Efficient radiator

Abstract

The utility model relates to the technical field of radiators, in particular to an efficient radiator. Comprising an upper heat-conducting fin block, a lower heat-conducting fin block, an integrated circuit board clamped between the upper heat-conducting fin block and the lower heat-conducting fin block, a plurality of semiconductor chilling plates arranged on the integrated circuit board, a plurality of hot-end cooling fans arranged at the top of the upper heat-conducting fin block, and a plurality of cold-end cooling fans arranged at the bottom of the lower heat-conducting fin block, each semiconductor chilling plate comprises a hot end surface and a cold end surface, the hot end surfaces of the semiconductor chilling plates are uniformly arranged upwards and are in contact with the upper heat conduction fin block, and the cold end surfaces of the semiconductor chilling plates are uniformly arranged downwards and are in contact with the lower heat conduction fin block; compared with a traditional radiator used for household appliances, the heat dissipation efficiency can be greatly improved, and the heat dissipation requirements of some high-power household appliances can be well met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially relates to a kind of high-efficiency radiators. BACKGROUND

[0002] In prior art, the radiator of household appliance is still mostly single heat dissipation fan for heat dissipation, overall heat dissipation efficiency is lower, cannot well meet the heat dissipation demand of some high-power household appliances, and an efficient radiator is urgently needed. UTILITY MODEL CONTENTS

[0003] The utility model discloses a kind of high-efficiency radiators to solve the technical problems in the prior art, can greatly improve heat dissipation efficiency, can well meet the heat dissipation demand of some high-power household appliances.

[0004] To achieve the above object, the technical scheme adopted by the utility model is: a kind of high-efficiency radiators, including upper heat conduction fin block, lower heat conduction fin block, integrated circuit board being clamped between upper heat conduction fin block and lower heat conduction fin block, a plurality of semiconductor refrigeration pieces being arranged on integrated circuit board, a plurality of hot-end heat dissipation fans being arranged on the top of upper heat conduction fin block, a plurality of cold-end heat dissipation fans being arranged on the bottom of lower heat conduction fin block, each semiconductor refrigeration piece includes hot end face, cold end face, the hot end face of each semiconductor refrigeration piece is uniformly set to and contact with upper heat conduction fin block, the cold end face of each semiconductor refrigeration piece is uniformly set to and contact with lower heat conduction fin block.

[0005] Further improvement to the above scheme is that the upper heat conduction fin block includes upper heat conduction base plate and a plurality of upper heat conduction fins arranged on the upper heat conduction base plate, the hot end face of each semiconductor refrigeration piece is in contact with the upper heat conduction base plate, and each hot-end heat dissipation fan is arranged on the upper heat conduction fin.

[0006] Further improvement to the above scheme is that the hot-end heat dissipation fan is used for blowing from bottom to top.

[0007] Further improvement to the above scheme is that the upper heat conduction base plate and each upper heat conduction fin are integrally formed.

[0008] Further improvement to the above scheme is that the lower heat conduction fin block includes lower heat conduction base plate and a plurality of lower heat conduction fins arranged on the lower heat conduction base plate, the cold end face of each semiconductor refrigeration piece is in contact with the lower heat conduction base plate, and each cold-end heat dissipation fan is arranged on the lower heat conduction fin.

[0009] Further improvement to the above scheme is that the cold-end heat dissipation fan is used for blowing from bottom to top.

[0010] Further improvement to the above scheme is that the lower heat conduction base plate and each lower heat conduction fin are integrally formed.

[0011] Further improvement of the above scheme is that the hot-end heat dissipation fans are the same number as the semiconductor refrigeration pieces, the shaft center of each hot-end heat dissipation fan is arranged corresponding to the center position of the corresponding semiconductor refrigeration piece, the cold-end heat dissipation fans are the same number as the semiconductor refrigeration pieces, and the shaft center of each cold-end heat dissipation fan is arranged corresponding to the center position of the corresponding semiconductor refrigeration piece.

[0012] The utility model discares an efficient radiator, including upper heat conduction fin block, lower heat conduction fin block, the integrated circuit board of pinching between upper heat conduction fin block and lower heat conduction fin block, a plurality of semiconductor refrigeration pieces of setting on integrated circuit board, a plurality of hot-end heat dissipation fans of setting in upper heat conduction fin block top, a plurality of cold-end heat dissipation fans of setting in lower heat conduction fin block bottom, each semiconductor refrigeration piece includes hot end face, cold end face respectively, the hot end face of each semiconductor refrigeration piece is uniformly arranged upwards and contacts with upper heat conduction fin block, and the cold end face of each semiconductor refrigeration piece is uniformly arranged downwards and contacts with lower heat conduction fin block.

[0013] When radiating through the utility model, first, the heat generated by the electric appliance is guided to the lower heat conduction fin block and transferred to the cold end face of the semiconductor refrigeration piece through the cold-end heat dissipation fan of the utility model, the heat is transferred from the cold end face to the hot end face of the semiconductor refrigeration piece through the Peltier effect of the semiconductor refrigeration piece, the heat transferred to the hot end face of the semiconductor refrigeration piece is transferred to the upper heat conduction fin block and radiated outward through the hot-end heat dissipation fan. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the structural schematic diagram of the utility model.

[0015] Figure 2 It is the exploded structural schematic diagram of the utility model.

[0016] Figure 3 It is Figure 2 It is the structural schematic diagram of another perspective.

[0017] Mark explanation: upper heat conduction fin block 1, upper heat conduction base plate 11, upper heat conduction fin 12, lower heat conduction fin block 2, lower heat conduction base plate 21, lower heat conduction fin 22, integrated circuit board 3, semiconductor refrigeration piece 4, hot end face 41, cold end face 42, hot-end heat dissipation fan 5, cold-end heat dissipation fan 6. DETAILED DESCRIPTION

[0018] The utility model will be further explained in connection with the drawings, such as Figures 1-3As shown, the utility model of include upper heat conduction fin block 1, lower heat conduction fin block 2, the integrated circuit board 3 of being clamped between upper heat conduction fin block 1 and lower heat conduction fin block 2, a plurality of semiconductor refrigeration piece 4 of being set on integrated circuit board 3, a plurality of hot end heat dissipation fan 5 of being set on the top of upper heat conduction fin block 1, a plurality of cold end heat dissipation fan 6 of being set on the bottom of lower heat conduction fin block 2, each semiconductor refrigeration piece 4 includes hot end face 41, cold end face 42 respectively, the hot end face 41 of each semiconductor refrigeration piece 4 is uniformly set up and is contacted with upper heat conduction fin block 1, the cold end face 42 of each semiconductor refrigeration piece 4 is uniformly set up and is contacted with lower heat conduction fin block 2, when radiating through the utility model, first through the cold end heat dissipation fan 6 of the utility model, the heat that the required emission of electric appliance generates is guided to lower heat conduction fin block 2 and is transmitted to the cold end face 42 of semiconductor refrigeration piece 4, the heat is transmitted to the hot end face 41 of semiconductor refrigeration piece 4 through the peltier effect of semiconductor refrigeration piece 4, the heat transmission to the hot end face 41 of semiconductor refrigeration piece 4 is transmitted to upper heat conduction fin block 1 and is outwardly emitted through hot end heat dissipation fan 5, compared with the conventional radiator for household appliance in the past, the utility model can greatly improve the radiating efficiency, can satisfy the radiating demand of some high-power household appliance well.

[0019] Upper heat conduction fin block 1 includes upper heat conduction base plate 11, a plurality of upper heat conduction fins 12 are set on upper heat conduction base plate 11, the hot end face 41 of each semiconductor refrigeration piece 4 is contacted with upper heat conduction base plate 11 respectively, each hot end heat dissipation fan 5 is set on upper heat conduction fin 12 respectively, the heat on the hot end face 41 of each semiconductor refrigeration piece 4 can be better transmitted to upper heat conduction base plate 11.

[0020] Hot end heat dissipation fan 5 is used for blowing from below to above, the heat on upper heat conduction fin block 1 can be quickly and effectively discharged upwards through hot end heat dissipation fan 5.

[0021] Upper heat conduction base plate 11 and each upper heat conduction fin 12 are integrally formed, not only the overall component quantity is less, but also the heat on upper heat conduction base plate 11 can be better transmitted to each upper heat conduction fin 12.

[0022] Lower heat conduction fin block 2 includes lower heat conduction base plate 21, a plurality of lower heat conduction fins 22 are set on lower heat conduction base plate 21, the cold end face 42 of each semiconductor refrigeration piece 4 is contacted with lower heat conduction base plate 21 respectively, each cold end heat dissipation fan 6 is set on lower heat conduction fin 22 respectively, the heat on lower heat conduction base plate 21 can be better transmitted to the cold end face 42 of each semiconductor refrigeration piece 4.

[0023] The cold end heat dissipation fan 6 is used for blowing from bottom to top, and the required heat dissipated by the electric appliance can be quickly and effectively guided to the lower heat conduction fin block 2.

[0024] The lower heat conduction base plate 21 and each lower heat conduction fin 22 are integrally formed, so that the number of components is small, assembly is facilitated, and the heat on each lower heat conduction fin 22 can be better transferred to the lower heat conduction base plate 21.

[0025] The number of the hot end heat dissipation fans 5 is the same as that of the semiconductor refrigeration pieces 4, the shaft center of each hot end heat dissipation fan 5 is arranged corresponding to the center position of the corresponding semiconductor refrigeration piece 4, the number of the cold end heat dissipation fans 6 is the same as that of the semiconductor refrigeration pieces 4, the shaft center of each cold end heat dissipation fan 6 is arranged corresponding to the center position of the corresponding semiconductor refrigeration piece 4, the overall structure layout is more reasonable, and better heat dissipation effect can be achieved.

[0026] Working principle:

[0027] First, the cold end heat dissipation fan 6 of the utility model is used to guide the heat dissipated by the electric appliance to the lower heat conduction fin block 2 and to the cold end surface 42 of the semiconductor refrigeration piece 4, the heat is transferred from the cold end surface 42 of the semiconductor refrigeration piece 4 to the hot end surface 41 of the semiconductor refrigeration piece 4 through the Peltier effect of the semiconductor refrigeration piece 4, the heat transferred to the hot end surface 41 of the semiconductor refrigeration piece 4 is transferred to the upper heat conduction fin block 1 and is dissipated outward through the hot end heat dissipation fan 5; compared with the traditional heat dissipation device for household appliances, the utility model can greatly improve the heat dissipation efficiency and can well meet the heat dissipation demand of some high-power household appliances.

[0028] Of course, the above-mentioned is only the preferred embodiment of the utility model, so that the equivalent changes or modifications made according to the structure, features and principles of the utility model patent application range are included in the utility model patent application range.

Claims

1. A high-efficiency heat sink, characterized in that: The device includes an upper heat-conducting fin (1), a lower heat-conducting fin (2), an integrated circuit board (3) sandwiched between the upper heat-conducting fin (1) and the lower heat-conducting fin (2), a plurality of semiconductor cooling chips (4) disposed on the integrated circuit board (3), a plurality of hot-end cooling fans (5) disposed on the top of the upper heat-conducting fin (1), and a plurality of cold-end cooling fans (6) disposed on the bottom of the lower heat-conducting fin (2). Each of the semiconductor cooling chips (4) includes a hot end face (41) and a cold end face (42). The hot end face (41) of each semiconductor cooling chip (4) is uniformly arranged facing upward and in contact with the upper heat-conducting fin (1), and the cold end face (42) of each semiconductor cooling chip (4) is uniformly arranged facing downward and in contact with the lower heat-conducting fin (2).

2. The high-efficiency heat sink according to claim 1, characterized in that: The upper heat-conducting fin block (1) includes an upper heat-conducting substrate (11) and a plurality of upper heat-conducting fins (12) disposed on the upper heat-conducting substrate (11). The hot end face (41) of each semiconductor cooling chip (4) is in contact with the upper heat-conducting substrate (11), and each hot end cooling fan (5) is disposed on the upper heat-conducting fin (12).

3. The high-efficiency heat sink according to claim 2, characterized in that: The hot-end cooling fan (5) is used to blow air from bottom to top.

4. A high-efficiency heat sink according to claim 2, characterized in that: The upper heat-conducting substrate (11) and each upper heat-conducting fin (12) are integrally formed.

5. A high-efficiency heat sink according to claim 1, characterized in that: The lower heat-conducting fin block (2) includes a lower heat-conducting substrate (21) and a plurality of lower heat-conducting fins (22) disposed on the lower heat-conducting substrate (21). The cold end face (42) of each semiconductor cooling chip (4) is in contact with the lower heat-conducting substrate (21), and each cold end heat dissipation fan (6) is disposed on the lower heat-conducting fin (22).

6. A high-efficiency heat sink according to claim 5, characterized in that: The cold end cooling fan (6) is used to blow air from bottom to top.

7. A high-efficiency radiator according to claim 5, characterized in that: The lower heat-conducting substrate (21) and each lower heat-conducting fin (22) are integrally formed.

8. A high-efficiency radiator according to any one of claims 1-7, characterized in that: The number of hot-end cooling fans (5) is the same as the number of thermoelectric coolers (4), and the axis of each hot-end cooling fan (5) is respectively set to correspond to the center position of the corresponding thermoelectric cooler (4). The number of cold-end cooling fans (6) is the same as the number of thermoelectric coolers (4), and the axis of each cold-end cooling fan (6) is respectively set to correspond to the center position of the corresponding thermoelectric cooler (4).

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