High-reliability gallium nitride power device
Gallium nitride power devices, through the synergistic effect of multiple heat dissipation methods, solve the problem of poor heat dissipation in high-temperature environments, achieve continuous cyclic cooling, and ensure the stable operation and reliability of the chip under high-temperature conditions.
Patent Information
- Application Number
- CN202423056849.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-11
AI Technical Summary
Existing gallium nitride power devices have poor heat dissipation performance in high-temperature environments, which can easily lead to chip damage and affect the normal operation and lifespan of the equipment.
Multiple heat dissipation methods work together, including a bottom square ring that tightly fits the chip, a serpentine liquid cooling pipe for circulating cooling, heat conduction pillars for uniform heat transfer, a cooling fan to accelerate airflow, an upper square ring to increase the heat dissipation area, and a limiting card to stabilize the structure, forming a continuous circulating cooling system.
It effectively ensures the stable operation of the chip in high-temperature environments, prevents overheating damage, improves heat dissipation efficiency and reliability, and ensures that the equipment continues to work reliably under high-temperature conditions.
Smart Images
Figure CN223566618U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component technology, specifically to a highly reliable gallium nitride power device. Background Technology
[0002] Gallium nitride (GaN) power devices are electronic devices made from gallium nitride (GaN) material, primarily used for power processing and conversion. Gallium nitride is a wide-bandgap semiconductor material. Compared to traditional silicon, it has a wider bandgap. In power device applications, this allows GaN power devices to withstand higher voltages, temperatures, and electric field strengths. Gallium nitride chips are a common type of GaN power device. These chips perform exceptionally well in high-frequency, high-efficiency power conversion scenarios. For example, in devices such as power adapters and electric vehicle charging stations, GaN chips can effectively reduce size, lower energy consumption, and improve power conversion efficiency.
[0003] Gallium nitride (GaN) chips generate considerable heat during operation, especially under high power and prolonged periods. Currently, cooling fans are commonly used to dissipate heat from GaN chips and other electronic components. However, when the operating area temperature is too high, the cooling capacity of these fans becomes insufficient, with minimal effect. In such cases, the excessive heat cannot be dissipated in time, potentially causing the GaN chip to overheat and damage, thus affecting the normal operation of the entire electronic device and possibly shortening its lifespan. Utility Model Content
[0004] To address the aforementioned problems, this invention proposes a highly reliable gallium nitride power device that can continuously and cyclically cool gallium nitride chips in high-temperature environments.
[0005] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is: a high-reliability gallium nitride power device, comprising:
[0006] Gallium nitride (GaN) chips have pins on both sides for connecting to a circuit board.
[0007] The bottom square is bonded to the perimeter of the gallium nitride chip using high-temperature resistant adhesive.
[0008] The upper square ring is welded to the bottom square ring via heat-conducting pillars; an arched plate is welded on the upper square ring, and a cooling fan is provided in the middle of the arched plate;
[0009] A serpentine liquid cooling tube runs through both sides of the bottom square ring and is connected to an external coolant supply device. Its middle part is in contact with the top of the gallium nitride chip, and its two ends are in contact with the pins through contact blocks. Limiting clips are provided between the two ends of the serpentine liquid cooling tube and the bottom square ring.
[0010] Further, the upper square ring is provided with grooves on both sides for increasing the heat dissipation area.
[0011] Further, the upper square ring is provided with long cut holes on the front and rear sides for reducing the weight.
[0012] Further, the lower surface of the contact block is attached to the upper surface of the pin.
[0013] Further, the limiting clamping piece comprises a supporting part and a clamping part, the supporting part is a flat arc-shaped metal plate with strong elasticity and is not easy to deform, and the clamping part clamps the two end parts of the serpentine liquid cooling pipe.
[0014] Further, the heat conduction columns are distributed on the upper circumferential part of the bottom square ring and are equidistantly arranged.
[0015] The gallium nitride power device has the advantages of coping with high temperature environment and continuously circulating cooling. The multiple heat dissipation modes are cooperated to effectively guarantee the stable operation of the chip in the high temperature environment. The bottom square ring closely contacts the chip to receive heat and lays a foundation for heat dissipation. The serpentine liquid cooling pipe directly contacts the chip and utilizes the circulating cooling liquid to quickly take away a large amount of heat. Especially when working for a long time, the chip heat can be continuously transferred out to ensure that the temperature of the chip is not too high. The heat dissipation fan accelerates the air flow, cooperates with the liquid cooling pipe and further enhances the heat dissipation effect. The heat conduction columns uniformly transfer heat to quickly spread to the upper square ring, the grooves of the upper square ring increase the heat dissipation area and improve the heat dissipation efficiency. The limiting clamping piece guarantees that the serpentine liquid cooling pipe is stable and adapts to thermal expansion and cold contraction, and ensures the reliability of the circulating cooling liquid. The long cut holes reduce the weight without affecting the heat dissipation and structural strength, and the gallium nitride chip is efficiently, continuously and circularly cooled in the whole body, so that the chip can reliably work in the high temperature environment. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is the three-dimensional view of the utility model Figure One ;
[0017] Figure 2 is the three-dimensional view of the utility model Figure Two ;
[0018] Figure 3 is the plan view of the utility model
[0019] Figure 4 is the front view of the utility model.
[0020] As shown in the figure: 1, gallium nitride chip; 2, bottom square ring; 3, upper square ring; 4, serpentine liquid cooling pipe; 5, groove; 6, long cutout hole; 7, limiting clamp; 8, heat-conducting column; 9, arched plate; 10, cooling fan; 11, contact block; 12, pin. DETAILED DESCRIPTION
[0021] The utility model will be made further detailed explanation in combination with the drawings.
[0022] In combination with the drawings Figure 1 to the drawings Figure 4 A gallium nitride power device with high reliability comprises:
[0023] The gallium nitride chip 1 is provided with pins 12 for connecting with a circuit board on both sides. The bottom square ring 2 is bonded to the upper peripheral ring of the gallium nitride chip 1 by high-temperature-resistant glue. The high-temperature-resistant glue is bonded to the upper peripheral ring of the gallium nitride chip 1, which can tightly fit the chip and effectively receive the heat generated by the chip during operation, thereby providing a preliminary heat conduction path for the subsequent heat dissipation link, and the high-temperature-resistant glue ensures the stability of the connection in a high-temperature working environment.
[0024] The upper square ring 3 is welded to the bottom square ring 2 by the heat-conducting columns 8, which are distributed on the upper peripheral ring of the bottom square ring 2 and are equidistantly arranged. The heat-conducting columns 8 can uniformly and efficiently transfer the heat from the bottom square ring 2 to the upper square ring 3, thereby realizing rapid diffusion of heat. The arched plate 9 is provided with a cooling fan 10 in the middle, which can accelerate air flow and further enhance the heat dissipation effect, thereby dissipating heat to the surrounding environment in time, reducing the temperature of the device, and improving the working stability and reliability.
[0025] The serpentine liquid cooling pipe 4 penetrates through both sides of the bottom square ring 2 and is connected in communication with an external cooling liquid supply device. The middle part is in contact with the upper surface of the gallium nitride chip 1, and the two end parts are in contact with the pins 12 through the contact blocks 11. The serpentine liquid cooling pipe 4 can directly absorb a large amount of heat generated by the chip and rapidly remove the heat through the circulation of the cooling liquid, thereby greatly improving the heat dissipation efficiency. Especially in the high-power and long-time working state, the serpentine liquid cooling pipe 4 can effectively prevent the chip from overheating and damage. The contact blocks 11 are attached to the upper surface of the pins 12, thereby increasing the contact area and improving the heat transfer efficiency, so that the heat at the pins 12 can also be effectively dissipated.
[0026] The supporting part of the limiting clamping piece 7 is a flat arc-shaped metal plate with strong elasticity and not easy to deform, and the clamping part clamps the two end parts of the serpentine liquid cooling pipe 4, which can not only ensure the stable position of the serpentine liquid cooling pipe 4 and prevent displacement of the serpentine liquid cooling pipe 4 due to vibration or other factors during work, but also ensure good thermal contact and cooling liquid flow, and can also adapt to certain thermal expansion and contraction changes through the elastic properties, thereby improving the reliability and stability of the entire heat dissipation structure. The grooves 5 arranged on both sides of the upper square ring 3 increase the heat dissipation area, so that heat can be dissipated to the surrounding air more quickly, further improving the heat dissipation efficiency, helping to reduce the overall temperature of the device, and ensuring the reliable operation of the gallium nitride power device in a high-temperature environment. The long cutout holes 6 arranged on the front and rear sides of the upper square ring 3 reduce the weight, and under the premise of not affecting the heat dissipation and structural strength of the device, the overall weight is reduced, which is conducive to the lightweight design of the power device, and facilitates installation and use, and also reduces the pressure on the gallium nitride chip 1.
[0027] Working principle: first, the gallium nitride chip 1 is connected with the circuit board through the pins 12 on both sides to realize the transmission of electrical signals. When the gallium nitride chip 1 works, the heat generated by the chip will be accepted by the bottom square ring 2 through the high-temperature resistant glue, and the heat will be evenly and efficiently transmitted to the upper square ring 3 through the equidistantly distributed heat conducting columns 8. At the same time, the serpentine liquid cooling pipe 4 is connected with the external cooling liquid supply device, the middle part is in contact with the chip 1, and the two end parts are in contact with the pins 12 through the contact blocks 11, directly absorbing a large amount of heat generated by the chip and taking away the heat through the cooling liquid circulation, and the limiting clamping piece 7 ensures the stable position of the serpentine liquid cooling pipe 4 and adapts to thermal expansion and contraction. The heat dissipation fan 10 in the middle of the arched plate 9 accelerates air flow, further enhancing the heat dissipation effect, the grooves 5 on both sides of the upper square ring 3 increase the heat dissipation area, and the long cutout holes 6 on the front and rear sides reduce the weight without affecting the heat dissipation and structural strength, thereby ensuring the stable and reliable operation of the gallium nitride power device under various working conditions, preventing the chip from overheating and damaging, and facilitating installation and use, and reducing the pressure on the chip.
[0028] In the description of the present application, it should be pointed out that, unless otherwise specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected, and for ordinary skilled in the art, the specific meaning of the above-mentioned term in the present application can be understood according to the specific circumstances.
[0029] The above describes the present application and its implementation, which is not restrictive, and the embodiment shown in the drawings is only one of the embodiments of the present application, and the actual structure is not limited thereto. In general, if the ordinary skilled in the art is inspired, without departing from the creative purpose of the present application, similar structure and embodiments can be designed without creative design, which should belong to the protection scope of the present application.
Claims
1. A gallium nitride power device with high reliability, characterized by, The utility model relates to a gallium nitride chip (1) which is connected with the circuit board through the pin (12) on both sides, a bottom square ring (2) which is bonded to the upper circular ring of the gallium nitride chip (1) through high-temperature resistant glue, an upper square ring (3) which is welded with the bottom square ring (2) through the heat-conducting column (8), an arc plate (9) which is welded on the upper square ring (3), a cooling fan (10) which is arranged in the middle of the arc plate (9), a serpentine liquid cooling pipe (4) which penetrates through both sides of the bottom square ring (2) and is connected with the external cooling liquid supply device, the middle part of which is in contact with the upper surface of the gallium nitride chip (1), the both end parts of which are in contact with the pin (12) through the contact block (11), and a limiting clamp (7) which is arranged between the both end parts of the serpentine liquid cooling pipe (4) and the bottom square ring (2). The upper square ring (3) is provided with a groove (5) on both sides to increase the heat dissipation area. The upper square ring (3) is provided with a long cutout hole (6) on the front and back sides to reduce the weight. The lower surface of the contact block (11) is attached to the upper surface of the pin (12). The limiting clamp (7) comprises a supporting part and a clamping part, the supporting part is a flat arc-shaped metal plate which is strong in elasticity and difficult to deform, and the clamping part clamps the both end parts of the serpentine liquid cooling pipe (4).
2. The GaN power device of claim 1, wherein: the GaN power device is a GaN HEMT. The heat-conducting columns (8) are arranged at equal intervals on the upper circular ring of the bottom square ring (2).
3. The GaN power device of claim 1, wherein: the GaN power device is a GaN HEMT. 4. The GaN power device of claim 1, wherein: the GaN power device is a GaN HEMT. 5. The GaN power device of claim 1, wherein: the GaN power device is a GaN HEMT. 6. The GaN power device of claim 1, wherein: the GaN power device is a GaN HEMT.