Cooling fin and core board cooling structure

Abstract

The utility model relates to a radiating fin and a core board radiating structure. Positioning through holes matched with installation of the cooling fin are formed in the four corners of a cooling unit of the cooling fin. Each heat dissipation unit comprises four triangular prisms, the cross section of the first triangular prism is a first isosceles triangle, the cross section of the second triangular prism is a second isosceles triangle, the cross section of the third triangular prism is a third isosceles triangle, and the cross section of the fourth triangular prism is a fourth isosceles triangle. The first isosceles triangle, the second isosceles triangle, the third isosceles triangle and the fourth isosceles triangle are completely consistent in shape and size, the bottom edge of the first isosceles triangle faces upwards, the bottom edge of the second isosceles triangle faces downwards, the bottom edge of the third isosceles triangle faces leftwards, and the bottom edge of the fourth isosceles triangle faces rightwards. According to the cooling fin, the core board has more adjustment space during device layout, and the flexible adaptation capacity of the core board and the cooling fin during high-density and high-speed wiring is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to core board heat dissipation technical field especially relates to a fin and core board heat dissipation structure. BACKGROUND

[0002] At present, the complexity of electronic products is higher and higher, and the product gradually changes from the original high integration integrated layout to the modular layout based on special functions. As the control center of the product, the core board is gradually designed and laid out independently with its unique high-speed, high-density and high-power functional characteristics. With the continuous improvement of the core board computing power, the power will continue to rise, and the design of the heat dissipation structure to assist heat dissipation has become a problem that must be considered.

[0003] The fixing of the fin is generally achieved by soft glue sticking, spring buckle and screw fastening. Among them, the soft glue sticking and spring buckle have low reliability and are not suitable for vertical fixing of the fin and obvious vibration in industrial control occasions. The reliability of screw fastening is the highest, but since the PCB, chip and fin are all solid, the combination between them needs to fully consider the error to ensure that the mechanical stress is effectively released. The device density of the core board is high, and the card space is limited. In order to optimize the high-speed layout and wiring, it is hoped that the mounting hole can be adjusted within a certain range. The public mold radiator on the market is a fixed hole position, which cannot provide adjustment space for designers, resulting in a situation that design and heat dissipation cannot be achieved. The angle of the core board installation is determined by the bottom plate, which can be any angle in 45°, 90° and 180°. The fin mainly dissipates heat through air convection, and it is necessary to ensure that the fin fins have suitable convection channels at any installation angle. At present, the fin needs to be customized according to different products, which has high cost, long delivery period, and the air convection channel of the fin is relatively single. SUMMARY

[0004] Therefore, it is necessary to provide a fin and a core board heat dissipation structure to solve the problems that the fin needs to be customized according to different products, which has high cost, long delivery period, and the fin structure cannot adapt to multiple convection angles.

[0005] A fin, one side of the fin is provided with a plurality of heat dissipation units arranged in a matrix, the heat dissipation units are square, and the four corner positions of the heat dissipation units are provided with positioning through holes matched with the installation of the fin.

[0006] The heat dissipation unit comprises a first triangular prism, a second triangular prism, a third triangular prism and a fourth triangular prism, the cross section of the first triangular prism is a first isosceles triangle, the cross section of the second triangular prism is a second isosceles triangle, the cross section of the third triangular prism is a third isosceles triangle, and the cross section of the fourth triangular prism is a fourth isosceles triangle.

[0007] The shapes and sizes of the first isosceles triangle, the second isosceles triangle, the third isosceles triangle and the fourth isosceles triangle are completely consistent, and the base of the first isosceles triangle faces upward, the base of the second isosceles triangle faces downward, the base of the third isosceles triangle faces leftward, and the base of the fourth isosceles triangle faces rightward.

[0008] The heat dissipation fins are fixed together with the core plate through the positioning through holes when working, and the matrix-distributed heat dissipation units can quickly conduct the heat generated by the core plate to the environment, thereby dissipating heat for the core plate. Since the heat dissipation unit includes a first triangular prism, a second triangular prism, a third triangular prism and a fourth triangular prism, the cross section of the first triangular prism is a first isosceles triangle, the cross section of the second triangular prism is a second isosceles triangle, the cross section of the third triangular prism is a third isosceles triangle, and the cross section of the fourth triangular prism is a fourth isosceles triangle, the shapes and sizes of the first isosceles triangle, the second isosceles triangle, the third isosceles triangle and the fourth isosceles triangle are completely consistent, and the base of the first isosceles triangle faces upward, the base of the second isosceles triangle faces downward, the base of the third isosceles triangle faces leftward, and the base of the fourth isosceles triangle faces rightward, so that the surface of the heat dissipation fin can form a plurality of air convection channels, thereby accelerating the heat dissipation of the core plate; further, since the heat dissipation fin mounting through hole matched with the positioning through hole needs to be designed on the core plate, the positioning through hole is arranged at the four corner positions of each heat dissipation unit, so that the core plate has more adjustment space when performing device layout, thereby improving the flexible adaptation capability of the core plate to the heat dissipation fin when performing high-density and high-speed wiring.

[0009] In one of the embodiments, a first air convection channel is arranged between two adjacent rows of the heat dissipation units, and a second air convection channel is arranged between two adjacent columns of the heat dissipation units.

[0010] The width of the first air convection channel is equal to the width of the second air convection channel.

[0011] In one of the embodiments, the heat dissipation unit includes a first diagonal line and a second diagonal line perpendicular to each other.

[0012] The first diagonal line and the second diagonal line are respectively provided with a third air convection channel and a fourth air convection channel.

[0013] The width of the third air convection channel is equal to the width of the fourth air convection channel.

[0014] In one of the embodiments, the width of the first air convection channel, the width of the second air convection channel, the width of the third air convection channel and the width of the fourth air convection channel are equal.

[0015] In one of the embodiments, the edge of the fin is provided with an edge triangular prism, and the cross section of the edge triangular prism is a fifth isosceles triangle.

[0016] The fifth isosceles triangle is identical in shape and size to the first isosceles triangle, the second isosceles triangle, the third isosceles triangle and the fourth isosceles triangle.

[0017] The base of the fifth isosceles triangle faces the inside of the fin.

[0018] A core plate heat dissipation structure comprises a core plate and the above-mentioned fin.

[0019] The core plate and the fin are fixedly connected, and one side of the fin provided with the heat dissipation unit faces away from the core plate.

[0020] In one of the embodiments, the core plate is provided with a first soldering chip.

[0021] Thermal conductive silicone grease is arranged between the first soldering chip and the fin.

[0022] In one of the embodiments, the core plate is further provided with a second soldering chip.

[0023] A soft rubber pad is attached to the second soldering chip, and thermal conductive silicone grease is arranged between the soft rubber pad and the fin.

[0024] In one of the embodiments, a positioning column is further arranged between the core plate and the fin, and the positioning column is a hollow structure.

[0025] The core plate is provided with a fin mounting through hole, and the two ends of the positioning column are respectively aligned with the positioning through hole and the fin mounting through hole.

[0026] A positioning screw is arranged on the side of the core plate facing away from the fin, and the positioning screw penetrates through the fin mounting through hole, the positioning column and the positioning through hole.

[0027] In one of the embodiments, the core plate is further provided with a plug-in part.

[0028] The first soldering chip and the second soldering chip are arranged on the side of the core plate facing the fin, and the plug-in part is arranged on the side of the core plate facing away from the fin. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a structural schematic view of the fin of the utility model;

[0030] Figure 2 It is another structural schematic view of the fin of the utility model;

[0031] Figure 3 The structure diagram of the core plate is shown in the figure;

[0032] Figure 4 The structure diagram of the core plate is shown in the figure; Figure 3 The structure diagram of the core plate is shown in the figure;

[0033] Wherein, 10 is a cooling fin, 20 is a core plate, 30 is a heat-conducting silicone grease, 40 is a soft rubber pad, 50 is a positioning column, 60 is a positioning screw, 11 is a cooling unit, 12 is a positioning through hole, 111 is a first triangular prism, 112 is a second triangular prism, 113 is a third triangular prism, 114 is a fourth triangular prism, 13 is a first air convection channel, 14 is a second air convection channel, 15 is a third air convection channel, 16 is a fourth air convection channel, 17 is an edge triangular prism, 21 is a first soldering chip, 22 is a second soldering chip, 23 is a plug-in part, and 24 is a cooling fin mounting through hole. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the utility model more apparent and easy to understand, the specific embodiments of the utility model are described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to fully understand the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intervening element. Conversely, when an element is referred to as being "directly on" another element, there is no intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0037] The utility model discloses a cooling fin and core plate heat dissipation structure.

[0038] As Figures 1 to 2As shown, one side of the heat sink 10 is provided with a plurality of heat dissipation units 11 arranged in a matrix, the heat dissipation unit 11 is a square, and the four corner positions of the heat dissipation unit 11 are provided with positioning through holes 12 matched with the installation of the heat sink 10. The heat dissipation unit 11 includes a first triangular prism 111, a second triangular prism 112, a third triangular prism 113, and a fourth triangular prism 114. The cross section of the first triangular prism 111 is a first isosceles triangle, the cross section of the second triangular prism 112 is a second isosceles triangle, the cross section of the third triangular prism 113 is a third isosceles triangle, and the cross section of the fourth triangular prism 114 is a fourth isosceles triangle. The shapes and sizes of the first isosceles triangle, the second isosceles triangle, the third isosceles triangle, and the fourth isosceles triangle are completely consistent, and the base of the first isosceles triangle faces upward, the base of the second isosceles triangle faces downward, the base of the third isosceles triangle faces left, and the base of the fourth isosceles triangle faces right.

[0039] Preferably, the heights of the first triangular prism 111, the second triangular prism 112, the third triangular prism 113, and the fourth triangular prism 114 are in the range of 5mm-10mm.

[0040] In the working process of the heat sink, the positioning through holes are fixedly connected with the core board, and the matrix-arranged heat dissipation units can quickly conduct the heat generated by the core board to the environment, thereby dissipating heat for the core board. Since the heat dissipation unit includes the first triangular prism, the second triangular prism, the third triangular prism, and the fourth triangular prism, the cross section of the first triangular prism is a first isosceles triangle, the cross section of the second triangular prism is a second isosceles triangle, the cross section of the third triangular prism is a third isosceles triangle, and the cross section of the fourth triangular prism is a fourth isosceles triangle. The shapes and sizes of the first isosceles triangle, the second isosceles triangle, the third isosceles triangle, and the fourth isosceles triangle are completely consistent, and the base of the first isosceles triangle faces upward, the base of the second isosceles triangle faces downward, the base of the third isosceles triangle faces left, and the base of the fourth isosceles triangle faces right. This allows the surface of the heat sink to form a plurality of air convection channels, thereby accelerating the heat dissipation of the core board. Furthermore, since the heat sink mounting through hole matched with the positioning through hole needs to be designed on the core board, the positioning through hole is arranged at the four corner positions of each heat dissipation unit, which provides more adjustment space for the core board when the device layout is performed, thereby improving the flexible adaptation capability of the core board to the heat sink when high-density and high-speed wiring is performed.

[0041] The first air convection passage 13 and the second air convection passage 14 are arranged between the adjacent two rows of the heat dissipation units 11. The width of the first air convection passage 13 is equal to the width of the second air convection passage 14. The width of the first air convection passage 13 is set to be equal to the width of the second air convection passage 14, so that the structure of the heat dissipation fin is more reasonable, and the processing of the heat dissipation fin is more convenient.

[0042] Further, the heat dissipation unit 11 comprises a first diagonal line and a second diagonal line perpendicular to each other, and the first diagonal line and the second diagonal line are respectively provided with a third air convection passage 15 and a fourth air convection passage 16. The width of the third air convection passage 15 is equal to the width of the fourth air convection passage 16. The width of the third air convection passage 15 is set to be equal to the width of the fourth air convection passage 16, so that the structure of the heat dissipation unit 11 is more reasonable, and the processing of the heat dissipation fin is more convenient.

[0043] Further, the width of the first air convection passage 13, the width of the second air convection passage 14, the width of the third air convection passage 15 and the width of the fourth air convection passage 16 are equal. The width of the first air convection passage 13, the width of the second air convection passage 14, the width of the third air convection passage 15 and the width of the fourth air convection passage 16 are equal, so that the processing of the heat dissipation fin is more convenient.

[0044] The edge of the heat dissipation fin 10 is provided with an edge triangular prism 17, and the cross section of the edge triangular prism 17 is a fifth isosceles triangle. The shape and size of the fifth isosceles triangle are completely consistent with those of the first isosceles triangle, the second isosceles triangle, the third isosceles triangle and the fourth isosceles triangle. The base of the fifth isosceles triangle faces the inside of the heat dissipation fin. It should be noted that the edge triangular prism 17 is arranged, so that the size of the heat dissipation fin 10 can be flexibly adjusted according to needs, avoiding the problem of mismatching with the size of the core board caused by only arranging the heat dissipation unit 11.

[0045] Further, the height of the edge triangular prism 17 can be set according to actual needs. Preferably, the height of the edge triangular prism 17 ranges from 5mm to 10mm.

[0046] As shown in Figures 3 to 4 The core board heat dissipation structure comprises a core board 20 and the heat dissipation fin 10. The core board 20 and the heat dissipation fin 10 are fixedly connected, and one side of the heat dissipation fin 10 provided with the heat dissipation unit 11 faces away from the core board 20.

[0047] The core board 20 can be quickly cooled by the heat dissipation fin 10, so as to improve the service life and working stability of the core board 20.

[0048] Further, the first welding chip 21 is arranged on the core plate 20, and the heat-conducting silicone grease 30 is arranged between the first welding chip 21 and the heat dissipation fin 10. The heat-conducting silicone grease 30 can buffer the mechanical stress between the heat dissipation fin 10 and the core plate 20, so as to avoid damage to the first welding chip 21 caused by excessive mechanical stress.

[0049] Further, the second welding chip 22 is arranged on the core plate 20, the soft rubber pad 40 is arranged on the second welding chip 22, and the heat-conducting silicone grease 30 is arranged between the soft rubber pad 40 and the heat dissipation fin 10. The soft rubber pad 40 has a high thermal conductivity, and the size of the soft rubber pad 40 is consistent with the size of the second welding chip 22. The thickness of the soft rubber pad 40 is less than the distance between the second welding chip 22 and the heat dissipation fin 10, so as to cooperate with the heat-conducting silicone grease 30 arranged between the soft rubber pad 40 and the heat dissipation fin 10.

[0050] Further, since the coating thickness of the heat-conducting silicone grease 30 is usually not more than 3 mm, if the distance between a certain chip on the core plate 20 and the heat dissipation fin 10 is not more than 3 mm, the heat-conducting silicone grease 30 can be arranged between the chip and the heat dissipation fin 10 according to the heat dissipation mode of the first welding chip 21; if the distance between a certain chip on the core plate 20 and the heat dissipation fin 10 is more than 3 mm, the soft rubber pad 40 and the heat-conducting silicone grease 30 can be arranged between the chip and the heat dissipation fin 10 according to the heat dissipation mode of the second welding chip 22.

[0051] Further, the positioning column 50 is arranged between the core plate 20 and the heat dissipation fin 10, and the positioning column 50 has a hollow structure. The positioning column 50 is made of hard materials such as copper and aluminum. The heat dissipation fin mounting through hole 24 is arranged on the core plate 20, and the two ends of the positioning column 50 are aligned with the positioning through hole 12 and the heat dissipation fin mounting through hole 24, respectively. The positioning screw 60 is arranged on the side of the core plate 20 away from the heat dissipation fin 10, and the positioning screw 60 penetrates the heat dissipation fin mounting through hole 24, the positioning column 50 and the positioning through hole 12. The positioning column 50 is arranged between the core plate 20 and the heat dissipation fin 10, so that the core plate 20 and the heat dissipation fin 10 can maintain a certain distance, and damage to the core plate 20 caused by too small distance can be avoided.

[0052] Further, it is assumed that the height of the highest chip on the core plate 20 is A, the height error of the positioning column 50 is ±a, the flatness error of the bottom of the heat dissipation fin 10 is ±b, and the height error of the chip after welding is ±c. The height X of the height limiting column is A+a+b+c.

[0053] Further, the core board 20 is further provided with a plug-in part 23; the first soldering chip 21 and the second soldering chip 22 are arranged on one side of the core board 20 facing the heat dissipation sheet 10, and the plug-in part 23 is arranged on the side of the core board 20 away from the heat dissipation sheet 10. Since the first soldering chip 21 and the second soldering chip 22 generally have high heat generation, the plug-in part 23 generally has low heat generation, arranging the first soldering chip 21 and the second soldering chip 22 on the side of the core board 20 facing the heat dissipation sheet 10 and arranging the plug-in part 23 on the side of the core board 20 away from the heat dissipation sheet 10 is beneficial to the rapid heat dissipation of the core board 20, and also makes the layout of the core board 20 more reasonable.

[0054] The assembly mode of the core board heat dissipation structure will be described below.

[0055] Firstly, the corresponding heat dissipation sheet mounting through hole 24 is reserved when the core board 20 is designed, since the heat dissipation unit 11 is designed in a matrix, the core board 20 is flexible when reserving the hole position of the heat dissipation sheet mounting through hole 24, which is beneficial to product layout and wiring.

[0056] Secondly, after the core board 20 is designed, the positioning column 50 with appropriate height is selected, and the positioning column 50 is aligned with the positioning through hole 12 on the heat dissipation sheet 10 and the heat dissipation sheet mounting through hole 24 on the core board 20 respectively.

[0057] Thirdly, since the devices needing heat dissipation of the core board 20 can not be only one chip, and the height of the chip after soldering is not the same, but the heat dissipation sheet 10 covers the entire core board 20, the effect of overall heat dissipation of multiple chips can be achieved by filling the heat-conducting silicone grease 30 and pasting the soft rubber pad 40. After the positioning column 50 is installed, if the distance between the chip and the heat dissipation sheet is < 3mm, a certain amount of heat-conducting silicone grease 30 is directly filled in the gap between the chip and the heat dissipation sheet; if the distance between the chip and the heat dissipation sheet is ≥ 3mm, the soft rubber pad 40 with appropriate thickness is selected to be pasted on the chip, and then the heat-conducting silicone grease 30 is used to fill the gap.

[0058] Fourthly, the positioning screw 60 is sequentially inserted through the heat dissipation sheet mounting through hole 24, the positioning column 50 and the positioning through hole 12, so as to realize the reliable connection between the heat dissipation sheet 10 and the core board 20.

[0059] The technical features of the above-described embodiments can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0060] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A heat sink, characterized in that, One side of the heat sink is provided with multiple heat dissipation units arranged in a matrix. The heat dissipation units are square, and each of the four corners of the heat dissipation unit is provided with positioning through holes to cooperate with the installation of the heat sink. The heat dissipation unit includes a first triangular prism, a second triangular prism, a third triangular prism, and a fourth triangular prism. The cross-section of the first triangular prism is a first isosceles triangle, the cross-section of the second triangular prism is a second isosceles triangle, the cross-section of the third triangular prism is a third isosceles triangle, and the cross-section of the fourth triangular prism is a fourth isosceles triangle. The first, second, third, and fourth isosceles triangles are identical in shape and size, with the base of the first isosceles triangle facing upwards, the base of the second isosceles triangle facing downwards, the base of the third isosceles triangle facing left, and the base of the fourth isosceles triangle facing right.

2. The heat sink according to claim 1, characterized in that, A first air convection channel is provided between two adjacent rows of heat dissipation units, and a second air convection channel is provided between two adjacent columns of heat dissipation units; The width of the first air convection channel is equal to the width of the second air convection channel.

3. The heat sink according to claim 2, characterized in that, The heat dissipation unit includes a first diagonal and a second diagonal that are perpendicular to each other; A third air convection channel and a fourth air convection channel are respectively provided on the first diagonal and the second diagonal; The width of the third air convection channel is equal to the width of the fourth air convection channel.

4. The heat sink according to claim 3, characterized in that, The widths of the first air convection channel, the second air convection channel, the third air convection channel, and the fourth air convection channel are equal.

5. The heat sink according to claim 4, characterized in that, The heat sink has an edge triangular prism, and the cross-section of the edge triangular prism is a fifth isosceles triangle; The fifth isosceles triangle is identical in shape and size to the first, second, third, and fourth isosceles triangles; The base of the fifth isosceles triangle faces the inside of the heat sink.

6. A core board heat dissipation structure, characterized in that, Includes a core board and the heat sink as described in any one of claims 1 to 5; The core board and the heat sink are fixedly connected, and the side of the heat sink with the heat dissipation unit faces away from the core board.

7. The core board heat dissipation structure according to claim 6, characterized in that, The core board is equipped with a first welding chip; Thermal grease is provided between the first welding chip and the heat sink.

8. The core board heat dissipation structure according to claim 7, characterized in that, The core board is also equipped with a second welding chip; A soft rubber pad is attached to the second soldering chip, and thermal grease is provided between the soft rubber pad and the heat sink.

9. The core board heat dissipation structure according to claim 8, characterized in that, A positioning post is also provided between the core board and the heat sink, and the positioning post has a hollow structure. The core plate is provided with heat sink mounting through holes, and the two ends of the positioning post are respectively aligned with the positioning through holes and the heat sink mounting through holes; The core plate has a mounting hole through the heat sink, the positioning post, and the positioning screw installed on the side opposite to the heat sink.

10. The core board heat dissipation structure according to claim 9, characterized in that, The core board is also equipped with connectors; The first welding chip and the second welding chip are disposed on the side of the core board facing the heat sink, and the connector is disposed on the side of the core board away from the heat sink.

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