Circuit board high-temperature adhesive tape and circuit board adhesive tape composite structure

Abstract

The utility model discloses a circuit board high-temperature adhesive tape and a circuit board adhesive tape composite structure. The high-temperature adhesive tape comprises a bearing layer; the adhesive tape layer is bonded with the bearing layer and is suitable for being stripped from the bearing layer so as to be bonded to and cover the sound outlet hole of the circuit board; the cushion block is positioned between the bearing layer and the adhesive tape layer and is bonded with the adhesive tape layer; in a first direction parallel to the unfolding plane of the adhesive tape layer, the first end of the cushion block extends to the edge of the adhesive tape layer, the corresponding second end of the cushion block extends to a first area in the adhesive tape layer, and the first area corresponds to the sound hole of the circuit board; in the second direction perpendicular to the first direction and parallel to the unfolding plane of the adhesive tape layer, the cushion block is provided with a first edge extending from the second end to the first end, and the side face of the first edge is separated from the lower surface of the adhesive tape layer, so that an air passing channel is formed between the first area and the edge of the adhesive tape layer; the air channel is suitable for communicating the sound hole of the circuit board with the outside of the adhesive tape layer. The high-temperature adhesive tape for the circuit board can solve the problem that water vapor is generated at the sound hole when the circuit board passes through a furnace.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of adhesive tape, specifically relates to a circuit board high temperature adhesive tape and circuit board adhesive tape composite structure. BACKGROUND

[0002] The circuit board with the microphone sound hole needs to paste the high temperature adhesive tape to cover the position of the microphone sound hole when carrying out the wave crest welding or reflow welding process, so as to avoid the damage of high temperature to the sound hole when passing through the furnace. However, the current high temperature adhesive tape will completely close the opening of the sound hole, and the high temperature will cause the water vapor at the position of the sound hole when the circuit board passes through the furnace, and the water vapor will form impurities after passing through the furnace, which affects the sound effect of the microphone sound hole. SUMMARY

[0003] The utility model discloses a circuit board high temperature adhesive tape and circuit board adhesive tape composite structure, which can improve the problem of water vapor at the position of the sound hole when the circuit board passes through the furnace.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme:

[0005] Technical scheme one: a circuit board high temperature adhesive tape is used for pasting and covering the sound hole of the circuit board, and is characterized by comprising: a bearing layer; an adhesive tape layer, which is bonded with the bearing layer and is suitable for being peeled off from the bearing layer to paste and cover the sound hole of the circuit board; and a pad, which is located between the bearing layer and the adhesive tape layer and is bonded with the adhesive tape layer; in the first direction parallel to the unfolding plane of the adhesive tape layer, the first end of the pad extends to the edge of the adhesive tape layer, and the corresponding second end extends to the first area in the adhesive tape layer, which corresponds to the sound hole of the circuit board; in the second direction perpendicular to the first direction and parallel to the unfolding plane of the adhesive tape layer, the pad has the first edge extending from the second end to the first end, and the side surface of the first edge is separated from the lower surface of the adhesive tape layer to form the air passage between the first area and the edge of the adhesive tape layer; the air passage is suitable for connecting the sound hole of the circuit board and the outside of the adhesive tape layer.

[0006] Technical scheme two based on technical scheme one: the area range of the first area is consistent with the area range of the sound hole of the circuit board; the second end of the pad has the overlapping part with the area range of the first area in the projection plane parallel to the first direction and the second direction.

[0007] Technical solution three based on technical solution two: along the second direction, the cushion block has a second edge corresponding to the first edge, the second edge extends from the second end to the first end, and the side surface of the second edge is separated from the lower surface of the adhesive tape layer to form the air passage between the first area and the edge of the adhesive tape layer.

[0008] Technical solution four based on technical solution three: the second end is in the shape of an arc or a taper angle extending into the first area.

[0009] Technical solution five based on technical solution four: the first edge and the second edge are in the shape of a straight line extending in the first direction and connected with the second end, and the size of the two connection points in the second direction is smaller than the size of the sound hole in the second direction.

[0010] Technical solution six based on technical solution five: the cushion block is made of polyimide material.

[0011] In addition, the utility model also provides technical solution seven: a circuit board adhesive tape composite structure, the circuit board has a sound hole, characterized by further comprising the adhesive tape layer and the cushion block in the circuit board high temperature adhesive tape of any one of technical solutions one to six;The adhesive tape layer carries the cushion block and is pasted and covers to the sound hole of the circuit board, and the second end of the cushion block partially coincides with the sound hole to communicate the sound hole and the outside of the adhesive tape layer through the air passage.

[0012] From the above description of the utility model, compared with the prior art, the utility model has the following beneficial effects:

[0013] Technical solution one provides a circuit board high temperature adhesive tape, which comprises a bearing layer, an adhesive tape layer and a cushion block, the bearing layer can adopt a release film to protect the adhesive tape layer and the cushion block, the adhesive tape layer is bonded with the bearing layer and can be peeled off from the bearing layer for use, and the adhesive tape layer can be used to paste and cover the sound hole of the circuit board when in use;The cushion block is located between the bearing layer and the adhesive tape layer and is bonded with the adhesive tape layer, so that the bearing layer can move with the adhesive tape layer to the circuit board, and the two ends of the cushion block in the first direction are distributed in the edge of the adhesive tape layer and the first area corresponding to the sound hole, so that the air passage is formed by separating the first edge side surface of the cushion block from the lower surface of the adhesive tape layer in the second direction;When the circuit board generates water vapor at the sound hole position due to passing through the furnace, the water vapor can be quickly discharged through the air passage, avoiding the accumulation of water vapor at the sound hole to form impurities affecting the sound effect, and at the same time, since the air passage is very narrow, the solder and the like outside is not easy to enter the sound hole;In addition, after the circuit board passes through the furnace, the high temperature adhesive tape can be easily peeled off from the circuit board, and the cushion block is taken away, without affecting the normal use of the circuit board.

[0014] In the second technical solution, the first area range is consistent with the sound hole range of the circuit board, and the second end of the cushion block has an overlapping part with the first area on a specific projection surface, which ensures that the cushion block can better cover the sound hole corresponding area, thereby making the communication between the air passage and the sound hole more effective, which is more conducive to the discharge of water vapor, further improves the ability to prevent water vapor accumulation from affecting the sound effect, and also ensures the effective coverage and protection of the sound hole by the adhesive tape layer.

[0015] In the third technical solution, along the second direction, the cushion block is provided with a second edge corresponding to the first edge, and the second edge side is separated from the lower surface of the adhesive tape layer to form an air passage, thereby increasing the path and area of the air passage.

[0016] In the fourth technical solution, the second end of the cushion block is in an arc shape or a tapered shape extending into the first area, which is conducive to guiding the water vapor to flow into the air passage and reducing the possibility of water vapor accumulation around the cushion block, thereby optimizing the water vapor discharge path and further enhancing the protection of the sound hole from water vapor, and ensuring stable sound effect.

[0017] In the fifth technical solution, the first edge and the second edge are designed as straight lines and are connected to the second end, and the size of the connection part is smaller than the size of the sound hole, which ensures that the side surface of the second end will not block the air outlet of the sound hole, and ensures smooth communication between the sound hole and the air passage.

[0018] In the sixth technical solution, the cushion block is made of polyimide material, which has good high temperature resistance and other properties, so that the cushion block can maintain stable structure during high temperature processes such as wave soldering or reflow soldering of the circuit board, and will not be deformed or damaged due to high temperature, thereby ensuring the stable existence of the air passage.

[0019] The seventh technical solution provides a circuit board adhesive tape composite structure, which comprises a specific adhesive tape layer and a cushion block, the adhesive tape layer carries the cushion block to cover and protect the sound hole, and the second end of the cushion block partially overlaps the sound hole, which utilizes the design of the cushion block and the air passage in the above adhesive tape; in actual circuit board application, the sound hole is effectively covered and protected, and through the reasonable overlap of the cushion block and the sound hole and the communication of the air passage, it is ensured that the water vapor can be smoothly discharged during the furnace process of the circuit board, thereby avoiding the accumulation of water vapor affecting the sound effect of the microphone sound hole, and ensuring that the circuit board can maintain good sound performance after high temperature process. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings needed in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0021] Figure 1 The structural explosion drawing of the circuit board high-temperature adhesive tape of the embodiment of the present application relates to;

[0022] Figure 2 The roll schematic diagram of the circuit board high-temperature adhesive tape of the embodiment of the present application relates to;

[0023] Figure 3 The schematic diagram of the circuit board adhesive tape composite structure of the embodiment of the present application relates to;

[0024] Figure 4 For Figure 3 The enlarged view of the A part in the middle;

[0025] Figure 5 The side schematic diagram of the circuit board adhesive tape composite structure of the embodiment of the present application relates to.

[0026] Main figure mark explanation:

[0027] Circuit board 1; sound hole 2; bearing layer 3; adhesive tape layer 4; cushion block 5; first end 6; second end 7; first area 8; first edge 9; air passage 10; second edge 11. Specific implementation

[0028] The technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are preferred embodiments of the present application, and should not be regarded as excluding other embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0029] In the claims, description and above drawings of the present application, unless otherwise explicitly limited, the terms such as "first", "second" or "third" are used only to distinguish different objects, and are not used to describe a specific order.

[0030] In the claims, description and above drawings of the present application, unless otherwise explicitly limited, for the orientation words, such as the terms "center", "transverse", "vertical", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "back", "left", "right", "clockwise", "counterclockwise" indicate the orientation or position relationship based on the orientation and position relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as limiting the specific protection scope of the present application.

[0031] In the claims, the specification, and the above drawings, unless otherwise specified, the use of the terms "fixedly connected" or "fixedly connected" should be interpreted broadly, that is, any connection mode between the two without displacement relationship and relative rotation relationship, that is, it includes non-detachable fixed connection, detachable fixed connection, integration and fixed connection through other devices or elements.

[0032] In the claims, the specification, and the above drawings, unless otherwise specified, the use of the terms "including", "having" and their variants is intended to mean "including but not limited to".

[0033] The utility model discloses an embodiment relates to a circuit board high temperature adhesive tape, the circuit board high temperature adhesive tape is used to paste and cover to the sound hole 2 place of circuit board 1. In addition, an embodiment of the utility model also relates to a circuit board high temperature adhesive tape composite structure, which adopts the circuit board high temperature adhesive tape described above.

[0034] Among them, the circuit board high temperature adhesive tape, the circuit board high temperature adhesive tape composite structure mentioned above, the circuit board 1 referred to is applied to the circuit board 1 with microphone, that is, the circuit board 1 with the function of receiving sound and emitting sound, on the circuit board 1, the sound hole 2 for emitting sound is arranged, the sound hole 2 is a blind hole, only has a hole edge on one side of the circuit board 1, and penetrates a certain depth to the surface of the other side of the circuit board 1 and does not penetrate to the surface of the other side of the circuit board 1. When the circuit board 1 is baked, high temperature adhesive tape needs to be pasted on the sound hole 2 position of the circuit board 1 to avoid the sound hole 2 from being damaged by high temperature, and to prevent soldering tin from entering the sound hole 2. However, the water vapor generated during the baking of the current high temperature adhesive tape will condense into moisture or impurities after cooling after pasting and covering to the sound hole 2 of the circuit board 1, which affects the sound emitting effect of the microphone.

[0035] Reference Figure 1 The circuit board high temperature adhesive tape includes a bearing layer 3, an adhesive tape layer 4 and a pad 5. Among them, the adhesive tape layer 4 is bonded with the bearing layer 3 and is suitable for peeling off from the bearing layer 3 to paste and cover to the sound hole 2 of the circuit board 1. The pad 5 is located between the bearing layer 3 and the adhesive tape layer 4 and is bonded with the adhesive tape layer 4.

[0036] The carrying layer 3 is a release film, which is used as a carrying platform for the adhesive tape layer 4 and the cushion 5 to avoid the adhesive material on the lower surface of the adhesive tape layer 4 from invalidation or contamination by foreign matters during the production, manufacturing and use of the high-temperature-resistant adhesive tape. The adhesive tape layer 4 is bonded to the upper surface of the carrying layer 3, and is made of a material resistant to high temperature and has an adhesive material on the lower surface to enable the adhesive tape layer 4 to be bonded to the carrying layer 3 or the circuit board 1. In addition, the adhesive tape layer 4 is designed to have a specific shape to enable the adhesive tape layer 4 to fit the specific area of the circuit board 1 where the sound hole 2 is arranged. In the embodiment, the part of the adhesive tape layer 4 used to be bonded to the circuit board 1 is approximately rectangular in shape, and a first area 8 is arranged at the middle position of the rectangular shape, which corresponds to the sound hole 2 on the circuit board 1. Of course, the first area 8 can not be specifically shown in the adhesive tape layer 4, and its specific position is anchored by the sound hole 2 on the circuit board 1. In addition, the area range of the first area 8 is consistent with the area range of the sound hole 2 on the circuit board 1, for example, when the upper end hole of the sound hole 2 is circular in shape, the area range of the first area 8 is also a circle of the same size.

[0037] In addition, in the first direction parallel to the development plane of the adhesive tape layer 4, the first end 6 of the cushion 5 extends to the edge of the adhesive tape layer 4, and the corresponding second end 7 extends to the first area 8 in the adhesive tape layer 4, which corresponds to the position of the sound hole 2 on the circuit board 1; in the second direction perpendicular to the first direction and parallel to the development plane of the adhesive tape layer 4, the cushion 5 has a first edge 9 extending from the second end 7 to the first end 6, and the side surface of the first edge 9 is separated from the lower surface of the adhesive tape layer 4 to form an air passage 10 between the first area 8 and the edge of the adhesive tape layer 4; the air passage 10 is adapted to communicate the sound hole 2 of the circuit board 1 and the outside of the adhesive tape layer 4. In addition, along the second direction, the cushion 5 has a second edge 11 corresponding to the first edge 9, the second edge 11 extends from the second end 7 to the first end 6, and the side surface of the second edge 11 is separated from the lower surface of the adhesive tape layer 4 to form the air passage 10 between the first area 8 and the edge of the adhesive tape layer 4.

[0038] In addition, along the second direction, the cushion 5 has a second edge 11 corresponding to the first edge 9, the second edge 11 extends from the second end 7 to the first end 6, and the side surface of the second edge 11 is separated from the lower surface of the adhesive tape layer 4 to form the air passage 10 between the first area 8 and the edge of the adhesive tape layer 4. The second end 7 of the cushion 5 has a part overlapping the area range of the first area 8 in the projection plane parallel to the first direction and the second direction.

[0039] Meanwhile, the second end 7 is in an arc shape or a taper shape extending into the first area 8. The first edge 9 and the second edge 11 are in a straight line shape extending in the first direction and connected with the second end 7, and the two connecting parts are smaller in the second direction than the sound hole 2 in the second direction.

[0040] Specifically, it is necessary to first describe the above-mentioned orientation. Referring to Figure 4 , which shows the specific direction of the first direction and the second direction. The first direction refers to a direction in the plane in which the tape layer 4 is developed, and the second direction is defined corresponding to the first direction, which is also in the development plane of the tape layer 4, and the second direction is perpendicular to the first direction.

[0041] In addition, referring to Figure 1 and Figure 4 , the shape of the cushion block 5 is a flat strip, and the thickness can be adjusted according to the specific situation, and the material is preferably polyimide material. This material has good high temperature resistance and other properties, so that the cushion block 5 can maintain stable structure when the circuit board 1 undergoes high temperature processes such as wave soldering or reflow soldering, and will not be deformed or damaged due to high temperature, thereby ensuring the stable existence of the gas passage 10.

[0042] In this embodiment, the extension direction of the cushion block 5 is the first direction, and the first end 6 and the second end 7 of the cushion block 5 are formed in the first direction, respectively, the first end 6 extends to one side edge of the tape layer 4 in the first direction, and the second end 7 extends to the first area 8 defined on the tape layer 4. In this embodiment, the first end 6 of the cushion block 5 is a straight line shape corresponding to the edge of the tape layer 4, and the side surface of the first end 6 is flush with the edge of the tape layer 4; the second end 7 of the cushion block 5 is in an arc shape, and the two ends of the arc are smoothly connected with the end parts of the first edge 9 and the second edge 11. And the second end 7 of the cushion block 5 extends into the first area 8, Figure 4 corresponding to the part of the sound hole 2 on the circuit board 1, the part of the first area 8 on the tape layer 4 in the high temperature tape of the circuit board. The part of the second end 7 of the cushion block 5 extends into the first area 8 does not exceed the center position of the first area 8, that is, the part of the cushion block 5 on the preset projection plane coinciding with the area range of the first area 8 only accounts for a small part of the area range of the first area 8. The range of the first area 8 is consistent with the range of the sound hole 2 of the circuit board 1, and the second end 7 of the cushion block 5 has a coinciding part with the first area 8 on a certain projection plane, which ensures that the cushion block 5 can better cover the area corresponding to the sound hole 2, thereby making the communication between the gas passage 10 and the sound hole 2 more effective, and more conducive to water vapor discharge, further improving the ability to prevent water vapor accumulation from affecting the sound effect, and also ensuring the effective coverage and protection of the tape layer 4 to the sound hole 2.

[0043] In another embodiment, the second end 7 can be shaped as a tapered angle, that is, a triangle with a pointed end, the pointed end of which extends into the first area 8 and has coinciding parts with the first area 8 on a preset projection plane, the coinciding parts also occupying a small part of the area of the first area 8. The arc-shaped or tapered angle-shaped second end 7 of the pad 5 extending into the first area 8 is beneficial for guiding the water vapor to flow to the air passage 10, reducing the possibility of water vapor accumulation around the pad 5, optimizing the water vapor discharge path, further enhancing the protection of the sound hole 2 from water vapor, and ensuring stable sound effect.

[0044] Referring to Figure 4 In the second direction, the pad 5 is formed with a first edge 9 and a second edge 11. The first edge 9 and the second edge 11 are both linear, and the same ends of the first edge 9 and the second edge 11 on the first direction are connected to both ends of the second end 7 of the pad 5, while the same ends of the first edge 9 and the second edge 11 on the other side of the first direction are connected to both ends of the first end 6 of the pad 5. Moreover, the distance between the two ends of the second end 7 of the pad 5 in the second direction is smaller than the size of the first area 8 in the second direction, which ensures that the side surface of the second end 7 does not block the air outlet of the sound hole 2, and ensures smooth communication between the sound hole 2 and the air passage 10.

[0045] Referring to Figure 5 It is easy to know that, since the pad 5 has a certain thickness, and the adhesive layer 4 is tightly bonded to the upper surface of the pad 5, the side surfaces of the first edge 9 and the second edge 11 of the adhesive layer 4 and the pad 5 are in a separated state, which defines two air passages 10 through the pad 5 and the adhesive layer 4. The air passage 10 is connected to the first area 8 through the second end 7 of the pad 5 at one end in the first direction, and is connected to the outside of the adhesive layer 4 through the first end 6 of the pad 5 at the other end in the first direction. Moreover, the size of the air passage 10 is related to the thickness of the pad 5. By increasing the number of air passages 10, the overall path and area of the air passages 10 are increased, and the water vapor at the position of the sound hole 2 is more easily discharged from the position of the air passage 10.

[0046] Referring to Figure 2 In the production process, the shape of the adhesive layer 4 can be cut on the release film by cutting equipment; at the same time, the pad 5 can be pre-cut into the required shape, and then fixed between the adhesive layer 4 and another release film serving as the supporting layer 3 during the cutting process.

[0047] The circuit board high-temperature adhesive tape comprises a bearing layer 3, an adhesive tape layer 4 and a cushion block 5, the bearing layer 3 can adopt a release film to protect the adhesive tape layer 4 and the cushion block 5, the adhesive tape layer 4 is bonded with the bearing layer 3 and can be peeled from the bearing layer 3 to be used, the adhesive tape layer 4 can be used to paste and cover the sound hole 2 of the circuit board 1 when used, the cushion block 5 is located between the bearing layer 3 and the adhesive tape layer 4 and is bonded with the adhesive tape layer 4, so that the bearing layer 3 can move with the adhesive tape layer 4 to the circuit board 1, and the two ends of the cushion block 5 are distributed in the edge of the adhesive tape layer 4 and a first area 8 corresponding to the sound hole 2 in a first direction, so that a gas passage 10 is formed by the first edge 9 side surface of the cushion block 5 and the lower surface of the adhesive tape layer 4 being separated in a second direction; when water vapor is generated at the position of the sound hole 2 of the circuit board 1 due to the furnace, the water vapor can be quickly discharged through the gas passage 10, so that the water vapor is prevented from accumulating at the sound hole 2 to form impurities and affect the sound effect, and meanwhile, since the gas passage 10 is very small, the solder and the like outside is difficult to enter the sound hole 2; in addition, after the circuit board 1 is subjected to the furnace, the high-temperature adhesive tape can be conveniently peeled from the circuit board 1, and the cushion block 5 is taken away, so that the normal use of the circuit board 1 is not affected.

[0048] In addition, the utility model embodiment still relates to a circuit board high-temperature adhesive tape composite structure, the circuit board 1 has a sound hole 2, still include the adhesive tape layer 4 and cushion block 5 in the circuit board high-temperature adhesive tape described above, the adhesive tape layer 4 carries cushion block 5 and pastes and covers to the sound hole 2 of the circuit board 1, and the second end 7 of the cushion block 5 partially coincides with the sound hole 2, to communicate the sound hole 2 and the outside of the adhesive tape layer 4 through the gas passage 10.

[0049] In use, referring to Figure 3 And Figure 4 the adhesive tape layer 4 is peeled from the bearing layer 3 with the cushion block 5, is aligned with the sound hole 2 on the circuit board 1, and is tightly pasted and covered to the accurate position, at this time, the second end 7 of the cushion block 5 covers a part of the sound hole 2, and the sound hole 2 is communicated with the two gas passages 10. When the circuit board 1 is subjected to the furnace, the water vapor at the position of the sound hole 2 can be discharged to the outside through the gas passage 10, and meanwhile, the solder and the like outside is difficult to enter the sound hole 2 from the gas passage 10. In actual circuit board 1 application, effective coverage protection of the sound hole 2 is realized, and through the reasonable coincidence of the cushion block 5 and the sound hole 2 and the communication of the gas passage 10, it is guaranteed that the water vapor can be smoothly discharged during the furnace process of the circuit board 1, the water vapor accumulation is avoided to affect the sound effect of the microphone sound hole 2, the circuit board 1 can still maintain good sound performance after the high-temperature process.

[0050] The description of the above specification and the embodiments are used to explain the protection scope of the present application, but do not constitute the limitation of the protection scope of the present application. Through the inspiration of the present application or the above embodiments, the ordinary skilled in the art combines the common knowledge, the ordinary technical knowledge in the art and / or the prior art, and obtains the modification, equivalent replacement or other improvement of the present application embodiment or one part of the technical features through logical analysis, reasoning or limited test, which should be included in the protection scope of the present application.

Claims

1. A circuit board high temperature adhesive tape for pasting over a sound hole (2) of a circuit board (1), comprising: a carrier layer (3); an adhesive tape layer (4) bonded to the carrier layer (3) and adapted to be peeled from the carrier layer (3) to paste over the sound hole (2) of the circuit board (1); and a spacer (5) located between the carrier layer (3) and the adhesive tape layer (4) and bonded to the adhesive tape layer (4); in a first direction parallel to a plane of development of the adhesive tape layer (4), a first end (6) of the spacer (5) extends to an edge of the adhesive tape layer (4) and a corresponding second end (7) extends to a first area (8) in the adhesive tape layer (4) corresponding to the sound hole (2) of the circuit board (1); in a second direction perpendicular to the first direction and parallel to the plane of development of the adhesive tape layer (4), the spacer (5) has a first edge (9) extending from the second end (7) to the first end (6), and a side surface of the first edge (9) is separated from a lower surface of the adhesive tape layer (4) to form an air passage (10) between the first area (8) and the edge of the adhesive tape layer (4); the air passage (10) is adapted to communicate the sound hole (2) of the circuit board (1) with an outside of the adhesive tape layer (4). A region of the first area (8) coincides with a region of the sound hole (2) of the circuit board (1); the second end (7) of the spacer (5) has a portion coinciding with the region of the first area (8) in a projection plane parallel to the first and second directions. In the second direction, the spacer (5) has a second edge (11) corresponding to the first edge (9), the second edge (11) extending from the second end (7) to the first end (6), and a side surface of the second edge (11) is separated from the lower surface of the adhesive tape layer (4) to form the air passage (10) between the first area (8) and the edge of the adhesive tape layer (4). The second end (7) is in the shape of an arc or a taper angle extending into the first area (8). The first edge (9) and the second edge (11) are in the shape of straight lines extending in the first direction and connected to the second end (7), and a dimension of the two connecting portions in the second direction is smaller than a dimension of the sound hole (2) in the second direction.

2. The circuit board high temperature tape of claim 1, wherein, The spacer (5) is made of polyimide.

3. The high-temperature adhesive tape for circuit boards as described in claim 2, characterized in that, Also provided are the adhesive tape layer (4) and the spacer (5) in the circuit board high temperature adhesive tape according to any one of claims 1-6; the adhesive tape layer (4) with the spacer (5) pasted over the sound hole (2) of the circuit board (1), and the second end (7) of the spacer (5) partially coinciding with the sound hole (2) to communicate the sound hole (2) with an outside of the adhesive tape layer (4) through the air passage (10).

4. The circuit board high temperature tape of claim 3, wherein the adhesive is a pressure sensitive adhesive. ​ 5. The circuit board high temperature tape of claim 4, wherein the adhesive is a pressure sensitive adhesive. ​ 6. The circuit board high temperature tape of claim 5, wherein the adhesive is a polyurethane adhesive. ​ 7. A circuit board tape composite structure having a sound hole (2) on a circuit board (1), characterized by ​

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