Vehicle-mounted domain controller with heat dissipation shell

Abstract

The utility model provides a vehicle-mounted domain controller with a heat dissipation shell, which comprises the shell and a mainboard arranged in the shell, the mainboard is provided with a chip, the upper part of the shell is provided with a contact part, the lower surface of the contact part is in vertical contact with the chip through a heat-conducting medium, and the upper surface of the contact part is provided with a heat dissipation structure. According to the utility model, the contact part is formed at the upper part of the shell, the contact part is in vertical contact with the chip through the heat-conducting medium, heat generated by the chip is transferred to the contact part, the heat dissipation structure on the upper surface of the contact part is used for heat dissipation, and the heat dissipation effect is good.

Description

TECHNICAL FIELD

[0001] The utility model belongs to vehicle area controller technical field, especially relate to a shell heat dissipation's vehicle area controller. BACKGROUND

[0002] Vehicle area controller (Domain Control Unit, DCU) is an important component in the automobile electronic and electrical architecture, which represents an important symbol of the evolution of automobile from distributed ECU architecture to domain centralized EE architecture. The domain controller is mainly responsible for integrating similar and separated ECU functions into a more powerful processor hardware platform than ECU.

[0003] The existing vehicle area controller has poor heat dissipation effect on the internal chip, which affects its performance and shortens its service life. SUMMARY

[0004] Therefore, in view of the above technical problems, the utility model provides a shell heat dissipation's vehicle area controller.

[0005] To solve the above technical problems, the utility model adopts the following technical scheme:

[0006] A shell heat dissipation's vehicle area controller, including shell and mainboard arranged in the shell, the mainboard has a chip, characterized by, the upper part of the shell has a contact part, the lower surface of the contact part is in contact with the chip through the heat conducting medium, and the upper surface of the contact part has a heat dissipation structure.

[0007] The utility model forms the contact part on the upper part of the shell, the heat generated by the chip is transmitted to the contact part through the heat conducting medium and the contact of the chip, and the heat dissipation structure on the upper surface of the contact part is used for heat dissipation, so that the heat dissipation effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 It is the explosion map of the shell heat dissipation's vehicle area controller of the utility model;

[0009] Figure 2 It is the plan view of the shell heat dissipation's vehicle area controller of the utility model;

[0010] Figure 3 It is Figure 2 A-A sectional view of the shell heat dissipation's vehicle area controller of the utility model. DETAILED DESCRIPTION

[0011] The embodiments of the utility model will be described below in conjunction with the drawings of the specification. It should be noted that the embodiments involved in the specification are not exhaustive, and do not represent the only embodiment of the utility model. The following examples are only for the purpose of clearly explaining the utility model content of the utility model patent, and are not limited to the embodiments. For ordinary skilled persons in the field, different forms of changes and modifications can be made on the basis of the example description, and any changes or modifications within the scope of the technical concept and utility model content of the utility model are also within the protection scope of the utility model.

[0012] As shown in Figure 1 and Figure 2 The utility model embodiment provides a shell heat dissipation's vehicle control ware of area, including shell 1100, mainboard 1200 and antenna 1300.

[0013] Shell 1100 includes upper shell body 1110 and lower cover plate 1120, and the inside is provided with mainboard 1200, and upper shell body 1110, mainboard 1200 and lower cover plate 1120 are fixed by screw.

[0014] As shown in Figure 3 The top of upper shell body 1110 includes first plate 1111, second plate 1112 and vertical connecting plate 1113, and first plate 1111 and second plate 1112 are horizontally arranged left and right, and first plate 1111 is used as contact part and is used for contacting chip 1210 on mainboard 1200, and it is lower than second plate 1112, and both are connected by vertical connecting plate 1113.

[0015] Among them, upper shell body 1110 is metal die casting shell, such as can adopt ALS i 12Cu1 material.

[0016] Die casting has no process opening, can have better electromagnetic compatibility, and the die casting structure is once formed by a mold, is higher in strength, is not easy to deform, and the post-process is machining (CNC), so the plasticity of the structure is stronger, can reduce assembly steps (including screw), and shorten the whole assembly process flow. And the upper shell body of the existing vehicle control ware of area is usually sheet metal part, and is double-layer plate, needs many screws to fix, and the sheet metal is easy to deform, affects assembly efficiency, and in addition, the sheet metal part is too many openings due to process limitation (stamping process, needs to reserve the process opening of stamping die), and the electromagnetic compatibility is not good.

[0017] First plate 1111 is concave to the position of chip 1210, and lower convex surface 1111a is formed on its lower surface, and lower convex surface 1111a is in contact with chip 1210 through heat conduction medium 1211.

[0018] Among them, heat conduction medium 1211 is heat conduction pad or heat conduction glue layer.

[0019] The upper surface of the contact part (i.e., the first plate 1111) has a heat dissipation structure, which facilitates heat dissipation of the chip 1210 and has a good heat dissipation effect.

[0020] Specifically, as shown in Figures 1-3 The heat dissipation structure includes a plurality of heat dissipation fins 1114 in the up-down direction and a heat dissipation fan 1115, the plurality of heat dissipation fins are arranged in parallel in the left-right direction, and a heat dissipation air duct is formed between adjacent heat dissipation fins.

[0021] The upper surface of the contact part forms a support part 1111b located on the left and right sides of the plurality of heat dissipation fins 1114, which can be a support piece in the up-down direction, and the heat dissipation fan 1115 is located on the front side of the plurality of heat dissipation fins, i.e., the front end of the heat dissipation air duct, and is fixed to the support part 1111b by a screw.

[0022] The lead of the heat dissipation fan 1115 is electrically connected to the main board 1200 inside the shell 1100.

[0023] It can be understood that the plurality of heat dissipation fins can also be arranged in parallel in other directions, and the heat dissipation fan 1115 can also be arranged at the rear end of the heat dissipation air duct and fixed to the upper surface of the contact part in other ways.

[0024] The heat dissipation structure described above dissipates heat for the chip 1210 by the heat dissipation fins 1114, and at the same time, the heat dissipation fan 1115 directly blows on the heat dissipation fins 1114, thereby improving the heat dissipation efficiency.

[0025] Due to the high height of the second plate 1112, the height of the inner cavity of the upper shell 1110 is also high, which facilitates the layout of high devices therein.

[0026] The left edge of the upper shell 1110 forms a mounting pin 1115 extending horizontally to the left, which is used for cooperation and fixation with an environmental part in the vehicle.

[0027] The antenna 1300 is used for communication with a terminal device and can be a built-in antenna, the number of which is two, and both are arranged on the second plate 1112, and the leads of the two antennas 1300 are electrically connected to the main board 1200 inside the shell 1100.

[0028] Among them, the two antennas 1300 are a BT antenna and a Wi Fi antenna, respectively.

[0029] As can be seen from the above, the vehicle-mounted domain controller with shell heat dissipation provided in the embodiments of the present application forms a contact part on the upper part of the shell, the contact part is in contact with the chip up and down through a heat-conducting medium, heat generated by the chip is transmitted to the contact part, and the heat is dissipated by a heat dissipation structure on the upper surface of the contact part, thereby having a good heat dissipation effect.

[0030] Obviously, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application, and are not used as a limitation to the present application, as long as the changes and variations of the above described embodiments are within the scope of the present application.

Claims

1. A vehicle-mounted domain controller with heat dissipation of the shell, comprising a shell and a mainboard arranged in the shell, and a chip on the mainboard, characterized in that, The upper part of the shell has a contact part, the lower surface of the contact part is in contact with the chip through a heat-conducting medium, and the upper surface of the contact part has a heat dissipation structure; the shell comprises an upper shell and a lower cover plate, the upper shell, the main plate and the lower cover plate are fixed by screws, the top of the upper shell comprises a first plate, a second plate and a vertical connecting plate, the first plate and the second plate are horizontally arranged left and right, the first plate is lower than the second plate, and the two are connected by the vertical connecting plate; the first plate forms a lower convex surface corresponding to the position of the chip, and the lower convex surface is in contact with the chip through a heat-conducting medium.

2. The vehicle domain controller of claim 1, wherein, The heat dissipation structure comprises a plurality of heat dissipation fins in the up-down direction and a heat dissipation fan, the plurality of heat dissipation fins are arranged in parallel and at intervals, heat dissipation air ducts are formed between adjacent heat dissipation fins, the heat dissipation fan is located at one end of the heat dissipation air ducts, and is fixed with the upper surface of the contact part; the heat dissipation fan is electrically connected with the main plate.

3. The vehicle domain controller of claim 2, wherein, The plurality of heat dissipation fins are arranged in parallel and at intervals left and right, the upper surface of the contact part forms a support part located on the left and right sides of the plurality of heat dissipation fins, and the heat dissipation fan is located in front of the plurality of heat dissipation fins and is fixed with the support part by screws.

4. The vehicle domain controller of claim 3, wherein, The support part is a support sheet in the up-down direction.

5. The vehicle domain controller of claim 1, wherein, The heat-conducting medium is a heat-conducting pad or a heat-conducting glue layer.

6. The vehicle domain controller of claim 1, wherein, The upper shell is a metal die-casting shell.

7. The vehicle domain controller of claim 1, wherein, The upper part of the shell is provided with an antenna, and the antenna is electrically connected with the main plate.

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