mold unscrambler having a plurality of optical paths, characterized by, The application relates to a laser doped device, comprising: a doping unit, comprising a first laser output mechanism capable of outputting a laser beam to a machining position of a workpiece to be machined, and a doping output mechanism (900) for delivering a doping medium to the machining position of the workpiece, the doping output mechanism (900) and the first laser output mechanism jointly acting on a doping process of the workpiece; a second laser output mechanism adjacent to the first laser output mechanism, the second laser output mechanism being capable of outputting a laser beam to the machining position of the workpiece to be machined; a jig (500) arranged at the laser output ends of the first laser output mechanism and the second laser output mechanism, the jig (500) being used for fixing the workpiece; the laser beam output by the first laser output mechanism and the laser beam output by the second laser output mechanism have an energy difference.

2. The laser mold unscrambler with multiple sets of optical paths according to claim 1, wherein, The first laser output mechanism comprises a first light source (100), a laser output unit (200) and a light propagation line between the first light source (100) and the laser output unit (200), and the light beam of the first light source (100) is processed into a product through the light propagation line and the laser output unit (200).

3. The laser mold unscrambler with multiple sets of optical paths according to claim 2, wherein, The second laser output mechanism comprises a second light source (300) and a light path switching unit (400), the light path switching unit (400) can be located on the light propagation line, and the light path switching unit (400) is used for processing the light beam of the second light source (300) into a product through the light propagation line and the laser output unit (200).

4. The laser mold unscrambler with multiple sets of optical paths according to claim 3, wherein, The light path switching unit (400) comprises a movable first reflecting piece (410), when the first reflecting piece (410) moves to the light propagation line, the first reflecting piece (410) conducts the light beam of the second light source (300) to the laser output unit (200).

5. The laser mold unscrambler of claim 3, wherein, The light path switching unit (400) comprises a rotatable first reflecting piece (410), and the first reflecting piece (410) is rotated to adjust the irradiation angle of the light beam of the second light source (300); or the light path switching unit (400) comprises a first sliding seat (420) and a first reflecting piece (410) rotatably arranged on the first sliding seat (420), the first reflecting piece (410) is rotated to adjust the irradiation angle of the light beam of the second light source (300), and when the first sliding seat (420) moves to the light propagation line, the first reflecting piece (410) conducts the light beam of the second light source (300) to the laser output unit (200).

6. The laser mold unscrambler with multiple sets of optical paths of claim 3, wherein, The light propagation line comprises a second reflecting piece (600), the second reflecting piece (600) conducts the light beam of the first light source (100) to the laser output unit (200), and the light path switching unit (400) can be located between the second reflecting piece (600) and the laser output unit (200).

7. The laser mold unscrambler with multiple sets of optical paths according to claim 6, wherein, The first light source (100) and the second light source (300) are located on both sides of the line connecting the second light-reflecting piece (600) and the laser output unit (200).

8. The laser mold unscrambler with multiple sets of optical paths of claim 6, wherein, The second light-reflecting piece (600), the light path switching unit (400) and the laser output unit (200) are arranged along a horizontal direction.

9. The laser mold unscrambler of claim 6, wherein, The first laser output mechanism comprises a first box (700), the first box (700) comprises a first box part (710) and a second box part (720) arranged in an L shape, the first box part (710) is provided with the first light source (100), the second box part (720) is provided with the light path switching unit (400) and the laser output unit (200), and the second light-reflecting piece (600) is located at the junction of the first box part (710) and the second box part (720).

10. The laser mold unscrambler of claim 9, wherein, The second laser output mechanism comprises a second box, the second light source (300) is arranged in the second box, the second box is provided with a light outlet, and the second box part (720) is provided with a light inlet corresponding to the light outlet.

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