Heat dissipation structure of power supply module

Abstract

The utility model discloses a power supply module heat radiation structure, which comprises a power supply module, an air supply plate, fixing pieces arranged on two sides of the air supply plate, an air supply mechanism arranged outside the air supply plate, a sealing shell arranged outside the air supply plate and close to the air supply mechanism, an output pipe arranged outside the sealing shell, and a connecting pipe arranged at the top of the sealing shell, the air supply mechanism is specifically composed of an input fan, an exhaust pipe and an air inlet pipe. Through the air supply plate, the sealing shell, the output pipe, the connecting pipe and the semiconductor chilling plate, heat generated in the process of the semiconductor chilling plate can be directly discharged out of equipment, and the heat generated by the semiconductor chilling plate is prevented from influencing a power module; the mode of filling heat conduction liquid is not used for temperature conduction cooling any more, the hidden danger that the heat conduction liquid leaks out is avoided, the cooling effect is achieved by reducing the temperature of air and controlling flowing of the air, and later maintenance is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model belongs to power module heat dissipation technical field especially relates to a power module heat dissipation structure. BACKGROUND

[0002] The power module is a kind of power function component that power function parts are zeroized, can be directly mounted or installed on printed circuit board by connector, to power supply for various electronic devices in each load, can greatly simplify the power design of electronic application system.

[0003] Prior art has the following shortcomings: prior art application number 202320624474.8 proposes a kind of power module heat dissipation structure, including the heat dissipation insulating film that can be laid on the heat generation surface of power module, further including semiconductor refrigerating sheet, the edge of heat dissipation insulating film and the edge of semiconductor refrigerating sheet heat absorption surface edge portion sealed connection, and heat dissipation insulating film and semiconductor refrigerating sheet constitute a closed cavity, the closed cavity is filled with heat-conducting liquid.The utility model because the setting of semiconductor refrigerating sheet makes heat dissipation insulating film quickly drop, guarantees that heat dissipation insulating film always exists greater temperature difference between power module heat generation surface, to improve the cooling efficiency of power module;Because the closed cavity is filled with heat-conducting liquid makes semiconductor refrigerating sheet heat absorption surface and heat dissipation insulating film between there is no gas interval, can effectively improve the cooling of semiconductor refrigerating sheet to heat dissipation insulating film.

[0004] The above-mentioned equipment adopts semiconductor refrigerating sheet, heat-conducting liquid and coaming, and reaches the effect of heat dissipation of heat dissipation fan, since the back of semiconductor refrigerating sheet generates heat in the process of refrigeration, current heat will accumulate in the upper portion of shell, and the heat generated by the back of semiconductor refrigerating sheet cannot be discharged only by a group of heat dissipation fans, and after power module is installed, it is in the interior of equipment, and the heat generated by the back of semiconductor refrigerating sheet cannot be discharged to the exterior of equipment by single heat dissipation fan, simultaneously, semiconductor refrigerating sheet, heat dissipation insulating film and coaming are sealed and filled with heat-conducting liquid between semiconductor refrigerating sheet and heat dissipation insulating film, coaming is not integrally formed between semiconductor refrigerating sheet, heat dissipation insulating film and coaming, and the sealing structure is reduced after long-term use, and even heat dissipation insulating film is damaged, which will cause heat-conducting liquid to leak, affect the normal use of power module and the filling mode of heat-conducting liquid is inconvenient for later maintenance.

[0005] It should be noted that the above content belongs to the technical cognition of the inventor and does not necessarily constitute prior art. UTILITY MODEL CONTENT

[0006] In view of the deficiencies of the prior art, the utility model provides a kind of power module heat dissipation structure to solve the problems raised in the above background art.

[0007] To achieve the above object, the utility model provides a kind of power module heat dissipation structure, including power module, air supply plate, the air supply plate both sides are provided with fixing piece, the air supply plate outside is provided with air supply mechanism, the air supply plate outside is close to air supply mechanism and is provided with sealing shell, the sealing shell outside is provided with output pipe, the sealing shell top is provided with link pipe, the air supply plate inside is provided with communicating short pipe, the sealing shell bottom is provided with semiconductor refrigeration sheet, the power module top is provided with exhaust hole;

[0008] The air supply mechanism is specifically composed of an input fan, an exhaust pipe and an air inlet pipe.

[0009] In one example, the air supply plate is internally hollow, and a sealed space is formed between the sealing shell and the semiconductor refrigeration sheet.

[0010] In one example, the fixing piece is fixedly installed on both sides of the air supply plate, and the fixing piece is fixedly installed on the outside of the power module by bolts.

[0011] In one example, holes suitable for the communicating short pipes are formed on the outside of the power module and correspond to the positions of the communicating short pipes, and three groups of communicating short pipes are provided on the air supply plate.

[0012] In one example, the exhaust pipe is fixedly installed on one side of the input fan, the air inlet pipe is fixedly installed on the other side of the input fan, and the exhaust pipe is fixedly installed on the outside of the air supply plate and communicates with the inside of the air supply plate.

[0013] In one example, the semiconductor refrigeration sheet is fixedly installed on the bottom of the sealing shell and sealed with the sealing shell, the refrigeration surface of the semiconductor refrigeration sheet faces outward, one side of the sealing shell where the semiconductor refrigeration sheet is installed is fixedly installed on the outside of the air supply plate, the refrigeration surface of the semiconductor refrigeration sheet contacts the air supply plate, the output pipe is fixedly installed on the outside of the sealing shell and communicates with the inside of the sealing shell, and the two ends of the link pipe respectively communicate with the inside of the sealing shell and the inside of the air supply plate.

[0014] In one example, the air supply plate is specifically made of copper, the outside of the air supply plate is coated with a graphene film, the connecting end of the semiconductor refrigeration sheet is connected to the power supply mechanism in the power module through a connecting line passing through the communicating short pipe, the connecting end of the input fan is connected to the power supply mechanism in the power module through a connecting line passing through the exhaust pipe and the communicating short pipe, the sealing shell and the air supply plate each have two groups and have consistent structures and installation structures, and the output pipe and the air inlet pipe are both flexible pipes with lengths adjusted according to actual needs.

[0015] The power module heat dissipation structure can bring the following beneficial effects:

[0016] 1、The power module heat dissipation structure, by setting the air supply plate, the sealed shell, the output pipe, the connecting pipe, the semiconductor refrigeration piece, the heat generated by the semiconductor refrigeration piece back will be gathered in the sealed shell, the low-temperature air formed under the action of the semiconductor refrigeration piece in the air supply plate will be input into the sealed shell from the connecting pipe, and the hot air and the low-temperature air in the sealed shell are neutralized, and the air in the sealed shell is full after being discharged to the outside of the equipment through the output pipe, so that the heat generated in the process of using the semiconductor refrigeration piece can be directly discharged to the outside of the equipment, and the heat generated by the semiconductor refrigeration piece does not affect the power module.

[0017] 2、The power module heat dissipation structure, by setting the air supply plate, the air supply mechanism, the communication short pipe, the semiconductor refrigeration piece, the air outlet, when the power module runs to generate temperature, the side of the semiconductor refrigeration piece for refrigeration contacts the air supply plate coated with graphite film, the low-temperature generated by the semiconductor refrigeration piece is rapidly conducted to the whole air supply plate, the input fan extracts the air in the air supply plate from the outside through the air inlet pipe, the air temperature in the air supply plate will be lowered under the refrigeration action of the semiconductor refrigeration piece, low-temperature air is formed, part of which will enter the inside of the power module from the communication short pipe, the low-temperature air flows in the power module, so that the hot air in the power module is neutralized, and finally discharged from the air outlet, without using the method of filling the heat-conducting liquid to conduct temperature and reduce temperature, avoiding the hidden danger of leakage of the heat-conducting liquid, reducing the temperature of the air and controlling the flow of the air to achieve the effect of cooling, and facilitating the later maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings described herein are used to provide further understanding of the utility model and constitute a part of the utility model, and the illustrative embodiments of the utility model and the description thereof are used to explain the utility model and do not constitute improper limitation on the utility model. In the drawings:

[0019] Fig. 1 It is the heat dissipation structure of the power module heat dissipation structure of the utility model.

[0020] Fig. 2 It is the communication short pipe installation position schematic view of the power module heat dissipation structure of the utility model.

[0021] Fig. 3 It is the semiconductor refrigeration piece installation position schematic view of the power module heat dissipation structure of the utility model.

[0022] Fig. 4 It is the air supply mechanism structure schematic view of the power module heat dissipation structure of the utility model.

[0023] In the figure: 1, power module; 2, air supply plate; 3, fixing piece; 4, air supply mechanism; 401, input fan; 402, exhaust pipe; 403, air inlet pipe; 5, sealed shell; 6, output pipe; 7, connecting pipe; 8, communication short pipe; 9, semiconductor refrigeration piece; 10, exhaust hole. DETAILED DESCRIPTION

[0024] In order to more clearly illustrate the overall concept of the utility model, the following will be described in detail with reference to the accompanying drawings.

[0025] In the description of the utility model, it is understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model.

[0026] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0027] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection, or communication; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0028] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "a solution," "some solutions," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that solution or example is included in at least one solution or example of this invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same solution or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more solutions or examples.

[0029] like Figs. 1-4 As shown, an embodiment of this utility model proposes a heat dissipation structure for a power module, which includes a power module 1, an air supply plate 2, fixing members 3 on both sides of the air supply plate 2, an air supply mechanism 4 on the outside of the air supply plate 2, a sealing shell 5 on the outside of the air supply plate 2 near the air supply mechanism 4, an output pipe 6 on the outside of the sealing shell 5, a connecting pipe 7 on the top of the sealing shell 5, a connecting short pipe 8 on the inside of the air supply plate 2, a semiconductor cooling chip 9 on the bottom of the sealing shell 5, and an exhaust hole 10 on the top of the power module 1.

[0030] The thermoelectric cooler 9 can cool and reduce the air flowing inside the air supply plate 2. The sealing shell 5 can prevent the heat generated by the thermoelectric cooler 9 from dissipating. The output pipe 6 can transport the heat generated by the thermoelectric cooler 9 in the sealing shell 5 to the outside of the equipment.

[0031] The air supply mechanism 4 is specifically composed of an input fan 401, an exhaust pipe 402 and an air inlet pipe 403. An exhaust pipe 402 is provided on one side of the input fan 401 and an air inlet pipe 403 is provided on the other side of the input fan 401.

[0032] The exhaust pipe 402 and the air intake pipe 403 facilitate the input of external air into the air supply plate 2 by the fan 401.

[0033] Specifically, the air supply plate 2 has a hollow interior, and a sealed space is formed between the sealing shell 5 and the semiconductor cooling chip 9. The air supply plate 2 can combine with the semiconductor cooling chip 9 to generate low-temperature air and deliver it to the power module 1.

[0034] Specifically, the fastener 3 is fixedly installed on both sides of the air supply plate 2. The fastener 3 is fixedly installed on the outside of the power module 1 by bolts. The fastener 3 facilitates the fixed installation of the air supply plate 2.

[0035] Specifically, the power module 1 is provided with a hole corresponding to the communicating short pipe 8, and the communicating short pipe 8 is fixedly installed on the inner side of the air supply plate 2 and communicates with the inside of the air supply plate 2, and the other end of the communicating short pipe 8 is inserted into the outer side of the power module 1 and communicates with the inside of the power module 1, so that the low-temperature air in the air supply plate 2 can be conveniently transported into the power module 1 through the communicating short pipe 8.

[0036] Specifically, the exhaust pipe 402 is fixedly installed on one side of the input fan 401, and the air inlet pipe 403 is fixedly installed on the other side of the input fan 401, and the exhaust pipe 402 is fixedly installed on the outside of the air supply plate 2 and communicates with the inside of the air supply plate 2, so that the input fan 401 can provide power for extracting external air.

[0037] Specifically, the semiconductor refrigeration piece 9 is fixedly installed on the bottom of the sealed shell 5 and sealed between the sealed shell 5, the refrigeration surface of the semiconductor refrigeration piece 9 faces outward, one side of the sealed shell 5 on which the semiconductor refrigeration piece 9 is installed is fixedly installed on the outside of the air supply plate 2, the refrigeration surface of the semiconductor refrigeration piece 9 contacts the air supply plate 2, the output pipe 6 is fixedly installed on the outside of the sealed shell 5 and communicates with the inside of the sealed shell 5, and the two ends of the connecting pipe 7 respectively communicate with the inside of the sealed shell 5 and the inside of the air supply plate 2, so that the low-temperature air in the air supply plate 2 can conveniently enter the sealed shell 5 through the connecting pipe 7.

[0038] Specifically, the air supply plate 2 is made of copper, the outer side of the air supply plate 2 is covered with a graphene film, the connecting end of the semiconductor refrigeration piece 9 is connected with the power supply mechanism in the power module 1 through the connecting line passing through the communicating short pipe 8, the connecting end of the input fan 401 is connected with the power supply mechanism in the power module 1 through the connecting line passing through the exhaust pipe 402 and the communicating short pipe 8, the sealed shell 5 and the air supply plate 2 each have two groups and have consistent structures and installation structures, the output pipe 6 and the air inlet pipe 403 are both flexible pipes and have lengths adjusted according to actual needs, and the input fan 401 can conveniently input the extracted external air into the air supply plate 2 through the exhaust pipe 402.

[0039] Working principle: in actual use, the power module 1 is installed in the corresponding equipment through the current conventional installation method, six circular holes are provided on the equipment shell in which the power module 1 is installed and correspond to four output pipes 6 and two air inlet pipes 403, and the output pipes 6 and the air inlet pipes 403 on both sides are extended outside the equipment through the corresponding circular holes during installation of the power module 1.

[0040] When the power module 1 runs to generate temperature, the power module 1 drives the input fan 401 and the semiconductor refrigeration piece 9 to run, the semiconductor refrigeration piece 9 is in contact with the copper and the air supply plate 2 of the graphite film-coated air supply plate 2, the low temperature generated by the semiconductor refrigeration piece 9 is rapidly conducted to the whole air supply plate 2, the input fan 401 extracts the external air through the air inlet pipe 403 and transports to the inside of the air supply plate 2 through the air outlet pipe 402, the temperature of the air entering the air supply plate 2 under the refrigeration of the semiconductor refrigeration piece 9 will be reduced, forming low-temperature air, after the air in the air supply plate 2 is full, a part will enter the inside of the power module 1 from the communication short pipe 8, the low-temperature air flows in the power module 1, the hot air in the power module 1 is neutralized, and finally is discharged from the air outlet hole 10, the temperature conduction cooling by filling the heat-conducting liquid is no longer used, the hidden danger of leakage of the heat-conducting liquid is avoided, the cooling effect is achieved by reducing the temperature of the air and controlling the flow of the air, and the later maintenance is facilitated.

[0041] The heat generated by the semiconductor refrigeration piece 9 will be gathered in the sealed shell 5, another part of the low-temperature air formed in the air supply plate 2 under the action of the semiconductor refrigeration piece 9 will be input into the sealed shell 5 from the connecting pipe 7, and the hot air and the low-temperature air in the sealed shell 5 are neutralized, after the air in the sealed shell 5 is full, the air is discharged to the outside of the equipment through the output pipe 6, the heat generated in the process of using the semiconductor refrigeration piece 9 can be directly discharged to the outside of the equipment, and the influence of the heat generated by the semiconductor refrigeration piece 9 on the power module 1 is avoided.

[0042] Each of the embodiments in the specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment mainly describes the difference from other embodiments. Especially, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the related parts can be referred to the part of the method embodiment.

[0043] The above only describes the embodiments of the utility model, and is not used to limit the utility model. For those skilled in the art, the utility model can have various changes and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the scope of claims of the utility model.

Claims

1. A power module heat dissipation structure, characterized by, The utility model provides an air supply device, including power module (1), air supply plate (2), the both sides of air supply plate (2) are provided with fixing piece (3), air supply plate (2) outside is provided with air supply mechanism (4), air supply plate (2) outside is close to air supply mechanism (4) and is provided with sealed shell (5), sealed shell (5) outside is provided with output pipe (6), sealed shell (5) top is provided with link pipe (7), air supply plate (2) inside is provided with communicating short pipe (8), sealed shell (5) bottom is provided with semiconductor refrigerating sheet (9), power module (1) top is provided with exhaust hole (10), The air supply mechanism (4) is specifically composed of an input fan (401), an exhaust pipe (402) and an air inlet pipe (403), one side of the input fan (401) is provided with the exhaust pipe (402), and the other side of the input fan (401) is provided with the air inlet pipe (403).

2. The power module heat sink structure of claim 1, wherein, The air supply plate (2) is in a hollow state, and a sealed space is formed between the sealed shell (5) and the semiconductor refrigerating sheet (9).

3. The power module heat sink structure of claim 1, wherein, The fixing piece (3) is fixedly installed on the both sides of the air supply plate (2), and the fixing piece (3) is fixedly installed on the outer side of the power module (1) by bolts.

4. The power module heat sink structure of claim 1, wherein, The outer side of the power module (1) is provided with a hole matched with the communicating short pipe (8) and corresponding to the position of the communicating short pipe (8), and the air supply plate (2) is provided with three groups of communicating short pipes (8) in total.

5. The power module heat sink structure of claim 1, wherein, The exhaust pipe (402) is fixedly installed on one side of the input fan (401), the air inlet pipe (403) is fixedly installed on the other side of the input fan (401), and the exhaust pipe (402) is fixedly installed on the outer side of the air supply plate (2) and communicates with the inside of the air supply plate (2).

6. The power module heat sink structure of claim 1, wherein, The semiconductor refrigerating sheet (9) is fixedly installed on the bottom of the sealed shell (5) and sealed with the sealed shell (5), the refrigeration surface of the semiconductor refrigerating sheet (9) faces outward, one side of the sealed shell (5) on which the semiconductor refrigerating sheet (9) is installed is fixedly installed on the outer side of the air supply plate (2), the refrigeration surface of the semiconductor refrigerating sheet (9) contacts the air supply plate (2), the output pipe (6) is fixedly installed on the outer side of the sealed shell (5) and communicates with the inside of the sealed shell (5), and the two ends of the link pipe (7) respectively communicate with the inside of the sealed shell (5) and the inside of the air supply plate (2).

7. The power module heat sink structure of claim 1, wherein, The air supply plate (2) is made of copper, the outer side of the air supply plate (2) is coated with a graphene film, the connecting end of the semiconductor refrigeration sheet (9) is connected with the power supply mechanism in the power module (1) through the communication short pipe (8) and the connecting line, the connecting end of the input fan (401) is connected with the power supply mechanism in the power module (1) through the exhaust pipe (402), the communication short pipe (8) and the connecting line, the sealing shell (5) and the air supply plate (2) are both provided with two groups and have the same structure and mounting structure, and the output pipe (6) and the air inlet pipe (403) are both flexible pipes with the length being adjusted according to actual requirements.

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