Improved heating structure of light sensing device capable of automatically removing foreign matters

Abstract

The utility model provides an improved heating structure of a light sensing device, which can automatically remove foreign matters. The present invention relates to a light sensing device, and more particularly, to a light sensing device which is sealed by a flexible and rigid material structure and transmits vibration generated by a piezoelectric element, the light sensing device comprising a housing, a transparent protective cover, a light sensor, a lens module, a flexible and rigid sealing material, and a piezoelectric element, and a heating element is matched, so that the light sensing device with the function of automatically removing foreign matters can be optimized, the use frequency of the piezoelectric element is reduced, the power consumption is reduced, the service life is prolonged, and the removal efficiency of small liquid beads is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of optical sensing device heating improved structure of automatic foreign matter removal. Especially, a kind of optical detection system is used to seal optical sensing device with flexible and rigid material structure and transmit the vibration generated by piezoelectric element, and it is matched with heating element, so that the function of automatic foreign matter removal can be optimized. BACKGROUND

[0002] Optical detection system, a light sensing device is carried, and the light information of external environment is collected through light-permeable observation window and converted into electrical signal on light sensor, and the corresponding reaction of setting is generated after the action of processor, which includes simple light receiving optical detection device, such as camera, camera and part passive light sensor, also includes light emitting device with active light projection, such as structured light device, time of flight camera (ToF, Time of Flight), optical radar and the like. However, when in outdoor or complex environment full of foreign matter, light sensing device is easily affected by foreign matter attached to observation window pollution, for example, rain (water) drop, snowfall, frost, slurry and other foreign matters may be attached to observation window to hinder or refract, reflect incident light, and light sensor is thus affected by the light signal received, causing signal deterioration or degradation.

[0003] To this end, a number of developers have proposed corresponding cleaning solutions. Patent publication US 11002954B2 discloses a camera unit with a cleaning device that uses a vibrator to vibrate a light-transmitting body, thereby cleaning the surface of the light-transmitting body. However, the vibrator must have a cylindrical structure (e.g., first and second cylindrical members) to provide a vibration space. Such a vibration device makes the structure of the light detection system (in this case, a camera) larger and more complex. The present inventor has also proposed a method for removing foreign matter from a camera system and a camera system ICVS (Instant Clear View System) in patent publication US 11489988B2. In the ICVS, a piezoelectric element is disposed on a transparent protective cover of a camera device, the piezoelectric element is vibrated to remove foreign matter from the transparent protective cover, and a soft sealing material is used to seal the light sensing device around the transparent protective cover. However, such a design using a soft sealing material (e.g., an O-ring) as an interface between the vibration source (i.e., the piezoelectric element) and the periphery has a trade-off between water resistance and vibration capability. Specifically, if the water resistance of the light detection system is to be improved, the pressing amount of the O-ring needs to be increased, which limits the vibration capability of the vibration source to the periphery, thereby reducing the performance of removing foreign matter. Conversely, if the pressing amount of the O-ring is reduced to improve the vibration capability, water vapor or even water can easily enter (leak) into the sealed space of the light detection system. Therefore, further, the present inventor has proposed a light detection system ICVS (Instant Clear View System) and a method for automatically removing foreign matter in patent publication JP7281843B2, which uses a material with flexibility and rigidity to seal the light sensing device, uses a different material from the prior art to seal the light sensing device and transmit the vibration generated by the piezoelectric element, thereby stably and effectively automatically removing foreign matter from the light detection system.

[0004] However, even if the aforementioned more optimized way is taken to improve the vibration transmission of the vibration source, when removing foreign matter by vibration, the fine liquid beads of the remaining foreign matter are still a problem to be solved, and the prior art uses the heat energy generated by the vibration source, such as lead zirconate titanate, when vibrating at high frequency, to heat and vaporize the fine liquid beads on the observation window, but high-frequency vibration represents high energy consumption, and at the same time, for such a vibration source, high-frequency voltage driving will quickly raise the temperature of the vibration source itself, and the continuous high-temperature heat accumulation will adversely affect the vibration ability of the vibration source, and in severe cases, it can even cause permanent depolarization and loss of vibration ability. Patent announcement case number US11366076B2 is to limit the operating temperature of the piezoelectric transducer by setting a temperature sensor and a temperature threshold, so as to achieve the effect of protecting the vibration source and maintaining the vibration ability. But this way of protecting the vibration source also limits the efficiency of removing foreign matter, and for applications that need to quickly remove, such as unmanned vehicles or assisted driving systems, it is not suitable for optical detection systems. Even for fixed optical monitoring systems, the expansion of the blind area on the observation time axis also needs to be avoided as much as possible, so the practicality is greatly limited. Practical new type content

[0005] Therefore, the present inventor develops a light sensing device heating improvement structure that can automatically remove foreign matter for the aforementioned foreign matter removal optical detection system, which effectively configures heating elements and improves the structure of the light sensing device to solve the problems that the aforementioned foreign matter removal optical detection system needs to overcome.

[0006] The utility model provides a kind of light sensing device heating improvement structure that can automatically remove foreign matter, the improvement structure includes: a housing, one side has an opening;A transparent protective cover is arranged at the opening, the housing and the transparent protective cover jointly define the internal space of the light sensing device;A light sensor is arranged in the internal space of the light sensing device;A lens module is arranged between the transparent protective cover and the light sensor;A piezoelectric element is arranged at the edge of the transparent protective cover in the internal space of the light sensing device;And flexible and rigid sealing material has annular sheet shape, is arranged between the edge of the transparent protective cover and the edge of the piezoelectric element, and extends and is fixed to the housing, to seal the internal space of the light sensing device, a heating element is arranged between the side of the transparent protective cover and the sealing material;Wherein, the piezoelectric element vibrates, and the vibration is transmitted to the transparent protective cover by the sealing material, to remove foreign matter from the transparent protective cover, the heating element generates heat energy, and the heat energy is transmitted to the transparent protective cover by the sealing material, to remove fine liquid beads from the transparent protective cover.

[0007] In another embodiment, the lens module is disposed at the opening, and the lens module comprises: a top side lens which is the transparent protective cover of the light sensing device and is disposed at the outermost side of the lens module relative to the inner space of the light sensing device; a lateral side housing, the housing of the light sensing device further comprises the lateral side housing, the top side lens and the housing of the light sensing device comprising the lateral side housing jointly define the inner space of the light sensing device; a bottom side lens disposed at the opposite side of the top side lens, the top side lens, the lateral side housing and the bottom side lens jointly define the inner space of the lens module; and one or more internal lenses disposed between the top side lens and the bottom side lens in the inner space of the lens module, the heating element is disposed between the top side lens and the sealing material; wherein the piezoelectric element is disposed at the edge of the top side lens in the inner space of the lens module; the sealing material is disposed between the edge of the top side lens and the edge of the piezoelectric element, and extends and is fixed to the lateral side housing to seal the inner space of the light sensing device; and wherein the piezoelectric element vibrates, the vibration is transmitted to the top side lens through the sealing material to remove foreign matter from the top side lens.

[0008] In a preferred embodiment, the light sensing device further comprises a soft shielding material having a ring sheet shape and disposed at the outer side of the housing and the transparent protective cover to shield the gap between the housing, the transparent protective cover and the sealing material.

[0009] In a preferred embodiment, the improved structure further comprises a heat insulation buffer element disposed between the piezoelectric element and the sealing material and combined with the piezoelectric element and the sealing material respectively.

[0010] In another preferred embodiment, the heat insulation buffer element is disposed between the piezoelectric element and the heating element and combined with the piezoelectric element and the heating element respectively. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 : show a light sensing device heating improved structure capable of automatically removing foreign matter according to an embodiment of the present application;

[0012] Figure 2 : show a light sensing device heating improved structure capable of automatically removing foreign matter according to another embodiment of the present application;

[0013] Figure 3 : show a light sensing device heating improved structure capable of automatically removing foreign matter according to another embodiment of the present application;

[0014] Figure 4 : show a light sensing device heating improved structure capable of automatically removing foreign matter according to another embodiment of the present application; Figure 3The lens module of the automatic foreign matter removal optical sensing device heating improvement structure

[0015] Figure 5A The combination of the sealing material, the heating element and the piezoelectric element of any embodiment of the present application is shown.

[0016] Figure 5B The combination of the sealing material, the heating element, the piezoelectric element and the heat insulation buffer element of a preferred embodiment of the present application is shown.

[0017] Figure 5C The combination of the sealing material, the heating element, the piezoelectric element and the heat insulation buffer element of another preferred embodiment of the present application is shown.

[0018] Figure 5D The combination of the sealing material, the heating element, the piezoelectric element and the heat insulation buffer element of another preferred embodiment of the present application is shown.

[0019] BRIEF DESCRIPTION OF DRAWINGS

[0020] 10: optical detection system

[0021] 20: optical sensing device

[0022] 210: optical sensor

[0023] 220: circuit board

[0024] 222: cable

[0025] 230: lens module

[0026] 230A: top side lens

[0027] 230B: lateral side housing

[0028] 230C: inner lens

[0029] 230D: bottom side lens

[0030] 240: transparent protective cover

[0031] 241: sealing material

[0032] 243: soft shielding material

[0033] 244: piezoelectric element

[0034] 245: heating element

[0035] 247: heat insulation buffer element

[0036] 260: housing

[0037] 262: first housing

[0038] 264: Lens module mounting hardware

[0039] 266: Second shell Detailed Implementation

[0040] The following description, with reference to the accompanying drawings, details the structural improvements of the heating structure of the photosensitive device capable of automatically removing foreign objects according to the present invention, wherein... Figure 1 This invention illustrates an exemplary improved heating structure for a photosensitive device capable of automatically removing foreign objects. Figures 2 to 4 The structural details of the photosensitive device 20, an automatic foreign object removal photosensitive device according to various embodiments of the present invention, are shown below. Since the following description focuses on structural features, reference is made to... Figure 5A , Figure 5B , Figure 5C Some of the components may not be further described or shown. Figures 1 to 4 However, it is understandable that such a component can be integrated into the photosensitive device. Figures 2 to 4 The light sensing device 20 is located within the light detection system 10 (not shown in the figure), which can be a photography system, and the light sensing device 20 can be a camera device. No special restrictions are required.

[0041] Reference Figure 1 This utility model provides an improved heating structure for a photosensitive device capable of automatically removing foreign objects. In an embodiment of this utility model, the photosensitive device 20 includes: a housing 260; a transparent protective cover 240; a photosensitive sensor 210; a lens module 230; a sealing material 241 with flexibility and rigidity; a piezoelectric element 244; and a heating element 245. Figure 3 This illustration shows an embodiment where the transparent protective cover 240 has a planar shape (e.g., a flat lens). Figure 4 An embodiment of the transparent protective cover 240 having a curved shape (e.g., a convex lens or a concave lens) is shown.

[0042] One side of the housing 260 (e.g.) Figure 3 and Figure 4 The upper side of the housing 260 has an opening, and the transparent protective cover 240 is disposed at the opening. The housing 260 and the transparent protective cover 240 together define the internal space of the light sensing device 20. The light sensor 210 is disposed in the internal space of the light sensing device 20. The lens module 230 is disposed between the transparent protective cover 240 and the light sensor 210.

[0043] The piezoelectric element 244 is disposed at the edge of the transparent protective cover 240 in the internal space of the light sensing device 20. The piezoelectric element 244 includes a piezoelectric material such as PZT or the like. The piezoelectric element 244 can be electrically connected to the circuit board 220 through the cable 222. The sealing material 241 has a ring sheet shape, which is disposed (attached) between the edge of the transparent protective cover 240 and the edge of the piezoelectric element 244, and extends and is fixed to the housing 260 to seal the internal space of the light sensing device 20. The piezoelectric element 244 vibrates, and the vibration is transmitted to the transparent protective cover 240 through the sealing material 241 to remove foreign matter from the transparent protective cover 240.

[0044] Preferably, the piezoelectric element 244 can be ring-shaped and disposed at the inner edge of the transparent protective cover 240 to facilitate removal of foreign matter in a more efficient and component-saving manner. The piezoelectric element 244 can be attached to the transparent protective cover 240. The piezoelectric element 244 can be disposed to surround the periphery of the lens module 230.

[0045] The sealing material 241 has flexibility and rigidity, and preferably includes one or more selected from the group consisting of aluminum, steel (e.g., SUS304), titanium alloy, magnesium-aluminum alloy, polyimide (PI), polycarbonate (PC), and polyethylene terephthalate (PET). The sealing material 241 can be a metal foil of metal such as aluminum, steel, titanium alloy, or magnesium-aluminum alloy, or a sheet or film made of polyimide, polycarbonate, or polyethylene terephthalate. The thickness of the sealing material 241 is preferably 10 to 200 μm. The sealing material 241 has water-repellent properties, thereby sealing the internal space of the light sensing device 20. The sealing material 241 having flexibility and rigidity can effectively transmit the vibration generated by the piezoelectric element 244 to the transparent protective cover 240 and reduce the vibration transmitted to other peripheries (other than the transparent protective cover 240), and the amplitude of the swing caused by the vibration is not greater than the elongation. Therefore, the sealing material 241 has sufficient support strength as an interface of the vibration source and the periphery, and there is no risk of the sealing material being broken.

[0046] In another aspect, in the present utility model, since the sealing material 241 with flexibility and rigidity is used to replace the soft sealing material in the prior art as the sealing material between the transparent protective cover 240 and the shell 260, there can be gaps between the shell 260, the transparent protective cover 240 and the sealing material 241. Therefore, the sealing material 241 can be exposed to the outside through such gaps, which can cause water or other substances to adhere to the sealing material 241. Therefore, in order to avoid water or other substances adhering to the sealing material 241, a thin soft material is used as a shielding material and attached to the transparent protective cover 240 and the sealing material 241 to shield the gaps, which can prevent water or other substances from directly adhering to the sealing material 241. Therefore, in a preferred embodiment, the light sensing device 20 can further include a soft shielding material 243 having a ring-shaped sheet shape and arranged on the outside of the shell 260 and the transparent protective cover 240 to shield the gaps between the shell 260, the transparent protective cover 240 and the sealing material 241.

[0047] The heating element 245 is arranged between the transparent protective cover 240 and the sealing material 241, and when fine liquid beads are attached to the transparent protective cover 240, the heating element 245 is independently activated to generate heat energy, which is transmitted to the transparent protective cover 240 through the sealing material 241 or directly heats the transparent protective cover 240 through contact heat conduction to remove the fine liquid beads.

[0048] According to some embodiments, the shell 260 can include a first shell 262, a lens module fixing member 264, and a second shell 266. A sealing member such as an O-ring can be arranged between two adjacent ones of the first shell 262, the lens module fixing member 264 and the second shell 266 for sealing. Figure 1 And Figure 2 In the embodiment shown, the opening of the shell 260 can be arranged at the second shell 266 (in particular, the upper side). In various embodiments of the present utility model, the lens module 230 can be embedded in the light sensing device 20 (as shown in Figure 1 And Figure 2 Alternatively, the lens module 230 can also at least partially protrude outward from the light sensing device 20 (as shown in Figure 3

[0049] Referring to Figure 3 In another embodiment, the lens module 230 is arranged at the opening of the shell 260, in which case the shell 260 only includes the first shell 262 and the lens module fixing member 264, and the opening of the shell 260 is arranged at the lens module fixing member 264 (in particular, the upper side). Referring to Figure 4 ​The lens module 230 can include a top side lens 230A, a lateral side housing 230B, one or more internal lenses 230C, and a bottom side lens 230D. The top side lens 230A, the internal lenses 230C, and the bottom side lens 230D can be planar or curved, i.e., each of them can be a flat lens, a convex lens, or a concave lens.

[0050] Referring to Figure 4 In this embodiment, the top side lens 230A is the transparent protective cover 240 of the light sensing device 20, and is disposed at the outermost side of the lens module 230 relative to the internal space of the light sensing device 20. The lateral side housing 230B can be a cylindrical member that, as part of the housing 260 of the light sensing device 20, cooperates with the top side lens 230A and the housing 260 to define the internal space of the light sensing device 20. The bottom side lens 230D is disposed at the opposite side of the top side lens 230A. The top side lens 230A, the lateral side housing 230B, and the bottom side lens 230D cooperatively define an internal space of the lens module 230. The one or more internal lenses 230C are disposed in the internal space of the lens module 230 between the top side lens 230A and the bottom side lens 230D. In this embodiment, the piezoelectric element 244 is disposed in the internal space of the lens module 230 at the edge of the top side lens 230A. The sealing material 241 is disposed (attached) between the edge of the top side lens 230A and the edge of the piezoelectric element 244, and extends and is fixed to the lateral side housing 230B to seal the internal space of the light sensing device 20. The piezoelectric element 244 is vibrated, and the vibration is transmitted to the top side lens 230A through the sealing material 241 to remove foreign matter from the top side lens 230A.

[0051] The heating element 245 is disposed between the transparent protective cover 240 and the sealing material 241, and is independently activated to generate heat energy when fine liquid beads are attached to the transparent protective cover 240, and the heat energy is transmitted to the transparent protective cover 240 or the top side lens 230A through the sealing material 241, or directly heats the transparent protective cover 240 or the top side lens 230A through contact heat conduction to remove the fine liquid beads.

[0052] The light sensing device 20 can further include the circuit board 220 electrically connected to the light sensor 210.

[0053] Referring to Figure 5A 、 Figure 5B 、 Figure 5C 、 Figure 5DIn another preferred embodiment, a heat insulation buffer element 247 can be added to the combination without the heat insulation buffer element 247, the heating element 245 is disposed on the side of the sealing material 241 opposite to the piezoelectric element 244 to avoid direct contact heat conduction affecting the piezoelectric element 244. Preferably, with the heat insulation buffer element 247, the heat insulation buffer element 247 can be disposed in combination as Figure 5B , Figure 5C or Figure 5D , Figure 5B The heating element 245 is disposed on the side of the sealing material 241 opposite to the piezoelectric element 244, and the heat insulation buffer element 247 is disposed between the sealing material 241 and the piezoelectric element 244 to achieve better heat insulation effect. Also as Figure 5C , the heat insulation buffer element 247 is disposed between the heating element 245 and the piezoelectric element 244, and the heat insulation buffer element 247 blocks direct contact heat conduction affecting the piezoelectric material 244. Also as Figure 5D , the heat insulation buffer element 247 is disposed below the piezoelectric element 244 to more effectively use the heat energy generated by the heating element 245 to avoid heat energy loss and to remove small liquid beads more quickly.

[0054] Any of the above attachments can be performed using adhesive, welding or any other means, and any adhesive with good tensile properties and low moisture absorption can be used for any adhesive.

[0055] The piezoelectric element 244, the sealing material 241, the soft shielding material 243, the heating element 245 and the heat insulation buffer element 247 can be disposed in any suitable annular shape as long as the incident light into the light sensor 210 is not blocked.

Claims

1. An improved heating structure for a photosensitive device capable of automatically removing foreign objects, characterized in that, A light sensing device includes: a housing having an opening on one side thereof; a transparent cover disposed at the opening, the housing and the transparent cover collectively defining an interior space of the light sensing device; a light sensor disposed in the interior space of the light sensing device; a lens module disposed between the transparent cover and the light sensor; a piezoelectric element disposed at an edge of the transparent cover in the interior space of the light sensing device; and a sealing material having flexibility and rigidity, having a ring sheet shape, disposed between an edge of the transparent cover and an edge of the piezoelectric element, and extending and fixed to the housing to seal the interior space of the light sensing device, a heating element disposed between the transparent cover and the sealing material; wherein the piezoelectric element vibrates, the vibration is transmitted to the transparent cover through the sealing material to remove foreign matter from the transparent cover, the heating element generates heat energy, the heat energy is transmitted to the transparent cover through the sealing material to remove fine liquid beads from the transparent cover. The heating element is disposed between the transparent cover and the sealing material.

2. The light sensing device heating improvement structure capable of automatically removing foreign matter according to claim 1, characterized by The lens module is disposed at the opening, and the lens module includes:

3. The self-cleanable photovoltaic device of claim 1, wherein the transparent conductive oxide layer is a transparent conductive oxide layer having a thickness of about 100 nm to about 500 nm. a top side lens, which is the transparent cover of the light sensing device, and is disposed at an outermost side of the lens module relative to the interior space of the light sensing device; a lateral side housing, the housing of the light sensing device further includes the lateral side housing, the top side lens and the housing of the light sensing device including the lateral side housing collectively define the interior space of the light sensing device; a bottom side lens disposed at an opposite side of the top side lens, the top side lens, the lateral side housing and the bottom side lens collectively define an interior space of the lens module; and one or more internal lenses disposed between the top side lens and the bottom side lens in the interior space of the lens module, the heating element is disposed between the top side lens and the sealing material; wherein the piezoelectric element is disposed at an edge of the top side lens in the interior space of the lens module; the sealing material is disposed between an edge of the top side lens and an edge of the piezoelectric element, and extends and is fixed to the lateral side housing to seal the interior space of the light sensing device; and wherein the piezoelectric element vibrates, the vibration is transmitted to the top side lens through the sealing material to remove foreign matter from the top side lens, the heating element generates heat energy, the heat energy is transmitted to the top side lens through the sealing material to remove fine liquid beads from the top side lens. The heating element is disposed between the top side lens and the sealing material.

4. The light sensing device heating improvement structure capable of automatically removing foreign matter according to claim 3, characterized by The light sensing device further includes a soft shielding material having a ring sheet shape and disposed outside the housing and the transparent cover to shield a gap between the housing, the transparent cover and the sealing material.

5. The self-cleaning photodetector heating improvement structure according to claim 1 or 2, wherein ​ 6. The light sensing device heating improvement structure capable of automatically removing foreign matter according to claim 3 or 4, wherein The light sensing device further comprises a soft shielding material having a ring sheet shape and disposed outside the housing and the transparent protective cover to shield the gap between the housing, the transparent protective cover and the sealing material.

7. The self-cleanable photovoltaic device of any one of claims 1 to 4, wherein the self-cleanable photovoltaic device is a solar cell. The improved structure further comprises a heat insulation buffer element disposed between the piezoelectric element and the sealing material and combined with the piezoelectric element and the sealing material respectively.

8. The self-cleanable photovoltaic device of any one of claims 1-4, wherein the device is a photovoltaic device. The improved structure further comprises a heat insulation buffer element disposed between the piezoelectric element and the heating element and combined with the heating element and the piezoelectric element respectively.

9. The self-cleanable photovoltaic device of any one of claims 1 to 4, wherein the self-cleanable photovoltaic device is a solar cell. The improved structure further comprises a heat insulation buffer element disposed below the piezoelectric element and combined with the piezoelectric element. The improved structure further comprises a heat insulation buffer element disposed below the piezoelectric element and combined with the piezoelectric element.

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